Loudspeaker module and electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of loudspeakers, in particular to a loudspeaker module and electronic equipment. The embodiment of the utility model aims to solve the problem that the thickness of the loudspeaker module is large. According to the loudspeaker module provided by the embodiment of the invention, a shell is provided with a sound outlet hole, a structural member is arranged in the shell, the structural member and the shell jointly define a cavity, the structural member is provided with a first groove, a first vibrating diaphragm is installed in the cavity, the first vibrating diaphragm and the structural member are arranged along a first direction, and the first direction is the thickness direction of the loudspeaker module. The first vibrating diaphragm at least divides the cavity into a first sound cavity and a second sound cavity, the shell, the structural member and the first vibrating diaphragm jointly define the first sound cavity, the first sound cavity is communicated with the sound outlet hole, the piezoelectric piece is arranged at the bottom of the first groove, at least part of the piezoelectric piece is located in the first groove, and the thickness of the whole formed by the piezoelectric piece and the structural member is reduced. Therefore, the thickness of the loudspeaker module can be reduced.

Description

Technical Field

[0001] This application relates to the field of loudspeaker technology, specifically to a loudspeaker module and an electronic device. Background Technology

[0002] A speaker module typically includes a first diaphragm, a voice coil, and a magnetic component. The voice coil is connected to the first diaphragm and is located within the magnetic field of the magnetic component. When an electric current is passed through the voice coil, it generates a magnetic field. The interaction between the voice coil's magnetic field and the magnetic field of the magnetic component causes the voice coil to vibrate, thereby driving the first diaphragm to vibrate and produce sound. To improve the speaker module's ability to output high-frequency audio signals, it may also include a piezoelectric component and a second diaphragm. Based on the piezoelectric effect, when an electric current is passed through the piezoelectric component, it drives the second diaphragm to vibrate and produce sound. However, speaker modules in related technologies are relatively thick, occupying a significant amount of space. Utility Model Content

[0003] This application provides a speaker module and an electronic device that can reduce the thickness of the speaker module.

[0004] In a first aspect, embodiments of this application provide a loudspeaker module, which includes: a housing, a structural component, a first diaphragm, and a piezoelectric component.

[0005] The structural component and the first diaphragm are both housed in the outer casing, and the structural component and the outer casing together enclose a cavity. The first diaphragm is installed inside the cavity and divides the cavity into at least a first sound cavity and a second sound cavity, with the first diaphragm located between the first and second sound cavities. The first sound cavity is formed by the outer casing, the structural component, and the first diaphragm, with at least a portion of the first sound cavity located between the structural component and the first diaphragm. The structural component and the first diaphragm are arranged along a first direction, which is the thickness direction of the speaker module. For example, the structural component, the first sound cavity, the first diaphragm, and the second sound cavity are arranged sequentially along the first direction.

[0006] The first diaphragm can vibrate to produce sound; the piezoelectric element is mounted on the structural component, and the piezoelectric element can drive the structural component to vibrate and produce sound. The outer shell has a sound outlet, which is connected to the first sound cavity. The sound generated by the vibration of the first diaphragm, the piezoelectric element, and the structural component can all be transmitted to the outside of the speaker module through the first sound cavity and the sound outlet.

[0007] The structural component has a first groove, and the piezoelectric element is located at the bottom of the first groove. With the above arrangement, at least part of the piezoelectric element is located in the first groove, and the thickness of the whole composed of the piezoelectric element and the structural component is reduced, thereby reducing the thickness of the speaker module and facilitating the miniaturization and thinning of the speaker module.

[0008] In some embodiments that may include the above-described embodiments, the structural component includes a stacked vibration isolation plate and a second diaphragm, with the second diaphragm disposed on the vibration isolation plate. The vibration isolation plate has a first through hole that penetrates the vibration isolation plate and includes the hole wall of the first through hole. The second diaphragm covers the first through hole to close one end of the first through hole. Thus, the vibration isolation plate and the second diaphragm together form a first groove, the sidewall of the first groove includes the hole wall of the first through hole, the bottom of the first groove includes at least a portion of the second diaphragm, and the hole wall of the first through hole and the second diaphragm form the first groove. A piezoelectric element is disposed on the second diaphragm.

[0009] With the above configuration, the piezoelectric element can drive the second diaphragm to vibrate and produce sound. Furthermore, the overall thickness of the piezoelectric element, the vibration isolation plate, and the second diaphragm is reduced, thereby reducing the thickness of the speaker module and facilitating its miniaturization and thinning.

[0010] In some embodiments that may include the above embodiments, on the first reference plane, the orthographic projection of the piezoelectric element and the orthographic projection of the structural element at least partially overlap, and the first reference plane is parallel to the first direction.

[0011] The above settings reduce the overall thickness of the piezoelectric components and structural components, as well as the thickness of the speaker module, which is beneficial for miniaturization and thinning of the speaker module.

[0012] In some embodiments that may include the above-described embodiments, at least a portion of the structural component is located between the piezoelectric element and the first diaphragm. For example, in a first direction, the piezoelectric element, the structural component, the first acoustic cavity, and the first diaphragm are arranged sequentially, and the piezoelectric element may be exposed on the outside of the speaker module.

[0013] The above configuration facilitates the electrical connection of piezoelectric components with external circuits such as flexible circuit boards or wires.

[0014] In some embodiments that may include the above embodiments, on a second reference plane perpendicular to the first direction, the orthographic projection of the first diaphragm and the orthographic projection of the piezoelectric element do not overlap, and the first diaphragm and the piezoelectric element are spaced apart.

[0015] The above settings can reduce the sound generated by the vibration of the piezoelectric element transmitted to the first diaphragm, reduce the impact of the piezoelectric element vibration on the first diaphragm, and help ensure the sound pressure level of the sound generated by the vibration of the first diaphragm; and can reduce the sound generated by the vibration of the first diaphragm transmitted to the piezoelectric element, reduce the impact of the first diaphragm vibration on the piezoelectric element, and help ensure the sound pressure level of the sound generated by the vibration of the piezoelectric element.

[0016] In some embodiments that may include the above-described examples, the housing is provided with a valve port connecting the first sound cavity and the second sound cavity. The speaker module also includes a vent membrane connected to the housing and covering the valve port. Thus, gas in the first sound cavity can pass through the vent membrane into the second sound cavity, and gas in the second sound cavity can pass through the vent membrane into the first sound cavity, thereby balancing the air pressure between the first and second sound cavities. This prevents the pressure difference between the first and second sound cavities from causing deformation of the first diaphragm, and also prevents the pressure difference between the first and second sound cavities from affecting the vibration of the first diaphragm for sound generation. Simultaneously, the vent membrane can prevent sound from the first sound cavity from being transmitted to the second sound cavity through the valve port, and can also prevent sound from the second sound cavity from being transmitted to the first sound cavity through the valve port.

[0017] On the second reference plane, the orthographic projection of the piezoelectric element at least partially overlaps with the orthographic projection of the breathable membrane. This arrangement helps to reduce the size of the speaker module.

[0018] Secondly, embodiments of this application provide an electronic device, including: a mid-frame, and a speaker module as described in any of the above embodiments. The mid-frame has a speaker opening, and a sound outlet communicates with the speaker opening. Thus, the sound generated by the vibration of the first diaphragm, piezoelectric element, and structural components can be transmitted to the outside of the electronic device through the first acoustic cavity, the sound outlet, and the speaker opening, thereby achieving audio playback functionality.

[0019] The above design reduces the thickness of the speaker module, which is beneficial for making electronic devices thinner and lighter.

[0020] Thirdly, embodiments of this application also provide another electronic device, including: a mid-frame, a housing, a first diaphragm, and a piezoelectric element.

[0021] The outer shell is disposed within the middle frame, forming a cavity with the middle frame. A first diaphragm is mounted within the cavity, and the first diaphragm divides the cavity into at least a first sound cavity and a second sound cavity, with the first diaphragm located between the first and second sound cavities. The first sound cavity is formed by the middle frame, the outer shell, and the first diaphragm, with at least a portion of the first sound cavity located between the middle frame and the first diaphragm. The first diaphragm and the middle frame are arranged along a first direction, which is the thickness direction of the electronic device. For example, the middle frame, the first sound cavity, the first diaphragm, and the second sound cavity are arranged sequentially along the first direction.

[0022] The first diaphragm can vibrate to produce sound; the piezoelectric element is located on the middle frame, and the piezoelectric element can drive the middle frame to vibrate and produce sound. The outer shell has a sound outlet, which is connected to the first sound cavity. The sound generated by the vibration of the first diaphragm, the piezoelectric element, and the middle frame can all be transmitted to the outside of the electronic device through the first sound cavity and the sound outlet.

[0023] A second groove is provided on the mid-frame, and the piezoelectric element is located at the bottom of the second groove. As a result, at least part of the piezoelectric element is located within the second groove, and the piezoelectric element has a smaller impact on the thickness of the mid-frame, which is beneficial for the thinning and lightening of electronic devices.

[0024] In some embodiments that may include the above embodiments, the electronic device further includes a second diaphragm, which is stacked on and disposed on the mid-frame. The mid-frame has a second through-hole that penetrates the mid-frame and includes the wall of the second through-hole. The second diaphragm covers the second through-hole to close one end of the second through-hole. Thus, the mid-frame and the second diaphragm together form a second groove, the sidewall of the second groove including the wall of the second through-hole, and the bottom of the second groove including at least a portion of the second diaphragm. The wall of the second through-hole and the second diaphragm together form the second groove.

[0025] The piezoelectric element is disposed on the second diaphragm, and at least part of the piezoelectric element is located within the second through hole. With the above arrangement, the piezoelectric element can drive the second diaphragm to vibrate and produce sound, and the piezoelectric element has little impact on the thickness of the middle frame, which is beneficial to the thinning and lightening of electronic devices.

[0026] In some embodiments that may include the above-described embodiments, on a first reference plane parallel to the first direction, the orthographic projection of the piezoelectric element and the orthographic projection of the mid-frame at least partially overlap, and at least a portion of the piezoelectric element is located within a second groove. This arrangement reduces the impact of the piezoelectric element on the thickness of the mid-frame, which is beneficial for making electronic devices thinner and lighter. Attached Figure Description

[0027] Figure 1 An exploded view of an electronic device in one embodiment;

[0028] Figure 2 A structural diagram of at least part of the mid-frame and speaker module in an electronic device;

[0029] Figure 3 This is a structural diagram of a speaker module in one embodiment;

[0030] Figure 4 for Figure 2 A cross-sectional view of the electronic device shown along section line AA;

[0031] Figure 5 for Figure 4 Enlarged view of the structure at point B;

[0032] Figure 6 for Figure 3 Exploded view of the speaker module shown;

[0033] Figure 7 This is a structural diagram of the speaker module in another embodiment;

[0034] Figure 8 for Figure 7The speaker module shown is a cross-sectional view along the CC section line.

[0035] Figure 9 for Figure 8 Enlarged view of the structure at point D;

[0036] Figure 10 This is a structural diagram of at least a portion of the electronic device in another embodiment;

[0037] Figure 11 for Figure 10 Exploded view of the electronic device shown;

[0038] Figure 12 for Figure 10 The electronic device shown is a cross-sectional view along the EE section line.

[0039] Explanation of reference numerals in the attached figures:

[0040] 100. Electronic device; 110. Display panel; 120. Circuit board; 121. Processor; 130. Battery; 140. Mid-frame; 140a. Second recess; 140b. Side wall of the second recess; 140c. Bottom of the second recess; 141. First frame; 142. Second frame; 143. Third frame; 144. Fourth frame; 145. Charging port; 146. Speaker port; 147. Mounting slot; 1471. Bottom of the mounting slot; 148. Second through hole; 1481. Hole wall of the second through hole; 150. Back cover;

[0041] 200, Speaker module; 210, Housing; 211, Sound outlet; 212, Opening; 213, Valve port; 220, Structural component; 220a, First groove; 220b, Side wall of the first groove; 220c, Bottom of the first groove; 221, Vibration damping plate; 2211, First through hole; 2212, Hole wall of the first through hole; 222, Second diaphragm; 230, Cavity; 231, First sound cavity; 232, Second sound cavity; 240, First adhesive layer; 250, First diaphragm; 251, Surround; 2511, Hollow part; 2512, Arc-shaped part; 2513, First connecting part; 2514, Second connecting part; 252, Dome; 260, Breathable membrane; 270, Piezoelectric component. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all possible embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0043] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0044] As used herein, terms such as “equal,” “parallel,” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equal items less than or equal to 5% of either one.

[0045] In the embodiments of this application, the directional indications used to explain the structure and movement of different components, such as up, down, left, right, front, and back, are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, these directional indications will also change accordingly.

[0046] This application provides an electronic device, which may include at least one device with audio playback functionality, such as a mobile phone, foldable phone, tablet computer, laptop computer, in-vehicle device, wearable device, virtual reality (VR) device, or augmented reality (AR) device. This application does not limit the type of electronic device. The electronic device includes a speaker module, which enables audio playback and other functions. The following description uses a mobile phone as an example, but the electronic device in this application is not limited to a mobile phone.

[0047] For ease of explanation, the thickness direction of the electronic device is defined as the first direction x, the width direction as the second direction y, and the length direction as the third direction z.

[0048] Please refer to Figure 1The electronic device 100 includes a display panel 110, a circuit board 120, a battery 130, a mid-frame 140, and a back cover 150. The display panel 110, mid-frame 140, and back cover 150 are arranged sequentially along a first direction x, with the display panel 110 covering one side of the mid-frame 140 and the back cover 150 covering the other side of the mid-frame 140. The mid-frame 140, display panel 110, and back cover 150 enclose the electronic device 100. The mid-frame 140 includes a first border 141, a second border 142, a third border 143, and a fourth border 144 connected sequentially. The first border 141 and third border 143 are opposite to each other and can both be parallel to a second direction y; the second border 142 and fourth border 144 are opposite to each other and can both be parallel to a third direction z, and both the second border 142 and fourth border 144 are connected between the first border 141 and the third border 143.

[0049] In an example where the electronic device 100 includes a foldable phone, the mid-frame 140 may include a first mid-frame and a second mid-frame, which are foldably connected. The first mid-frame can be folded or unfolded relative to the second mid-frame. Alternatively, the mid-frame 140 may also include a third mid-frame, which can be foldably connected to either the first or second mid-frame. The first, second, and third mid-frames can be folded or unfolded relative to each other. In the above examples, the first, second, and third mid-frames can all be connected by hinges. This application does not limit the structure of the hinges, as long as they allow the first, second, and third mid-frames to fold or unfold relative to each other.

[0050] Circuit board 120 is disposed on the middle frame 140. Processor 121 may be disposed on circuit board 120. Processor 121 may include at least one of the following electronic components: central processing unit (CPU), digital signal processing (DSP) chip, integrated circuit (IC), or power amplifier. There may be one or more circuit boards 120 and one or more processors 121. The number of circuit boards 120 and processors 121 is not limited in this embodiment.

[0051] Battery 130 is located in the middle frame 140 and is used to power electronic device 100. For example, battery 130 can power display panel 110 or circuit board 120. Figure 1 and Figure 2As shown, a charging port 145 may be provided on the middle frame 140, through which the battery 130 can be charged. For example, the charging port 145 may be located on the first border 141. Of course, in other examples, the charging port 145 may also be located on at least one of the second border 142, the third border 143, or the fourth border 144. Here, Figure 2 The diagram only shows part of the structure of the middle frame 140; another part of the structure of the middle frame 140 is not shown. Figure 2 As shown in the image.

[0052] Please refer to Figure 2 The electronic device 100 includes a speaker module 200, which may be disposed on a mid-frame 140. In an example where the electronic device 100 includes a foldable phone, the speaker module 200 may be disposed on at least one of a first mid-frame, a second mid-frame, or a third mid-frame.

[0053] In one example, the mid-frame 140 has a mounting slot 147, within which the speaker module 200 can be disposed and connected to the bottom 1471 of the mounting slot. For example, the mounting slot 147 can be located on the side of the mid-frame 140 near the rear cover 150. Thus, the speaker module 200 is located between the mid-frame 140 and the rear cover 150. Alternatively, the mounting slot 147 can be located on the side of the mid-frame 140 near the display panel 110. Thus, the speaker module 200 is located between the mid-frame 140 and the display panel 110.

[0054] When the speaker module 200 is mounted on the middle frame 140, the thickness direction of the speaker module 200 is parallel to the thickness direction of the electronic device 100, that is, the thickness direction of the speaker module 200 can be parallel to the first direction x; the length direction of the speaker module 200 can be parallel to the width direction of the electronic device 100, that is, the length direction of the speaker module 200 can be parallel to the second direction y; the width direction of the speaker module 200 can be parallel to the length direction of the electronic device 100, that is, the width direction of the speaker module 200 can be parallel to the third direction z. In the above example, parallelism can be understood as absolute parallelism, or, parallelism can also be understood as approximate parallelism.

[0055] A speaker port 146 is provided on the middle frame 140. The speaker module 200 can be positioned close to the speaker port 146 and transmit sound to the outside of the electronic device 100 through the speaker port 146 to achieve the function of audio playback. The speaker port 146 can be located on the first frame 141, or it can also be located on the second frame 142 or the third frame 143 (e.g.,...). Figure 1The speaker 146 is located on at least one of the following: (as shown) or the fourth frame 144. This application embodiment does not limit the number of speaker 146. For example, there may be one speaker 146; or, there may be multiple speaker 146, which may be arranged along the second direction y. This application embodiment does not limit the shape of the speaker 146; for example, the speaker 146 may be any shape such as circular or rectangular.

[0056] Please combine Figure 2 and Figure 3 This application provides a speaker module 200, which includes a housing 210 connected to a mid-frame 140. For example, the housing 210 can be connected to the bottom 1471 of a mounting groove. In some implementations, the housing 210 can be connected to the mid-frame 140 by at least one of the following connection methods: adhesive, snap-fit, or welding.

[0057] The outer casing 210 has a sound outlet 211. When the speaker module 200 is disposed on the middle frame 140, the sound outlet 211 communicates with the speaker opening 146. For example, the sound outlet 211 may communicate with multiple speaker openings 146. The shape of the sound outlet 211 is not limited in this embodiment. For example, the sound outlet 211 may be strip-shaped, and the length direction of the sound outlet 211 may be parallel to the second direction y; or, the sound outlet 211 may also be circular, etc. Of course, the shape of the sound outlet 211 in this embodiment is not limited to strip or circle.

[0058] Please refer to Figure 4 The speaker module 200 includes a structural member 220, which is disposed on the housing 210 and together with the housing 210 encloses a cavity 230. The thickness direction of the structural member 220 is parallel to the thickness direction of the speaker module 200. Here, parallel can be understood as absolutely parallel, or it can be understood as approximately parallel. When the speaker module 200 is disposed on the middle frame 140, the housing 210, the structural member 220, and the bottom 1471 of the mounting groove are arranged sequentially in the first direction x. For example, the structural member 220 may be located between the bottom 1471 of the mounting groove and the housing 210, and the structural member 220 may be spaced apart from the bottom 1471 of the mounting groove. Alternatively, at least part of the housing 210 may be located between the structural member 220 and the bottom 1471 of the mounting groove.

[0059] In some embodiments, please combine Figure 4 and Figure 5The structural component 220 may include a vibration damping plate 221, which is connected to the housing 210. In some implementations, the vibration damping plate 221 may be bonded to the housing 210. For example, the speaker module 200 may include a first adhesive layer 240, which is stacked with the vibration damping plate 221 and connected between the structural component 220 and the housing 210 to bond the structural component 220 to the housing 210. In other implementations, the structural component 220 may also be mounted to the housing 210 by snap-fit, injection molding, or other methods.

[0060] The materials used to manufacture the vibration isolation plate 221 are not limited in this application embodiment. For example, the materials used to manufacture the vibration isolation plate 221 may include at least one of the following metals: steel, zinc, nickel, etc.; or, the materials used to manufacture the vibration isolation plate 221 may also include at least one of the following materials: glass, polyvinyl chloride, etc. The materials used to manufacture the vibration isolation plate 221 are not limited to metal, glass, or polyvinyl chloride. The shape of the vibration isolation plate 221 is not limited in this application embodiment embodiment; the vibration isolation plate 221 may be any of the following shapes: rectangular, approximately rectangular, or circular.

[0061] Please refer to Figure 4 The speaker module 200 includes a first diaphragm 250, which is mounted within the cavity 230. In a first direction, the first diaphragm 250 and the structural member 220 are spaced apart. When the speaker module 200 is mounted on the mid-frame 140, the structural member 220 may be located between the first diaphragm 250 and the bottom 1471 of the mounting groove; alternatively, the first diaphragm 250 may be located between the structural member 220 and the bottom 1471 of the mounting groove.

[0062] The first diaphragm 250 is connected to the housing 210 and divides the cavity 230 into at least a first acoustic cavity 231 and a second acoustic cavity 232. Exemplarily, in a first direction, the structural member 220, the first acoustic cavity 231, the first diaphragm 250, and the second acoustic cavity 232 can be arranged sequentially, with at least a portion of the first acoustic cavity 231 located between the structural member 220 and the first diaphragm 250, and the first diaphragm 250 located between the first acoustic cavity 231 and the second acoustic cavity 232.

[0063] The structural component 220, the first diaphragm 250, and at least a portion of the outer shell 210 form a first acoustic cavity 231, which communicates with the sound outlet 211. The first diaphragm 250 and at least a portion of the outer shell 210 form a second acoustic cavity 232. The second acoustic cavity 232 may be a sealed cavity, or it may not be a sealed cavity. For example, the outer shell 210 may have an opening 212 penetrating through it, and the second acoustic cavity 232 may communicate with the opening 212.

[0064] In some implementations, the first diaphragm 250 may include a first diaphragm body, which may be sheet-like. This application embodiment does not limit the shape of the first diaphragm body; it may be any shape such as rectangular, approximately rectangular, or circular. Of course, the shape of the first diaphragm body is not limited to rectangular, approximately rectangular, or circular. This application embodiment does not limit the material used to make the first diaphragm body; for example, the material used to make the first diaphragm body may include at least one of metal, plastic, or carbon fiber. Of course, the material used to make the first diaphragm body is not limited to metal, plastic, or carbon fiber.

[0065] For other implementations, please refer to Figure 6 The first diaphragm 250 may include a folded ring 251 and a dome 252 connected to each other. The folded ring 251 may be annular and may have a hollow portion 2511. The folded ring 251 includes an arcuate portion 2512, a first connecting portion 2513, and a second connecting portion 2514. All three portions (arcuate portion 2512, first connecting portion 2513, and second connecting portion 2514) may be annular. The arcuate portion 2512 surrounds the first connecting portion 2513, and the second connecting portion 2514 surrounds the arcuate portion 2512. The arcuate portion 2512 connects the first connecting portion 2513 and the second connecting portion 2514. The hollow portion 2511 is located within the area enclosed by the first connecting portion 2513, and the first connecting portion 2513 is closer to the hollow portion 2511 than the second connecting portion 2514.

[0066] The first connecting portion 2513 is connected to the outer casing 210. For example, the first connecting portion 2513 can be connected to the outer casing 210 by at least one of the following connection methods: bonding, snap-fitting, or heat pressing. The dome 252 is connected to the second connecting portion 2514 and covers the hollow portion 2511. For example, the dome 252 can be connected to the second connecting portion 2514 by at least one of the following connection methods: bonding, snap-fitting, or heat pressing.

[0067] The embodiments of this application do not limit the material used to form the folded ring 251. For example, the material used to form the folded ring 251 may include at least one of materials such as plastic, silicone, or rubber. Of course, the material used to form the folded ring 251 is not limited to plastic, silicone, or rubber. The embodiments of this application do not limit the material used to form the dome 252. For example, the material used to form the dome 252 may include at least one of materials such as metal, diamond-like carbon (DLC), polyester, or natural fibers. Of course, the material used to form the dome 252 is not limited to metal, diamond-like carbon, polyester, or natural fibers.

[0068] The embodiments of this application do not limit the shape of the folded ring 251 or the dome 252. For example, the folded ring 251 can be any of the shapes of a rectangle, an approximate rectangle, or a circle; the dome 252 can be any of the shapes of a rectangle, an approximate rectangle, or a circle.

[0069] Please refer to Figure 4 The speaker module 200 also includes a driving component (not shown in the figure), which is connected to the first diaphragm 250 and is used to drive the first diaphragm 250 to vibrate and produce sound. The sound generated by the vibration of the first diaphragm 250 can be transmitted to the electronic device 100 (e.g., [unclear]) in sequence through the first sound cavity 231, the sound outlet 211, and the speaker port 146. Figure 2 (As shown) The driver component can be connected to processor 121 (such as...) Figure 1 The circuit board 120 (as shown) is electrically connected to receive electrical signals transmitted by the processor 121 and converts the electrical signals into audio signals by driving the first diaphragm 250 to vibrate and produce sound, thereby realizing the audio playback function. For example, the processor 121 may include a digital signal processing chip and a power amplifier. The driving component can be electrically connected to the digital signal processing chip via the power amplifier and receive the electrical signals processed by the digital signal processing chip and the power amplifier. In some implementations, the driving component can be connected to the circuit board 120 (as shown) via at least one of a flexible printed circuit (FPC), a wire, or a contact. Figure 1 (As shown) is connected, thereby electrically connected to the processor 121. This application embodiment does not limit the structure of the driving component, as long as it can drive the first diaphragm 250 to vibrate and produce sound.

[0070] In one embodiment, the driving assembly may include a voice coil (not shown) and a magnetic element (not shown), both mounted within the second acoustic cavity 232. The magnetic element may be disposed on the housing 210, and the voice coil is connected to the first diaphragm 250 and spaced apart from the magnetic element. For example, the voice coil may be connected to the dome 252. In some implementations, at least a portion of the magnetic element may be located within the space enclosed by the voice coil. The voice coil is located within the magnetic field of the magnetic element. When the voice coil receives an electrical signal, it generates a magnetic field. The interaction between the magnetic field of the voice coil and the magnetic field of the magnetic element causes the voice coil to vibrate, thereby causing the voice coil to drive the first diaphragm 250 to vibrate and produce sound.

[0071] In another embodiment, the driving assembly may include an armature (not shown), a coil (not shown), and a permanent magnet (not shown), all of which are mounted within the second acoustic cavity 232. The coil may be disposed on the housing 210, the armature is connected to the first diaphragm 250, and the permanent magnet is spaced apart from the armature, with the armature located within the magnetic field of the permanent magnet. When the coil receives an electrical signal, it generates a magnetic field. The armature, located within the magnetic field of the coil, magnetizes the armature, causing it to generate its own magnetic field. The interaction between the magnetic field of the armature and the magnetic field of the permanent magnet causes the armature to vibrate, thereby driving the first diaphragm 250 to vibrate and produce sound.

[0072] In another embodiment, the driving component may include a piezoelectric structure (not shown) connected to the first diaphragm 250. The material used to make the piezoelectric structure may include at least one of piezoelectric ceramics, piezoelectric crystals, or organic polymer piezoelectric materials capable of generating a piezoelectric effect. Based on the piezoelectric effect, the piezoelectric structure can deform and vibrate when it receives an electrical signal, thereby driving the first diaphragm 250 to vibrate and produce sound.

[0073] In the above embodiments, please refer to Figure 4 and Figure 5 The vibration damping plate 221 can prevent the sound generated by the vibration of the first diaphragm 250 from being transmitted outside the speaker module 200. For example, the vibration damping plate 221 can prevent the sound generated by the vibration of the first diaphragm 250 from being transmitted to the display panel 110 (e.g., ...). Figure 1 (as shown) or battery 130 (e.g.) Figure 1 (As shown) This transmission helps to prevent the display panel 110 or battery 130 from vibrating due to the influence of sound.

[0074] For some implementation methods, please refer to Figure 7 and Figure 8The speaker module 200 also includes a breathable membrane 260. A valve port 213 is provided on the housing 210, connecting the first sound cavity 231 and the second sound cavity 232. The breathable membrane 260 is connected to the housing 210 and covers the valve port 213. The material used to make the breathable membrane 260 may include at least one of polytetrafluoroethylene, nanofibers, or silicone. Thus, gas in the first sound cavity 231 can pass through the breathable membrane 260 into the second sound cavity 232, and gas in the second sound cavity 232 can pass through the breathable membrane 260 into the first sound cavity 231, thereby balancing the air pressure between the first and second sound cavities 231 and 232. This prevents the pressure difference between the first and second sound cavities 231 and 232 from causing deformation of the first diaphragm 250, and also prevents the pressure difference between the first and second sound cavities 231 and 232 from affecting the vibration and sound production of the first diaphragm 250. At the same time, the breathable membrane 260 can prevent the sound in the first sound cavity 231 from being transmitted to the second sound cavity 232 through the valve port 213, and can also prevent the sound in the second sound cavity 232 from being transmitted to the first sound cavity 231 through the valve port 213.

[0075] Please refer to the above again. Figure 4 and Figure 5 The speaker module 200 also includes a piezoelectric element 270, which is stacked with and connected to the structural element 220. In some implementations, the piezoelectric element 270 can be connected to the structural element 220 by at least one of the following connection methods: bonding, snap-fitting, or welding. The shape of the piezoelectric element 270 is not limited in this embodiment; for example, the piezoelectric element 270 can be any shape such as circular, approximately rectangular, or rectangular. The number of piezoelectric elements 270 is not limited in this embodiment; there can be one piezoelectric element 270, and in other examples, there can be two or more piezoelectric elements 270.

[0076] The material used to fabricate the piezoelectric element 270 may include at least one of piezoelectric ceramics, piezoelectric crystals, or organic polymer piezoelectric materials, which are capable of generating a piezoelectric effect. Based on the piezoelectric effect, the piezoelectric element 270 can deform and vibrate when receiving an electrical signal, thereby causing the structural component 220 to vibrate and produce sound. The sound generated by the vibration of the piezoelectric element 270 and the structural component 220 can be transmitted sequentially to the electronic device 100 (e.g., [unclear]) through the first sound cavity 231, the sound outlet 211, and the speaker 146. Figure 2 (As shown) outside.

[0077] In one example, the piezoelectric element 270 can be used with the processor 121 (e.g., Figure 1The piezoelectric element 270 is electrically connected to the circuit board 120 (as shown) to receive electrical signals transmitted by the processor 121 and to drive the structural component 220 to vibrate, thereby converting the electrical signals into audio signals and realizing the audio playback function. For example, the processor 121 may include a digital signal processing chip and a power amplifier. The piezoelectric element 270 can be electrically connected to the digital signal processing chip via the power amplifier and receive the electrical signals processed by the digital signal processing chip and the power amplifier. In some implementations, the piezoelectric element 270 can be connected to the circuit board 120 (e.g., via a flexible circuit board or wires). Figure 1 (as shown) is connected, thereby electrically connected to the processor 121.

[0078] Please refer to Figure 4 and Figure 5 In this embodiment, the piezoelectric element 270 and the first diaphragm 250 are spaced apart from each other. The piezoelectric element 270 has a smaller impact on the vibration of the first diaphragm 250, which helps to avoid deformation of the first diaphragm 250 due to the influence of the piezoelectric element 270, and also helps to avoid friction between the voice coil and the housing 210, magnetic components, etc.

[0079] In one embodiment, in the first direction x, the piezoelectric element 270 may be located between the structural member 220 and the first diaphragm 250, and the piezoelectric element 270 may be located within the first acoustic cavity 231.

[0080] In another embodiment, in the first direction x, at least a portion of the structural member 220 is located between the piezoelectric element 270 and the first diaphragm 250, with the piezoelectric element 270 located outside the first acoustic cavity 231. When the speaker module 200 is mounted on the middle frame 140, the piezoelectric element 270 can be located between the structural member 220 and the bottom 1471 of the mounting groove, with the piezoelectric element 270 spaced apart from the bottom 1471 of the mounting groove to prevent the piezoelectric element 270 from contacting the middle frame 140 during vibration. This arrangement facilitates the connection of flexible circuit boards or wires to the piezoelectric element 270.

[0081] In one embodiment, the drive assembly and piezoelectric element 270 can be used to receive electrical signals of the same frequency band and simultaneously drive the first diaphragm 250 and the structural element 220 to vibrate.

[0082] In another embodiment, the driving component and piezoelectric element 270 can be used to receive electrical signals of different frequency bands and convert them into audio signals respectively. For example, the driving component can be used to receive low-frequency electrical signals; the piezoelectric element 270 can be used to receive high-frequency electrical signals. The low-frequency and high-frequency electrical signals can be distinguished by a frequency division point. The main energy of the low-frequency electrical signal is concentrated before the frequency division point, meaning the main frequency range of the low-frequency electrical signal is smaller than the frequency division point; the main energy of the high-frequency electrical signal is concentrated after the frequency division point, meaning the main frequency range of the high-frequency electrical signal is larger than the frequency division point.

[0083] For example, the crossover point can be chosen within the range of 2kHz to 15kHz. In one example, the crossover point could be 2kHz. Correspondingly, the dominant frequency range of the low-frequency signal is less than 2kHz, such as 20Hz to 2kHz; and the dominant frequency range of the high-frequency signal is greater than 2kHz, such as 2kHz to 20kHz. In another example, the crossover point could be 8kHz. Correspondingly, the dominant frequency range of the low-frequency signal is less than 8kHz, such as 20Hz to 8kHz; and the dominant frequency range of the high-frequency signal is greater than 8kHz, such as 8kHz to 20kHz. In yet another example, the crossover point could be 15kHz. Correspondingly, the dominant frequency range of the low-frequency signal is less than 15kHz, such as 20Hz to 15kHz; and the dominant frequency range of the high-frequency signal is greater than 15kHz, such as 15kHz to 20kHz.

[0084] This application does not limit the value of the frequency division point in its embodiments. In the above example, the frequency division point can also take other values, and the range of the frequency division point is not limited to 2kHz to 15kHz. This application also does not limit the main frequency range of low-frequency and high-frequency electrical signals in its embodiments; the above ranges are only illustrative examples.

[0085] In some implementations, the drive assembly and piezoelectric element 270 receiving electrical signals of different frequency bands can be achieved using a digital divider. For example, circuit board 120 (such as...) Figure 1 A digital frequency divider can be provided on the device (as shown), and the drive assembly and piezoelectric element 270 are connected to the processor 121 (as shown) via the digital frequency divider. Figure 1 (As shown) Electrical connection. The digital frequency divider is used to receive the electrical signal transmitted by the processor 121, split the electrical signal into a low-frequency electrical signal and a high-frequency electrical signal, and then transmit the low-frequency electrical signal to the drive component and the high-frequency electrical signal to the piezoelectric element 270.

[0086] In other implementations, the drive assembly and piezoelectric element 270 receiving electrical signals of different frequency bands can be achieved using an analog frequency divider circuit. For example, circuit board 120 (such as...) Figure 1 An analog frequency divider circuit may be provided on the device (as shown), which may include at least one electronic component such as a capacitor, resistor, or inductor. The driving component may be connected in series with a resistor in the analog frequency divider circuit, and the piezoelectric element 270 may be connected in series with a capacitor in the analog frequency divider circuit (here, the piezoelectric element 270 itself can be considered a capacitor). The driving component and the piezoelectric element 270 are connected in parallel to the processor 121 (as shown) through the analog frequency divider circuit. Figure 1 (As shown). Thus, the drive component can receive low-frequency electrical signals transmitted by the processor 121, and the piezoelectric element 270 can receive high-frequency electrical signals transmitted by the processor 121.

[0087] In the above embodiments, since the piezoelectric element 270 deforms quickly when receiving electrical signals, it responds quickly to high-frequency electrical signals. Consequently, the sound pressure level of the high-frequency audio signal generated by the vibration of the piezoelectric element 270 and the structural member 220 is higher. In the speaker module 200 of this application embodiment, the piezoelectric element 270 can be used to receive high-frequency electrical signals and drive the structural member 220 to vibrate to convert the high-frequency electrical signals into high-frequency audio signals, thereby improving the sound pressure level of the high-frequency audio signal output by the speaker module 200 and enhancing the speaker module 200's ability to output high-frequency audio signals.

[0088] In the above embodiments, please refer to Figure 3 and Figure 4 as well as Figure 5 The structural component 220 has a first groove 220a. The first groove 220a can be located on the side of the structural component 220 near the first sound cavity 231 and communicate with the first sound cavity 231; alternatively, the first groove 220a can be located on the side of the structural component 220 away from the first sound cavity 231 and not communicate with the first sound cavity 231, and the first groove 220a can be exposed on the outer surface of the housing 210. The first groove 220a includes a sidewall 220b and a groove bottom 220c adjacent to the sidewall 220b. The sidewall 220b of the first groove can be parallel to a first direction, and the groove bottom 220c of the first groove can be perpendicular to the first direction. Here, perpendicularity can be understood as absolute perpendicularity, or it can be understood as approximately perpendicularity. The piezoelectric element 270 is disposed at the bottom 220c of the first groove, and the piezoelectric element 270 is spaced apart from the side wall 220b of the first groove, thereby at least a portion of the piezoelectric element 270 is located within the first groove 220a.

[0089] The speaker module 200 provided in this embodiment includes a housing 210, a structural component 220, a first diaphragm 250, and a piezoelectric component 270. The structural component 220 and the first diaphragm 250 are both disposed within the housing 210, and together they enclose a cavity 230. The first diaphragm 250 is installed within the cavity 230 and at least divides the cavity 230 into a first acoustic cavity 231 and a second acoustic cavity 232, with the first diaphragm 250 located between the first acoustic cavity 231 and the second acoustic cavity 232. The first acoustic cavity 231 is formed by the housing 210, the structural component 220, and the first diaphragm 250, with at least a portion of the first acoustic cavity 231 located between the first diaphragm 250 and the structural component 220. The structural component 220 and the first diaphragm 250 are arranged along a first direction x, where x is the thickness direction of the speaker module 200. For example, structural component 220, first acoustic cavity 231, first diaphragm 250 and second acoustic cavity 232 are arranged sequentially in the first direction x.

[0090] The first diaphragm 250 can vibrate to produce sound; the piezoelectric element 270 is disposed on the structural component 220, and the piezoelectric element 270 can drive the structural component 220 to vibrate and produce sound. The outer shell 210 has a sound outlet 211, which is connected to the first sound cavity 231. The sound generated by the vibration of the first diaphragm 250, the piezoelectric element 270, and the structural component 220 can all be transmitted to the outside of the speaker module 200 through the first sound cavity 231 and the sound outlet 211.

[0091] The structural component 220 has a first groove 220a, and the piezoelectric component 270 is disposed at the bottom 220c of the first groove. As a result, at least a portion of the piezoelectric component 270 is located within the first groove 220a, and the overall thickness of the piezoelectric component 270 and the structural component 220 is reduced, thereby reducing the thickness of the speaker module 200, which is beneficial for the miniaturization and thinning of the speaker module 200.

[0092] Meanwhile, compared to the maximum thickness of the structural component 220, the thickness of at least part of the structural component 220 in contact with the piezoelectric component 270 is smaller, resulting in lower inertia during vibration and faster response to high-frequency electrical signals. Therefore, the high-frequency audio signal output by the speaker module 200 has a higher sound pressure level, and the speaker module 200 has a stronger ability to output high-frequency audio signals.

[0093] Please combine Figure 3 , Figure 4 and Figure 5 In an embodiment where the structural component 220 includes a vibration isolation plate 221, a first groove 220a may be provided on the vibration isolation plate 221. The first groove 220a may be formed by at least one of the following methods: stamping, CNC machining, laser processing, or injection molding.

[0094] Please combine Figure 4 , Figure 5 and Figure 6 In some embodiments, structural member 220 includes a stacked vibration isolation plate 221 and a second diaphragm 222. The vibration isolation plate 221 has a first through hole 2211, and the second diaphragm 222 is connected to the vibration isolation plate 221 and covers the first through hole 2211. Thus, the vibration isolation plate 221 and the second diaphragm 222 form a first groove 220a. The sidewall 220b of the first groove may include the hole wall 2212 of the first through hole, and the bottom 220c of the first groove may include at least a portion of the second diaphragm 222. A piezoelectric element 270 is connected to the second diaphragm 222, and at least a portion of the piezoelectric element 270 is located within the first through hole 2211. With the above arrangement, the piezoelectric element 270 can drive the second diaphragm 222 to vibrate and produce sound, and the overall thickness of the piezoelectric element 270, the vibration isolation plate 221, and the second diaphragm 222 is reduced, thereby reducing the thickness of the speaker module 200, which is beneficial for the miniaturization and thinning of the speaker module 200.

[0095] The shape of the second diaphragm 222 is not limited in this embodiment. The second diaphragm 222 can be any shape, such as rectangular, approximately rectangular, or circular. Of course, the shape of the second diaphragm 222 is not limited to rectangular, approximately rectangular, or circular. The material used to make the second diaphragm 222 is not limited in this embodiment. For example, the material used to make the second diaphragm 222 can include at least one of metal, plastic, or carbon fiber. Of course, the material used to make the second diaphragm 222 is not limited to metal, plastic, or carbon fiber.

[0096] In one example, the second diaphragm 222 may be bonded to the vibration isolation plate 221. For example, the speaker module 200 also includes a second adhesive layer (not shown), with the vibration isolation plate 221, the second adhesive layer, and the second diaphragm 222 stacked together. The second adhesive layer connects the vibration isolation plate 221 and the second diaphragm 222 to bond the vibration isolation plate 221 and the second diaphragm 222. In other examples, the second diaphragm 222 may also be connected to the vibration isolation plate 221 by at least one of welding or hot pressing.

[0097] Please refer to Figure 4 and Figure 5 At least a portion of the piezoelectric element 270 is located within the first groove 220a, and on a first reference plane parallel to the first direction x, the orthographic projections of the piezoelectric element 270 and the structural element 220 at least partially overlap. This reduces the overall thickness of the piezoelectric element 270 and the structural element 220, as well as the thickness of the speaker module 200, which is beneficial for miniaturization and thinning of the speaker module 200.

[0098] In the above embodiments, the piezoelectric element 270 can be entirely located within the first groove 220a, and on the first reference surface, the orthographic projection of the piezoelectric element 270 and the orthographic projection of the structural element 220 can completely overlap. Therefore, compared to having only a portion of the piezoelectric element 270 located within the first groove 220a, having all of the piezoelectric element 270 located within the first groove 220a further reduces the overall thickness of the piezoelectric element 270 and the structural element 220, and can even minimize the overall thickness of the piezoelectric element 270 and the structural element 220. This is beneficial for reducing the thickness of the speaker module 200, and also for miniaturizing and thinning the speaker module 200.

[0099] In some embodiments, such as Figure 3 , Figure 4 and Figure 5As shown, on a second reference plane perpendicular to the first direction x, the orthographic projection of the piezoelectric element 270 and the orthographic projection of the first diaphragm 250 at least partially overlap. This facilitates a reduction in the size of the speaker module 200, and promotes miniaturization of the speaker module 200. For example, the size of the speaker module 200 in the second direction y can be reduced, which also facilitates a reduction in the length of the speaker module 200. Alternatively, the size of the speaker module 200 in the third direction z can be reduced, which also facilitates a reduction in the width of the speaker module 200.

[0100] In other embodiments, please refer to Figure 8 and Figure 9 On the second reference plane perpendicular to the first direction x, the orthographic projection of the piezoelectric element 270 and the orthographic projection of the first diaphragm 250 do not overlap. This arrangement reduces the sound transmitted to the first diaphragm 250 by the vibration of the piezoelectric element 270, thus mitigating the impact of the piezoelectric element 270's vibration on the first diaphragm 250 and ensuring the sound pressure level of the sound generated by the vibration of the first diaphragm 250.

[0101] In some implementation methods, please continue to refer to Figure 8 and Figure 9 On a second reference plane perpendicular to the first direction x, the orthographic projection of the piezoelectric element 270 and the orthographic projection of the first diaphragm 250 do not overlap, and the orthographic projection of the piezoelectric element 270 at least partially overlaps with the orthographic projection of the breathable membrane 260. This arrangement helps to reduce the size of the speaker module 200.

[0102] This application also provides another electronic device 100, please refer to Figure 10 , Figure 11 and Figure 12The electronic device 100 includes a mid-frame 140, a housing 210, a first diaphragm 250, and a piezoelectric element 270. The housing 210 is connected to the mid-frame 140 and together they form a cavity 230. The first diaphragm 250 is disposed on the housing 210, and in a first direction x, the first diaphragm 250 and the mid-frame 140 are spaced apart. The first diaphragm 250 is installed within the cavity 230 and divides the cavity 230 into at least a first acoustic cavity 231 and a second acoustic cavity 232, with the first diaphragm 250 located between the first acoustic cavity 231 and the second acoustic cavity 232. The first diaphragm 250, at least a portion of the mid-frame 140, and at least a portion of the housing 210 together enclose the first acoustic cavity 231, which is located between the mid-frame 140 and the first diaphragm 250. The first acoustic cavity 231 communicates with the sound outlet 211 of the housing 210 and the speaker opening 146 of the mid-frame 140. The first diaphragm 250 and at least part of the outer shell 210 together enclose the second acoustic cavity 232. For example, in the first direction x, the middle frame 140, the first acoustic cavity 231, the first diaphragm 250 and the second acoustic cavity 232 are arranged in sequence.

[0103] The electronic device 100 may also include a voice coil (not shown) and a magnetic component (not shown), both of which are disposed within the second acoustic cavity 232 and are used to drive the first diaphragm 250 to vibrate and produce sound.

[0104] The electronic device 100 also includes a piezoelectric element 270, which is disposed in the middle frame 140. The piezoelectric element 270 can be disposed inside the first sound cavity 231 or outside the first sound cavity 231. The piezoelectric element 270 is used to drive the middle frame 140 to vibrate and produce sound. The method by which the piezoelectric element 270 drives the middle frame 140 to vibrate and produce sound can be referred to above, and will not be repeated here. In the above example, the electronic device 100 avoids the use of the vibration isolation plate 221, which is conducive to the thinning and lightening of the electronic device 100.

[0105] Please refer to Figure 12 The middle frame 140 has a second groove 140a. The second groove 140a can be located on the side of the middle frame 140 near the first sound cavity 231 and communicate with the first sound cavity 231; or, the second groove 140a can be located on the side of the middle frame 140 away from the first sound cavity 231 and not communicate with the first sound cavity 231. The second groove 140a includes a sidewall 140b of the second groove and a groove bottom 140c of the second groove adjacent to the sidewall 140b of the second groove. The sidewall 140b of the second groove can be parallel to a first direction, and the groove bottom 140c of the second groove can be perpendicular to the first direction. A piezoelectric element 270 is located at the groove bottom 140c of the second groove, and the piezoelectric element 270 is spaced apart from the sidewall 140b of the second groove, thereby at least a portion of the piezoelectric element 270 is located within the second groove 140a.

[0106] The electronic device 100 provided in this application embodiment includes a middle frame 140, a housing 210, a first diaphragm 250, and a piezoelectric element 270. The housing 210 is disposed on the middle frame 140 and forms a cavity 230 with the middle frame 140. The first diaphragm 250 and the middle frame 140 are arranged along a first direction x, where the first direction x is the thickness direction of the electronic device 100. The first diaphragm 250 is installed in the cavity 230 and divides the cavity 230 into at least a first sound cavity 231 and a second sound cavity 232. The housing 210 has a sound outlet 211, and the first sound cavity 231 communicates with the sound outlet 211. The first diaphragm 250... The device can vibrate to produce sound. The piezoelectric element 270 is disposed on the middle frame 140. The piezoelectric element 270 can drive the middle frame 140 to vibrate and produce sound. The sound generated by the vibration of the first diaphragm 250, the piezoelectric element 270 and the middle frame 140 can be transmitted to the outside of the outer shell 210 through the first sound cavity 231 and the sound outlet 211. The middle frame 140 is provided with a second groove 140a. The piezoelectric element 270 is disposed at the bottom 140c of the second groove. Thus, at least part of the piezoelectric element 270 is located in the second groove 140a. The piezoelectric element 270 has little impact on the thickness of the middle frame 140, which is conducive to the thinning and lightening of the electronic device 100.

[0107] Meanwhile, compared to the maximum thickness of the middle frame 140, the thickness of at least part of the middle frame 140 in contact with the piezoelectric element 270 is smaller, resulting in lower inertia during vibration and faster response to high-frequency electrical signals. Therefore, the sound pressure level of the high-frequency audio signal output by the electronic device 100 is higher, and the electronic device 100 has a stronger ability to output high-frequency audio signals.

[0108] In one embodiment, please refer to Figure 11 and Figure 12 The electronic device 100 also includes a second diaphragm 222, which is stacked and connected to the middle frame 140. The middle frame 140 has a second through hole 148, and the second diaphragm 222 covers the second through hole 148. Thus, the middle frame 140 and the second diaphragm 222 form a second groove 140a. The sidewall 140b of the second groove may include the hole wall 1481 of the second through hole, and the bottom 140c of the second groove may include at least a portion of the second diaphragm 222. The connection method between the second diaphragm 222 and the middle frame 140 can be referred to the connection method between the second diaphragm 222 and the vibration isolation plate 221 described above, and will not be repeated here. The piezoelectric element 270 is connected to the second diaphragm 222, and at least a portion of the piezoelectric element 270 is located within the second through hole 148. With the above settings, the piezoelectric element 270 can drive the second diaphragm 222 to vibrate and produce sound, and the piezoelectric element 270 has little impact on the thickness of the middle frame 140, which is beneficial to the thinning and lightening of the electronic device 100.

[0109] Please refer to Figure 12At least a portion of the piezoelectric element 270 is located within the second groove 140a, and on a first reference plane parallel to the first direction x, the orthographic projection of the piezoelectric element 270 and the orthographic projection of the mid-frame 140 at least partially overlap. This reduces the impact of the piezoelectric element 270 on the thickness of the mid-frame 140, contributing to the thinner and lighter design of the electronic device 100.

[0110] In the above embodiment, the piezoelectric element 270 can be entirely located within the second groove 140a, and on the first reference surface, the orthographic projection of the piezoelectric element 270 and the orthographic projection of the mid-frame 140 completely overlap. Therefore, compared to having only a portion of the piezoelectric element 270 located within the second groove 140a, having all of the piezoelectric element 270 located within the second groove 140a further reduces the impact of the piezoelectric element 270 on the thickness of the mid-frame 140. In fact, the piezoelectric element 270 may not even increase the thickness of the mid-frame 140, which is beneficial for the thinner and lighter design of the electronic device 100.

[0111] It should be noted that, in the description of the embodiments of this application, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection or an integral connection; they can also refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or as many of the technical features as possible; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A speaker module, characterized in that, include: The outer casing has a sound outlet; A structural component is provided on the outer shell, and the structural component and the outer shell together enclose a cavity; The structural component has a first groove; A first diaphragm is installed in the cavity. The first diaphragm and the structural component are arranged along a first direction. The first diaphragm divides the cavity into at least a first sound cavity and a second sound cavity. The outer shell, the structural component, and the first diaphragm together enclose the first sound cavity. The first sound cavity is connected to the sound outlet. A piezoelectric element is disposed at the bottom of the first groove; Wherein, the first direction is the thickness direction of the speaker module.

2. The speaker module according to claim 1, characterized in that, The structural component includes a vibration isolation plate and a second diaphragm stacked together. The vibration isolation plate has a first through hole, and the second diaphragm covers the first through hole. The wall of the first through hole and the second diaphragm form the first groove, and the piezoelectric element is disposed on the second diaphragm.

3. The speaker module according to claim 1 or 2, characterized in that, On the first reference plane, the orthographic projection of the piezoelectric element and the orthographic projection of the structural element at least partially overlap, and the first reference plane is parallel to the first direction.

4. The speaker module according to any one of claims 1 to 3, characterized in that, At least a portion of the structural component is located between the piezoelectric element and the first diaphragm.

5. The speaker module according to any one of claims 1 to 4, characterized in that, On the second reference plane, the orthographic projection of the first diaphragm and the orthographic projection of the piezoelectric element do not overlap, and the second reference plane is perpendicular to the first direction.

6. The speaker module according to claim 5, characterized in that, The outer casing is provided with a valve port that connects the first sound cavity and the second sound cavity, and the speaker module further includes a breathable membrane that covers the valve port; On the second reference plane, the orthographic projection of the piezoelectric element at least partially overlaps with the orthographic projection of the breathable membrane.

7. An electronic device, characterized in that, include: The middle frame, and the speaker module according to any one of claims 1 to 6, wherein the middle frame is provided with a sound outlet, and the sound outlet is connected to the sound outlet.

8. An electronic device, characterized in that, include: The middle frame has a second groove; An outer shell is disposed on the middle frame, the outer shell and the middle frame form a cavity, and the outer shell has a sound outlet; A first diaphragm is installed in the cavity. The first diaphragm and the middle frame are arranged along a first direction, which is the thickness direction of the electronic device. The first diaphragm divides the cavity into at least a first sound cavity and a second sound cavity. The outer shell, the middle frame, and the first diaphragm together enclose the first sound cavity. The first sound cavity is connected to the sound outlet. A piezoelectric element is disposed at the bottom of the second groove.

9. The electronic device according to claim 8, characterized in that, The middle frame has a second through hole, and the electronic device further includes a second diaphragm that covers the second through hole; The wall of the second through hole and the second diaphragm form the second groove, the piezoelectric element is disposed on the second diaphragm, and at least part of the piezoelectric element is located in the second through hole.

10. The electronic device according to claim 8 or 9, characterized in that, On the first reference plane, the orthographic projection of the piezoelectric element and the orthographic projection of the middle frame at least partially overlap, and the first reference plane is perpendicular to the first direction.

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