High-frequency communication chip type common mode inductor

Abstract

The utility model provides a high-frequency communication chip-type common mode inductor, which is characterized in that a winding mode of a magnetic core framework of the chip-type common mode inductor mainly comprises the following steps of: uniformly arranging and winding a single copper wire on a middle column of the magnetic core framework for multiple circles according to a certain direction, pulling a distance of two times of a wire diameter, and sequentially and uniformly arranging and winding the copper wire for multiple circles to form a wire group; and the repeated second winding is uniformly arranged on the first winding of the chip common mode inductor to complete winding, and the complete high-frequency communication chip common mode inductor is formed by welding and fixing a lead end pin and assembling and bonding an upper cover. According to the unique process mode that the single winding is wound in two sections, is uniformly arranged and wound for multiple circles, is pulled by the distance of two times of the wire diameter, and then is wound for multiple circles backwards, the distributed capacitance and leakage inductance of the chip common mode inductor during high-frequency communication are effectively reduced, so that the parameter value of the chip common mode inductor during high-frequency communication is improved, and the purpose of improving the communication quality is achieved; the technical problem of the chip common mode inductor in high-frequency communication is solved.

Description

Technical Field

[0001] This utility model relates to the field of high-frequency communication chip common-mode inductor technology, specifically a high-frequency communication chip common-mode inductor. Background Technology

[0002] Chip common mode inductors serve as bridges for data communication and are widely used in network switches, routers, network cards, hubs, and automotive Ethernet, playing roles such as impedance matching and electromagnetic interference suppression. The production of chip common mode inductors is now fully automated.

[0003] There are two main methods for manufacturing traditional chip common-mode inductors: one is single-layer parallel winding (such as...) Figure 1 As shown), two enameled wires are wound parallel to each other on the central pillar of the magnetic core frame, starting from one side and ending on the other side; the second is double-layer overlapping winding (as shown). Figure 2 As shown, one enameled wire is used to evenly wind from one side of the core frame column to the other side, and then another enameled wire is used to evenly cover and wind from one side of the core frame column to the other side. Both winding processes use a loose wire method, resulting in a low coupling coefficient between the two differential lines on the chip common mode inductor. The network characteristics exhibited will weaken sharply with the increase of frequency, making it difficult to meet the communication frequency standard requirements at higher frequency bands.

[0004] Therefore, it is necessary to provide a new high-frequency communication chip common-mode inductor to solve the above-mentioned technical problems. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides a high-frequency communication chip common-mode inductor that improves communication parameter values ​​and communication quality.

[0006] The high-frequency communication chip common-mode inductor provided by this utility model includes a chip common-mode inductor core frame, a first enameled wire, a second enameled wire, adhesive, and a chip common-mode inductor cover. After the first enameled wire is wound multiple turns on the chip common-mode inductor core frame, it is stretched out by twice the wire diameter and then wound multiple turns on the chip common-mode inductor core frame to complete the first winding. After the second enameled wire is wound multiple turns on the first winding, it is stretched out by twice the wire diameter and then wound multiple turns on the first winding to complete the second winding.

[0007] The chip common mode inductor core frame is provided with multiple terminals. The ends of the first and second enameled wires are respectively soldered to the terminals. The adhesive is fixed to the chip common mode inductor core frame. The chip common mode inductor core frame and the chip common mode inductor cover are assembled and fixed by adhesive.

[0008] Both the chip common mode inductor core frame and the chip common mode inductor cover are made of ferrite magnet material.

[0009] Both the first enameled wire and the second enameled wire are made of enameled copper wire.

[0010] The adhesive used is an epoxy resin adhesive.

[0011] The high-frequency communication chip common-mode inductor includes two repeating windings. Each winding is arranged in parallel segments along the central column of the chip common-mode inductor core skeleton. After each winding is wound with multiple turns of wire evenly arranged in a certain direction, the distance is pulled apart by twice the wire diameter, and multiple turns of wire are evenly arranged in sequence to complete the winding.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This high-frequency communication chip common-mode inductor uses a single copper wire wound evenly multiple times in a specific direction on the central column of the chip common-mode inductor core frame. Then, the wire is stretched to twice its diameter and wound evenly multiple times to form a winding group. A second winding is then evenly wound on top of the first winding of the chip common-mode inductor. The lead ends are welded and fixed, and the top cover is assembled and glued to form a complete high-frequency communication chip common-mode inductor. The unique single-winding method involves two sections of winding: first, multiple evenly wound turns... The process of winding multiple turns with twice the wire diameter has better coupling performance compared to the traditional loose-wire close-winding method. It reduces parasitic parameters and stray capacitance in high-frequency communication, enhances transmission capability, reduces network signal transmission loss, strengthens the anti-interference capability of network signals, and ensures normal transmission of network signals in the high-frequency band. It breaks through the technical difficulty that chip common-mode inductors can only be used in low-frequency communication systems, bringing chip common-mode inductors into new application fields, extending the life cycle of chip common-mode inductors, and expanding their application range. Attached Figure Description

[0014] Figure 1 A schematic diagram of a traditional chip common-mode inductor manufacturing method;

[0015] Figure 2 This is a schematic diagram of the structure of a traditional chip common mode inductor fabrication method two;

[0016] Figure 3 This is a three-dimensional view of the structure of this utility model;

[0017] Figure 4 This is a front view of the structure of this utility model;

[0018] Figure 5 This is a bottom view of the core skeleton structure of the chip common mode inductor of this utility model;

[0019] Figure 6 This is a schematic diagram showing the connection between the first enameled wire and the core frame of the chip common mode inductor of this utility model;

[0020] Figure 7 This is a schematic diagram showing the connection between the second enameled wire and the core frame of the chip common mode inductor of this utility model.

[0021] The components include: 1. Chip common mode inductor core frame; 2. First enameled wire; 3. Second enameled wire; 4. Adhesive; 5. Chip common mode inductor top cover; 6. Terminals. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 ,in Figure 1 A schematic diagram of a traditional chip common-mode inductor manufacturing method; Figure 2 This is a schematic diagram of the structure of a traditional chip common mode inductor fabrication method two; Figure 3 This is a three-dimensional view of the structure of this utility model; Figure 4 This is a front view of the structure of this utility model; Figure 5 This is a bottom view of the core skeleton structure of the chip common mode inductor of this utility model; Figure 6 This is a schematic diagram showing the connection between the first enameled wire and the core frame of the chip common mode inductor of this utility model; Figure 7This is a schematic diagram showing the connection between the second enameled wire and the chip common-mode inductor core frame of this utility model. A high-frequency communication chip common-mode inductor includes a chip common-mode inductor core frame 1, a first enameled wire 2, a second enameled wire 3, adhesive 4, and a chip common-mode inductor cover 5. The first enameled wire 2 is wound multiple turns on the chip common-mode inductor core frame 1, then stretched out by twice the wire diameter, and then wound multiple turns on the chip common-mode inductor core frame 1 to complete the first winding. The second enameled wire 3 is wound multiple turns on the first winding, then stretched out by twice the wire diameter, and then wound multiple turns on the first winding to complete the second winding. The chip common-mode inductor core frame 1 is provided with multiple terminals 6. The ends of the first enameled wire 2 and the second enameled wire 3 are soldered to... The common mode inductor core frame 1 is attached to the terminal 6 and fixed to the common mode inductor top cover 5 by adhesive 4. Both the common mode inductor core frame 1 and the common mode inductor top cover 5 are made of ferrite magnet material. The first enameled wire 2 and the second enameled wire 3 are made of enameled copper wire. The adhesive 4 is made of epoxy resin. The high-frequency communication common mode inductor includes two repeating windings. Each winding is arranged in parallel segments along the central column of the common mode inductor core frame 1. After winding multiple turns of wire evenly in a certain direction, the distance is pulled apart by twice the wire diameter, and multiple turns of wire are evenly arranged in sequence to complete the winding.

[0024] Using the above technical solution, the end of the first enameled wire 2 is soldered to the terminal 6. After winding multiple turns on the central column of the common-mode inductor core 1 to form the first bottom winding, the wire is then stretched to twice its diameter and wound multiple turns on the central column of the common-mode inductor core 1 to form the second bottom winding. The end of the first enameled wire 2 is then soldered to the terminal 6, completing the first winding. The end of the second enameled wire 3 is then soldered to the terminal 6 of the common-mode inductor core 1. The first section of the surface winding is formed by winding multiple turns on the central column of the chip common mode inductor core frame 1. The distance is increased by twice the wire diameter, and multiple turns are then wound on the central column of the chip common mode inductor core frame 1 to form the second section of the surface winding. Then, the tail of the second enameled wire 3 is soldered to the end 6 to complete the second winding. The chip common mode inductor core frame 1 and the chip common mode inductor cover 5 can be assembled and bonded together with adhesive 4 to form a complete high-frequency communication chip common mode inductor.

[0025] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. Furthermore, the structure and principle of the components known to those skilled in the art can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-frequency communication chip common-mode inductor, characterized in that: The device includes a chip common mode inductor core frame (1), a first enameled wire (2), a second enameled wire (3), adhesive (4), and a chip common mode inductor cover (5). The first enameled wire (2) is wound multiple times on the chip common mode inductor core frame (1), and then the distance is increased by twice the wire diameter. The first winding is completed by winding multiple times on the chip common mode inductor core frame (1). The second enameled wire (3) is wound multiple times on the first winding, and then the distance is increased by twice the wire diameter. The second winding is completed by winding multiple times on the first winding. The chip common mode inductor core frame (1) is provided with multiple terminals (6). The ends of the first enameled wire (2) and the second enameled wire (3) are respectively welded to the terminals (6). The adhesive (4) is fixed on the chip common mode inductor core frame (1). The chip common mode inductor core frame (1) and the chip common mode inductor top cover (5) are assembled and fixed by the adhesive (4).

2. The high-frequency communication chip common-mode inductor according to claim 1, characterized in that: Both the chip common mode inductor core frame (1) and the chip common mode inductor top cover (5) are made of ferrite magnet material.

3. A high-frequency communication chip common-mode inductor according to claim 1, characterized in that: Both the first enameled wire (2) and the second enameled wire (3) are made of enameled copper wire.

4. A high-frequency communication chip common-mode inductor according to claim 1, characterized in that: The adhesive (4) is made of epoxy resin.

5. A high-frequency communication chip common-mode inductor according to claim 1, characterized in that: The high-frequency communication chip common-mode inductor includes two repeating windings. Each winding is arranged in parallel segments along the central column of the chip common-mode inductor core skeleton (1). After each winding is wound with multiple turns of wire evenly arranged in a certain direction, the distance is pulled apart by twice the wire diameter, and multiple turns of wire are evenly arranged in sequence to complete the winding.

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