Heat dissipation device of Internet server

Abstract

The utility model discloses a heat dissipation device of an internet server, which comprises a case, a circuit board, a processor and a heat dissipation device are arranged in the case, a first jack module and a second jack module are respectively arranged on the front side and the rear side of the case, a first power supply module is arranged below the second jack module, and a second power supply module is arranged below the second jack module. Heat dissipation holes are formed in the front side and the rear side of the case, a hard disk containing frame is installed in the case, a containing block is installed on the top of the case, a second fan is installed in the containing block, a single-chip microcomputer module and a second power module are installed on the containing block, and a temperature sensor is installed at the bottom of the second fan. The required temperature is set on the single-chip microcomputer module, when the detected temperature reaches the set temperature, the corresponding second fan is started to dissipate heat of the top of the case, and after the temperature is reduced to the set temperature, the second fan is closed, heat dissipation is conducted on the case, and the heat dissipation efficiency is improved; and a large amount of energy consumption caused by continuous operation of the fan II is avoided.

Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation technology, specifically a heat dissipation device for an Internet server. Background Technology

[0002] An internet server is a computer that provides services and manages resources via the internet. Servers typically consist of high-performance computer hardware and a dedicated operating system to ensure the stable and efficient operation of various network services.

[0003] Servers generate a lot of heat during operation, which can cause the internal temperature to rise and potentially lead to hardware failure. Currently, fans and heatsinks are installed inside servers. Fans remove heat from the chassis by accelerating airflow and dissipate it into the external environment, while heatsinks increase heat dissipation efficiency by increasing the heat dissipation area of ​​the processor. This maintains the server within a suitable operating temperature range and prevents overheating-related malfunctions.

[0004] Most server chassis are currently made of aluminum alloy, which has good thermal conductivity. The fan exhausts the hot air inside the server through the ventilation holes on the chassis, but in the process, it also conducts heat to the chassis, resulting in a reduction in heat dissipation. Utility Model Content

[0005] The purpose of this utility model is to provide a heat dissipation device for an internet server, overcoming the aforementioned deficiencies in the prior art. According to this utility model, a heat dissipation device for an internet server includes a chassis, a circuit board installed inside the chassis, a processor installed on the circuit board, a socket module one and a socket module two respectively installed on the front and rear sides of the chassis, a power module one installed below the socket module two, several heat dissipation holes opened on the front and rear sides of the chassis, several hard drive racks installed inside the chassis, and a heat dissipation device installed on the circuit board.

[0006] A second fan is installed on the top of the chassis, a microcontroller module and a second power supply module are installed on the mounting block, and a temperature sensor is installed at the bottom of the second fan.

[0007] Preferably, the heat dissipation device includes a heat sink mounted on the processor and a plurality of fans mounted between the processor and the hard disk drive bay.

[0008] Preferably, a placement block is installed on the top of the chassis, two placement slots are opened on the placement block, a second fan is installed in the placement slot, and a code is input into the microcontroller module to start the second fan when a specified temperature is detected, and the two second fans are connected in parallel.

[0009] Preferably, a connecting assembly is provided between the chassis and the placement block. The connecting assembly includes a connector installed around the placement block, sliding grooves formed on both sides of the connector, sliders fixedly installed on both sides of the placement block, the sliders slidably connected to the sliding grooves, rotating parts fixedly installed on both sides of the connector, a fixing plate rotatably installed on the rotating parts, a fixing block fixedly installed on the inner side of the fixing plate, and a fixing hole formed on the placement block. The opening of the fixing hole is smaller than that of the fixing block, and the fixing block is made of elastic rubber material.

[0010] Preferably, a handle is fixedly installed on the placement block.

[0011] The beneficial effects of this utility model are:

[0012] 1. A placement block is installed on the top of the chassis, with two placement slots. A second fan is installed in each slot. A microcontroller module and a second power supply module are installed on the placement block. A temperature sensor is installed at the bottom of the second fan. The microcontroller module is programmed with code to start the second fan only when a specified temperature is detected. The two second fans are connected in parallel. Before starting the server, the required temperature is set. During server operation, the two temperature sensors detect the temperature at the top of the chassis. When the temperature sensor detects that the temperature has reached the set temperature, the second fan corresponding to that temperature sensor is activated to dissipate heat from the top of the chassis. When the temperature drops to the set temperature, the second fan is turned off. This structure can dissipate heat from the surface of the chassis, improving heat dissipation efficiency and avoiding excessive energy consumption caused by the second fan running continuously during the heat dissipation process.

[0013] 2. Install a connector on the outside of the placement block, slide the connector to the connector, fix rotating parts on both sides of the connector, rotatably install a fixing plate on the rotating parts, fix a fixing block on the inner side of the fixing plate, and make a fixing hole on the placement block. The opening of the fixing hole is smaller than that of the fixing block. The fixing block is made of elastic rubber material and is installed in the fixing hole. Slide the placement block in the connector, rotate and press the fixing plate inward to deform the fixing block and install it into the fixing hole, thereby fixing the placement block and ensuring that the second fan is installed in the correct position. Pull the fixing plate outward and then pull the placement block outward to clean the second fan. This structure allows the user to remove the placement block separately, which is convenient for the user.

[0014] 3. A handle is fixedly installed on the placement block to facilitate the user in removing the placement block. Attached Figure Description

[0015] Figure 1 This is a first appearance schematic diagram of the present utility model;

[0016] Figure 2 This is a second appearance schematic diagram of the present invention;

[0017] Figure 3 This is a side sectional view of the present invention;

[0018] Figure 4 This is a top sectional view of the present invention;

[0019] Figure 5 yes Figure 4 Enlarged view of point A;

[0020] Figure 6 This is a front sectional view of the present invention;

[0021] Figure 7 This is a circuit diagram of the present invention;

[0022] In the diagram: 1. Chassis; 2. Hard drive rack; 3. Ventilation holes; 4. Circuit board; 5. Processor; 6. Heatsink; 7. Module 1 (jack); 8. Module 2 (jack); 9. Power module 1; 10. Fan 1; 11. Microcontroller module; 12. Fan 2; 13. Temperature sensor; 14. Placement block; 15. Placement slot; 16. Power module 2; 17. Connector; 18. Slide rail; 19. Slider; 20. Rotating component; 21. Fixing plate; 22. Fixing hole; 23. Fixing block; 24. Handle. Detailed Implementation

[0023] To make the objectives and advantages of this utility model clearer, the following detailed description of the utility model is provided in conjunction with embodiments. It should be understood that the following text is merely used to describe a heat dissipation device for an internet server or several specific implementation methods of this utility model, and does not strictly limit the scope of protection specifically claimed by this utility model. As used herein, the terms up and down and left and right are not limited to their strict geometric definitions, but include tolerances for reasonable and inconsistent machining or human errors. The specific features of the heat dissipation device for an internet server are described in detail below:

[0024] Reference Figures 1-7According to an embodiment of the present invention, a heat dissipation device for an internet server includes a chassis 1, a circuit board 4 installed inside the chassis 1, a processor 5 installed on the circuit board 4, a socket module 7 and a socket module 8 respectively installed on the front and rear sides of the chassis 1, a power module 9 installed below the socket module 8, a plurality of heat dissipation holes 3 opened on the front and rear sides of the chassis 1, a plurality of hard disk racks 2 installed inside the chassis 1, and a heat dissipation device installed on the circuit board 4. This is a conventional structure of a heat dissipation device for an internet server.

[0025] The heat dissipation device includes a heat sink 6 installed on the processor 5 and several fans 10 installed between the processor 5 and the hard disk rack 2. The heat sink 6 improves heat dissipation efficiency by increasing the heat dissipation area of ​​the processor 5. The fans 10 remove heat from the heat sink 6 and the chassis 1 by accelerating airflow. The above structure can prevent overheating from causing server failure.

[0026] Since the process of the fan expelling hot air also conducts heat to the chassis 1, and there is no heat dissipation structure for the chassis 1, the heat dissipation effect is reduced. In order to solve this problem, the inventors considered making the following improvements to the chassis 1.

[0027] A placement block 14 is installed on the top of the chassis 1, and two placement slots 15 are formed on the placement block 14. A second fan 12 is installed in the placement slots 15. A microcontroller module 11 and a second power supply module 16 are installed on the placement block 14. A temperature sensor 13 is installed at the bottom of the second fan 12. The microcontroller module 11 is input with code that the second fan 12 will start when a specified temperature is detected. The two second fans 12 are connected in parallel. Before starting the server, the required temperature is set. During server operation, the two temperature sensors 13 detect the temperature of the top of the chassis 1. When the temperature sensor 13 detects that the temperature has reached the set temperature, the second fan 12 corresponding to the temperature sensor 13 is started to dissipate heat from the top of the chassis 1. When the temperature drops to the set temperature, the second fan 12 is turned off to disconnect the circuit. The above structure can dissipate heat from the surface of the chassis 1, improve the heat dissipation efficiency, and avoid the large amount of energy consumption caused by the second fan 12 running continuously during the heat dissipation process.

[0028] Furthermore, the second fan 12 exposed to the air is prone to accumulating dust on its blades after prolonged use, which leads to a decrease in the heat dissipation effect of the second fan 12. In order to ensure the heat dissipation effect, the second fan 12 needs to be cleaned regularly. The above structure requires the removal of the chassis 1 during cleaning, which is inconvenient for users. In order to solve this problem, the inventors considered setting a connecting component between the chassis 1 and the placement block 14.

[0029] The connecting assembly includes a connector 17 installed around the placement block 14, grooves 18 formed on both sides of the connector 17, sliders 19 fixedly installed on both sides of the placement block 14, the sliders 19 slidably connected to the grooves 18, rotating parts 20 fixedly installed on both sides of the connector 17, a fixing plate 21 rotatably installed on the rotating parts 20, a fixing block 23 fixedly installed on the inner side of the fixing plate 21, and a fixing hole 22 formed on the placement block 14, the opening of the fixing hole 22 being smaller than that of the fixing block 23, the fixing block 23 being made of elastic rubber. The placement block 14 is slidably installed in the connector 20, the fixing plate 21 is rotated and pressed inward to deform the fixing block 23 and install it into the fixing hole 22, thereby fixing the placement block 14 and ensuring that the second fan 12 is installed in the accurate position. The fixing plate 21 is pulled outward, and then the placement block 14 is pulled outward to clean the second fan 12. This structure allows the user to remove the placement block 14 separately, making it convenient for the user to operate.

[0030] Furthermore, a handle 24 is fixedly installed on the placement block 14 to facilitate the user in removing the placement block 14.

[0031] Those skilled in the art will appreciate that various modifications to the above embodiments can be made without departing from the overall spirit and concept of this utility model. All such modifications fall within the protection scope of this utility model. The protection scheme of this utility model is defined by the appended claims.

Claims

1. A heat dissipation device for an internet server, comprising a chassis (1), a circuit board (4) installed inside the chassis (1), a processor (5) installed on the circuit board (4), a socket module one (7) and a socket module two (8) respectively installed on the front and rear sides of the chassis (1), a power module one (9) installed below the socket module two (8), a plurality of heat dissipation holes (3) opened on the front and rear sides of the chassis (1), a plurality of hard disk racks (2) installed inside the chassis (1), and a heat dissipation device installed on the circuit board (4), characterized in that: A second fan (12) is installed on the top of the chassis (1), a microcontroller module (11) and a second power supply module (16) are installed on the placement block (14), and a temperature sensor (13) is installed at the bottom of the second fan (12).

2. The heat dissipation device for an internet server according to claim 1, characterized in that: The heat dissipation device includes a heat sink (6) installed on the processor (5) and a plurality of fans (10) installed between the processor (5) and the hard disk rack (2).

3. The heat dissipation device for an internet server according to claim 1, characterized in that: A placement block (14) is installed on the top of the chassis (1), and two placement slots (15) are opened on the placement block (14). Fan 2 (12) is installed in the placement slot (15). The code for the fan 2 (12) to be started after the specified temperature is detected is input into the microcontroller module (11). The two fans 2 (12) are connected in parallel.

4. The heat dissipation device for an internet server according to claim 3, characterized in that: A connecting assembly is provided between the chassis (1) and the placement block (14). The connecting assembly includes a connector (17) installed around the placement block (14), a sliding groove (18) opened on both sides of the connector (17), a slider (19) fixedly installed on both sides of the placement block (14), the slider (19) being slidably connected to the sliding groove (18), a rotating part (20) fixedly installed on both sides of the connector (17), a fixing plate (21) rotatably installed on the rotating part (20), a fixing block (23) fixedly installed on the inner side of the fixing plate (21), and a fixing hole (22) opened on the placement block (14). The opening of the fixing hole (22) is smaller than that of the fixing block (23), and the fixing block (23) is made of elastic rubber material.

5. The heat dissipation device for an internet server according to claim 4, characterized in that: A handle (24) is fixedly installed on the placement block (14).

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