Three-level NPC module and electronic equipment

Abstract

The embodiment of the utility model provides a three-level NPC module and electronic equipment, the three-level NPC module comprises a first DBC substrate and a second DBC substrate, the first DBC substrate is provided with a first bridge arm circuit, and the first bridge arm circuit is provided with a first pin; the second DBC substrate is provided with a second bridge arm circuit, and the second bridge arm circuit is provided with a second pin; wherein the first pin and the second pin are used for being connected to a load inductor, at least one lead bonding wire is arranged between the first DBC substrate and the second DBC substrate, and the lead bonding wire is used for bridging the first pin and the second pin. The first pin and the second pin are directly connected through the lead bonding wire, so that the first pin and the second pin of the two parts do not need to be short-circuited and then connected to the load inductor through PCB design wiring, a current loop can be shortened, loop stray inductance is reduced, and system reliability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic circuits, and in particular to a three-level NPC module and electronic equipment. BACKGROUND

[0002] In the related art, the NPC (Neutral Point Clamped) three-level topology is a most widely used multi-level topology. In recent years, with the development of power electronic technology in the power industry, the NPC three-level technology has been increasingly applied to various fields, including photovoltaic inverters, wind power converters, high-voltage frequency converters, UPS (Uninterruptible Power Supply), high-frequency power supplies, etc.

[0003] For the three-level technology, the parameters that are very important to the switching characteristics of the IGBT are the stray inductance and the parasitic capacitance. The stray inductance mainly includes two parts: the commutation loop stray inductance Ls and the driving loop stray inductance Lg. The formula for the influence of the commutation loop stray inductance Ls is V=Ls*di / dt, and the loop Ls affects the IGBT turn-off voltage in the case of current change. The commutation loop Ls includes the bus capacitor stray inductance, the stray inductance between the bus capacitor and the IGBT module, and the internal stray inductance of the module, such as the terminal-to-terminal stray inductance, the bonding wire and the DCB copper layer stray inductance. Therefore, the stray inductance of the three-level topology structure is high, and the system reliability is poor. CONTENT OF THE INVENTION

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a three-level NPC module and electronic equipment, which aims to reduce the loop stray inductance and improve the system reliability.

[0005] In a first aspect, an embodiment of the present application provides a three-level NPC module, comprising:

[0006] A first DBC substrate is provided with a first bridge arm circuit, and the first bridge arm circuit is provided with a first pin;

[0007] A second DBC substrate is provided with a second bridge arm circuit, and the second bridge arm circuit is provided with a second pin;

[0008] The first pin and the second pin are used to be connected to a load inductance, at least one wire bonding line is provided between the first DBC substrate and the second DBC substrate, and the wire bonding line is used to crosslink the first pin and the second pin.

[0009] According to some embodiments of the present application, the first bridge arm circuit further comprises a bus positive port, a first bus neutral port, a first switch device, a second switch device and a fifth diode, the bus positive port is connected to an input end of the first switch device, an output end of the first switch device is connected to an input end of the second switch device, an output end of the second switch device is connected to the first pin, the first bus neutral port is connected to the output end of the first switch device and the input end of the second switch device through the fifth diode.

[0010] According to some embodiments of the present application, the first switch device is provided with a first parasitic diode, a second parasitic diode is provided for the second switch device, a positive electrode of the first parasitic diode is connected to an output end of the first switch device, a negative electrode of the first parasitic diode is connected to an input end of the first switch device, a positive electrode of the second parasitic diode is connected to an output end of the second switch device, and a negative electrode of the second parasitic diode is connected to an input end of the second switch device.

[0011] According to some embodiments of the present application, the second bridge arm circuit further comprises a bus negative port, a second bus neutral port, a third switch device, a fourth switch device and a sixth diode, the second pin is connected to an input end of the third switch device, an output end of the third switch device is connected to the second bus neutral port through the sixth diode, the output end of the third switch device is also connected to an input end of the fourth switch device, and an output end of the fourth switch device is connected to the bus negative port.

[0012] According to some embodiments of the present application, the third switch device is provided with a third parasitic diode, a fourth parasitic diode is provided for the fourth switch device, a positive electrode of the third parasitic diode is connected to an output end of the third switch device, a negative electrode of the third parasitic diode is connected to an input end of the third switch device, a positive electrode of the fourth parasitic diode is connected to an output end of the fourth switch device, and a negative electrode of the fourth parasitic diode is connected to an input end of the fourth switch device.

[0013] According to some embodiments of the present application, one of the following is included:

[0014] In the case of inverter mode, when the first switch device and the second switch device are in an open state, current flows from the bus positive port to the first pin and the second pin through the first switch device and the second switch device.

[0015] In the inverter mode, when the first switch device is in the off state and the second switch device is in the on state, the current flows from the first bus neutral port to the first pin and the second pin through the fifth diode and the second switch device.

[0016] According to some embodiments of the present application, the following one is included:

[0017] In the inverter mode, when the first switch device is in the off state and the second switch device is in the on state, the current flows from the first bus neutral port to the first pin and the second pin through the fifth diode and the second switch device.

[0018] In the inverter mode, when the first switch device is in the off state and the second switch device is in the on state, the current flows from the first bus neutral port to the first pin and the second pin through the fifth diode and the second switch device.

[0019] According to some embodiments of the present application, the number of the wire bonding lines is multiple, and the multiple wire bonding lines are arranged side by side.

[0020] According to some embodiments of the present application, the first DBC substrate and the second DBC substrate are located on the same substrate.

[0021] In the second aspect, the embodiments of the present application further provide an electronic device comprising the three-level NPC module of the first aspect.

[0022] According to the technical scheme of the embodiments of the present application, at least the following beneficial effects are achieved: the embodiments of the present application include the first DBC substrate and the second DBC substrate, the first DBC substrate is provided with the first bridge arm circuit, the first bridge arm circuit is provided with the first pin, the second DBC substrate is provided with the second bridge arm circuit, the second bridge arm circuit is provided with the second pin, wherein the first pin and the second pin are used to be connected to the load inductance, at least one wire bonding line is arranged between the first DBC substrate and the second DBC substrate, and the wire bonding line is used to cross-connect the first pin and the second pin. Since the first pin and the second pin are directly connected through the wire bonding line, the embodiments of the present application do not need to short the first pin and the second pin of the two parts through the PCB design wire and then connect them to the load inductance, so as to shorten the current loop, thereby reducing the loop stray inductance and improving the system reliability.

[0023] Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and / or can be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings are intended to provide a further understanding of the technical solutions of the present application and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical solutions of the present application, and do not constitute a limitation on the technical solutions of the present application.

[0025] Figure 1 is a circuit schematic diagram of an existing three-level NPC module;

[0026] Figure 2 is a module appearance diagram of an existing three-level NPC module;

[0027] Figure 3 is a module internal schematic diagram of an existing three-level NPC module;

[0028] Figure 4 is a circuit schematic diagram of a three-level NPC module provided by an embodiment of the present application;

[0029] Figure 5 is a module internal schematic diagram of a three-level NPC module provided by an embodiment of the present application. DETAILED DESCRIPTION

[0030] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, in which the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, and are only used to explain the present application, and cannot be understood as a limitation on the present application.

[0031] In the description of the present application, it should be understood that, if the orientation description, such as up, down, front, back, left, right, etc. indicates the orientation or positional relationship shown in the drawings, it is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In the description of the present application, the meaning of several is one or more, and the meaning of multiple is two or more. Greater than, less than, more than, etc. are understood as not including the number, and above, below, etc. are understood as including the number. If it is described as first, second, etc., it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of indicated technical features.

[0033] In the description of the present application, the meaning of several is one or more, the meaning of multiple is more than two, greater than, less than, more than, etc. Understand as not including the number, above, below, etc. Understand as including the number. If it is described to the first, the second is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0034] The serial numbers of components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any order or technical meaning. The "connection" and "coupling" in the present application include direct and indirect connection (coupling) unless otherwise specified.

[0035] In the description of the present application, unless otherwise expressly limited, the words such as setting, installing, connecting, etc. should be broadly understood, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical scheme.

[0036] In some cases, NPC three-level topology is one of the most widely used multi-level topologies. In recent years, with the development of power electronics technology in the power industry, NPC three-level technology has been increasingly applied to various fields, including photovoltaic inverters, wind power converters, high-voltage frequency converters, UPS, high-frequency power supplies, etc.

[0037] For three-level technology, the parameters that greatly affect the switching characteristics of IGBT are stray inductance and parasitic capacitance. Stray inductance mainly includes two parts: stray inductance Ls of the commutation loop and stray inductance Lg of the drive loop. The formula for the influence of stray inductance Ls is V=Ls*di / dt, and the loop Ls affects the IGBT turn-off voltage in the case of current change. The commutation loop Ls includes: bus capacitance stray inductance, bus capacitance to IGBT module stray inductance, and module internal stray inductance, such as terminal stray inductance, bonding wire and DCB copper layer stray inductance. Therefore, the stray inductance of the three-level topology is high, and the system reliability is poor.

[0038] As shown in Figures 1 to 3 PH1 / PH2 is the pin of the module, which must be short-circuited by PCB design wiring, and then connected to the load inductance. The internal pin of the module is not connected. This design method has a large current loop, especially in the case of long commutation loop in the reactive or rectification mode of INPC, IGBT T2 / T3 bears a larger turn-off overshoot voltage, which may cause IGBT CE overvoltage damage in extreme cases.

[0039] Based on the above situation, the embodiments of the present application propose a three-level NPC module and electronic equipment, which aims to reduce the stray inductance of the module current loop and improve the system reliability.

[0040] The various embodiments of the three-level NPC module of the present application are further described below with reference to the accompanying drawings.

[0041] In an embodiment, as shown in Figure 4 and Figure 5 The three-level NPC module of the embodiment of the present application includes, but is not limited to, a first DBC substrate DBC1 and a second DBC substrate DBC2, the first DBC substrate DBC1 is provided with a first bridge arm circuit, the first bridge arm circuit is provided with a first pin PH1; the second DBC substrate DBC2 is provided with a second bridge arm circuit, the second bridge arm circuit is provided with a second pin PH2.

[0042] The first pin PH1 and the second pin PH2 are used to be connected to a load inductance, at least one wire bonding line 100 is arranged between the first DBC substrate DBC1 and the second DBC substrate DBC2, and the wire bonding line 100 is used to cross-connect the first pin PH1 and the second pin PH2.

[0043] As shown in Figure 3 , the PH1 20-29, PH2 49-58 PIN feet are respectively on the DBC1 and DBC2 copper-clad plates and are not connected. In order to reduce the loop stray inductance, the DBC layout is optimized and designed, that is, as shown in Figure 5 , the DBC1 / DBC2 PH1 / PH2 is connected by a bonding wire.

[0044] After the module PH1 / PH2 pin feet are internally short-circuited by the bonding wire, the phase current output does not need to pass through the loop formed on the PCB, the current loop stray inductance Ls is reduced, the switching device turn-off voltage is greatly improved in the case of long commutation loop in the reactive or rectification mode, and the system reliability is improved. In addition, this scheme is not limited to INPC, and is also effective for TNPC / ANPC.

[0045] It should be noted that, since the first pin PH1 and the second pin PH2 are directly connected by the wire bonding line 100, the first pin PH1 and the second pin PH2 of the two parts do not need to be short-circuited and then connected to the load inductance by the PCB design trace, so that the current loop can be shortened, the loop stray inductance is reduced, and the system reliability is improved.

[0046] In an embodiment, the first bridge arm circuit further comprises a bus positive port DC+, a first bus neutral port N1, a first switching device T1, a second switching device T2 and a fifth diode D5, the bus positive port DC+ is connected to an input end of the first switching device T1, an output end of the first switching device T1 is connected to an input end of the second switching device T2, an output end of the second switching device T2 is connected to the first pin PH1, the first bus neutral port N1 is connected to the output end of the first switching device T1 and the input end of the second switching device T2 through the fifth diode D5.

[0047] In an embodiment, the first switching device T1 is provided with a first parasitic diode D1, the second switching device T2 is provided with a second parasitic diode D2, a positive electrode of the first parasitic diode D1 is connected to the output end of the first switching device T1, a negative electrode of the first parasitic diode D1 is connected to the input end of the first switching device T1, a positive electrode of the second parasitic diode D2 is connected to the output end of the second switching device T2, a negative electrode of the second parasitic diode D2 is connected to the input end of the second switching device T2.

[0048] In an embodiment, the second bridge arm circuit further comprises a bus negative port DC-, a second bus neutral port N2, a third switching device T3, a fourth switching device T4 and a sixth diode D6, the second pin PH2 is connected to an input end of the third switching device T3, an output end of the third switching device T3 is connected to the second bus neutral port N2 through the sixth diode D6, the output end of the third switching device T3 is also connected to an input end of the fourth switching device T4, an output end of the fourth switching device T4 is connected to the bus negative port DC-.

[0049] In an embodiment, the third switching device T3 is provided with a third parasitic diode D3, the fourth switching device T4 is provided with a fourth parasitic diode D4, a positive electrode of the third parasitic diode D3 is connected to the output end of the third switching device T3, a negative electrode of the third parasitic diode D3 is connected to the input end of the third switching device T3, a positive electrode of the fourth parasitic diode D4 is connected to the output end of the fourth switching device T4, a negative electrode of the fourth parasitic diode D4 is connected to the input end of the fourth switching device T4.

[0050] In an embodiment, the short commutation loop comprises the following cases:

[0051] In the case of inverter mode, when the first switching device T1 and the second switching device T2 are in an open state, the current flows from the bus positive port DC+ to the first pin PH1 and the second pin PH2 through the first switching device T1 and the second switching device T2.

[0052] In the inverter mode, when the first switch device T1 is in the off state and the second switch device T2 is in the on state, the current flows from the first bus neutral point port N1 to the first pin PH1 and the second pin PH2 through the fifth diode D5 and the second switch device T2.

[0053] Specifically, in the inverter mode, the first switch device T1 and the second switch device T2 are on, and the current flows to the load inductor; when the first switch device T1 is off, the current flows through the fifth diode D5 and the second switch device T2 for freewheeling.

[0054] In an embodiment, the long commutation loop includes the following cases:

[0055] In the reactive or rectification mode, when the third switch device T3 is in the on state, the current flows from the first pin PH1 and the second pin PH2 to the second bus neutral point port N2 through the third switch and the sixth diode D6.

[0056] In the reactive or rectification mode, when the third switch device T3 is in the off state, the current flows from the first pin PH1 and the second pin PH2 to the bus positive port DC+ through the second parasitic diode D2 and the first parasitic diode D1.

[0057] Specifically, in the reactive or rectification mode, the third switch device T3 is on, and the current flows to the third switch device T3 and the sixth diode D6; when the third switch device T3 is off, the freewheeling loop is through the second parasitic diode D2 and the first parasitic diode D1, and the parasitic inductance of this loop is larger than that of the short commutation loop.

[0058] In an embodiment, as shown in FIG. 1, the number of wire bonding wires 100 is multiple, and the multiple wire bonding wires 100 are arranged side by side. Figure 5

[0059] In an embodiment, as shown in FIG. 1, the first DBC substrate DBC1 and the second DBC substrate DBC2 are located on the same substrate, or the first DBC substrate DBC1 and the second DBC substrate DBC2 are independently arranged. Figure 5

[0060] Based on the three-level NPC module of each of the above embodiments, each embodiment of the electronic device of the present application is proposed as follows.

[0061] In an embodiment, the electronic device of the present application includes but is not limited to the three-level NPC module of any of the above embodiments.

[0062] ​​It is worth noting that since the electronic device of the embodiment of the present application includes the three-level NPC module of any of the above embodiments, the specific implementation and technical effects of the electronic device of the embodiment of the present application can refer to the specific implementation and technical effects of the three-level NPC module of any of the above embodiments.

[0063] It should be understood that in the present application, "at least one" refers to one or more, and "multiple" refers to two or more. "And / or" is used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, "A and / or B" can mean that there are three cases of only A, only B and A and B at the same time, where A and B can be singular or plural. The character " / " generally represents that the associated objects before and after are in an "or" relationship. "At least one of the following" or the like means any combination of these items, including any combination of single item or multiple items. For example, at least one of a, b or c can mean a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0064] In several embodiments provided by the present application, it should be understood that the disclosed system, apparatus and method can be implemented in other ways. For example, the apparatus embodiments described above are merely schematic, for example, the division of units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed units can be indirect coupling or communication connection through some interfaces, apparatuses or units, which can be electrical, mechanical or other forms. The units described as separate components can be or can not be physically separated, and the components displayed as units can be or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. Some or all units can be selected according to actual needs to achieve the purpose of the embodiment of the present application.

[0065] The above is a specific description of the preferred embodiments of the present application, but the present application is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application. These equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A three-level NPC module, characterized by The first DBC substrate is provided with a first bridge arm circuit, and the first bridge arm circuit is provided with a first pin; The second DBC substrate is provided with a second bridge arm circuit, and the second bridge arm circuit is provided with a second pin; The first pin and the second pin are used to be connected to a load inductor, at least one wire bonding line is arranged between the first DBC substrate and the second DBC substrate, and the wire bonding line is used to cross-connect the first pin and the second pin. The first bridge arm circuit further comprises a bus positive port, a first bus neutral point port, a first switch device, a second switch device and a fifth diode, the bus positive port is connected to the input end of the first switch device, the output end of the first switch device is connected to the input end of the second switch device, the output end of the second switch device is connected to the first pin, and the first bus neutral point port is connected to the output end of the first switch device and the input end of the second switch device through the fifth diode.

2. The three-level NPC module of claim 1, wherein, The first switch device is provided with a first parasitic diode, the positive electrode of the first parasitic diode is connected to the output end of the first switch device, the negative electrode of the first parasitic diode is connected to the input end of the first switch device, the second switch device is provided with a second parasitic diode, the positive electrode of the second parasitic diode is connected to the output end of the second switch device, and the negative electrode of the second parasitic diode is connected to the input end of the second switch device.

3. The three-level NPC module of claim 2, wherein, The second bridge arm circuit further comprises a bus negative port, a second bus neutral point port, a third switch device, a fourth switch device and a sixth diode, the second pin is connected to the input end of the third switch device, the output end of the third switch device is connected to the second bus neutral point port through the sixth diode, the output end of the third switch device is also connected to the input end of the fourth switch device, and the output end of the fourth switch device is connected to the bus negative port.

4. The three-level NPC module of claim 3, wherein, The third switch device is provided with a third parasitic diode, the positive electrode of the third parasitic diode is connected to the output end of the third switch device, the negative electrode of the third parasitic diode is connected to the input end of the third switch device, the fourth switch device is provided with a fourth parasitic diode, the positive electrode of the fourth parasitic diode is connected to the output end of the fourth switch device, and the negative electrode of the fourth parasitic diode is connected to the input end of the fourth switch device.

5. The three-level NPC module of claim 4, wherein, One of the following is included:

6. The three-level NPC module of claim 5, wherein, In the case of inverter mode, when the first switch device and the second switch device are in the open state, the current flows from the bus positive port to the first pin and the second pin through the first switch device and the second switch device; In the case of inverter mode, when the first switch device is in the off state and the second switch device is in the open state, the current flows from the first bus neutral point port to the first pin and the second pin through the fifth diode and the second switch device. One of the following is included:

7. The three-level NPC module of claim 5, wherein, ​ In the case of reactive or rectification mode, when the third switch device is in the open state, the current flows from the first pin and the second pin through the third switch and the sixth diode to the second bus neutral port; In the case of reactive or rectification mode, when the third switch device is in the open state, the current flows from the first pin and the second pin through the third switch and the sixth diode to the second bus neutral port.

8. The three-level NPC module of claim 1, wherein, The number of the wire bonding lines is multiple, and the multiple wire bonding lines are arranged side by side.

9. The three-level NPC module of claim 1, wherein, The first DBC substrate and the second DBC substrate are located on the same substrate.

10. An electronic device, comprising: A three-level NPC module as claimed in any one of claims 1 to 9. A three-level NPC module as claimed in any one of claims 1 to 9.

Images