Heat dissipation device

Abstract

The utility model discloses a heat dissipation device, which comprises a box body, at least one heat pipe, a water cooling row and a uniform temperature plate, the box body is provided with an accommodating space, and the at least one heat pipe is arranged in the accommodating space; the water cooling bar is communicated with the box body; the uniform temperature plate is arranged on the box body, the heat pipe abuts against the bottom surface of the uniform temperature plate, and the top surface of the uniform temperature plate is used for being attached to a heat source; wherein after heat of the heat source is conducted to the heat pipe through the uniform temperature plate, the heat is guided to the water cooling bar through a fluid contained in the containing space and then is discharged.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation device, especially a heat dissipation device for VGA. BACKGROUND

[0002] The VGA industry responds to the heat dissipation demand of high-wattage chips and effectively solves the heat dissipation. In order to meet the above demand, the common module design architecture in the market has VC, heat pipe, VC+heat pipe conduction chip. The heat is blown out by the wafer with forced air flow to complete the whole heat dissipation process. This architecture is large in size and heavy in weight. In the future, the wattage of the chip may continue to increase. The air cooling architecture can only increase the heat pipe and increase the heat dissipation area to solve the problem, so it will interfere with the thinness of the product.

[0003] Therefore, it is urgent to develop a heat dissipation device which overcomes the above defects. UTILITY MODEL CONTENT

[0004] The utility model provides a heat dissipation device with smaller size and weight, better heat dissipation efficiency, and lower cost.

[0005] An embodiment of the utility model discloses a heat dissipation device, which comprises:

[0006] A box body has a containing space;

[0007] At least one heat pipe is arranged in the containing space;

[0008] A water cooling row is connected to the box body;

[0009] A uniform temperature plate is arranged on the box body, the heat pipe abuts against the bottom surface of the uniform temperature plate, and the top surface of the uniform temperature plate is used to adhere to a heat source;

[0010] The heat of the heat source is conducted to the heat pipe through the uniform temperature plate, and then the heat is guided to the water cooling row through a fluid contained in the containing space and then discharged.

[0011] The heat dissipation device comprises at least one fan arranged on the water cooling row, and the fan cools and lowers the temperature of the fluid in the water cooling row.

[0012] The heat dissipation device comprises a pump connected to the box body and the water cooling row respectively, and the pump circulates the fluid between the box body and the water cooling row, so that the cooled fluid flows back to the containing space.

[0013] The heat dissipation device, wherein the box has a first liquid inlet and a first liquid outlet, the water cooling radiator has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

[0014] The heat dissipation device, wherein the box has a first liquid inlet and a first liquid outlet, the water cooling radiator has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

[0015] The heat dissipation device, wherein the box has a first liquid inlet and a first liquid outlet, the water cooling radiator has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

[0016] The heat dissipation device, wherein the box has a first liquid inlet and a first liquid outlet, the water cooling radiator has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

[0017] The heat dissipation device, wherein the box has a first liquid inlet and a first liquid outlet, the water cooling radiator has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

[0018] The heat dissipation device, wherein the box has a first liquid inlet and a first liquid outlet, the water cooling radiator has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

[0019] The heat dissipation device, wherein the box has a first liquid inlet and a first liquid outlet, the water cooling radiator has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

[0020] According to the heat dissipation device of the above embodiment, by completely immersing the heat pipe in the fluid, the fluid flows into the water cooling radiator through the box to be cooled, and the cooled fluid flows into the box to take away the heat of the heat pipe, thereby completing a heat dissipation process. Therefore, the efficiency of water cooling is higher than that of air cooling, that is, the volume of the heat dissipation part can be smaller than that of air cooling, and the heat pipe can be reduced or shortened accordingly, so that better heat dissipation performance is provided with smaller volume and weight, and the cost is reduced.

[0021] The above description of the present application and the following description of the embodiments are used to demonstrate and explain the principle of the present application, and provide further explanation of the patent application range of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a perspective view of the heat dissipation device according to the present application.

[0023] Figure 2Another perspective view of the heat dissipation device according to the utility model.

[0024] Figure 3 For Figure 1 Partial exploded view of the heat dissipation device.

[0025] Figure 4 For assembly diagram of box and heat pipe.

[0026] Figure 5 For heat pipe structure diagram.

[0027] Among them, the reference sign:

[0028] Heat dissipation device: 1;

[0029] Box: 11;

[0030] Accommodation space: S;

[0031] First liquid inlet: 111;

[0032] First liquid outlet: 112;

[0033] Heat pipe: 12;

[0034] End: 121;

[0035] Arc: 122;

[0036] Water cooling row: 13;

[0037] Uniform plate: 14;

[0038] Bottom: P1;

[0039] Top: P2;

[0040] Convex part: 141;

[0041] Fan: 15;

[0042] Pump: 16;

[0043] Second liquid inlet: 131;

[0044] Second liquid outlet: 132;

[0045] First pipeline: L1;

[0046] Second pipeline: L2;

[0047] Third pipeline: L3;

[0048] First joint: 171;

[0049] Second joint 172;

[0050] Flow channel: T;

[0051] Sub-flow passage: T1;

[0052] Ring frame: 18;

[0053] Mounting plate: 19. DETAILED DESCRIPTION

[0054] Please refer to Figures 1 to 4 . Figure 1 It is a perspective view of the heat dissipation device according to the present application from one angle. Figure 2 It is a perspective view of the heat dissipation device according to the present application from another angle. Figure 3 It is a perspective view of the heat dissipation device according to the present application from another angle. Figure 1 It is a partially exploded view of the heat dissipation device according to the present application. Figure 4 It is a structural view of the box and the heat pipe.

[0055] The heat dissipation device 1 of the present embodiment comprises a box 11, at least one heat pipe 12, a water cooling panel 13 and a uniform temperature plate 14. The box 11 has a receiving space S, and the at least one heat pipe 12 is arranged in the receiving space S. The water cooling panel 13 is connected to the box 11. The uniform temperature plate 14 is arranged on the box 11, the heat pipe 12 abuts against the bottom surface P1 of the uniform temperature plate 14, and the top surface P2 of the uniform temperature plate 14 is used to adhere to a heat source. The heat of the heat source is conducted to the heat pipe 12 through the uniform temperature plate 14, and then the heat is guided to the water cooling panel 13 through a fluid contained in the receiving space S and then discharged. Thus, the efficiency of water cooling is higher than that of air cooling, that is, the volume of the heat dissipation part can be smaller relative to air cooling, and the heat pipe can be correspondingly reduced or shortened, so that better heat dissipation efficiency is provided with smaller volume and weight, and the cost is reduced.

[0056] Further, the heat dissipation device 1 comprises at least one fan 15 and a pump 16. The fan 15 is arranged on the water cooling panel 13 to cool and lower the temperature of the fluid in the water cooling panel 13. The pump 16 is connected to the box 11 and the water cooling panel 13 respectively, and the fluid is circulated between the box 11 and the water cooling panel 13 through the pump 16, so that the cooled fluid flows back to the receiving space S.

[0057] The box 11 has a first liquid inlet 111 and a first liquid outlet 112, the water cooling panel 13 has a second liquid inlet 131 and a second liquid outlet 132, the first liquid inlet 111 is connected to the second liquid outlet 132 through a first pipeline L1, the first liquid outlet 112 is connected to the pump 16 through a second pipeline L2, and the second liquid inlet 131 is connected to the pump 16 through a third pipeline L3.

[0058] Further, the heat dissipation device 1 further comprises a first joint 171 and a second joint 172, the first joint 101 is arranged on the first liquid inlet 111, one end of the first pipeline L1 is arranged on the first joint 171, the second joint 172 is arranged on the first liquid outlet 112, and one end of the second pipeline L2 is arranged on the second joint 172.

[0059] Further, the accommodation space S is provided with a flow channel T, and at least one heat pipe 12 is arranged in the flow channel T.

[0060] In the embodiment, the heat pipe 12 is in a U shape, and specifically, the heat pipe 12 comprises two end portions 121 and an arc portion 122, one end of the two end portions 121 is connected to the arc portion 122, one of the two end portions 121 is in a rectangular cross section and is used to abut against the bottom surface P1 of the vapor chamber 14, and the other end portion 121 is in a circular cross section and is used to abut against the box body 11.

[0061] Further, the heat dissipation device 1 further comprises a ring frame 18 arranged on the box body 11, the ring frame 18 has a hollow portion 181 to expose part of the heat pipe 12, the vapor chamber 14 is arranged on the ring frame 18, and the bottom surface P1 of the vapor chamber 14 abuts against the heat pipe 12 through the hollow portion 181.

[0062] The top surface P2 of the vapor chamber 14 has a convex portion 141 as a core heat dissipation area, the convex portion 141 is used to abut against the heat source, and the heat dissipation device further comprises a mounting plate 19 arranged on the vapor chamber 14 and surrounding the convex portion 141, and the mounting plate 19 is used to lock the heat source on the vapor chamber 14.

[0063] According to the heat dissipation device in the above embodiment, the heat pipe is completely immersed in the fluid, the fluid flows into the water cooling row through the box body to be cooled, the cooled fluid flows into the box body to take away the heat of the heat pipe, and one heat dissipation process is completed, so that the efficiency of water cooling is higher than that of air cooling, that is, the volume of the heat dissipation part can be smaller than that of air cooling, and the heat pipe can be correspondingly reduced or shortened, so that better heat dissipation efficiency is provided with smaller volume and weight, and the cost is reduced.

[0064] Although the utility model discloses the above-mentioned implementation example, but it is not used to limit the utility model, any person skilled in the similar art, when can make some changes and adornments without departing from the spirit and scope of the utility model, therefore the patent protection scope of the utility model must be viewed with the application patent range attached in the present application as accurate.

Claims

1. A heat dissipating device, characterized by, A heat dissipation device comprises: a box having a receiving space; at least one heat pipe arranged in the receiving space; a water cooling device connected to the box; a vapor chamber arranged on the box, the heat pipe abutting against a bottom surface of the vapor chamber, and a top surface of the vapor chamber being used to adhere to a heat source; wherein heat of the heat source is conducted to the heat pipe through the vapor chamber, and then is guided to the water cooling device through a fluid contained in the receiving space and then is discharged.

2. The heat dissipating device of claim 1, wherein The heat dissipation device further comprises: at least one fan arranged on the water cooling device to cool the fluid in the water cooling device.

3. The heat dissipating device of claim 2, wherein The heat dissipation device further comprises: a pump connected to the box and the water cooling device respectively to make the fluid circulate between the box and the water cooling device, so that the cooled fluid flows back to the receiving space.

4. The heat dissipating device of claim 3, wherein The box has a first liquid inlet and a first liquid outlet, the water cooling device has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

5. The heat dissipating device of claim 4, wherein The heat dissipation device further comprises a first connector arranged on the first liquid inlet, the first pipeline being arranged on the first connector, a second connector arranged on the first liquid outlet, and the second pipeline being arranged on the second connector.

6. The heat dissipating device of claim 4, wherein The receiving space is provided with a flow channel, and at least one heat pipe is arranged in the flow channel.

7. The heat dissipating device of claim 6, wherein The flow channel is in an S shape.

8. The heat dissipating device of claim 1, wherein The heat dissipation device further comprises a ring frame arranged on the box, the ring frame having a hollow portion to expose part of the heat pipe, and the vapor chamber is arranged on the ring frame, the bottom surface of the vapor chamber abutting against the heat pipe through the hollow portion.

9. The heat dissipating device of claim 1, wherein Each heat pipe is in a U shape.

10. The heat dissipating device of claim 1, wherein The top surface of the vapor chamber has a protruding portion as a core heat dissipation area, the protruding portion being used to adhere to the heat source, and the heat dissipation device further comprises a mounting plate arranged on the vapor chamber and surrounding the protruding portion.

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