Flexible circuit board stamping deviation inspection device

Abstract

The utility model discloses a flexible circuit board stamping deviation checking device, and relates to the field of circuit board processing. The flexible circuit board stamping offset inspection device comprises a mounting seat arranged on a stamping mechanical arm and a stamping offset mark arranged on a circuit board body, a connecting frame is movably clamped on the mounting seat, a loop detection probe is arranged on the connecting frame, the stamping offset mark is made of a conductive material, and the circuit board body is provided with a circuit detection probe. And the stamping offset mark is arranged below the loop detection probe. According to the flexible circuit board stamping offset inspection device, no secondary measuring equipment needs to be specially arranged, offset detection can be carried out in the stamping process only by additionally installing the device on a traditional stamping mechanical arm, the detection mode is low in cost and good in stability and accuracy, the FPC typesetting rate is not occupied, defective products are prevented from flowing out, the inspection cost is reduced, and the production efficiency is improved. The inspection efficiency and the product quality are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board processing, in particular to flexible circuit board stamping offset inspection device. BACKGROUND

[0002] Flexible circuit board as the important component of electronic product, along with product style diversification, assembly integration is more and more complex, and the requirement precision is higher and higher, mainly reflected in the appearance to the line offset requirement is more and more strict

[0003] Traditional inspection offset device usually uses secondary measurement equipment, measures the appearance to line size;Meanwhile, visual inspection mark will be placed, through setting inspection station, lets the inspector to implement the inspection to appearance, but this kind of inspection mode has many artificial influence factors, makes after inspection still there is higher defective product, influences product quality, in view of the deficiency of prior art, the utility model provides flexible circuit board stamping offset inspection device to solve above-mentioned problem. UTILITY MODEL CONTENT

[0004] In view of the deficiency of prior art, the utility model provides flexible circuit board stamping offset inspection device, need not specially set secondary measurement equipment, only need to install the device on traditional stamping mechanical arm, can realize offset detection to stamping process, this detection mode cost is low, stability and accuracy are good, need not occupy FPC layout rate, prevents defective product to flow out, reduces inspection cost, improves inspection efficiency, promotes product quality.

[0005] In order to realize above-mentioned purpose, the utility model is realized through following technical scheme: flexible circuit board stamping offset inspection device, including the installation seat set on stamping mechanical arm and the stamping offset mark set on the circuit board main body, the connecting frame is movably connected on the installation seat, and the loop detection probe is equipped on the connecting frame;

[0006] The stamping offset mark is made of conductive material, and the stamping offset mark is arranged below the loop detection probe.

[0007] Preferably, the circuit board main body is provided with a stamping area and a detection area, the stamping offset mark is located in the detection area, and the stamping area is located below the stamping mechanical arm.

[0008] Preferably, the connecting frame is provided with an adjusting block, the adjusting block is threadedly connected with a clamping bolt, and the clamping bolt and the adjusting block are used for clamping and limiting the installation seat.

[0009] Preferably, the installation seat is provided with a clamping groove corresponding to the adjusting block.

[0010] Preferably, the connecting frame is provided with a buffer assembly for supporting the loop detection probe, the loop detection probe is slidably connected to the connecting frame, and the buffer assembly comprises a fixed block arranged on the loop detection probe and a spring fixedly connected between the fixed block and the connecting frame.

[0011] Preferably, the top of the loop detection probe is fixedly connected with a stop block.

[0012] Preferably, the detection area is supported by a stamping offset mark, and the stamping offset mark extends to the position of the stamping area.

[0013] Preferably, the stamping offset mark is provided with a metal detection contact.

[0014] The utility model discloses a flexible circuit board stamping offset inspection device, and has the beneficial effects as follows:

[0015] The flexible circuit board stamping offset inspection device does not need to specially set secondary measurement equipment, only needs to install the device on the traditional stamping mechanical arm, can realize offset detection in the stamping process, the detection mode is low in cost, good in stability and accuracy, does not need to occupy FPC layout rate, prevents defective products from flowing out, reduces inspection cost, improves inspection efficiency and improves product quality. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without paying creative labor.

[0017] Figure 1 It is the whole structure schematic diagram of the utility model;

[0018] Figure 2 It is the structure schematic diagram of the buffer assembly of the utility model;

[0019] Figure 3 It is the utility model Figure 2 The enlarged view of part A;

[0020] Figure 4 It is the structure schematic diagram of the circuit board main body of the utility model.

[0021] In the drawing: 1, stamping mechanical arm;2, mounting seat;21, clamping groove;3, connecting frame;31, adjusting block;32, clamping bolt;4, loop detection probe;5, circuit board main body;51, stamping area;52, detection area;53, stamping offset mark;6, buffer assembly;61, fixed block;62, spring;63, stop block. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0023] The flexible circuit board stamping offset checking device provided in the embodiments of the present application solves the problem that the traditional offset checking device usually uses secondary measurement equipment to measure the size of the appearance to the circuit, and places visual inspection marks, and through the setting of a checking station, an inspector checks the appearance, but this checking method has many human factors, so that after checking, there are still a large number of defective products, which affects the product quality.

[0024] In order to better understand the above technical scheme, the above technical scheme will be described in detail in combination with the drawings of the specification and specific embodiments.

[0025] The embodiments of the present application disclose a flexible circuit board stamping offset checking device, according to the accompanying drawings Figures 1-4 As shown in the drawings, the device comprises a mounting seat 2 arranged on a stamping mechanical arm 1 and a stamping offset mark 53 arranged on a circuit board body 5, a connecting frame 3 is movably connected to the mounting seat 2, and a loop detection probe 4 is arranged on the connecting frame 3.

[0026] The stamping offset mark 53 is made of conductive material, the stamping offset mark 53 is arranged below the loop detection probe 4, and the stamping offset mark 53 is provided with a metal detection contact.

[0027] During use of the device, the stamping action is controlled by the stamping mechanical arm 1, and during stamping, if the circuit on the circuit board body 5 does not appear stamping offset, the loop is complete, the loop detection probe 4 contacts the stamping offset mark 53 on the circuit board body 5, and a closed loop conduction is formed with the loop detection instrument of the loop detection probe 4, and the program determines that there is no stamping offset; if there is stamping offset, the circuit of the circuit board body 5 is disconnected, and after detection by the loop detection probe 4, a closed loop cannot be formed, and the program determines that there is stamping offset. Since each circuit board body 5 is provided with one stamping offset mark 53, only the products with stamping offset can be detected in the electrical test and automatically marked NG on the corresponding products, and the special traceability system of the factory is uploaded, and the defective products are removed in the subsequent special process.

[0028] The circuit board body 5 is provided with a punching area 51 and a detection area 52, the punching offset mark 53 is located in the detection area 52, the punching area 51 is located below the punching mechanical arm 1, and the punching area 51 and the detection area 52 are separated, so that the detection effect is accurate and good.

[0029] The connecting frame 3 is provided with an adjusting block 31, the adjusting block 31 is threadedly connected with a clamping bolt 32, the clamping bolt 32 and the adjusting block 31 are used for clamping and limiting the mounting seat 2, the mounting seat 2 is provided with a clamping groove 21 corresponding to the adjusting block 31, the device is convenient for realizing spacing and position adjustment of the loop detection probe 4 through the design of the adjusting block 31 and the clamping bolt 32, so that the loop detection probe 4 is adapted to various models of the circuit board body 5 for detection, when the position of the loop detection probe 4 needs to be adjusted, the adjusting block 31 is only needed to be slid transversely, the connecting frame 3 and the loop detection probe 4 are driven to displace through the adjusting block 31, and after the position is adjusted, the clamping bolt 32 is tightened and the mounting seat 2 is clamped and limited.

[0030] The connecting frame 3 is provided with a buffer assembly 6 for supporting the loop detection probe 4, the loop detection probe 4 is slidably connected to the connecting frame 3, the buffer assembly 6 comprises a fixed block 61 arranged on the loop detection probe 4 and a spring 62 fixedly connected between the fixed block 61 and the connecting frame 3, the device is convenient for realizing buffering of the loop detection probe 4 through the design of the buffer assembly 6, when the loop detection probe 4 is in contact with and extruded by the circuit board body 5, the loop detection probe 4 is activated and drives the fixed block 61 to extrude the spring 62, buffering is provided, the loop detection probe 4 is prevented from being damaged, and the service life and stability of the loop detection probe 4 are improved.

[0031] The top of the loop detection probe 4 is fixedly connected with a stop block 63, the loop detection probe 4 is limited through the stop block 63, and excessive displacement of the loop detection probe 4 is avoided.

[0032] The detection area 52 supports the punching offset mark 53, and the punching offset mark 53 extends to the position of the punching area 51.

[0033] The basic principle and main features of the utility model and the advantages of the utility model are shown and described. It should be understood by those skilled in the art that the utility model is not limited by the above-mentioned embodiments, and the above-mentioned embodiments and the description in the specification only illustrate the principle of the utility model, various changes and improvements of the utility model can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The protection scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A flexible circuit board stamping offset inspection device, comprising a mounting seat (2) arranged on a stamping mechanical arm (1) and a stamping offset mark (53) arranged on a circuit board main body (5), characterized in that: The connecting frame (3) is movably connected to the mounting base (2), and the loop detection probe (4) is arranged on the connecting frame (3); The stamping offset mark (53) is made of conductive material, and is arranged below the loop detection probe (4); The circuit board body (5) is provided with a stamping area (51) and a detection area (52), the stamping offset mark (53) is located in the detection area (52), and the stamping area (51) is located below the stamping mechanical arm (1); The connecting frame (3) is provided with an adjusting block (31), the adjusting block (31) is threadedly connected with a clamping bolt (32), and the clamping bolt (32) and the adjusting block (31) are used for clamping and limiting the mounting base (2); The connecting frame (3) is provided with a buffer assembly (6) for supporting the loop detection probe (4), the loop detection probe (4) is slidably connected to the connecting frame (3), and the buffer assembly (6) comprises a fixed block (61) arranged on the loop detection probe (4) and a spring (62) fixedly connected between the fixed block (61) and the connecting frame (3); The detection area (52) supports the stamping offset mark (53), and the stamping offset mark (53) extends to the position of the stamping area (51).

2. The flexible wiring board press displacement inspection apparatus according to claim 1, characterized by: The mounting base (2) is provided with a clamping groove (21) corresponding to the adjusting block (31).

3. The flexible wiring board press displacement inspection apparatus according to claim 1, characterized by: The top of the loop detection probe (4) is fixedly connected with a stop block (63).

4. The flexible wiring board press displacement inspection apparatus according to claim 1, characterized by: The stamping offset mark (53) is provided with a metal detection contact.

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