Heat dissipation device

Abstract

The utility model discloses a heat dissipation device, which comprises a base assembly, a fluid accommodating box, at least one heat pipe and a water cooling row, and is characterized in that the base assembly is used for bearing a heat source; the fluid containing box is provided with a containing space, and the containing space is used for containing cooling fluid. One end of the at least one heat pipe is connected to the base assembly, and the other end of the at least one heat pipe is connected to the fluid containing box; the water cooling bar is communicated with the fluid accommodating box; after heat of the heat source is transmitted into the containing space through the heat pipe, the heat is guided to the water-cooling bar through cooling fluid contained in the containing space and then is discharged.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation device, especially a heat dissipation device for VGA. BACKGROUND

[0002] The VGA industry responds to the heat dissipation demand of high-wattage chips and effectively solves the heat dissipation. In order to meet the above demand, the common module design architecture in the market has VC, heat pipe, VC+heat pipe conduction chip. The heat is blown out by the wafer with forced air flow to complete the whole heat dissipation process. This architecture is large in size and heavy in weight. In the future, the wattage of chips may continue to increase. The air cooling architecture can only increase the heat pipe and increase the heat dissipation area to solve the problem, so it will interfere with the thinness of the product.

[0003] Therefore, it is urgent to develop a heat dissipation device which overcomes the above defects. UTILITY MODEL CONTENT

[0004] The utility model provides a heat dissipation device, which has smaller size and weight, provides better heat dissipation performance, and reduces cost.

[0005] An embodiment of the utility model discloses a heat dissipation device, which comprises:

[0006] A base assembly is used to support a heat source.

[0007] A fluid containing box has a containing space, and the containing space is used to contain cooling fluid.

[0008] At least one heat pipe is connected to the base assembly at one end and connected to the fluid containing box at the other end.

[0009] A water cooling row is connected to the fluid containing box.

[0010] After the heat pipe transmits the heat of the heat source to the containing space, a cooling fluid contained in the containing space guides the heat to the water cooling row and then discharges it.

[0011] The heat dissipation device comprises at least one fan installed on the water cooling row, and the fan cools and lowers the temperature of the fluid in the water cooling row.

[0012] The heat dissipation device comprises a pump connected to the fluid containing box and the water cooling row respectively, and the pump circulates the cooling fluid between the fluid containing box and the water cooling row, so that the cooled cooling fluid flows back to the containing space.

[0013] The base assembly comprises:

[0014] a U-shaped base plate, one end of the heat pipe is arranged in a receiving groove of the U-shaped base plate;

[0015] a top plate, arranged on the U-shaped base plate, the top plate has an opening part, one end of the heat pipe is exposed through the opening part so that the heat source is attached to one end of the heat pipe.

[0016] The heat dissipation device, wherein the base assembly further comprises:

[0017] a vapor chamber, arranged on one end of the heat pipe, the heat source is arranged on the vapor chamber.

[0018] The heat dissipation device, wherein the fluid receiving box comprises:

[0019] a bottom shell, having the receiving space inside, the other end of the heat pipe extends into the receiving space from one side of the bottom shell;

[0020] a cover plate, arranged on the bottom shell and covering the receiving space.

[0021] The heat dissipation device, wherein a flow channel is arranged in the receiving space, and the other end of at least one heat pipe is arranged in the flow channel.

[0022] The heat dissipation device, wherein the flow channel is in S shape.

[0023] The heat dissipation device, wherein the bottom shell has a first liquid inlet and a first liquid outlet, the water cooling radiator has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

[0024] The heat dissipation device, further comprising a first connector and a second connector, the first connector is arranged on the first liquid inlet, the first pipeline is arranged on the first connector, the second connector is arranged on the first liquid outlet, and the second pipeline is arranged on the second connector.

[0025] The heat dissipation device, wherein at least one through hole is formed on one side of the bottom shell, and the fluid receiving box further comprises: at least one guide connector, arranged on the through hole correspondingly, and the other end of the heat pipe extends into the receiving space through the guide connector.

[0026] The heat dissipation device, wherein the fluid receiving box further comprises: at least one clamp, arranged on at least one guide connector correspondingly, and the heat pipe is clamped on the guide connector through the clamp.

[0027] The heat dissipation device further comprises at least one fixing connector, one end of which is connected to the base assembly and the other end of which is connected to the fluid containing box.

[0028] The heat dissipation device further comprises a heat conducting block, which is arranged on the top plate and contacts the heat pipe, and the heat conducting block is attached to the heat source when the top plate is locked to the heat source.

[0029] According to the heat dissipation device, the heat pipe is partially immersed in the fluid, the fluid flows into the water cooling radiator through the box for cooling, the cooled fluid flows into the box to take away the heat of the heat pipe, and thus a heat dissipation process is completed. Therefore, the efficiency of water cooling is higher than that of air cooling, that is, the volume of the heat dissipation part can be smaller than that of air cooling, and the heat pipe can be correspondingly reduced or shortened, so that better heat dissipation efficiency is provided with smaller volume and weight, and the cost is reduced.

[0030] The above description and the following description of the embodiments are used to demonstrate and explain the principle of the utility model, and provide further explanation of the patent application range of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 It is a perspective view of the heat dissipation device according to the utility model from one angle.

[0032] Figure 2 It is a perspective view of the heat dissipation device according to the utility model from another angle.

[0033] Figure 3 It is a partial exploded view of the heat dissipation device. Figure 1

[0034] Figure 4 It is an assembly view of the bottom shell and the heat pipe.

[0035] Figure 5 It is an exploded view of the base assembly.

[0036] In the drawings, reference numerals:

[0037] Heat dissipation device: 1;

[0038] Base assembly: 11;

[0039] U-shaped bottom plate: 111;

[0040] Containing groove: C1;

[0041] Top plate: 112;

[0042] Opening part: K1;

[0043] Uniform temperature plate: 113; ​

[0044] Fluid accommodating box: 12;

[0045] Bottom shell: 121;

[0046] First liquid inlet: 1211;

[0047] First liquid outlet: 1212;

[0048] Cover plate: 122;

[0049] Guide joint: 123;

[0050] Chuck: 124;

[0051] Accommodating space: S;

[0052] Flow channel: T;

[0053] Sub-flow channel: T1;

[0054] Heat pipe: 13;

[0055] Water cooling row: 14;

[0056] Second liquid inlet: 141;

[0057] Second liquid outlet: 142;

[0058] Fan: 15;

[0059] Pump: 16;

[0060] First pipeline: L1;

[0061] Second pipeline: L2;

[0062] Third pipeline: L3;

[0063] First joint: 171;

[0064] Second joint: 172;

[0065] Through hole: K2;

[0066] Fixed connecting piece: 18;

[0067] Thermal conductive block: 19. DETAILED DESCRIPTION

[0068] Please refer to Figures 1 to 5 . Figure 1 It is a perspective view of the heat dissipation device according to the utility model from one angle. Figure 2 It is a perspective view of the heat dissipation device according to the utility model from another angle. Figure 3 It is Figure 1 a partially exploded view of the heat dissipation device. Figure 4 It is an assembly view of the box body and the heat pipe.Figure 5 This is a schematic diagram of a heat pipe structure.

[0069] like Figures 1 to 5 As shown, the heat dissipation device 1 of this embodiment includes: a base assembly 11, a fluid containment tank 12, at least one heat pipe 13, and a water-cooled radiator 14. The base assembly 11 is used to support a heat source; the fluid containment tank 12 has a containment space S for containing cooling fluid; one end of the at least one heat pipe 13 is connected to the base assembly 11, and the other end of the at least one heat pipe 13 is connected to the fluid containment tank 12; the water-cooled radiator 14 is connected to the fluid containment tank 12; wherein, after the heat from the heat source is transferred to the containment space S through the heat pipe 13, the heat is guided to the water-cooled radiator 14 and discharged through the cooling fluid contained in the containment space S. Therefore, the efficiency of water cooling is higher than that of air cooling, that is, the volume of the heat dissipation part can be reduced compared to air cooling, and the heat pipes can be reduced or shortened accordingly, thereby providing better heat dissipation performance with a smaller volume and weight, while also reducing costs.

[0070] Furthermore, the heat dissipation device 1 includes: at least one fan 15 and a pump 16. The at least one fan 15 is mounted on the water cooling radiator 14 and cools the fluid in the water cooling radiator 14 by means of the fan 15. The pump 16 is connected to the fluid storage tank 12 and the water cooling radiator 14 respectively, and the pump 16 causes the cooling fluid to circulate between the fluid storage tank 12 and the water cooling radiator 14, so that the cooled cooling fluid flows back to the storage space S.

[0071] The base assembly 11 includes a U-shaped base plate 111, a top plate 112, and a heat spreader 113. One end of the heat pipe 13 is disposed in a receiving groove C1 of the U-shaped base plate 111. The top plate 112 is mounted on the U-shaped base plate 111 and has an opening K1 through which one end of the heat pipe 13 is exposed, allowing the heat source to adhere to that end of the heat pipe 13. In this embodiment, the base assembly 11 further includes a heat spreader 113, which is disposed on one end of the heat pipe 13. The heat source is disposed on the heat spreader 113, and the opening K1 exposes one end of the heat pipe 13 and the heat spreader 113, allowing the heat source to adhere to the heat spreader 113.

[0072] The fluid accommodating box 12 comprises a bottom shell 121 and a cover plate 122. The bottom shell 121 has the accommodating space S inside. The other end of the heat pipe 13 extends into the bottom shell 121 and is located in the accommodating space S. The cover plate 122 is arranged on the bottom shell 121 and covers the accommodating space S. The flow channel T is arranged in the accommodating space S. The other end of at least one heat pipe 13 is arranged in the flow channel T. In this embodiment, the flow channel T comprises a plurality of sub-flow channels T1. Preferably, the plurality of sub-flow channels T1 combine to form an S-shaped flow channel T.

[0073] The bottom shell 121 has a first liquid inlet 1211 and a first liquid outlet 1212. The water cooling radiator 14 has a second liquid inlet 141 and a second liquid outlet 142. The first liquid inlet 1211 is connected to the second liquid outlet 142 through a first pipeline L1. The first liquid outlet 1212 is connected to the pump 16 through a second pipeline L2. The second liquid inlet 141 is connected to the pump 16 through a third pipeline L3.

[0074] Further, the heat dissipation device 1 further comprises a first connector 171 and a second connector 172. The first connector 171 is arranged on the first liquid inlet 1211. One end of the first pipeline L1 is arranged on the first connector 171. The second connector 172 is arranged on the first liquid outlet 1212. One end of the second pipeline L2 is arranged on the second connector 172.

[0075] Further, one side of the bottom shell 121 is provided with at least one through hole K2. The fluid accommodating box 12 further comprises at least one guide connector 123 arranged on the through hole K2. The other end of the heat pipe 13 extends into the accommodating space S through the guide connector 123. The fluid accommodating box 12 further comprises at least one clamp 124 arranged on the guide connector 123. The heat pipe 13 is clamped on the guide connector 123 through the clamp 124.

[0076] Further, the heat dissipation device 1 further comprises at least one fixing connector 18. One end of the fixing connector 18 is connected to the base assembly 11. The other end of the fixing connector 18 is connected to the fluid accommodating box 12. In this embodiment, the heat dissipation device 1 comprises two fixing connectors 18. One end of the fixing connector 18 is connected to the U-shaped bottom plate 111. The other end of the fixing connector 18 is connected to the bottom surface of the fluid accommodating box 12.

[0077] In this embodiment, the heat dissipation device 1 further comprises a heat conduction block 19 arranged on the top plate 112 and contacting the heat pipe 13. When the top plate 112 is locked on the heat source, the heat conduction block 19 is attached to the heat source.

[0078] According to the heat dissipation device of the above-mentioned embodiment, by immersing part of the heat pipe in the fluid, the fluid flows into the water cooling row through the box body to be cooled and cooled, and the cooled fluid flows into the box body to take away the heat of the heat pipe, thereby completing a heat dissipation process, and the efficiency of water cooling is higher than that of air cooling, that is, the volume of the heat dissipation part can be smaller than that of air cooling, and the heat pipe can be correspondingly reduced or shortened, thereby providing better heat dissipation efficiency with smaller volume and weight, and reducing the cost.

[0079] Although the utility model discloses as above through the above-mentioned item, it is not used to limit the utility model, and anyone skilled in the art can make some changes and adornments without departing from the spirit and scope of the utility model, therefore the patent protection scope of the utility model must be defined by the application patent range attached to the present specification.

Claims

1. A heat dissipating device, characterized by, The utility model relates to a heat pipe cooling system, comprising: a base assembly for carrying a heat source; a fluid container having a receiving space for containing a cooling fluid; at least one heat pipe having one end connected to the base assembly and the other end connected to the fluid container; a water cooling rack in communication with the fluid container; wherein heat from the heat source is transferred to the receiving space through the heat pipe, and then conducted to the water cooling rack through the cooling fluid contained in the receiving space and then discharged.

2. The heat dissipating device of claim 1, wherein The utility model further comprises: at least one fan installed on the water cooling rack for cooling the fluid in the water cooling rack.

3. The heat dissipating device of claim 2, wherein The utility model further comprises: a pump in communication with the fluid container and the water cooling rack respectively, for circulating the cooling fluid between the fluid container and the water cooling rack, so that the cooled cooling fluid flows back to the receiving space.

4. The heat dissipating device of claim 1, wherein The base assembly comprises: a U-shaped bottom plate, one end of the heat pipe is arranged in a receiving groove of the U-shaped bottom plate; a top plate installed on the U-shaped bottom plate, the top plate has an opening part, one end of the heat pipe is exposed through the opening part so that the heat source is attached to one end of the heat pipe.

5. The heat dissipating device of claim 4, wherein The base assembly further comprises: a vapor chamber arranged on one end of the heat pipe, the heat source is arranged on the vapor chamber.

6. The heat dissipating device of claim 3, wherein The fluid container comprises: a bottom shell having the receiving space inside, the other end of the heat pipe extends into the bottom shell from one side of the bottom shell and is located in the receiving space; a cover plate installed on the bottom shell and covering the receiving space.

7. The heat dissipating device of claim 6, wherein The receiving space is provided with a flow channel, and the other end of at least one heat pipe is arranged in the flow channel.

8. The heat dissipating device of claim 7, wherein The flow channel is in an S shape.

9. The heat dissipating device of claim 6, wherein The bottom shell has a first liquid inlet and a first liquid outlet, the water cooling rack has a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet through a first pipeline, the first liquid outlet is connected to the pump through a second pipeline, and the second liquid inlet is connected to the pump through a third pipeline.

10. The heat dissipating device of claim 9, wherein The utility model further comprises a first connector and a second connector, the first connector is installed on the first liquid inlet, the first pipeline is installed on the first connector, the second connector is installed on the first liquid outlet, and the second pipeline is installed on the second connector.

11. The heat dissipating device of claim 6, wherein One side of the bottom shell is provided with at least one through hole, and the fluid container further comprises:

12. The heat dissipating device of claim 11, wherein, at least one guide connector correspondingly installed on the through hole, the other end of the heat pipe extends into the receiving space through the guide connector.

13. The heat dissipating device of claim 1, wherein The fluid container further comprises:

14. The heat dissipating device of claim 4, wherein at least one clamp connector correspondingly installed on at least one guide connector, the heat pipe is clamped on the guide connector through the clamp connector. The utility model further comprises at least one fixed connecting piece, one end of which is connected to the base assembly, and the other end of which is connected to the fluid container. The utility model further comprises a heat-conducting block installed on the top plate and contacting the heat pipe, when the top plate is locked on the heat source, the heat-conducting block is attached to the heat source.

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