Semiconductor cleaning fluid treatment device

Abstract

The utility model discloses a semiconductor cleaning fluid treatment device, which relates to the technical field of cleaning fluid treatment and comprises a base, one end of the top of the base is clamped with a thread bushing connecting bin through a clamping mechanism, and the top of the thread bushing connecting bin is in threaded connection with a threaded pipe connecting bin. The top of the threaded pipe connecting bin is in threaded connection with a multi-threaded-end water inlet bin, the inner wall of one end of the multi-threaded-end water inlet bin is in threaded connection with a micro-filtration membrane tank, the outer wall of one end of the multi-threaded-end water inlet bin is in threaded connection with a precise filtration membrane tank, and an ultrafiltration filter element is clamped between the threaded sleeve connecting bin and the threaded pipe connecting bin. According to the base provided by the utility model, rapid treatment is carried out on the basis of filtering and decoloring a semiconductor cleaning solution piece, so that the problems that an existing semiconductor cleaning solution treatment device can be used for treatment only after chemicals such as a treatment agent and the like are mixed and react with the cleaning solution, and filtering and decoloring treatment cannot be automatically carried out are solved.

Description

Technical Field

[0001] This utility model relates to the field of cleaning fluid treatment technology, and specifically to a semiconductor cleaning fluid treatment device. Background Technology

[0002] The semiconductor manufacturing process generates a large amount of cleaning wastewater. The main pollutants in the cleaning wastewater are high concentrations of suspended particulate matter and heavy metal ions, so the cleaning wastewater needs to be treated before being discharged.

[0003] A search revealed a semiconductor cleaning fluid treatment device (publication number: CN221940232U) comprising a sedimentation tank and a motor. The sedimentation tank has symmetrically arranged mounting frames rotatably connected inside. Each mounting frame has symmetrically arranged passage slots on its side walls. Symmetrically arranged moving blocks are slidably connected inside each mounting frame. The moving blocks on the same horizontal plane are rotatably connected to a rotating rod. Two transmission racks are fixedly connected to both sides of the sedimentation tank's interior. Guide frames are fixedly connected to both sides of the sedimentation tank's interior, and each guide frame has a guide groove. Driven gears are fixedly connected to both ends of the rotating rod, passing through the passage slots and guide grooves, and these driven gears mesh with the transmission racks. This device improves the mixing efficiency of waste liquid and treatment agent, solving the problems of small contact area and low treatment efficiency associated with traditional direct addition of treatment agents.

[0004] The above technical solution has the following shortcomings;

[0005] The above-mentioned solution requires waiting for the treatment agent and other chemicals to mix and react with the cleaning solution before the discharge standard can be met. This is slow and cannot quickly treat the cleaning solution. Furthermore, the cleaning solution contains a large amount of high-concentration suspended particulate matter, heavy metal ions, and colored liquids, making automatic filtration and decolorization impossible. Therefore, it is necessary to solve the problem that the existing semiconductor cleaning solution treatment device requires waiting for the treatment agent and other chemicals to mix and react with the cleaning solution before it can be used, and it cannot automatically filter and decolorize. Utility Model Content

[0006] In view of the problems existing in the current semiconductor cleaning fluid treatment device, this utility model is proposed.

[0007] Therefore, the purpose of this utility model is to provide a semiconductor cleaning fluid treatment device that solves the problem that existing semiconductor cleaning fluid treatment devices require waiting for the treatment agent and other chemicals to mix with the cleaning fluid to react before they can be used, and that they cannot automatically perform filtration and decolorization.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] A semiconductor cleaning fluid treatment device includes a base. A threaded sleeve connecting chamber is snapped into one end of the top of the base via a snap-fit ​​mechanism. A threaded tube connecting chamber is threadedly connected to the top of the threaded sleeve connecting chamber. A multi-threaded end water inlet chamber is threadedly connected to the top of the threaded tube connecting chamber. A microfiltration membrane tank is threadedly connected to the inner wall of one end of the multi-threaded end water inlet chamber, and a precision filtration membrane tank is threadedly connected to the outer wall of one end of the multi-threaded end water inlet chamber. An ultrafiltration filter element is snapped between the threaded sleeve connecting chamber and the threaded tube connecting chamber. A treatment chamber device is fixedly connected to the top of the base. An L-shaped support frame is fixedly connected to the end of the device. A booster pump is fixedly connected to the top of the L-shaped support frame. A mixing mechanism is provided between the L-shaped support frame and the processing chamber device. A delivery pipe is fixedly connected between the input end of the booster pump device and the output end of the threaded sleeve connecting chamber. A U-shaped heating plate device is fixedly connected to the inner side wall of the processing chamber device. An exhaust sleeve device is fixedly connected to the top of the processing chamber device. A power supply mechanism is provided at one top end of the base and fixedly connected to the U-shaped heating plate device and the exhaust sleeve device. An electric valve is fixedly connected to the output end of the processing chamber.

[0010] Preferably, the snap-fit ​​mechanism includes a snap-fit ​​base and snap-fit ​​plates. The snap-fit ​​base is fixedly connected to one top end of the base, and snap-fit ​​plates are fixedly connected to the side walls of both ends of the threaded sleeve connecting chamber. The snap-fit ​​plates at both ends are inserted into the snap-fit ​​base.

[0011] Preferably, the mixing mechanism includes an ultrasonic generator and an ultrasonic transducer. The ultrasonic generator is fixedly connected to the other end of the top of the L-shaped support frame. The ultrasonic transducer is fixedly connected inside the cavity of the processing chamber device. One end of the ultrasonic transducer passes through the top of the processing chamber device and is fixedly connected to the output end of the ultrasonic generator.

[0012] Preferably, the power supply mechanism includes an ozone generator, a gas supply pipe, and an electromagnetic heating device. The ozone generator is fixedly connected to one top end of the base, the gas supply pipe is fixedly connected to the output end of the ozone generator, the other end of the gas supply pipe is fixedly connected to the input end of the exhaust sleeve device, and the electromagnetic heating device is fixedly connected to one top end of the base. The electromagnetic heating device and the U-shaped heating plate device are fixedly connected.

[0013] Preferably, both the microfiltration membrane tank and the precision filtration membrane tank are tanks with mesh openings on the side walls, and the inner side walls of the cavity are respectively fixedly connected with microfiltration membranes and precision filtration membranes.

[0014] Furthermore, the top two ends of the snap-fit ​​base are provided with limit screw holes, and the side walls of the snap-fit ​​plates at both ends are provided with limit bolts through openings, and the limit bolts at both ends are threadedly connected to the limit screw holes.

[0015] Preferably, the bottom of the base is fixedly connected to multiple casters.

[0016] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0017] 1. This utility model utilizes a microfiltration membrane tank with an internal threaded connection at one end of the multi-threaded water inlet chamber to remove suspended particles, bacteria, and some larger impurities from the cleaning solution entering the multi-threaded water inlet chamber. The precision filtration membrane tank further removes tiny particles from the cleaning solution after the first filtration. Finally, an ultrafiltration filter element removes large molecular organic matter, proteins, and pigments from the second filtration of the cleaning solution.

[0018] 2. This utility model utilizes a U-shaped heating plate device installed at one end of an electromagnetic heating device to heat the cleaning liquid, and utilizes an exhaust sleeve device installed at one end of an ozone generator connected to an air supply pipe to discharge ozone for further treatment of the cleaning liquid. It also utilizes an ultrasonic generator and an ultrasonic transducer to generate ultrasonic waves in the processing chamber, thereby accelerating the reaction time between the cleaning liquid and ozone in conjunction with the U-shaped heating plate device.

[0019] 3. This utility model utilizes a threaded pipe connecting chamber with a threaded connection at the top of the threaded sleeve connecting chamber, and a multi-threaded end water inlet chamber with a threaded connection to the threaded pipe connecting chamber. The threaded connection facilitates disassembly, allowing for easy rotation and removal of the internal microfiltration membrane tank and precision filtration membrane tank, as well as removal, cleaning, and replacement of the ultrafiltration filter element. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0021] Figure 1 This is a front structural diagram of the present invention;

[0022] Figure 2 This is a front structural cross-sectional view of the present invention;

[0023] Figure 3 This is a side structural sectional view of the present invention;

[0024] Figure 4 This is a partial perspective view of the present invention.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Base; 2. Threaded sleeve connection compartment; 3. Threaded pipe connection compartment; 4. Multi-threaded end water inlet compartment; 5. Microfiltration membrane tank; 6. Precision filter membrane tank; 7. Ultrafiltration filter element; 8. Treatment compartment device; 9. L-shaped support frame; 10. Booster pump device; 11. Delivery pipe; 12. U-shaped heating plate device; 13. Exhaust sleeve device; 14. Electric valve; 15. Snap-fit ​​seat; 16. Snap-fit ​​plate; 17. Ultrasonic generator; 18. Ultrasonic transducer; 19. Ozone generator; 20. Air supply pipe; 21. Electromagnetic heating device; 22. Mesh; 23. Microfiltration membrane; 24. Precision filter membrane; 25. Limiting screw hole; 26. Limiting bolt; 27. Casters. Detailed Implementation

[0027] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0028] This utility model discloses a semiconductor cleaning fluid treatment device.

[0029] Example 1

[0030] This utility model provides, for example Figure 1-4A semiconductor cleaning fluid treatment device is shown, comprising a base 1, a threaded sleeve connecting chamber 2 being snapped into one end of the base 1 via a snap-fit ​​mechanism, a threaded tube connecting chamber 3 being threadedly connected to the top of the threaded sleeve connecting chamber 2, a multi-threaded end water inlet chamber 4 being threadedly connected to the top of the threaded tube connecting chamber 3, a microfiltration membrane tank 5 being threadedly connected to the inner wall of one end of the multi-threaded end water inlet chamber 4, a precision filtration membrane tank 6 being threadedly connected to the outer wall of one end of the multi-threaded end water inlet chamber 4, an ultrafiltration filter element 7 being snapped between the threaded sleeve connecting chamber 2 and the threaded tube connecting chamber 3, a treatment chamber device 8 being fixedly connected to the top of the base 1, and an L-shaped [device / device] being fixedly connected to one end of the top of the base 1. The support frame 9 has a booster pump device 10 fixedly connected to its top. A mixing mechanism is provided between the L-shaped support frame 9 and the processing chamber device 8. A delivery pipe 11 is fixedly connected between the input end of the booster pump device 10 and the output end of the threaded sleeve connecting chamber 6. A U-shaped heating plate device 12 is fixedly connected to the inner side wall of the processing chamber device 8. An exhaust sleeve device 13 is fixedly connected to the top of the processing chamber device 8. A power supply mechanism is provided at one end of the top of the base 1, which is fixedly connected to the U-shaped heating plate device 12 and the exhaust sleeve device 13. An electric valve 14 is fixedly connected to the output end of the processing chamber 8. The microfiltration membrane is used to... Tank 5 removes suspended particles, bacteria, and larger impurities from the cleaning solution entering from the multi-threaded end inlet tank 4. A precision filter membrane tank 6 removes fine particles from the first filtration of the cleaning solution. Finally, an ultrafiltration filter element 7 removes large organic molecules, proteins, and pigments from the second filtration. A booster pump device 10 transports the final filtered cleaning solution through a delivery pipe 11 to the treatment chamber device 8. A U-shaped heating plate device 12 heats the cleaning solution, and an exhaust sleeve device 13 releases ozone to further treat the cleaning solution. The process involves using a mixing mechanism to accelerate the reaction time between the cleaning solution and ozone. Finally, the treated cleaning solution is discharged through a water pipe connected to the output end of the electric valve 14. The threaded sleeve connection chamber 2, the threaded pipe connection chamber 3, and the multi-threaded water inlet chamber 4 are connected by threads for easy disassembly. The internal microfiltration membrane tank 5, precision filtration membrane tank 6, and ultrafiltration filter element 7 can be removed for cleaning and replacement. This solves the problem that existing semiconductor cleaning solution treatment devices require waiting for the treatment agent and other chemicals to mix and react with the cleaning solution before treatment can begin, and they cannot automatically perform filtration and decolorization.

[0031] Example 2

[0032] To facilitate the installation and disassembly of the threaded sleeve connection chamber 2 and the base 1, such as Figure 1 and 2As shown, the snap-fit ​​mechanism includes a snap-fit ​​seat 15 and a snap-fit ​​plate 16. The snap-fit ​​seat 15 is fixedly connected to one end of the top of the base 1, and the snap-fit ​​plate 16 is fixedly connected to the side walls of both ends of the threaded sleeve connection chamber 2. The snap-fit ​​plates 16 at both ends are inserted into the snap-fit ​​seat 15. By using the snap-fit ​​plates 16 provided on the side walls of both ends of the threaded sleeve connection chamber 2 and inserting them into the snap-fit ​​seat 15, it is convenient to install and disassemble the threaded sleeve connection chamber 2 and the base 1.

[0033] Example 3

[0034] To accelerate the reaction time between the cleaning solution and ozone, in conjunction with the U-shaped heating plate device 12, such as Figure 1-3 As shown, the mixing mechanism includes an ultrasonic generator 17 and an ultrasonic transducer 18. The ultrasonic generator 17 is fixedly connected to the top of the L-shaped support frame 9. The ultrasonic transducer 18 is fixedly connected inside the cavity of the treatment chamber device 8. One end of the ultrasonic transducer 18 passes through the top of the treatment chamber device 8 and is fixedly connected to the output end of the ultrasonic generator 17. By using the ultrasonic generator 17 and the ultrasonic transducer 18, ultrasonic waves are generated inside the cavity of the treatment chamber device 8, thereby cooperating with the U-shaped heating plate device 12 to accelerate the reaction time between the cleaning fluid and ozone.

[0035] Example 3

[0036] In order to provide corresponding power to the U-shaped heating plate device 12 and the exhaust sleeve device 13, such as Figure 1-3 As shown, the power supply mechanism includes an ozone generator 19, a gas supply pipe 20, and an electromagnetic heating device 21. The ozone generator 19 is fixedly connected to one end of the top of the base 1, and the gas supply pipe 20 is fixedly connected to the output end of the ozone generator 19. The other end of the gas supply pipe 20 is fixedly connected to the input end of the exhaust sleeve device 13. The electromagnetic heating device 21 is fixedly connected to the top of the base 1. The electromagnetic heating device 21 and the U-shaped heating plate device 12 are fixedly connected. The ozone generator 19, with its input end connected to an oxygen cylinder, provides ozone to the exhaust sleeve device 13 through the gas supply pipe 20 at its output end. The electromagnetic heating device 21 heats the U-shaped heating plate device 12, thereby heating the cleaning fluid and accelerating the reaction time between the cleaning fluid and ozone.

[0037] Example 4

[0038] In order for the microfiltration membrane tank 5 and the precision filtration membrane tank 6 to achieve the filtration function, such as Figure 2 and 4 As shown, both the microfiltration membrane tank 5 and the precision filtration membrane tank 6 are tanks with mesh openings 22 on their side walls, and microfiltration membranes 23 and precision filtration membranes 24 are fixedly connected to the inner side walls of the chambers, respectively. By utilizing the microfiltration membranes 23 and precision filtration membranes 24 set in the chambers, the microfiltration membrane tank 5 and the precision filtration membrane tank 6 can achieve the filtration function.

[0039] Example 5

[0040] To limit the position of the snap-fit ​​plate 16 after installation and to facilitate the movement of the device, such as Figure 1-3 As shown, the top two ends of the snap-fit ​​base 15 have limit screw holes 25, and the side walls of the snap-fit ​​plates 16 at both ends are connected to limit bolts 26 through openings. The limit bolts 26 at both ends are threadedly connected to the limit screw holes 25. The bottom of the base 1 is fixedly connected with multiple casters 27. By using the limit bolts 26 to be threadedly connected to the corresponding limit screw holes 25, the snap-fit ​​plates 16 are limited after installation. The multiple casters 27 facilitate the movement of the device.

[0041] How to use:

[0042] In use, the cleaning solution is connected to the multi-threaded inlet tank 4 via a water pipe. The cleaning solution first enters the microfiltration membrane tank 5 through the multi-threaded inlet tank 4, where the microfiltration membrane 23 removes suspended particles, bacteria, and some larger impurities. It then enters the precision filtration membrane tank 6, where the precision filtration membrane 24 removes tiny particles. Finally, the second-filtered cleaning solution passes through the ultrafiltration filter element 7 to remove large organic molecules, proteins, and pigments. A booster pump 10, through a delivery pipe 11, transports the final filtered cleaning solution to the treatment chamber 8. An electromagnetic heating device 21 then... The U-shaped heating plate device 12 heats the cleaning solution, which is then connected to an oxygen cylinder through the input end of the ozone generator 19. Ozone is then supplied to the exhaust sleeve device 13 through the gas supply pipe 20 at the output end. The mixing mechanism accelerates the reaction time between the cleaning solution and the ozone. After treatment, the treated cleaning solution is discharged through a water pipe connected to the output end of the electric valve 14. The threaded sleeve connection chamber 2, the threaded pipe connection chamber 3, and the multi-threaded end water inlet chamber 4 are connected by threads for easy disassembly. This allows for easy rotation and removal of the internal microfiltration membrane tank 5, precision filtration membrane tank 6, and ultrafiltration filter element 7 for cleaning and replacement.

[0043] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A semiconductor cleaning fluid treatment apparatus, comprising a base (1), characterized in that, The top end of the base (1) is snapped with a threaded sleeve connecting chamber (2) via a snap-fit ​​mechanism. The top of the threaded sleeve connecting chamber (2) is threaded with a threaded pipe connecting chamber (3). The top of the threaded pipe connecting chamber (3) is threaded with a multi-threaded end water inlet chamber (4). A microfiltration membrane tank (5) is threaded to the inner wall of one end of the multi-threaded end water inlet chamber (4). A precision filtration membrane tank (6) is threaded to the outer wall of one end of the multi-threaded end water inlet chamber (4). An ultrafiltration filter element (7) is snapped between the threaded sleeve connecting chamber (2) and the threaded pipe connecting chamber (3). A treatment chamber device (8) is fixedly connected to the top of the base (1). An L-shaped support frame (9) is fixedly connected to the top end of the base (1). A booster pump device (10) is fixedly connected to the top of the L-shaped support frame (9). A mixing mechanism is provided between the L-shaped support frame (9) and the processing chamber device (8). A delivery pipe (11) is fixedly connected between the input end of the booster pump device (10) and the output end of the threaded sleeve connection chamber (2). A U-shaped heating plate device (12) is fixedly connected to the inner side wall of the processing chamber device (8). An exhaust sleeve device (13) is fixedly connected to the top of the processing chamber device (8). A power supply mechanism is provided at one end of the top of the base (1) and fixedly connected to the U-shaped heating plate device (12) and the exhaust sleeve device (13). An electric valve (14) is fixedly connected to the output end of the processing chamber device (8).

2. The semiconductor cleaning fluid treatment apparatus according to claim 1, characterized in that, The snap-fit ​​mechanism includes a snap-fit ​​seat (15) and a snap-fit ​​plate (16). The snap-fit ​​seat (15) is fixedly connected to one end of the top of the base (1), and the snap-fit ​​plate (16) is fixedly connected to the side walls of both ends of the threaded sleeve connecting chamber (2). The snap-fit ​​plates (16) at both ends are inserted into the snap-fit ​​seat (15).

3. The semiconductor cleaning solution treatment apparatus according to claim 1, characterized in that, The mixing mechanism includes an ultrasonic generator (17) and an ultrasonic transducer (18). The ultrasonic generator (17) is fixedly connected to the other end of the top of the L-shaped support frame (9). The ultrasonic transducer (18) is fixedly connected inside the cavity of the processing chamber device (8). One end of the ultrasonic transducer (18) passes through the top of the processing chamber device (8) and is fixedly connected to the output end of the ultrasonic generator (17).

4. The semiconductor cleaning solution treatment apparatus according to claim 1, characterized in that, The power supply mechanism includes an ozone generator (19), a gas supply pipe (20), and an electromagnetic heating device (21). The ozone generator (19) is fixedly connected to one end of the top of the base (1). The gas supply pipe (20) is fixedly connected to the output end of the ozone generator (19). The other end of the gas supply pipe (20) is fixedly connected to the input end of the exhaust sleeve device (13). The electromagnetic heating device (21) is fixedly connected to one end of the top of the base (1). The electromagnetic heating device (21) and the U-shaped heating plate device (12) are fixedly connected.

5. The semiconductor cleaning fluid treatment apparatus according to claim 1, characterized in that, The microfiltration membrane tank (5) and the precision filtration membrane tank (6) are both tanks with mesh holes (22) on the side walls, and the inner side walls of the cavity are respectively fixedly connected with microfiltration membrane (23) and precision filtration membrane (24).

6. The semiconductor cleaning fluid treatment apparatus according to claim 2, characterized in that, The top two ends of the snap-fit ​​base (15) are provided with limiting screw holes (25), and the side walls of the snap-fit ​​plates (16) at both ends are connected to limiting bolts (26) through openings. The limiting bolts (26) at both ends are threadedly connected to the limiting screw holes (25).

7. The semiconductor cleaning fluid treatment apparatus according to claim 1, characterized in that, The bottom of the base (1) is fixedly connected to multiple casters (27).

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