Bearing table assembly, grinding device and chamfering machine

Abstract

The utility model relates to the technical field of electronic device manufacturing, in particular to a bearing table assembly, a grinding device and a chamfering machine, and aims to solve the problem of how to improve the machining quality of workpieces. In order to achieve the purpose, the bearing table assembly comprises a driving motor, a bearing table body and a bearing table body, the rotating shaft is connected with the rotor, and the rotating shaft is provided with a second channel communicated with the first channel; the suction cup is arranged at the end, away from the driving motor, of the rotating shaft, the suction cup is used for bearing a to-be-machined workpiece, and an inner cavity of the suction cup communicates with the second channel; and the gas pipeline extends into the second channel and is in sealed connection with a port, far away from the suction cup, of the first channel. The positioning precision and the jumping precision of the suction cup on the rotating shaft can be improved, and therefore the machining quality of a workpiece can be improved.

Description

Technical Field

[0001] This application relates to the field of electronic device manufacturing technology, specifically providing a support platform assembly, a grinding device, and a chamfering machine. Background Technology

[0002] Semiconductor wafers are the foundation for manufacturing integrated circuits and are widely used in advanced electronics, communications, aerospace, and other fields. Ingots are cut into thin slices to obtain wafers. Before grinding the wafer surface, the edges are usually chamfered to remove small cracks and defects from the cutting process and to prevent chipping or other defects during the grinding process.

[0003] Wafer grinding equipment typically includes a stage assembly and a grinding assembly. The stage assembly holds the wafer and rotates it. During wafer rotation, the grinding assembly contacts the wafer's edge, thus performing grinding processing on various locations along the wafer's edge. However, the stage assembly is affected by transmission errors in its internal drive structure, which can impact the wafer's positioning and runout accuracy during rotation, thereby affecting the wafer's processing quality.

[0004] Accordingly, a new technical solution is needed in this field to solve the above problems. Utility Model Content

[0005] This application aims to solve the aforementioned technical problem, namely, how to improve the quality of workpiece processing.

[0006] In a first aspect, this application provides a stage assembly comprising:

[0007] The drive motor has a first channel inside its rotor;

[0008] A rotating shaft connected to the rotor, the rotating shaft having a second channel communicating with the first channel;

[0009] A suction cup is disposed at the end of the rotating shaft away from the drive motor. The suction cup is used to carry the workpiece to be processed, and the internal cavity of the suction cup is connected to the second channel.

[0010] A gas conduit extends into the second channel and is sealed to the port of the first channel away from the suction cup.

[0011] By adopting the above technical solution, this application provides a hollow first channel inside the rotor of the drive motor, allowing the gas pipe that provides the air passage connection to the suction cup to pass through the first channel and form a closed air passage that communicates with the second channel inside the rotating shaft. This enables the suction cup to adsorb and fix the workpiece. Based on this, the rotating shaft can be directly connected to the rotor of the drive motor, eliminating the transmission structure between the rotating shaft and the drive motor. The power of the drive motor is directly transmitted to the rotating shaft, which can improve the positioning accuracy and runout accuracy of the suction cup on the rotating shaft, thereby improving the processing quality of the workpiece.

[0012] In one technical solution of the above-mentioned support platform assembly, the support platform assembly further includes a protective shell disposed outside the drive motor and the rotating shaft, with the rotating shaft extending out of the protective shell.

[0013] The above technical solution can protect the rotating shaft and the drive motor.

[0014] In one technical solution of the aforementioned support platform assembly, the protective shell includes:

[0015] A base having a first chamber inside, wherein the drive motor is at least partially located in the first chamber;

[0016] The upper housing has a second chamber inside it. The upper housing is detachably connected to the base to communicate the first chamber and the second chamber. One end of the rotating shaft is located in the second chamber, and the other end extends out of the second chamber.

[0017] The above technical solution facilitates the assembly and maintenance of the support platform components.

[0018] In one technical solution of the above-mentioned support platform assembly, a first groove is provided circumferentially on the inner wall of the upper housing near the suction cup, and a first sealing ring is provided in the first groove.

[0019] By adopting the above technical solution, external impurities such as water vapor and powder can be prevented from entering the second chamber and the first chamber sequentially along the gap between the rotating shaft and the upper housing, thus protecting the drive motor and reducing the impact of external impurities on the rotation of the rotating shaft.

[0020] In one technical solution of the above-mentioned support platform assembly, a second groove is provided circumferentially on the inner wall of the upper housing near the drive motor, and a second sealing ring is provided in the second groove.

[0021] By adopting the above technical solution, external impurities such as water vapor and powder can be prevented from entering the second chamber and the first chamber sequentially along the gap between the rotating shaft and the upper housing, thus protecting the drive motor and reducing the impact of external impurities on the rotation of the rotating shaft.

[0022] In one technical solution of the above-mentioned support platform assembly, the inner wall of the upper housing is further provided with a third groove along its circumference. The third groove is located between the first groove and the suction cup. A gas channel is provided in the side wall of the upper housing. The inlet end of the gas channel is connected to the outer surface of the upper housing, and the exhaust end of the gas channel is connected to the third groove.

[0023] When the above technical solution is adopted, by connecting an external gas device to the gas inlet end of the gas channel, during the workpiece grinding process, the fluid enters the third groove through the gas channel, forming a gas barrier within the third groove. This effectively prevents impurities such as powder and water vapor from entering the upper housing during the workpiece grinding process, thus protecting the internal structure of the support platform assembly. Furthermore, when the support platform assembly is not in operation, gas can be blown into the gas channel. This blows impurities in the gap between the rotating shaft and the upper housing to the outside, cleaning the gap between the rotating shaft and the upper housing.

[0024] In one technical solution of the aforementioned support platform assembly, the gas channel includes:

[0025] The first part is radially opened along the axis of rotation and communicates with the third groove;

[0026] The second part is opened along the axial direction of the rotation axis, the second part communicates with the first part and extends toward the side close to the drive motor, and the second part communicates with the outer surface of the upper housing.

[0027] By adopting the above technical solution, by setting the gas channel into a first part and a second part with the extension direction perpendicular to each other, the second pipe connector can be set at a position away from the suction cup. This can reduce the interference of external gas devices and components such as the second pipe connector on the area around the suction cup, and the spatial layout is more reasonable.

[0028] In one technical solution of the aforementioned support platform assembly, the axis of the first channel coincides with the axis of the second channel.

[0029] When the above technical solution is adopted, the gas passage consisting of the gas pipeline and the second channel extends in a straight line, which can minimize the pressure loss caused by gas path turning and tortuosity, and is conducive to improving the adsorption effect on the workpiece.

[0030] In one technical solution of the aforementioned support platform assembly, the diameter of the first channel is larger than the diameter of the second channel.

[0031] Using the above technical solution facilitates the installation of gas pipelines and other sealing components.

[0032] In one technical solution of the above-mentioned support platform assembly, the support platform assembly further includes a first pipeline connector disposed at the end of the gas pipeline away from the second channel;

[0033] The gas pipeline is fixedly connected to the port of the second channel, and the first pipeline connector is rotatably connected to the gas pipeline; or

[0034] The gas pipeline is rotatably connected to the port of the second channel, and the first pipeline connector is fixedly connected to the gas pipeline.

[0035] In a second aspect, this application provides a grinding apparatus comprising the stage assembly described in any one of the first aspects.

[0036] In a third aspect, this application provides a chamfering machine that includes the grinding apparatus described in the second aspect. Attached Figure Description

[0037] The preferred embodiments of this application are described below with reference to the accompanying drawings, in which:

[0038] Figure 1 This is a schematic diagram of the overall structure of a support platform assembly according to an embodiment of this application;

[0039] Figure 2 yes Figure 1 A longitudinal sectional view;

[0040] Figure 3 yes Figure 2 A magnified view of part A in the middle.

[0041] In the figure, the reference numerals refer to the following:

[0042] 1. Drive motor; 100. Wafer; 11. First channel; 2. Rotating shaft; 21. Second channel; 3. Suction cup; 4. Gas pipeline; 41. First pipeline connector; 5. Protective shell; 51. Base; 510. First chamber; 511. Through hole; 52. Upper shell; 520. Second chamber; 521. First groove; 522. First sealing ring; 523. Second groove; 524. Second sealing ring; 525. Third groove; 526. Gas channel; 5261. First part; 5262. Second part; 5263. First plug; 5264. Second plug; 527. Second pipeline connector. Detailed Implementation

[0043] Preferred embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0044] It should be noted that in the description of this application, terms such as "upper," "lower," "left," "right," "inner," and "outer," which indicate direction or positional relationship, are based on the direction or positional relationship shown in the accompanying drawings. These terms are used merely for ease of description and do not indicate or imply that the relevant device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, ordinal numbers such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0045] Furthermore, it should be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0046] In the chamfering grinding process of workpieces such as wafers, the stage assembly first fixes the workpiece and drives it to rotate. Simultaneously, the grinding wheel on the grinding assembly rotates and contacts the edge of the workpiece, thus achieving grinding processing at various points on the workpiece edge. The stage assembly typically includes a rotating shaft and a driver that drives the rotating shaft. A reducer or other transmission structure is also installed between the driver and the rotating shaft. However, due to transmission errors and inherent structural precision errors in the transmission structure, the positioning accuracy and runout accuracy of the workpiece are affected during rotation, resulting in a decrease in the workpiece's machining quality.

[0047] It should be noted that the "positioning accuracy" mentioned above refers to the accuracy of the workpiece's coordinate values ​​in the horizontal plane, while the "runout accuracy" refers to the accuracy of the workpiece's coordinate values ​​in the vertical direction. It can be seen that excessive positioning accuracy and runout accuracy will affect the quality of the workpiece's chamfered surface, leading to a decrease in the workpiece's processing quality.

[0048] This application uses wafers as the workpiece to be processed as an example for illustration.

[0049] Reference Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the overall structure of a support platform assembly according to an embodiment of this application. Figure 2 for Figure 1 The longitudinal sectional view shows the support platform assembly, which includes a drive motor 1, a rotating shaft 2, a suction cup 3, a gas pipeline 4, and a protective shell 5.

[0050] The rotor of the drive motor 1 has a hollow structure, with a first channel 11 formed inside. The rotating shaft 2 is connected to the rotor of the drive motor 1, and a second channel 21 is formed inside the rotating shaft 2. When the rotating shaft 2 and the drive motor 1 are installed, the first channel 11 and the second channel 21 are connected. The suction cup 3 is fixedly disposed at the end of the rotating shaft 2 away from the drive motor 1. The internal cavity of the suction cup 3 is connected to the second channel 21. The suction cup 3 is used to support the wafer 100. After the wafer 100 is placed on the surface of the suction cup 3, it can be adsorbed and fixed on the suction cup 3 under negative pressure.

[0051] Gas pipe 4 extends into the second channel 21, and gas pipe 4 is sealed to the port of the first channel 11 away from the suction cup 3. In this way, by installing a negative pressure system on gas pipe 4, the gas pipe 4, the first channel 11 and the internal cavity of suction cup 3 form a sealed gas passage.

[0052] The protective shell 5 is disposed on the outside of the drive motor 1 and the rotating shaft 2, serving to support and protect the drive motor 1 and the rotating shaft 2. In one embodiment of this application, the protective shell 5 includes a base 51 and an upper shell 52 detachably connected to the base 51. The base 51 has a first chamber 510 inside, and the upper shell 52 has a second chamber 520 inside. When the upper shell 52 and the base 51 are installed, the first chamber 510 and the second chamber 520 are in communication. The drive motor 1 is at least partially located in the first chamber 510, and the lower end of the rotating shaft 2 is located in the second chamber 520, while the upper end extends out of the second chamber 520.

[0053] In one implementation, the drive motor 1 is fixedly connected to the bottom surface of the base 51, and the bottom of the base 51 has a through hole 511 for the gas pipeline 4 to extend into. As stated above, the drive motor 1 being "at least partially" located in the first chamber 510 means that, depending on the size and model of the drive motor 1, in some embodiments, the drive motor 1 may be entirely located within the first chamber 510, or it may protrude into the second chamber 520; this application does not impose any limitations on this. The upper housing 52 and the base 51 can be connected by fasteners such as bolts; specific connection methods include, but are not limited to, flange connections.

[0054] By setting the protective shell 5 as a base 51 and an upper shell 52 that can be detachably connected to each other, during the assembly of the bearing platform assembly, the drive motor 1 can be installed on the base 51 first, then the gas pipeline 4 can be connected to the rotating shaft 2, then the rotating shaft 2 can be connected to the drive motor 1, and finally the upper shell 52 can be fitted onto the outside of the rotating shaft 2 and fixed to the base 51. This facilitates the assembly and maintenance of the bearing platform assembly.

[0055] As described above, this application hollows out the rotor of the drive motor 1 to form a first channel 11 that penetrates the rotor. This allows the gas pipe 4, which provides an air passage connection to the suction cup 3, to pass through the first channel 11 and form a closed air passage that communicates with the second channel 21 in the rotating shaft 2. This enables the suction cup 3 to adsorb and fix the wafer 100. Based on this, the rotating shaft 2 can be directly connected to the rotor of the drive motor 1, eliminating the transmission structure between the rotating shaft 2 and the drive motor 1. The power of the drive motor 1 is directly transmitted to the rotating shaft 2, which can improve the positioning accuracy and runout accuracy of the suction cup 3 on the rotating shaft 2, thereby improving the processing quality of the wafer 100.

[0056] In one embodiment of this application, the axis of the first channel 11 coincides with the axis of the second channel 21. Thus, the gas passage formed by the gas pipe 4 and the second channel 21 extends in a straight line, minimizing pressure loss caused by gas path deflection or tortuosity, which is beneficial for improving the adsorption effect on the wafer 100.

[0057] Furthermore, the diameter of the first channel 11 is larger than the diameter of the second channel 21, so that the gas pipeline 4 can pass through the second channel 21 more conveniently, and sufficient space can be reserved at the connection between the gas pipeline 4 and the first channel 11 to accommodate components such as seals or sealing joints.

[0058] Reference Figure 2 A first pipe connector 41 is provided at the end of the gas pipeline 4 furthest from the second channel 21. The first pipe connector 41 is used to connect to the negative pressure system for evacuation. In one implementation, the gas pipeline 4 is fixedly connected to the port of the second channel 21, and the first pipe connector 41 is rotatably connected to the port of the gas pipeline 4 furthest from the second channel 21. Thus, during the operation of the support platform assembly, the rotating shaft 2 drives the gas pipeline 4 to rotate relative to the first pipe connector 41. In another implementation, the gas pipeline 4 is rotatably connected to the port of the second channel 21, and the first pipe connector 41 is fixedly connected to the port of the gas pipeline 4 furthest from the second channel 21. In this case, the normal operation of the gas system can also be ensured even when the rotating shaft 2 rotates. Those skilled in the art can choose one of the two methods mentioned above according to actual application requirements.

[0059] Reference Figure 2 and Figure 3 In one implementation of this application, a first groove 521 is formed circumferentially on the inner wall of the upper housing 52 near the suction cup 3, and a first sealing ring 522 is disposed in the first groove 521. A second groove 523 is formed circumferentially on the inner wall of the upper housing 52 near the drive motor 1, and a second sealing ring 524 is disposed in the second groove 523.

[0060] Both the first sealing ring 522 and the second sealing ring 524 are in contact with the side surface of the rotating shaft 2, thereby preventing external moisture, powder and other impurities from entering the second chamber 520 and the first chamber 510 sequentially along the gap between the rotating shaft 2 and the upper housing 52, thus protecting the drive motor 1 and reducing the impact of external impurities on the rotation of the rotating shaft 2.

[0061] Reference Figure 2 and Figure 3 As an embodiment of this application, a third groove 525 is also provided circumferentially on the inner wall of the upper housing 52. Specifically, the third groove 525 is located between the first groove 521 and the suction cup 3, that is, the third groove 525 is closer to the upper end of the upper housing 52. A gas channel 526 is provided in the side wall of the upper housing 52. The gas channel 526 is used to blow air into the third groove 525. For ease of description, one end of the gas channel 526 and the third groove 525 is called the exhaust end, and the other end is called the inlet end. The inlet end of the gas channel 526 is connected to the outer surface of the upper housing 52 to connect to an external gas device, and the exhaust end of the gas channel 526 is connected to the third groove 525.

[0062] When the above technical solution is adopted, by connecting an external gas device to the gas inlet end of the gas channel 526, during the wafer 100 grinding process, the fluid enters the third groove 525 through the gas channel 526, forming a gas barrier in the third groove 525. This prevents impurities such as powder and water vapor during the wafer 100 grinding process from entering the upper housing 52, thus protecting the internal structure of the support stage assembly. Furthermore, when the support stage assembly is not in operation, gas can be blown into the gas channel 526. This blows impurities in the gap between the rotating shaft 2 and the upper housing 52 to the outside, cleaning the gap between the rotating shaft 2 and the upper housing 52.

[0063] Optionally, the gas passage 526 includes a first portion 5261 and a second portion 5262. The first portion 5261 is radially opened along the rotation shaft 2, and the second portion 5262 is axially opened along the rotation shaft 2. The first portion 5261 and the second portion 5262 are interconnected. The first portion 5261 is connected to the third groove 525, and the second portion 5262 extends from the port of the first portion 5261 toward the drive motor 1 and is connected to the outer surface of the upper housing 52. A second pipe connector 527 is fixedly provided on the upper housing 52. The second pipe connector 527 is connected to the second portion 5262 and is used to connect to an external gas device.

[0064] As shown above, by setting the gas channel 526 as a first part 5261 and a second part 5262 with their extension directions perpendicular to each other, the second pipe connector 527 can be set at a position away from the suction cup 3. This can reduce the interference of external gas devices and components such as the second pipe connector 527 on the area around the suction cup 3, and the spatial layout is more reasonable.

[0065] Reference Figure 2 and Figure 3 Based on practical processing considerations, for the first part 5261, during processing, a hole can be drilled radially inward from the outer surface of the upper housing 52 until it penetrates the third groove 525, and then the port of the first part 5261 away from the third groove 525 is sealed with a first plug 5263. Similarly, for the second part 5262, a hole can be drilled axially downward from the end face of the upper housing 52 to a set depth, and then the open end of the second part 5262 is sealed with a second plug 5264.

[0066] It should be noted that, although the above embodiments of this application use the gas channel 526 as an example, which includes a first part 5261 and a second part 5262 extending in mutually perpendicular directions, this does not constitute a limitation on this application, as long as the gas channel 526 can enable the external gas device and the third groove 525 to form a gas passage.

[0067] This application also discloses a grinding apparatus, which includes a grinding component and a support stage assembly as described in any of the above embodiments. The grinding component includes a rotatable grinding wheel and is located on one side of the support stage assembly. During the process of the support stage assembly driving the wafer to rotate, the grinding wheel of the grinding component performs grinding processing on the wafer.

[0068] This application also discloses a chamfering machine, which includes the grinding device in the above embodiments as well as functional parts such as a feeding device, a discharging device, and a detection device, which will not be described in detail here.

[0069] The technical solutions of this application have been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. Without departing from the principles of this application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of this application.

Claims

1. A support platform assembly, characterized in that, include: The drive motor (1) has a first channel (11) inside its rotor; A rotating shaft (2) connected to the rotor, the rotating shaft (2) having a second channel (21) communicating with the first channel (11); A suction cup (3) is disposed at the end of the rotating shaft (2) away from the drive motor (1). The suction cup (3) is used to carry the workpiece to be processed. The internal cavity of the suction cup (3) is connected to the second channel (21). A gas conduit (4) extends into the second channel (21) and is sealed to the port of the first channel (11) away from the suction cup (3).

2. The support platform assembly according to claim 1, characterized in that, The support platform assembly also includes a protective shell (5) disposed outside the drive motor (1) and the rotating shaft (2), with the rotating shaft (2) extending out of the protective shell (5).

3. The support platform assembly according to claim 2, characterized in that, The protective shell (5) includes: The base (51) has a first chamber (510) formed inside it, and the drive motor (1) is at least partially located in the first chamber (510); The upper housing (52) has a second chamber (520) formed inside it. The upper housing (52) is detachably connected to the base (51) to communicate the first chamber (510) and the second chamber (520). One end of the rotating shaft (2) is located in the second chamber (520), and the other end extends out of the second chamber (520).

4. The support platform assembly according to claim 3, characterized in that, The inner wall of the upper housing (52) near the suction cup (3) has a first groove (521) circumferentially provided, and a first sealing ring (522) is provided in the first groove (521).

5. The support platform assembly according to claim 3, characterized in that, The inner wall of the upper housing (52) near the drive motor (1) has a second groove (523) circumferentially provided, and a second sealing ring (524) is provided in the second groove (523).

6. The support platform assembly according to claim 4, characterized in that, The inner wall of the upper housing (52) is also provided with a third groove (525) along its circumference. The third groove (525) is located between the first groove (521) and the suction cup (3). A gas channel (526) is provided in the side wall of the upper housing (52). The inlet end of the gas channel (526) is connected to the outer surface of the upper housing (52), and the exhaust end of the gas channel (526) is connected to the third groove (525).

7. The support platform assembly according to claim 6, characterized in that, The gas passage (526) includes: The first part (5261) is radially opened along the rotation axis (2) and communicates with the third groove (525); The second part (5262) ​​is opened along the axial direction of the rotation shaft (2), the second part (5262) ​​communicates with the first part (5261) and extends toward the side close to the drive motor (1), and the second part (5262) ​​communicates with the outer surface of the upper housing (52).

8. The platform assembly according to any one of claims 1 to 7, characterized in that, The axis of the first channel (11) coincides with the axis of the second channel (21).

9. The support platform assembly according to claim 8, characterized in that, The diameter of the first channel (11) is larger than the diameter of the second channel (21).

10. The support platform assembly according to claim 8, characterized in that, The support platform assembly also includes a first pipe joint (41) disposed at the end of the gas pipe (4) away from the second channel (21); The gas pipeline (4) is fixedly connected to the port of the second channel (21), and the first pipeline connector (41) is rotatably connected to the gas pipeline (4); or The gas pipeline (4) is rotatably connected to the port of the second channel (21), and the first pipeline connector (41) is fixedly connected to the gas pipeline (4).

11. A grinding apparatus, characterized in that, Includes the platform assembly as described in any one of claims 1 to 10.

12. A chamfering machine, characterized in that, Includes the grinding apparatus as described in claim 11.

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