Radio frequency power amplifier test tool

Abstract

According to the radio frequency power amplifier test tool provided by the utility model, the structure of the radio frequency power amplifier test tool is improved, so that the heat dissipation efficiency is improved, and the accuracy of a test result is ensured. The radio frequency power amplifier test tool comprises a base assembly and a pressing assembly, a to-be-tested piece is placed between the base assembly and the pressing assembly, and the pressing assembly presses the to-be-tested piece to the base assembly; the base assembly is provided with a first heat conduction piece, the pressing assembly is provided with a second heat conduction piece, and the first heat conduction piece is arranged opposite to the second heat conduction piece in the vertical direction; the first heat conduction piece and the second heat conduction piece are attached to the corresponding side surfaces of the to-be-tested piece. According to the testing tool, the two heat conduction pieces are arranged on the testing tool to make contact with the bottom and the top of the radio frequency power amplifier respectively, the conduction heat dissipation area of the radio frequency power amplifier is increased, heat of the radio frequency power amplifier can be conducted out, the heat dissipation efficiency is improved, and the accuracy of the testing result is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency power amplifier testing technology, specifically to a radio frequency power amplifier testing fixture. Background Technology

[0002] As a key component in wireless communication systems, the performance stability and reliability of radio frequency (RF) power amplifiers are of paramount importance. During the testing process, a series of performance tests are required to verify whether the RF power amplifier's various technical specifications meet the design requirements. RF power amplifiers generate significant heat during operation; poor heat dissipation during testing can lead to inaccurate test data, thus affecting the determination of its pass / fail status.

[0003] Currently, during RF power amplifier testing, the amplifier is placed directly on a metal base plate, which dissipates the heat. However, this method has low heat dissipation efficiency and is prone to causing reduced accuracy in factory test results due to poor heat dissipation. Utility Model Content

[0004] The purpose of this invention is to provide a test fixture for radio frequency power amplifiers. By improving the structure of the test fixture, the heat dissipation efficiency is improved, and the accuracy of the test results is guaranteed.

[0005] To achieve the above objectives, this utility model provides a radio frequency power amplifier test fixture, including a base assembly and a pressing assembly. The base assembly and the pressing assembly are used to place a device under test (DUT), and the pressing assembly presses the DUT against the base assembly. The base assembly has a first heat-conducting element, and the pressing assembly has a second heat-conducting element. The first heat-conducting element is vertically opposite to the second heat-conducting element. The first heat-conducting element and the second heat-conducting element are in contact with the corresponding side surfaces of the DUT.

[0006] In this application, by setting two heat conduction components in the test fixture to contact the bottom and top of the RF power amplifier respectively, the heat conduction and heat dissipation area of ​​the RF power amplifier is increased, which can dissipate the heat of the RF power amplifier, improve the heat dissipation efficiency, and ensure the accuracy of the test results.

[0007] Optionally, it also includes a positioning connection device, through which the pressing component is hinged to the base component.

[0008] By hinged the pressing component to the base component, the pressing component can be rotated during the loading and unloading process to avoid obstructing the passage of the loading and unloading components; in addition, it also facilitates the storage of RF power amplifier test fixtures and avoids the loss of components.

[0009] Optionally, the positioning device includes a slide rod disposed on the base assembly and a slide hole opened in the pressing assembly, the slide hole being rotatably adapted to the slide rod through the hole;

[0010] The pressing component is capable of moving up and down relative to the base assembly along the extension direction of the slide bar.

[0011] Therefore, it can be applied to test pieces of different thicknesses.

[0012] Optionally, the base assembly has a base upper surface, a portion of which is recessed to form a first groove; the pressing assembly has a pressing lower surface, a portion of which is recessed to form a second groove.

[0013] The first tank is used to accommodate the first heat-conducting element, and the second tank is used to accommodate the second heat-conducting element.

[0014] By creating a groove to place the heat transfer component, it is possible to connect and limit the heat transfer component.

[0015] Optionally, the base assembly has a lower base surface, and the lower base surface is provided with a heat dissipation device; and / or,

[0016] The pressing component has a pressing upper surface, and the pressing upper surface is provided with a heat dissipation device.

[0017] Further adding a heat dissipation device to the base assembly or pressure assembly can further increase the heat dissipation efficiency of the RF power amplifier test fixture.

[0018] Optionally, the heat dissipation device includes a plurality of vertically recessed heat dissipation grooves, which are constructed on the lower surface of the base and / or the upper surface of the pressure plate;

[0019] The heat dissipation device further includes a cooling fan, which is disposed on at least one of the lower surface of the base and the upper surface of the pressure plate. The cooling fan has an air outlet side, which is vertically opposite to the bottom of the corresponding heat dissipation groove.

[0020] The heat sink is compatible with the cooling fan, which can accelerate heat exchange while guiding the air blown out by the cooling fan.

[0021] Optionally, the heat dissipation groove is defined to have a first direction on a horizontal plane and extends along the first direction;

[0022] The heat dissipation groove located in the base assembly and / or the pressing assembly extends through the sidewall of the corresponding base assembly and pressing assembly in its extending direction.

[0023] Therefore, the hot air generated after heat exchange can be guided to the side of the base assembly or the pressing assembly, thereby controlling the outlet position of the hot air.

[0024] Optionally, the base assembly further includes a pickup channel formed by a recess in a portion of the sidewall of the base assembly toward the side closest to the first heat-conducting element.

[0025] This allows the test piece to be lifted from the bottom of the base assembly, facilitating the removal of the test piece.

[0026] Optionally, a second direction is defined on a horizontal plane perpendicular to the first direction, and the pick-up channels are distributed along the second direction on at least one side of the first heat-conducting component. This increases the lifting position of the component under test, thereby improving the adaptability of the RF power amplifier test fixture.

[0027] Optionally, the base assembly further includes a grounding wire; in the first direction, at least one side of the pick-up channel has a grounded conductive area for contacting the device under test, and the grounded conductive area is electrically connected to the grounding wire.

[0028] This allows for the use of a grounded conductive area within the component pick-up channel, thereby improving the space utilization of the RF power amplifier test fixture and reducing its size.

[0029] Other features and advantages of this specification will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0030] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of this specification and, together with their description, serve to explain the principles of this specification.

[0031] Figure 1 This is a schematic diagram of the structure of the RF power amplifier test fixture in this embodiment of the present invention;

[0032] Figure 2 yes Figure 1 A schematic diagram of the base assembly in the diagram;

[0033] Figure 3 This is a top view of the base plate;

[0034] Figure 4 This is a bottom view of the base plate;

[0035] Figure 5 This is a bottom view of the pressure plate;

[0036] Figure 6 This is a top view of the pressure-down component;

[0037] Figure 7 This is the mounting state of the RF power amplifier test fixture in this application;

[0038] Figure 8 The RF power amplifier test fixture in this application is in the test state.

[0039] Figure label:

[0040] 100-Base assembly; 101-Base plate; 102-First groove; 103-First heat conduction component; 104-Third groove; 105-Slide rod; 106-Conductive cotton; 107-Piece retrieval channel; 108-Grounding wire; 109-Support rod;

[0041] 200 - Pressing assembly; 201 - Pressure plate; 202 - Sliding hole; 203 - Bearing; 204 - Second heat conduction component; 205 - Counterweight;

[0042] 300 - Heat dissipation device; 301 - Heat dissipation trough; 302 - Cooling fan; 303 - Protective mesh;

[0043] 400 - Item to be tested. Detailed Implementation

[0044] This invention provides a test fixture for radio frequency power amplifiers. By improving the structure of the test fixture, heat dissipation efficiency is increased and the accuracy of test results is ensured.

[0045] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] Relational terms such as “first” and “second” are used merely to distinguish one component from another that has the same name, without necessarily requiring or implying any such actual relationship or order between the components.

[0047] Please refer to Figure 1 and Figure 8 , Figure 1 This is a schematic diagram of the structure of the RF power amplifier test fixture in this embodiment of the present invention; Figure 2 yes Figure 1 A structural diagram of the base assembly; Figure 3 This is a top view of the base plate; Figure 4 This is a bottom view of the base plate; Figure 5 This is a bottom view of the pressure plate; Figure 6 This is a top view of the pressure-down component; Figure 7 This is the mounting state of the RF power amplifier test fixture in this application; Figure 8 The RF power amplifier test fixture in this application is in the test state.

[0048] This invention provides a radio frequency (RF) power amplifier test fixture, which includes a base assembly 100 and a pressing assembly 200. A device under test (DUT) 400 is placed between the base assembly 100 and the pressing assembly 200, and the pressing assembly 200 presses the DUT 400 against the base assembly 100. The base assembly 100 has a first heat-conducting element 103, and the pressing assembly 200 has a second heat-conducting element 204. The first heat-conducting element 103 is vertically positioned opposite to the second heat-conducting element 204. The first heat-conducting element 103 and the second heat-conducting element 204 are used to contact the corresponding side surfaces of the DUT 400.

[0049] In a specific example, the base assembly 100 includes a base plate 101, and the pressing assembly 200 includes a pressure plate 201, which is located vertically above the base plate 101. The base plate 101 is divided into an upper surface and a lower surface on its upper and lower vertical surfaces, respectively, and the pressure plate 201 is divided into an upper surface and a lower surface on its upper and lower vertical surfaces, respectively. The upper surface of the base and the lower surface of the pressure plate 201 are vertically opposite each other, and the area between them is used to accommodate the test piece 400. A first heat-conducting element 103 is disposed on the upper surface of the base, and a second heat-conducting element 204 is disposed on the lower surface of the pressure plate 201.

[0050] The first heat conduction element 103 and the second heat conduction element 204 can be thermally conductive silicone pads or thermally conductive silicone grease. Thermally conductive silicone grease and thermally conductive silicone pads can make up for the tiny gaps left when metals come into contact with each other in the traditional way, thereby achieving close contact between the test piece 400 and the base plate 101 and the pressure plate 201, thereby further improving the heat conduction between the test piece 400, the base plate 101 and the pressure plate 201.

[0051] In this application, by setting two heat conduction components in the test fixture to contact the bottom and top of the RF power amplifier respectively, the heat conduction and heat dissipation area of ​​the RF power amplifier is increased, which can dissipate the heat of the RF power amplifier, improve the heat dissipation efficiency, and ensure the accuracy of the test results.

[0052] In this embodiment, the testing fixture further includes a positioning and connecting device. The positioning device includes a slide rod 105 disposed on the base assembly 100 and a sliding hole 202 formed in the pressing assembly 200, the sliding hole 202 penetrating the pressing assembly 200. The slide rod 105 is inserted into the sliding hole 202 and is in clearance fit with the hole wall of the sliding hole 202.

[0053] Therefore, the pressing component 200 can move up and down relative to the base assembly 100 along the extension direction of the slide rod 105. During actual testing, the test piece 400 is placed on the first heat-conducting component 103. The pressing component 200, by its own weight, slides down to the upper side of the test piece 400. At this time, the second heat-conducting component 204 abuts against the upper surface of the test piece 400, and the pressing component 200, by its own weight, presses the test piece 400 against the first heat-conducting component 103. This achieves the pressing of the test piece 400 against the two heat-conducting components. Simultaneously, it increases the adaptability of the testing fixture in this application to accommodate test pieces 400 of different thicknesses. In an optional configuration, a bearing 203 is also provided within the sliding hole 202, and the slide rod 105 is inserted into the bearing 203. The pressing component 200 is hinged to the base assembly 100 via a positioning connection device. To increase its own weight, a counterweight 205 can also be installed on the pressure plate 201.

[0054] By hinged to the base assembly 100, the pressing component 200 can be rotated during the loading and unloading process to avoid obstructing the passage of the loading and unloading components; in addition, it also facilitates the storage of RF power amplifier test fixtures and avoids the loss of components.

[0055] To facilitate the mounting of the heat-conducting component, a portion of the upper surface of the base is recessed to form a first groove 102. The pressing assembly 200 has a pressing lower surface, a portion of which is recessed to form a second groove.

[0056] The first groove 102 is used to accommodate the first heat-conducting component 103, and the second groove is used to accommodate the second heat-conducting component 204. When the heat-conducting component is a thermally conductive silicone pad, the thermally conductive silicone pad is placed in the corresponding groove. When the test piece 400 is not placed, the surface of the heat-conducting component protrudes from the upper surface and the lower surface of the corresponding base. By creating grooves to place the heat-conducting component, the heat-conducting component can be connected and positioned.

[0057] In the example shown in the figure, the first heat conduction element 103 is disposed in the middle of the upper surface of the base, and the rest of the upper surface of the base is distributed around the first heat conduction element 103, forming the edge of the upper surface of the base.

[0058] At least one third groove 104 is provided on the edge of the upper surface of the base for placing conductive cotton 106. The portion where the third groove 104 is located is defined as the grounding conductive area, which is used to contact the device under test. The base assembly 100 also includes a grounding wire, and the grounding conductive area is electrically connected to the grounding wire. By adopting this method, the RF power amplifier is grounded stably. During operation, the RF power amplifier is pressed tightly against the conductive cotton 106, ensuring that it is always well grounded.

[0059] In the example shown, to facilitate the unloading of the test piece 400, the base assembly 100 also includes a pick-up channel 107. The pick-up channel 107 is formed by a recess in a portion of the side wall of the base assembly 100 toward the side where the first heat-conducting element 103 is located. That is, a recessed groove is formed in a portion of the side wall of the base plate 101 as the pick-up channel 107. During the unloading process, the lifting element can lift a portion of the test piece 400 through the pick-up channel 107, thereby facilitating the unloading operation.

[0060] During actual testing, when loading the component, ensure that part of the component to be tested 400 covers a portion of the component retrieval channel 107 to facilitate the unloading operation.

[0061] The pick-up channels 107 are distributed in a second direction on at least one side of the first heat-conducting component 103. This increases the lifting position of the device under test (DUT), thereby improving the adaptability of the RF power amplifier test fixture. Specifically, to increase adaptability to different DUTs 400, the pick-up channels 107 can be arranged around the first heat-conducting component 103. Alternatively, as shown in the figure, two pick-up channels 107 can be arranged, with the two pick-up channels 107 distributed on both sides of the first heat-conducting component 103 in a second direction. The distribution direction of the two pick-up channels 107 is the second direction. It can be either the left-right direction shown in the figure or the up-down direction shown in the figure.

[0062] In the aforementioned example, the direction perpendicular to the second direction is the first direction, and in the first direction, at least one side of the pick-up channel 107 has a grounded conductive area. In the example shown in the figure, two grounded conductive areas are provided on both sides of each pick-up channel 107. This allows the grounded conductive area to be provided within the portion of the pick-up channel 107, thereby improving the space utilization of the RF power amplifier test fixture and reducing its size.

[0063] In some other embodiments of this application, to increase the heat dissipation efficiency of the test fixture, a heat dissipation device 300 is provided on the lower surface of the base; and / or, the pressing assembly 200 has a pressing upper surface, on which the heat dissipation device 300 is provided. That is, the heat dissipation device 300 is provided on the lower surface of the base or the pressing upper surface, or both. The specific structure of the heat dissipation device 300 can be a structure such as a semiconductor cooling chip or the heat dissipation device 300 structure shown in the figure.

[0064] Specifically, the heat dissipation device 300 includes a plurality of vertically recessed heat dissipation grooves 301, which are constructed on the lower surface of the base and / or the upper surface of the base; the heat dissipation device 300 also includes a cooling fan 302, which is disposed on at least one of the lower surface of the base and the upper surface of the base, and the cooling fan 302 has an air outlet side, which is vertically opposite to the bottom of the corresponding heat dissipation groove 301.

[0065] The heat dissipation groove 301 located on the lower surface of the base is formed by a concave shape on the lower surface of the base, but does not penetrate the base plate 101; similarly, the heat dissipation groove 301 located on the upper surface of the pressure plate 201 is formed by a concave shape on the upper surface of the pressure plate 201, and also does not penetrate the pressure plate 201. A plurality of heat dissipation grooves 301 are spaced apart along the second direction and extend along the first direction.

[0066] The cooling fan 302 is fixedly connected to the surface on the corresponding side, and its air outlet side is opposite to the bottom of the heat sink 301 on the corresponding side. When the cooling fan 302 blows air, the hot air that has absorbed heat will move along the extension direction of the heat sink 301 and be discharged to the outside.

[0067] Optionally, a protective mesh 303 is also provided on the air intake side of the cooling fan 302 to filter the air intake side and protect the cooling fan 302.

[0068] In actual operation, operators typically face the test fixture in the second direction and operate the test fixture. The heat dissipation slot 301 located in the base assembly 100 and / or the pressure assembly 200 penetrates the sidewall of the corresponding base assembly 100 and pressure assembly 200 in the first direction. This allows the hot air generated after heat exchange to be guided to the side of the base assembly 100 or pressure assembly 200, thereby controlling the outlet position of the hot air.

[0069] In the aforementioned scheme, in order to install a heat dissipation device 300 on the lower surface of the base, a number of support rods 109 are also provided on the lower side of the base plate 101. The support rods 109 support the base plate 101 to a certain height, thereby enabling the heat dissipation device 300 to be installed on the lower side of the base plate 101.

[0070] Compared with the prior art, this application has the following advantages:

[0071] First, the test fixture in this application is compatible with RF power amplifiers of any size. The down-pressing component 200 in the test fixture of this application can slide up and down along the guide rail, thereby adapting to RF power amplifiers of different sizes.

[0072] Second, the test fixture in this application can achieve good contact between the RF power amplifier and the heat dissipation component without external force.

[0073] Third, the grounding scheme for the test fixture in this application is simple and easy to operate. The test fixture in this application uses conductive cotton 106 to achieve electrical conductivity between the RF power amplifier shell and the fixture, eliminating the need for additional grounding operations such as wiring, soldering, and screwing.

[0074] Fourth, the pressure component 200 of the test fixture in this application can slide up and down and rotate, providing ample operating space for the disassembly and assembly of the RF power amplifier; the test fixture in this application is equipped with a handle feature, which can easily remove the RF power amplifier from the thermal pad.

[0075] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A test fixture for an RF power amplifier, characterized in that, The device includes a base assembly (100) and a pressing assembly (200), wherein a test piece (400) is placed between the base assembly (100) and the pressing assembly (200), and the pressing assembly (200) is used to press the test piece (400) against the base assembly (100); the base assembly (100) has a first heat conduction element (103), and the pressing assembly (200) has a second heat conduction element (204), wherein the first heat conduction element (103) is vertically opposite to the second heat conduction element (204); the first heat conduction element (103) and the second heat conduction element (204) are in contact with the corresponding side surfaces of the test piece (400).

2. The RF power amplifier test fixture according to claim 1, characterized in that, The first heat conduction element (103) and the second heat conduction element (204) can be thermally conductive silicone pads or thermally conductive silicone grease.

3. The RF power amplifier test fixture according to claim 2, characterized in that, It also includes a positioning device, through which the base assembly (100) is hinged to the pressing assembly (200); The positioning device includes a slide rod (105) disposed on the base assembly (100) and a slide hole (202) opened on the pressing assembly (200). The slide rod (105) can be inserted into the slide hole (202) and is in clearance fit with the slide hole (202). The slide bar (105) extends vertically, and the pressing assembly (200) is capable of moving up and down relative to the base assembly (100) along the slide bar (105).

4. The RF power amplifier test fixture according to claim 1, characterized in that, The base assembly (100) has a base upper surface, a portion of which is recessed to form a first groove (102); the pressing assembly (200) has a pressing lower surface, a portion of which is recessed to form a second groove. The first tank (102) is used to accommodate the first heat-conducting element (103), and the second tank is used to accommodate the second heat-conducting element (204).

5. The RF power amplifier test fixture according to claim 4, characterized in that, The base assembly (100) has a lower base surface, on which a heat dissipation device (300) is provided; and / or, the pressing assembly (200) has a pressing upper surface, on which a heat dissipation device (300) is provided.

6. The RF power amplifier test fixture according to claim 5, characterized in that, The heat dissipation device (300) includes a plurality of vertically recessed heat dissipation grooves (301), which are constructed on the lower surface of the base and / or on the upper surface of the pressure plate; The heat dissipation device (300) further includes a cooling fan (302), which is disposed on at least one of the lower surface of the base and the upper surface of the pressure plate. The cooling fan (302) has an air outlet side, which is vertically opposite to the bottom of the corresponding heat dissipation groove (301).

7. The RF power amplifier test fixture according to claim 6, characterized in that, Defined to have a first direction on a horizontal plane, the heat dissipation groove (301) extends along the first direction; The heat dissipation groove (301) located in the base assembly (100) and / or the pressing assembly (200) extends through the side wall of the corresponding base assembly (100) or the pressing assembly (200) in its extending direction.

8. The RF power amplifier test fixture according to any one of claims 1-7, characterized in that, The base assembly (100) also includes a pickup channel (107) formed by a portion of the sidewall of the base assembly (100) recessed toward the side closest to the first heat-conducting element (103).

9. The RF power amplifier test fixture according to claim 8, characterized in that, A first direction is defined on a horizontal plane, and a second direction is defined as perpendicular to the first direction; The pick-up channel (107) is located on at least one side of the first heat conduction member (103) in the second direction.

10. The RF power amplifier test fixture according to claim 9, characterized in that, The base assembly (100) also includes a grounding wire (108). In the first direction, at least one side of the pick-up channel (107) has a grounded conductive area, which is used to contact any position of the test piece (400) and is electrically connected to the grounding wire (108).

Images