Heat dissipation assembly, magnetic device and electronic equipment

Abstract

The utility model provides a heat dissipation assembly, a magnetic device and electronic equipment. The magnetic device comprises a magnetic core and a winding, and the magnetic core comprises two end portions and a middle connecting portion which is located between the two end portions and used for connecting the two end portions. The heat dissipation assembly comprises a heat absorption part and a heat dissipation part which are connected, the heat absorption part comprises multiple heat absorption layers, and the multiple heat absorption layers are arranged outside the middle connecting part in a sleeving mode, are arranged in the axial direction of the middle connecting part and are located between the two end parts; the multiple heat absorption layers at least comprise a first heat absorption layer and a second heat absorption layer, and the first heat absorption layer is located between at least one end part and the annular winding layer adjacent to the end part and abuts against the corresponding end part and the annular winding layer; the second heat absorption layer is located between the two adjacent annular winding layers and abuts against the two annular winding layers. Heat is dissipated for the magnetic core and the winding at the same time, thermal resistance on a heat dissipation path can be reduced, and the heat dissipation efficiency is greatly improved.

Description

Technical Field

[0001] This disclosure relates to the field of magnetic device technology, and in particular to a heat dissipation component, a magnetic device, and an electronic device. Background Technology

[0002] Magnetic devices, also known as magnetic components, typically consist of windings and a magnetic core. They are essential power electronic devices for energy storage, energy conversion, and electrical isolation, and mainly include two categories: transformers and inductors. Magnetic devices account for a large proportion of heat dissipation in energy storage / power supply products, generally exceeding 40% of the total heat dissipation, resulting in significant heat dissipation challenges.

[0003] In related technologies, magnetic devices typically use thermal pads for heat dissipation. In this case, heat is dissipated through one side of the magnetic core. Due to the low thermal conductivity and high thermal resistance of the core, the other half of the core remains hot. Simultaneously, there is extensive insulation material (such as rice paper or high-temperature tape) between the windings and the core, and between the coils of the windings. Furthermore, the coils in the windings are not tightly wound, leaving significant air gaps. This results in high internal thermal resistance, making it difficult to dissipate heat and leading to a high internal temperature. Consequently, the temperature of the unheated half of the core is even higher, resulting in poor heat dissipation. Alternatively, some related technologies use potting compound and external heat sinks for heat dissipation. This method significantly increases the product weight and fails to address the high internal temperature problem, resulting in still poor heat dissipation. Utility Model Content

[0004] In view of this, in order to solve the technical problem of poor heat dissipation of the above-mentioned magnetic devices, this disclosure provides a heat dissipation component, a magnetic device, and an electronic device.

[0005] According to a first aspect of the present disclosure, a heat dissipation assembly is provided for use in a magnetic device. The magnetic device includes a magnetic core and a winding. The magnetic core includes two ends and an intermediate connecting portion located between the two ends for connecting the two ends. The winding includes multiple annular winding layers, which are sleeved outside the intermediate connecting portion and arranged along the axial direction of the intermediate connecting portion, and the multiple annular winding layers are located between the two ends.

[0006] The heat dissipation assembly includes a heat-absorbing part and a heat-dissipating part connected together. The heat-absorbing part includes multiple heat-absorbing layers. The multiple heat-absorbing layers are sleeved outside the intermediate connecting part and arranged along the axial direction of the intermediate connecting part. The multiple heat-absorbing layers are located between the two ends.

[0007] The multilayer heat-absorbing layer includes at least a first heat-absorbing layer and a second heat-absorbing layer, wherein the first heat-absorbing layer is located between at least one end and the annular winding layer adjacent to the end, and abuts against the corresponding end and the annular winding layer respectively; the second heat-absorbing layer is located between two adjacent annular winding layers, and abuts against the two annular winding layers respectively.

[0008] The heat-absorbing part absorbs the heat from the magnetic core and the annular winding and transfers it to the heat-dissipating part, so that it can diffuse to the outside of the heat dissipation assembly through the heat dissipating part.

[0009] In an optional embodiment, the heat-absorbing layer includes a conductor body layer, wherein an insulating layer is disposed on the surface of the conductor body layer that contacts the magnetic device, and the conductor body layer is configured as a non-closed structure in the circumferential direction of the intermediate connection portion.

[0010] In one alternative embodiment, the heat-absorbing layer includes an insulating body layer, and in the circumferential direction of the intermediate connection portion, the insulating body layer is configured as a closed annular structure or a non-closed structure.

[0011] In an optional implementation, when the magnetic device is applied to a first scenario, the heat dissipation part includes a heat collection sub-part and a plurality of heat dissipation teeth; the side of the heat collection sub-part facing the heat absorption part is connected to a plurality of heat absorption layers to collect the heat absorbed by the plurality of heat absorption layers; the side of the heat collection sub-part facing away from the heat absorption part is connected to a plurality of heat dissipation teeth, and the plurality of heat dissipation teeth are distributed on the side of the heat collection sub-part facing away from the heat absorption part; wherein, the first scenario is a scenario of natural heat dissipation or air cooling and an internal circulation fan is present.

[0012] In an optional implementation, when the magnetic device is applied in the second scenario, the heat dissipation part includes a heat collection sub-part and a thermally conductive insulating material layer. The heat collection sub-part can be connected to the heat sink in the second scenario. The side of the heat collection sub-part facing the heat absorption part is connected to multiple heat absorption layers to collect the heat absorbed by the multiple heat absorption layers. The side of the heat collection sub-part facing away from the heat absorption part is connected to the heat sink through the thermally conductive insulating material layer to realize heat transfer between the heat collection sub-part and the heat sink. The second scenario is a scenario of natural heat dissipation or air cooling without an internal circulation fan.

[0013] In an optional implementation, when the magnetic device is applied to a third scenario, the heat dissipation part includes a heat collection sub-part and a thermally conductive insulating material layer. The heat collection sub-part can be connected to the liquid cooling plate in the third scenario. The side of the heat collection sub-part facing away from the heat absorption part is connected to the liquid cooling plate through the thermally conductive insulating material layer to realize heat transfer between the heat collection sub-part and the liquid cooling plate. The third scenario is a liquid cooling heat dissipation scenario.

[0014] In an optional implementation, when the magnetic device is applied to a third scenario, a refrigerant channel is provided in the heat dissipation section, the side of the heat dissipation section facing the heat absorption section is connected to multiple heat absorption layers, and a refrigerant inlet and a refrigerant outlet are provided on the side of the heat dissipation section away from the heat absorption section; wherein, the third scenario is a liquid cooling scenario, and the refrigerant circulation system of the third scenario is connected to the refrigerant inlet and the refrigerant outlet respectively.

[0015] In one optional implementation,

[0016] The heat dissipation component further includes a conductive material, which includes copper and / or aluminum; or,

[0017] The heat dissipation component also includes an insulating material, which includes ceramics and / or highly thermally conductive plastics.

[0018] According to a second aspect of the present disclosure, a magnetic device is provided, the magnetic device including a magnetic core and a winding, the magnetic core including two ends and an intermediate connecting portion located between the two ends for connecting the two ends, the winding including multiple annular winding layers, the multiple annular winding layers being sleeved outside the intermediate connecting portion and arranged along the axial direction of the intermediate connecting portion, and the multiple annular winding layers being located between the two ends, the magnetic device further including a heat dissipation component as described in any of the first aspects.

[0019] According to a third aspect of the present disclosure, an electronic device is provided, the electronic device including the magnetic device as described in the second aspect.

[0020] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: In this disclosure, the magnetic core includes two ends and an intermediate connecting portion located between the two ends for connecting the two ends. The winding includes multiple annular winding layers, which are sleeved on the outside of the intermediate connecting portion and arranged along the axial direction of the intermediate connecting portion, and the multiple annular winding layers are located between the two ends. In addition, the heat dissipation assembly is provided with a heat dissipation portion and a heat absorption portion composed of multiple heat absorption layers, which are located between the two ends of the magnetic core and are sleeved on the outside of the intermediate connecting portion of the magnetic core and arranged along the axial direction of the intermediate connecting portion. Furthermore, in the multiple heat absorption layers, a first type of heat absorption layer is located between at least one end of the magnetic core and an annular winding layer, and abuts against the aforementioned end and annular winding layer; a second type of heat absorption layer is located between two adjacent annular winding layers, and abuts against the aforementioned annular winding layers respectively. The multi-layer heat-absorbing layer design disclosed herein can better absorb heat from multiple locations in magnetic devices, such as the ends of the magnetic core, the intermediate connecting parts, and the interior of the windings. This allows the heat dissipation component to contact both the magnetic core and the windings separately, simultaneously dissipating heat for both. After absorbing heat from the magnetic core and the windings through the heat-absorbing parts, the heat dissipation component dissipates the absorbed heat through the heat dissipation parts connected to the multi-layer heat-absorbing layers. This reduces thermal resistance along the heat dissipation path, significantly improves heat dissipation efficiency, and solves the problem of concentrated heat inside magnetic devices that is difficult to dissipate, thus greatly improving the overall heat dissipation effect of magnetic devices.

[0021] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0025] Figure 1 This is a schematic diagram of a heat dissipation assembly according to an exemplary embodiment.

[0026] Figure 2 This is a schematic diagram of a magnetic device according to an exemplary embodiment.

[0027] Figure 3 This is a top view of a magnetic device according to an exemplary embodiment.

[0028] Figure 4 This is a top view of another magnetic device illustrated according to an exemplary embodiment.

[0029] Figure 5 This is a top view of another magnetic device illustrated according to an exemplary embodiment.

[0030] Figure 6 This is a schematic diagram illustrating another magnetic device according to an exemplary embodiment.

[0031] Figure 7 This is a schematic diagram illustrating another magnetic device according to an exemplary embodiment.

[0032] Figure 8 This is a schematic diagram illustrating another magnetic device according to an exemplary embodiment.

[0033] Figure 9 This is a schematic diagram illustrating another magnetic device according to an exemplary embodiment.

[0034] Figure 10 This is a schematic diagram illustrating a thermal resistance path according to an exemplary embodiment.

[0035] Figure 11 This is a schematic diagram illustrating another thermal resistance path according to an exemplary embodiment.

[0036] Figure 12 This is a schematic diagram illustrating another thermal resistance path according to an exemplary embodiment. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0039] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0040] To address the technical problem of poor heat dissipation in the aforementioned magnetic devices, this disclosure provides a heat dissipation assembly, a magnetic device, and an electronic device. In this disclosure, the magnetic core includes two ends and an intermediate connecting portion located between the two ends for connecting them. The winding includes multiple annular winding layers, which are sleeved outside the intermediate connecting portion and arranged axially along the intermediate connecting portion, with the multiple annular winding layers located between the two ends. Furthermore, the heat dissipation assembly includes a heat dissipation portion and a heat absorption portion composed of multiple heat-absorbing layers, which are located between the two ends of the magnetic core and sleeved outside the intermediate connecting portion of the magnetic core, arranged axially along the intermediate connecting portion. Additionally, in the multiple heat-absorbing layers, a first type of heat-absorbing layer is located between at least one end of the magnetic core and an annular winding layer, and abuts against the aforementioned end and annular winding layer; a second type of heat-absorbing layer is located between two adjacent annular winding layers, and abuts against each of the aforementioned annular winding layers. The multi-layer heat-absorbing layer design disclosed herein can better absorb heat from multiple locations in magnetic devices, such as the ends of the magnetic core, the intermediate connecting parts, and the interior of the windings. This allows the heat dissipation component to contact both the magnetic core and the windings separately, simultaneously dissipating heat for both. After absorbing heat from the magnetic core and the windings through the heat-absorbing parts, the heat dissipation component dissipates the absorbed heat through the heat dissipation parts connected to the multi-layer heat-absorbing layers. This reduces thermal resistance along the heat dissipation path, significantly improves heat dissipation efficiency, and solves the problem of concentrated heat inside magnetic devices that is difficult to dissipate, thus greatly improving the overall heat dissipation effect of magnetic devices.

[0041] In one exemplary embodiment, reference Figure 1 , Figure 2 and Figure 6 As shown, a heat dissipation component 30 is provided, as well as a magnetic device on which the heat dissipation component 30 is provided (i.e., the heat dissipation component 30 can be applied to a magnetic device), and an electronic device on which the magnetic device is provided.

[0042] The magnetic device may include a magnetic core 10, which includes two ends 11 and an intermediate connecting portion 12 located between the two ends 11 for connecting them. The two ends 11 of the magnetic core 10 may be referred to as a first end 11a and a second end 11b, respectively. The first end 11a is connected to a first axial end of the intermediate connecting portion 12, and the second end 11b is connected to a second axial end of the intermediate connecting portion 12. The first end 11a, the intermediate connecting portion 12, and the second end 11b can be constructed as a single integral structure to ensure the overall stability of the magnetic properties. For example, the magnetic core 10 can be manufactured using ferrite material through powder metallurgy to ensure overall stability and magnetic performance.

[0043] The magnetic device may also include a winding 20. The intermediate connecting portion 12 connects the two ends 11 and provides mounting space for the winding 20. Its length and diameter can be designed according to specific application requirements. The winding 20 includes a ring-shaped winding layer 21 formed by multiple layers of coils. The multiple ring-shaped winding layer 21 is sleeved on the outside of the intermediate connecting portion 12 and arranged along the axial direction of the intermediate connecting portion 12, and the multiple ring-shaped winding layer 21 is located between the two ends 11.

[0044] For example, each toroidal winding layer 21 can be made of enameled wire of a certain diameter. For example, each toroidal winding layer 21 can be wound using enameled wire with a diameter of 0.5 mm. The number of layers and the number of turns per layer can be determined according to the different inductor or transformer requirements.

[0045] When current flows through winding 20, a magnetic field is generated in magnetic core 10. Due to the special structure of magnetic core 10, the magnetic field can form a closed loop between the intermediate connection 12 and the two ends 11, thus realizing the function of an inductor or transformer. During the operation of the magnetic device, the current flowing through winding 20 generates Joule heat, and the magnetic core 10 also generates heat such as iron loss under the action of the alternating magnetic field. If this heat cannot be dissipated in a timely and effective manner, it will cause the temperature of the magnetic device to rise, thereby affecting its performance and lifespan.

[0046] In this embodiment, a heat dissipation component 30 is added to the magnetic device. The heat dissipation component 30 may include a heat-absorbing part 31 and a heat dissipation part 32 connected together. The heat-absorbing part 31 includes multiple heat-absorbing layers 311, which are sleeved on the outside of the intermediate connecting part 12 and arranged along the axial direction of the intermediate connecting part 12, and the multiple heat-absorbing layers 311 are located between the two ends 11.

[0047] The multilayer heat-absorbing layer 311 includes at least a first heat-absorbing layer 311 and a second heat-absorbing layer 311. The first heat-absorbing layer 311 is located between at least one end 11 and an annular winding layer 21 adjacent to the end 11, and abuts against the corresponding end 11 and an annular winding layer 21 respectively; the second heat-absorbing layer 311 is located between two adjacent annular winding layers 21, and abuts against the two annular winding layers 21 respectively.

[0048] The heat-absorbing part 31 absorbs heat from the magnetic core 10 and the winding 20 and transfers it to the heat-dissipating part 32, where it diffuses to the outside of the heat dissipation assembly 30. Specifically, when the magnetic core 10 and the winding 20 generate heat, the multi-layered heat-absorbing layer 311 of the heat-absorbing part 31 can quickly absorb this heat. The first type of heat-absorbing layer 311 is in direct contact with the end 11 and the adjacent annular winding layer 21, and can quickly absorb the heat from the end 11 and the edge portion of the winding 20. The second type of heat-absorbing layer 311 is located between two adjacent annular winding layers 21, and can effectively absorb the heat generated inside the winding 20. Since the heat-absorbing part 31 and the heat dissipating part 32 are connected, the heat absorbed by the heat-absorbing part 31 can be quickly transferred to the heat dissipating part 32 through thermal conduction, and then dissipated by the heat dissipating part 32, thereby achieving heat dissipation and cooling of the magnetic core and the winding 20.

[0049] The heat-absorbing part 31 and the heat-dissipating part 32 can be made of materials with high thermal conductivity. The heat-absorbing part 31 is connected to the heat-dissipating part 32 to ensure rapid heat transfer. During the heat transfer process, the structure of the multi-layer heat-absorbing layer 311 can effectively increase the heat conduction area and improve the efficiency of heat transfer.

[0050] It should be noted that the heat dissipation component 30 in this embodiment can be constructed as an integrally molded structure, which can not only ensure the structural stability of the heat dissipation component 30, but also better ensure the thermal conductivity of the heat dissipation component 30.

[0051] In the design of heat dissipation for magnetic devices, thermal resistance network (RTN) models can be used. An RTN model describes the resistance encountered by heat during its transfer within an object. The importance of RTN models lies in their ability to accurately predict and evaluate the temperature distribution and changes of electronic equipment under various operating conditions, thereby optimizing heat dissipation design and preventing performance degradation or damage caused by overheating. By establishing RTN models, the heat transfer process within devices can be better understood, improving design efficiency and product quality.

[0052] When designing heat dissipation for magnetic devices, the first step is to draw the thermal resistance network of the magnetic device, find the heat transfer path with the lowest thermal resistance, and, from a first-principles perspective, reduce the total thermal resistance in the path to design the heat dissipation method with the lowest thermal resistance. Taking winding 20 as an example, the thermal resistance path for heat dissipation of winding 20 is drawn. In the original design, the heat transfer path from winding 20 to the environment is long. (Refer to...) Figure 10As shown, R1 is the thermal resistance of the insulating material, R2 is the thermal resistance of the air, R3 is the thermal resistance of the magnetic core 10, R4 is the thermal resistance of the thermally conductive material, and R5 is the thermal resistance of the heat dissipation component 30. Thus, the thermal resistance of the winding 20 is extremely high, making heat dissipation very difficult. From the perspective of minimizing thermal resistance, the heat from the winding 20 can be directly transferred to the heat dissipation component 30 and dissipated into the environment. When the heat dissipation component 30 is a conductor, the thermal resistance path of the winding 20 consists only of the thermal resistance of the insulating material R1 and the thermal resistance of the heat dissipation component 30 R5, as shown... Figure 11 As shown. When the heat dissipation component 30 is an insulator, the thermal resistance path of the winding 20 consists only of the thermal resistance R5 of the heat dissipation component 30 (or can be considered as only the thermal resistance R1 of the insulating material), as... Figure 12 As shown.

[0053] In this embodiment, the design of the multi-layer heat-absorbing layer 311 can better absorb heat from multiple locations in the magnetic device, such as the end 11 of the magnetic core 10, the intermediate connecting part 12, and the inside of the winding 20. This allows the heat dissipation component 30 to contact the magnetic core 10 and the winding 20 respectively, simultaneously dissipating heat for both. After absorbing heat from the magnetic core 10 and the winding 20 through the heat-absorbing part 31, the heat dissipation component 30 dissipates the absorbed heat through the heat dissipation part 32 connected to the multi-layer heat-absorbing layer 311. This reduces the thermal resistance on the heat dissipation path, greatly improves heat dissipation efficiency, and solves the problem of concentrated heat inside the magnetic device, which is difficult to dissipate. This significantly improves the overall heat dissipation effect of the magnetic device. It should be noted that when all materials of the heat dissipation component 30 are highly thermally conductive insulating materials, only the thermal resistance of the insulating material is present during the heat dissipation process of the magnetic core 10 and the winding 20, which can further improve the heat dissipation effect.

[0054] In one exemplary embodiment, reference Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 As shown, a heat dissipation component 30 is provided, as well as a magnetic device on which the heat dissipation component 30 is disposed (i.e., the heat dissipation component 30 can be applied to a magnetic device), and an electronic device on which the aforementioned magnetic device is disposed. In this embodiment, the heat-absorbing layer 311 may include a conductor body layer 3111, that is, the heat-absorbing layer 311 includes a conductor body layer 3111 made of a highly thermally conductive conductor material. The conductor material may be, for example, copper, aluminum, etc., and is not limited thereto.

[0055] Among them, reference Figure 3 and 4 As shown, the conductor body layer 3111 is sleeved on the outside of the intermediate connecting portion 12, but in the circumferential direction of the intermediate connecting portion 12, the conductor body layer 3111 is constructed as a non-closed structure. This arrangement can prevent the generation of induced current in the conductor body layer 3111.

[0056] It should be noted that the conductor body layer 3111 can be a non-closed ring structure with an opening, a U-shaped structure, or two strip-shaped layers distributed on both sides of the radial direction of the intermediate connecting part 12. Its specific structure is not limited and can be set according to actual needs. Furthermore, although the shape of the conductor body layer 3111 can vary, it should ensure a larger contact area with the magnetic core 10 and the winding 20, and the area enclosed by the magnetic core 10 should not be closed.

[0057] Furthermore, when the heat-absorbing layer 311 includes the conductor body layer 3111, direct contact between the conductor body layer 3111 and the magnetic core 10, the coil in the winding 20, etc., could lead to a short circuit. Therefore, an insulating layer 3112 is required between the conductor body layer 3111 and the magnetic core 10, and between the conductor body layer 3111 and the coil. That is, an insulating layer 3112 is provided on the surface of the conductor body layer 3111 that contacts the magnetic device to prevent short circuits caused by contact. The insulating layer 3112 is made of a highly thermally conductive insulating material. The insulating material can be, for example, highly thermally conductive plastics, ceramics, etc., and is not limited thereto.

[0058] In this embodiment, by setting a conductor body layer 3111 made of a high thermal conductivity conductor material and an insulating layer 3112 made of a high thermal conductivity insulating material in the heat-absorbing layer 311 of the magnetic device, both efficient heat dissipation can be achieved, and the risk of short circuits can be avoided. The non-closed structure design and various forms of the conductor body layer 311 make the heat-absorbing layer 311 structurally flexible and diverse, adaptable to different magnetic device structures and heat dissipation requirements, and it does not generate induced current, thus avoiding interference with the normal operation of the magnetic device. It should be noted that in practical applications, the appropriate structure and material of the heat-absorbing layer 311 can be selected according to the specific situation to achieve the best heat dissipation effect and safety performance.

[0059] In one exemplary embodiment, reference Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, a heat dissipation assembly 30 is provided, as well as a magnetic device on which the heat dissipation assembly 30 is disposed (i.e., the heat dissipation assembly 30 can be applied to a magnetic device), and an electronic device on which the aforementioned magnetic device is disposed. The heat-absorbing layer 311 in this embodiment may include an insulating body layer, i.e., the heat-absorbing layer 311 includes an insulating body layer made of a highly thermally conductive insulating material. The insulating material may be, for example, a highly thermally conductive plastic, ceramic, etc., and is not limited thereto.

[0060] Even if the insulating main layer made of insulating material is constructed as a closed ring structure, it will not generate an induced current. Therefore, in the circumferential direction of the intermediate connecting portion 12, the insulating main layer can be constructed as a closed ring structure or a non-closed structure. The closed ring structure can be a square ring, a circular ring, or other ring structures, and there is no limitation thereto. For the specific form of the non-closed structure, please refer to the conductor main layer 3111 in other embodiments, which will not be described in detail here.

[0061] The structure of the insulating main layer can be flexibly designed according to actual needs, adapting to different magnetic device structures and installation environments. This structural flexibility allows for more diverse heat dissipation designs for magnetic devices, meeting the requirements of different application scenarios. For example, in electronic devices with high heat dissipation requirements, a closed-loop insulating main layer structure can be selected to increase the heat conduction area and improve heat dissipation efficiency. Furthermore, in applications with limited space, a non-closed insulating main layer structure can be selected to better adapt to the installation space.

[0062] In this embodiment, by setting an insulating main layer made of highly thermally conductive insulating material in the heat-absorbing layer 311 of the magnetic device, and selecting a closed ring structure or a non-closed structure according to actual needs, a highly efficient heat dissipation effect is achieved while avoiding induced current problems. This design improves the performance and reliability of the magnetic device and provides a strong guarantee for the stable operation of electronic equipment. In practical applications, a suitable insulating main layer structure and material can be selected according to specific heat dissipation requirements and installation environment to achieve the best heat dissipation effect. It should be noted that when all materials of the heat dissipation component 30 are highly thermally conductive insulating materials, only the thermal resistance of the insulating material is involved in the heat dissipation process of the magnetic core 10 and the winding 20. Moreover, the insulating main layer can be set as a closed ring structure, which can achieve a larger contact area with the magnetic core 10 and the winding 20, thereby better improving the heat dissipation effect.

[0063] In one exemplary embodiment, reference Figure 1 , Figure 2 and Figure 6 As shown, a heat dissipation component 30 is provided, as well as a magnetic device on which the heat dissipation component 30 is disposed (i.e., the heat dissipation component 30 can be applied to a magnetic device), and an electronic device on which the aforementioned magnetic device is disposed. In the electronic device of this embodiment, the environment in which the magnetic device is located can be equipped with an internal circulation fan. Furthermore, the electronic device employs a heat dissipation method of natural heat dissipation or air cooling. That is, the magnetic device is located in a scenario with natural heat dissipation or air cooling and an internal circulation fan; this scenario can be referred to as the first scenario.

[0064] In the first scenario, when the magnetic device is applied, the heat dissipation assembly 30 can dissipate heat using an internal circulation fan. The heat dissipation section 32 may include a heat collector 321 and multiple first heat dissipation teeth 322, and the fan can directly blow heat from the first heat dissipation teeth 322. The side of the heat collector 321 facing the heat absorber 31 is connected to multiple heat absorber layers 311 to collect the heat absorbed by the multiple heat absorber layers 311. The side of the heat collector 321 away from the heat absorber 31 is connected to multiple first heat dissipation teeth 322, and the multiple first heat dissipation teeth 322 are distributed on the side of the heat collector 321 away from the heat absorber 31 to give the heat dissipation section 32 a better heat dissipation effect.

[0065] When the magnetic device is operating, the current in the winding 20 generates Joule heat, and the magnetic core 10 also generates heat such as iron loss under the action of the alternating magnetic field. The multi-layered heat-absorbing layer 311 of the heat-absorbing part 31 can quickly absorb this heat and transfer it to the heat-collecting part 321. The heat-collecting part 321 gathers the heat absorbed by the multiple heat-absorbing layers 311, and then dissipates the heat into the surrounding air through multiple first heat-dissipating teeth 322 connected to the heat-collecting part 321. The dispersed arrangement of the first heat-dissipating teeth 322 increases the heat dissipation area, allowing heat to exchange with the air more quickly. The internal circulation fan generates airflow inside the electronic device, and the airflow directly blows on the first heat-dissipating teeth 322, accelerating the heat exchange between the first heat-dissipating teeth 322 and the air, thereby improving the heat dissipation efficiency. At the same time, the dispersed arrangement of the first heat-dissipating teeth 322 and the uniform heat dissipation effect of the internal circulation fan can also prevent local overheating of the magnetic device, further improving the reliability of the magnetic device.

[0066] In this embodiment, by designing a specific heat dissipation component 30 within the magnetic device and combining it with an internal circulation fan and natural or air-cooled heat dissipation methods within the electronic device, efficient heat dissipation of the magnetic device is achieved. This heat dissipation solution improves the performance and reliability of the magnetic device and is suitable for various electronic device scenarios with natural or air-cooled heat dissipation and an internal circulation fan.

[0067] In one exemplary embodiment, reference Figure 1 , Figure 2 and Figure 7 As shown, a heat dissipation component 30 is provided, as well as a magnetic device on which the heat dissipation component 30 is disposed (i.e., the heat dissipation component 30 can be applied to a magnetic device), and an electronic device on which the aforementioned magnetic device is disposed. In the electronic device of this embodiment, the environment in which the magnetic device is located may not have an internal circulation fan. Furthermore, the electronic device employs natural heat dissipation or air cooling. That is, the magnetic device is located in a scenario with natural heat dissipation or air cooling and without an internal circulation fan; this scenario can be referred to as the second scenario.

[0068] In the second scenario, when the magnetic device is applied, the heat dissipation unit 32 includes a heat collector 321, a thermally conductive insulating material layer 324, and a heat sink 323 in the second scenario. The side of the heat collector 321 facing the heat absorber 31 is connected to multiple heat absorber layers 311 to collect the heat absorbed by these layers. The heat collector 321 of the heat dissipation assembly 30 can be connected to the heat sink 323 in the second scenario to establish a heat conduction path, transferring heat from the heat collector 321 to the heat sink 323. Specifically, the side of the heat collector 321 facing away from the heat absorber 31 is connected to the heat sink 323 via the thermally conductive insulating material layer 324 to achieve heat transfer between the heat collector 321 and the heat sink 323.

[0069] The heat sink 323 may include a heat sink substrate 3231 and a plurality of second heat dissipation teeth 3232. The side of the heat sink substrate 3231 facing the heat collector 321 is connected to the heat collector 321 through a thermally conductive insulating material layer 324. A plurality of second heat dissipation teeth 3232 are provided on the side of the heat sink substrate 3231 facing away from the heat collector 321, and the plurality of second heat dissipation teeth 3232 are distributed in a dispersed manner on the side of the heat sink substrate 3231 facing away from the heat collector 321, so that the heat sink 32 has a better heat dissipation effect.

[0070] It should be noted that the heat collector 321 and the heat sink substrate 3231 can be bonded together. In this case, a thermally conductive and insulating composite material with adhesive properties, such as a thermally conductive adhesive, can be used to achieve the connection between the heat collector 321 and the heat sink substrate 3231. Alternatively, the two can be connected using fasteners (such as screws). Thermal conductivity and insulation can be achieved through structures such as thermally conductive pads and thermally conductive insulating pads, followed by fastener fixation. Of course, the heat collector 321 and the heat sink substrate 3231 can also be connected in other ways, and this is not limited.

[0071] When the magnetic device operates, the current in the winding 20 generates Joule heat, and the magnetic core 10 generates heat such as iron loss under the action of the alternating magnetic field. The multi-layered heat-absorbing layer 311 of the heat-absorbing part 31 quickly absorbs this heat and transfers it to the heat-collecting part 321. The heat-collecting part 321 gathers the heat absorbed by the multiple heat-absorbing layers 311 and then transfers the heat to the heat-dissipating substrate 3231 of the heat sink 323 through the thermally conductive insulating material layer 324. The heat-dissipating substrate 3231 then transfers the heat to the dispersed second heat-dissipating teeth 3232. Due to the large surface area of ​​the second heat-dissipating teeth 3232, they can fully exchange heat with the surrounding air. Under the action of natural heat dissipation or external air cooling, the air flows through the second heat-dissipating teeth 3232, carrying away heat and thus reducing the temperature of the magnetic device. In the absence of an internal circulation fan, the heat generated by the magnetic device can be effectively dissipated through the cooperation of the heat dissipation component 30 and the heat sink 323. The use of thermally conductive insulating material ensures heat transfer while avoiding the risk of electrical short circuits.

[0072] In this embodiment, for a second scenario where the magnetic device is located in a place with natural or air-cooled heat dissipation and no internal circulation fan, a heat dissipation component 30 using a heat sink 323 for heat dissipation is designed. Through the synergistic effect of the heat-absorbing layer 311, the heat-collecting sub-part 321, the thermally conductive insulating material, and the original heat sink 323 in the electronic device, the heat generated by the magnetic device can be effectively dissipated, improving the performance and reliability of the electronic device.

[0073] In one exemplary embodiment, reference Figure 1 , Figure 2 and Figure 8 As shown, a heat dissipation component 30 is provided, as well as a magnetic device on which the heat dissipation component 30 is disposed (i.e., the heat dissipation component 30 can be applied to a magnetic device), and an electronic device on which the aforementioned magnetic device is disposed. In the electronic device of this embodiment, the environment in which the magnetic device is located can be a liquid cooling scenario. That is, the electronic device adopts a liquid cooling method, and the magnetic device is located in a liquid cooling scenario, which can be referred to as the third scenario.

[0074] When the magnetic device is applied in the third scenario, the heat dissipation part 32 includes a heat collector part 321, a thermally conductive insulating material layer 324, and a liquid cooling plate 325 in the third scenario. The heat collector part 321 can be connected to the liquid cooling plate 325 in the third scenario. For example, the side of the heat collector part 321 that is away from the heat absorption part 31 is connected to the liquid cooling plate 325 through the thermally conductive insulating material layer 324 to realize the heat transfer between the heat collector part 321 and the liquid cooling plate 325.

[0075] The liquid cooling plate 325 may contain a refrigerant channel for circulating refrigerant. The side of the liquid cooling plate 325 facing the heat collector 321 is connected to the heat collector 321 via a thermally conductive insulating material layer 324. The side of the liquid cooling plate 325 facing away from the heat collector 321 has a refrigerant inlet 3251 and a refrigerant outlet 3252, connecting to an external refrigerant circulation system. It should be noted that the liquid cooling plate 325 and refrigerant circulation system in this embodiment can be an existing liquid cooling plate 325 and refrigerant circulation system in electronic devices, or it can be a newly added liquid cooling plate 325 and refrigerant circulation system for magnetic devices; there is no limitation on this.

[0076] When the magnetic device is operating, the current in the winding 20 generates Joule heat, and the magnetic core 10 generates heat such as iron loss under the action of the alternating magnetic field. The multi-layered heat-absorbing layer 311 of the heat-absorbing part 31 quickly absorbs this heat and transfers it to the heat-collecting part 321. The heat-collecting part 321 gathers the heat absorbed by the multiple heat-absorbing layers 311 and then transfers the heat to the liquid cooling plate 325 through the thermally conductive insulating material layer 324. The refrigerant in the liquid cooling plate 325 absorbs heat during its circulation and carries the heat away from the magnetic device. The refrigerant enters the liquid cooling plate 325 from the refrigerant inlet 3251, flows through the refrigerant channel, absorbs heat, and then flows out from the refrigerant outlet 3252, returning to the external refrigerant circulation system for cooling. The cooled refrigerant re-enters the liquid cooling plate 325, circulating continuously to dissipate heat from the magnetic device.

[0077] In this embodiment, a heat dissipation scheme including a heat dissipation component 30 and a liquid cooling plate 325 is designed for magnetic devices located in a liquid cooling scenario. Through the synergistic effect of the heat-absorbing layer 311, the heat-collecting sub-unit 321, the thermally conductive insulating material, and the liquid cooling plate 325, the heat generated by the magnetic device can be effectively transferred to the refrigerant, achieving efficient heat dissipation. This heat dissipation scheme is suitable for various electronic devices employing liquid cooling, providing a strong guarantee for improving the performance and reliability of electronic devices.

[0078] In one exemplary embodiment, reference Figure 1 , Figure 2 and Figure 9 As shown, a heat dissipation component 30 is provided, as well as a magnetic device on which the heat dissipation component 30 is disposed (i.e., the heat dissipation component 30 can be applied to a magnetic device), and an electronic device on which the aforementioned magnetic device is disposed. In the electronic device of this embodiment, the environment in which the magnetic device is located can be a liquid cooling scenario. That is, the electronic device adopts a liquid cooling method, and the magnetic device is located in a liquid cooling scenario, which can be referred to as the third scenario.

[0079] In this embodiment, when the magnetic device is applied in the third scenario, a refrigerant channel is provided within the heat dissipation unit 32. The side of the heat dissipation unit 32 facing the heat absorption unit 31 is connected to multiple heat absorption layers 311, and a refrigerant inlet 3251 and a refrigerant outlet 3252 are provided on the side of the heat dissipation unit 32 away from the heat absorption unit 31. That is, in this embodiment, the heat collection and heat dissipation functions can be integrated into the heat dissipation unit 32. A refrigerant channel is provided within the heat dissipation unit 32, and a refrigerant inlet 3251 and a refrigerant outlet 3252 are provided within the heat dissipation unit 32, thereby connecting to a refrigerant circulation system. In other words, the refrigerant circulation system in the third scenario can be connected to both the refrigerant inlet 3251 and the refrigerant outlet 3252. It should be noted that the refrigerant circulation system in this embodiment can be an existing refrigerant circulation system in the electronic device, or a new refrigerant circulation system added for the magnetic device; there is no limitation on this.

[0080] When the magnetic device is operating, the current in the winding 20 generates Joule heat, and the magnetic core 10 generates heat such as iron loss under the action of the alternating magnetic field. The heat-absorbing layer 311 quickly absorbs this heat and transfers it to the heat dissipation section 32. The refrigerant channel in the heat dissipation section 32 receives heat from the heat-absorbing layer 311. The refrigerant enters the refrigerant channel of the heat dissipation section 32 from the refrigerant inlet 3251, absorbs heat during its flow, and then flows out from the refrigerant outlet 3252 into the refrigerant circulation system for cooling. The cooled low-temperature refrigerant re-enters the refrigerant channel of the heat dissipation section 32 to provide low-temperature refrigerant for the heat dissipation section 32, and the cycle repeats continuously to dissipate heat from the magnetic device.

[0081] In this embodiment, by integrating heat collection and heat dissipation functions into the heat dissipation section 32 of the magnetic device and connecting it to a refrigerant circulation system, efficient heat dissipation of the magnetic device in liquid cooling scenarios is achieved. This integrated heat dissipation solution is characterized by high efficiency, flexibility, and reliability, and is suitable for various electronic devices that employ liquid cooling.

[0082] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0083] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0084] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A heat dissipation assembly applied to a magnetic device, the magnetic device comprising a magnetic core and a winding, the magnetic core comprising two ends and an intermediate connecting portion located between the two ends for connecting the two ends, the winding comprising multiple annular winding layers, the multiple annular winding layers being sleeved outside the intermediate connecting portion and arranged along the axial direction of the intermediate connecting portion, and the multiple annular winding layers being located between the two ends, characterized in that... The heat dissipation assembly includes a heat-absorbing part and a heat-dissipating part connected together. The heat-absorbing part includes multiple heat-absorbing layers. The multiple heat-absorbing layers are sleeved outside the intermediate connecting part and arranged along the axial direction of the intermediate connecting part. The multiple heat-absorbing layers are located between the two ends. The multilayer heat-absorbing layer includes at least a first heat-absorbing layer and a second heat-absorbing layer, wherein the first heat-absorbing layer is located between at least one end and the annular winding layer adjacent to the end, and abuts against the corresponding end and the annular winding layer respectively; the second heat-absorbing layer is located between two adjacent annular winding layers, and abuts against the two annular winding layers respectively. The heat-absorbing part absorbs the heat from the magnetic core and the winding and transfers it to the heat-dissipating part, so that it can be diffused to the outside of the heat dissipation assembly through the heat dissipating part.

2. The heat dissipation assembly according to claim 1, characterized in that, The heat-absorbing layer includes a conductor body layer, in which an insulating layer is disposed on the surface of the conductor body layer that contacts the magnetic device, and in the circumferential direction of the intermediate connection portion, the conductor body layer is constructed as a non-closed structure.

3. The heat dissipation assembly according to claim 1, characterized in that, The heat-absorbing layer includes an insulating main layer, and in the circumferential direction of the intermediate connecting portion, the insulating main layer is constructed as a closed ring structure or a non-closed structure.

4. The heat dissipation assembly according to claim 2 or 3, characterized in that, When the magnetic device is applied in the first scenario, the heat dissipation part includes a heat collection sub-part and multiple heat dissipation teeth; the side of the heat collection sub-part facing the heat absorption part is connected to multiple heat absorption layers to collect the heat absorbed by the multiple heat absorption layers; the side of the heat collection sub-part facing away from the heat absorption part is connected to multiple heat dissipation teeth, and the multiple heat dissipation teeth are distributed on the side of the heat collection sub-part facing away from the heat absorption part; wherein, the first scenario is a scenario of natural heat dissipation or air cooling heat dissipation, and an internal circulation fan is present.

5. The heat dissipation assembly according to claim 2 or 3, characterized in that, When the magnetic device is applied in the second scenario, the heat dissipation part includes a heat collection sub-part and a thermally conductive insulating material layer. The heat collection sub-part can be connected to the heat sink in the second scenario. The side of the heat collection sub-part facing the heat absorption part is connected to multiple heat absorption layers to collect the heat absorbed by the multiple heat absorption layers. The side of the heat collection sub-part facing away from the heat absorption part is connected to the heat sink through the thermally conductive insulating material layer to realize heat transfer between the heat collection sub-part and the heat sink. The second scenario is a scenario of natural heat dissipation or air cooling without an internal circulation fan.

6. The heat dissipation assembly according to claim 2 or 3, characterized in that, When the magnetic device is applied in the third scenario, the heat dissipation part includes a heat collection sub-part and a thermally conductive insulating material layer. The heat collection sub-part can be connected to the liquid cooling plate in the third scenario. The side of the heat collection sub-part facing away from the heat absorption part is connected to the liquid cooling plate through the thermally conductive insulating material layer to realize heat transfer between the heat collection sub-part and the liquid cooling plate. The third scenario is a liquid cooling heat dissipation scenario.

7. The heat dissipation assembly according to claim 2 or 3, characterized in that, When the magnetic device is applied in the third scenario, a refrigerant channel is provided in the heat dissipation part, the side of the heat dissipation part facing the heat absorption part is connected to multiple heat absorption layers, and a refrigerant inlet and a refrigerant outlet are provided on the side of the heat dissipation part away from the heat absorption part; wherein, the third scenario is a liquid cooling scenario, and the refrigerant circulation system of the third scenario is connected to the refrigerant inlet and the refrigerant outlet respectively.

8. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation component further includes a conductive material, which includes copper and / or aluminum; or, The heat dissipation component also includes an insulating material, which includes ceramics and / or highly thermally conductive plastics.

9. A magnetic device, characterized in that, The magnetic device includes a magnetic core and a winding. The magnetic core includes two ends and an intermediate connecting portion located between the two ends for connecting the two ends. The winding includes multiple annular winding layers, which are sleeved on the outside of the intermediate connecting portion and arranged along the axial direction of the intermediate connecting portion. The multiple annular winding layers are located between the two ends. The magnetic device further includes a heat dissipation component as described in any one of claims 1-8.

10. An electronic device, characterized in that, The electronic device includes the magnetic device as described in claim 9.

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