Chemical etching and polishing treatment device for wafer blank

Abstract

The utility model belongs to the technical field of wafer processing devices, and discloses a wafer blank chemical etching and polishing treatment device, which comprises a fixed cylinder, a baffle is fixedly sleeved on the outer surface of the fixed cylinder, and a side plate is fixedly mounted on the left side of the baffle. By arranging the vertical rod, the rotating plate, the circular block and the movable frame, when a wafer blank body is polished, a power motor can be started to enable the rotating shaft to drive the circular plate to rotate, so that the movable block drives the circular block to rotate by taking the rotating shaft as the axis, and the circular block extrudes and pushes the inner surface of the movable frame; when the wafer blank body is polished, the movable frame is driven to rotate, so that the movable frame drives the rotating plate to swing with the vertical rod as the axis, the wafer blank body can continuously swing back and forth at the top of the polishing disc, polishing liquid can permeate between the wafer blank body and the polishing disc, and the polishing effect on the wafer blank body is improved.

Description

Technical Field

[0001] This utility model belongs to the technical field of wafer processing equipment, specifically a device for chemical etching and polishing of wafer blanks. Background Technology

[0002] Wafer blanks are the basic materials for manufacturing silicon semiconductor integrated circuits. They are mainly made of high-purity single-crystal silicon, which is extracted from abundant silica ore on the Earth's crust through a complex refining and purification process.

[0003] Wafer blanks have a regular circular shape. After fine processing such as slicing, grinding, and polishing, they can be made into silicon wafers used to manufacture various circuit element structures. When polishing wafer blanks, polishing fluid needs to be sprayed. The corrosive solution inside the polishing fluid can soften the surface of the wafer, allowing polishing to proceed smoothly. In existing polishing equipment, because the wafer blank does not move after contacting the polishing pad, the polishing fluid cannot fully penetrate between the wafer blank and the polishing pad. This prevents the polishing fluid from fully softening the surface of the wafer blank and from effectively removing the heat and debris generated during the polishing process. These residues further affect the polishing effect and the quality of the wafer, so improvements are needed. Utility Model Content

[0004] The purpose of this invention is to address the above problems by providing a chemical etching and polishing device for wafer blanks, which has the advantage of improving the polishing effect.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a chemical etching and polishing device for wafer blanks, comprising a fixed cylinder, a baffle fixedly sleeved on the outer surface of the fixed cylinder, a side plate fixedly installed on the left side of the baffle, a vertical rod fixedly installed on the right side of the top of the side plate, a rotating plate movably sleeved on the top of the outer surface of the vertical rod, a drive motor fixedly installed on the right side of the top of the rotating plate, a circular shaft fixedly connected to the other end of the output shaft of the drive motor, the bottom end of the circular shaft extending below the rotating plate and movably sleeved with the inner wall of the rotating plate, a bearing plate fixedly connected to the bottom of the circular shaft, a wafer blank body fixedly connected to the bottom of the bearing plate, a power motor fixedly installed on the left side of the top of the side plate, a rotating shaft fixedly connected to the other end of the output shaft of the power motor, a circular plate fixedly connected to the top of the rotating shaft, a movable block movably installed inside the circular plate, a circular block fixedly connected to the top of the movable block, a movable frame movably connected to the outer surface of the circular block, and the right end of the movable frame fixedly connected to the left end of the rotating plate.

[0006] As a preferred embodiment of this utility model, a threaded rod is movably sleeved on the left side inside the circular plate, the outer surface of the threaded rod is threadedly sleeved with the inner wall of the movable block, and a rotating block is fixedly connected to the left end of the threaded rod.

[0007] As a preferred embodiment of this utility model, a pneumatic cylinder is fixedly installed at the bottom of the inner surface of the fixed cylinder, a protective shell is fixedly connected to the top of the pneumatic cylinder, and a fixed motor is fixedly sleeved inside the protective shell.

[0008] In a preferred embodiment of this invention, a movable shaft is fixedly connected to the other end of the fixed motor output shaft, and an mounting plate is fixedly sleeved on the outer surface of the movable shaft. The bottom of the mounting plate is movably connected to the top of the fixed cylinder, and a polishing disc is fixedly connected to the top of the mounting plate.

[0009] As a preferred embodiment of this utility model, a drain pipe is fixedly installed on the right side of the bottom of the baffle, and a fixing plate is fixedly installed on the top of the back of the baffle.

[0010] As a preferred embodiment of this utility model, a water pump is fixedly installed on the top of the fixing plate, and an inlet pipe is fixedly connected to the bottom of the water pump. The bottom of the inlet pipe passes through the fixing plate and extends to the lower part of the fixing plate.

[0011] As a preferred embodiment of this utility model, a drain hose is fixedly installed on the front of the water pump, the outer surface of the drain hose is fixedly sleeved with the inner wall of the rotating plate, and a nozzle is fixedly connected to the bottom of the drain hose.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] This invention, by setting up a vertical rod, a rotating plate, a circular block, and a movable frame, allows the wafer blank to be polished by starting a power motor. This causes the rotating shaft to rotate the circular plate, which in turn causes the movable block to rotate around the rotating shaft. The circular block then presses against the inner surface of the movable frame, causing the movable frame to rotate. This causes the movable frame to drive the rotating plate to swing around the vertical rod, allowing the wafer blank to continuously swing back and forth on top of the polishing pad. This allows the polishing fluid to penetrate between the wafer blank and the polishing pad, thereby improving the polishing effect on the wafer blank. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a cross-sectional view of the front of the present invention;

[0016] Figure 3 This is a side view of the structure of this utility model;

[0017] Figure 4 This is a top view of the structure of the top of this utility model;

[0018] Figure 5 for Figure 2 A magnified schematic diagram of the structure at point A in the middle.

[0019] In the diagram: 1. Fixed cylinder; 2. Baffle; 3. Side plate; 4. Vertical rod; 5. Rotating plate; 6. Drive motor; 7. Round shaft; 8. Bearing plate; 9. Wafer blank body; 10. Power motor; 11. Rotating shaft; 12. Round plate; 13. Moving block; 14. Round block; 15. Movable frame; 16. Threaded rod; 17. Rotating block; 18. Pneumatic cylinder; 19. Protective shell; 20. Fixed motor; 21. Movable shaft; 22. Mounting plate; 23. Polishing disc; 24. Drain pipe; 25. Fixed plate; 26. Water pump; 27. Inlet pipe; 28. Drain hose; 29. ​​Nozzle. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figures 1 to 5As shown, this utility model provides a chemical etching and polishing device for wafer blanks, including a fixed cylinder 1. A baffle 2 is fixedly sleeved on the outer surface of the fixed cylinder 1. A side plate 3 is fixedly installed on the left side of the baffle 2. A vertical rod 4 is fixedly installed on the right side of the top of the side plate 3. A rotating plate 5 is movably sleeved on the top of the outer surface of the vertical rod 4. A drive motor 6 is fixedly installed on the right side of the top of the rotating plate 5. A circular shaft 7 is fixedly connected to the other end of the output shaft of the drive motor 6. The bottom end of the circular shaft 7 extends to the bottom of the rotating plate 5 and is movably sleeved with the inner wall of the rotating plate 5. A bearing plate 8 is fixedly connected to the bottom of the circular shaft 7. A wafer blank body 9 is fixedly connected to the bottom of the bearing plate 8. A power motor 10 is fixedly installed on the left side of the top of the side plate 3. A rotating shaft 11 is fixedly connected to the other end of the output shaft of the power motor 10. A circular plate 12 is fixedly connected to the top of the rotating shaft 11. A moving block 13 is movably installed inside the circular plate 12. A circular block 14 is fixedly connected to the top of the movable block 13. A movable frame 15 is movably connected to the outer surface of the circular block 14. The right end of the movable frame 15 is fixedly connected to the left end of the rotating plate 5. The operator can start the drive motor 6 to make the circular shaft 7 drive the bearing plate 8 and the wafer blank body 9 to rotate, thereby polishing the wafer blank body 9. At this time, the operator can start the power motor 10 to make the rotating shaft 11 drive the circular plate 12 to rotate. The circular plate 12 will drive the circular block 14 to rotate through the movable block 13, so that the outer surface of the circular block 14 squeezes and pushes the inner surface of the movable frame 15, thereby driving the movable frame 15 to move. The movable frame 15 drives the rotating plate 5 to swing around the vertical rod 4 as the axis, so that the wafer blank body 9 can continuously contact the polishing liquid, so that the corrosive solution in the polishing liquid can soften the surface of the wafer.

[0022] The left side of the circular plate 12 is movably fitted with a threaded rod 16. The outer surface of the threaded rod 16 is threadedly fitted with the inner wall of the movable block 13. The left end of the threaded rod 16 is fixedly connected to a rotating block 17. The operator can rotate the rotating block 17 to make the threaded rod 16 drive the movable block 13 to move to the right inside the circular plate 12, thereby adjusting the position of the circular block 14 and adjusting the swing amplitude of the rotating plate 5.

[0023] A pneumatic cylinder 18 is fixedly installed at the bottom of the inner surface of the fixed cylinder 1. A protective shell 19 is fixedly connected to the top of the pneumatic cylinder 18. A fixed motor 20 is fixedly sleeved inside the protective shell 19. The operator can start the pneumatic cylinder 18 to make the pneumatic cylinder 18 drive the protective shell 19 to move upward. Due to the design of the protective shell 19, the protective shell 19 can protect the fixed motor 20.

[0024] The fixed motor 20 has a movable shaft 21 fixedly connected to the other end of its output shaft. A mounting plate 22 is fixedly sleeved on the outer surface of the movable shaft 21. The bottom of the mounting plate 22 is movably connected to the top of the fixed cylinder 1. A polishing disc 23 is fixedly connected to the top of the mounting plate 22. The operator can start the fixed motor 20 to make the movable shaft 21 drive the mounting plate 22 to rotate, which in turn makes the polishing disc 23 rotate. This allows the polishing disc 23 to polish the wafer blank body 9 more evenly and quickly.

[0025] A drain pipe 24 is fixedly installed on the right side of the bottom of the baffle 2, and a fixing plate 25 is fixedly installed on the top of the back of the baffle 2. The polishing liquid falling on the top of the polishing disc 23 will be thrown into the interior of the baffle 2 under the action of centrifugal force, and then flow out through the drain pipe 24.

[0026] The top of the fixing plate 25 is fixedly installed with a water pump 26, and the bottom of the water pump 26 is fixedly connected with an inlet pipe 27. The bottom of the inlet pipe 27 passes through the fixing plate 25 and extends to the lower part of the fixing plate 25. Due to the design of the fixing plate 25, the fixing plate 25 can play the role of installation and support for the water pump 26. The operator starts the water pump 26 so that the inlet pipe 27 can draw in the polishing liquid.

[0027] The water pump 26 is fixedly installed with a drain hose 28 on the front. The outer surface of the drain hose 28 is fixedly sleeved with the inner wall of the rotating plate 5. The bottom of the drain hose 28 is fixedly connected with a nozzle 29. When the inlet pipe 27 draws in the polishing liquid, it will be delivered to the inside of the drain hose 28 and then sprayed out through the nozzle 29, thereby softening the soft surface of the wafer blank body 9.

[0028] Working principle and usage process of this utility model:

[0029] The operator mounts the wafer blank body 9 on the bottom of the support plate 8, starts the drive motor 6, causing the circular shaft 7 to rotate the support plate 8 and the wafer blank body 9. Then, by starting the pneumatic cylinder 18, the protective shell 19 is pushed upward, causing the polishing disc 23 to rise and contact the bottom of the wafer blank body 9. At this time, by starting the fixed motor 20, the movable shaft 21 drives the mounting plate 22 and the polishing disc 23 to rotate, thereby polishing the wafer blank body 9. The operator starts the water pump 26, causing the inlet pipe 27 to draw in polishing liquid, which is then sprayed out through the drain hose 28 and the nozzle 29. The corrosive solution in the polishing liquid softens the surface of the wafer. At this time, the operator starts the power motor 10, causing the rotating shaft 11 to rotate the circular plate 12, which will then... The moving block 13 drives the circular block 14 to rotate around the pivot 11, causing the circular block 14 to press and push the inner surface of the movable frame 15, thereby causing the movable frame 15 to rotate. This causes the movable frame 15 to drive the rotating plate 5 to swing around the vertical rod 4. As the circular plate 12 rotates continuously, the circular block 14 drives the movable frame 15 to move continuously, so that the rotating plate 5 can drive the wafer blank body 9 to swing back and forth on the top of the polishing disk 23. This allows the polishing fluid to penetrate between the wafer blank body 9 and the polishing disk 23, thereby improving the polishing effect on the wafer blank body 9. The operator can rotate the rotating block 17 to cause the threaded rod 16 to drive the moving block 13 to move to the right inside the circular plate 12, thereby adjusting the position of the circular block 14 and adjusting the swing amplitude of the rotating plate 5.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chemical etching and polishing apparatus for wafer blanks, comprising a fixed cylinder (1), characterized in that: A baffle (2) is fixedly sleeved on the outer surface of the fixed cylinder (1). A side plate (3) is fixedly installed on the left side of the baffle (2). A vertical rod (4) is fixedly installed on the right side of the top of the side plate (3). A rotating plate (5) is movably sleeved on the top of the outer surface of the vertical rod (4). A drive motor (6) is fixedly installed on the right side of the top of the rotating plate (5). A round shaft (7) is fixedly connected to the other end of the output shaft of the drive motor (6). The bottom end of the round shaft (7) extends to the bottom of the rotating plate (5) and is movably sleeved with the inner wall of the rotating plate (5). A bearing plate (8) is fixedly connected to the bottom of the round shaft (7). The bottom of the support plate (8) is fixedly connected to the wafer blank body (9), the left side of the top of the side plate (3) is fixedly installed with a power motor (10), the other end of the output shaft of the power motor (10) is fixedly connected to a rotating shaft (11), the top of the rotating shaft (11) is fixedly connected to a circular plate (12), a movable block (13) is movably installed inside the circular plate (12), a circular block (14) is fixedly connected to the top of the movable block (13), a movable frame (15) is movably connected to the outer surface of the circular block (14), and the right end of the movable frame (15) is fixedly connected to the left end of the rotating plate (5).

2. The wafer blank chemical etching and polishing apparatus according to claim 1, characterized in that: A threaded rod (16) is movably sleeved on the left side inside the circular plate (12). The outer surface of the threaded rod (16) is threadedly sleeved with the inner wall of the moving block (13). A rotating block (17) is fixedly connected to the left end of the threaded rod (16).

3. The wafer blank chemical etching and polishing apparatus according to claim 1, characterized in that: A pneumatic cylinder (18) is fixedly installed at the bottom of the inner surface of the fixed cylinder (1), and a protective shell (19) is fixedly connected to the top of the pneumatic cylinder (18). A fixed motor (20) is fixedly sleeved inside the protective shell (19).

4. The wafer blank chemical etching and polishing apparatus according to claim 3, characterized in that: The other end of the output shaft of the fixed motor (20) is fixedly connected to a movable shaft (21). A mounting plate (22) is fixedly sleeved on the outer surface of the movable shaft (21). The bottom of the mounting plate (22) is movably connected to the top of the fixed cylinder (1). A polishing disc (23) is fixedly connected to the top of the mounting plate (22).

5. The wafer blank chemical etching and polishing apparatus according to claim 1, characterized in that: A drain pipe (24) is fixedly installed on the right side of the bottom of the baffle (2), and a fixing plate (25) is fixedly installed on the top of the back of the baffle (2).

6. The wafer blank chemical etching and polishing apparatus according to claim 5, characterized in that: A water pump (26) is fixedly installed on the top of the fixed plate (25), and an inlet pipe (27) is fixedly connected to the bottom of the water pump (26). The bottom of the inlet pipe (27) passes through the fixed plate (25) and extends to the lower part of the fixed plate (25).

7. The wafer blank chemical etching and polishing apparatus according to claim 6, characterized in that: A drain hose (28) is fixedly installed on the front of the water pump (26). The outer surface of the drain hose (28) is fixedly sleeved with the inner wall of the rotating plate (5). A nozzle (29) is fixedly connected to the bottom of the drain hose (28).

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