PCB structure for new energy automobile charging pile indicating lamp
By using a transparent substrate and encapsulation layer structure on the PCB board, the indicator light of the new energy vehicle charging pile is made transparent on both sides and waterproof and sealed, which solves the problem of the existing PCB board being opaque, improves the lighting range and controls thermal stress.
Patent Information
- Application Number
- CN202520079735.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-14
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-01-14
AI Technical Summary
The existing PCB light board is opaque and cannot achieve double-sided light transmission, thus failing to meet the double-sided lighting requirements of the indicator lights for new energy vehicle charging piles.
It adopts a transparent substrate and encapsulation layer structure. The upper and lower surfaces of the transparent substrate are respectively provided with LED beads and encapsulation layer, and a heat-conducting gap layer is provided in the middle to avoid heat concentration, ensuring that the light is transparent on both sides and waterproof and sealed.
It achieves double-sided light transmission for the indicator lights of new energy vehicle charging piles, improving the lighting range, and controls thermal stress through a thermally conductive void layer to ensure stable operation of the light panel.
Smart Images

Figure CN223786244U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED lamp panel technical field more specifically, it is a kind of PCB board structure for new energy automobile charging pile indicating lamp. BACKGROUND
[0002] PCB lamp panel, i.e. printed circuit board, is the stable carrier of electronic components, and plays the role of electrical connection and support. In the field of LED lighting, PCB lamp panel provides support and power for LED lamp beads, ensuring stable work in various lighting scenarios. These LED lamp beads are usually precisely soldered by SMT (Surface Mount Technology).
[0003] The closest prior art PCB is Application Publication No. CN109357176A, which includes lamp beads and an aluminum substrate. The aluminum substrate has a circuit layer, an insulating layer, and a metal base layer. The circuit layer has lamp bead pads, and the lamp beads are soldered to the circuit layer of the aluminum substrate. The feature is that the lamp bead pads on the circuit layer are connected to the mesh functional area. The mesh functional area on the circuit layer is formed by interlacing warp threads and weft threads. The preferred width of the warp threads is between 0.2mm and 2mm, the preferred width of the weft threads is between 0.2mm and 2mm, the preferred distance between the warp threads is between 0.2mm and 2mm, and the preferred distance between the weft threads is between 0.2mm and 2mm.
[0004] The existing lamp beads are soldered and installed using an aluminum substrate, but the lamp panel substrate is not light-transmitting, and cannot perform double-sided light transmission.
[0005] Therefore, the utility model provides a double-sided light-transmitting, simple-structured PCB board structure for new energy automobile charging pile indicating lamp. UTILITY MODEL CONTENTS
[0006] The utility model provides a double-sided light-transmitting, simple-structured PCB board structure for new energy automobile charging pile indicating lamp.
[0007] A PCB board structure for new energy automobile charging pile indicating lamp, including transparent substrate 1, upper lamp bead 2, encapsulation layer 3, its characterized in that: transparent substrate 1 includes transparent substrate body 4, first copper pad layer, the upper of transparent substrate body 4 is equipped with first copper pad layer, first copper pad layer upper evenly interval is equipped with a plurality of upper lamp beads 2, upper lamp bead 2 and first copper pad layer soldering connection, upper lamp bead 2 upper is equipped with upper encapsulation layer 3, and upper encapsulation layer 3 is used to play the role of waterproof sealing, transparent substrate 1 is one of polyester film or polycarbonate material.
[0008] Further, the lower side of the transparent substrate body 4 is also provided with a second copper clad pad layer, a plurality of lower lamp beads 5 are uniformly arranged below the second copper clad pad layer, the lower lamp beads 5 are welded with the second copper clad pad layer, and the upper side of the upper lamp bead 2 is provided with a lower packaging layer 6.
[0009] In some embodiments, the thickness of the transparent substrate body 4 is 1.0-2.0mm.
[0010] In some embodiments, the material of the packaging layer 3 is one of heat-conducting silica gel, heat-conducting epoxy resin and transparent heat-conducting material.
[0011] In some embodiments, a heat-conducting gap layer 7 is arranged between the upper packaging layer 3 and the upper lamp bead 2, the heat-conducting gap layer 7 is used for avoiding heat concentration, controlling the generation of thermal stress and helping the propagation of light.
[0012] Further, the thickness of the heat-conducting gap layer 7 is less than 1mm.
[0013] Further, the heat-conducting gap layer 7 is filled with a thermal interface material 8, and the thermal interface material 8 is used for reducing thermal resistance and enhancing the efficiency of heat conduction from the lamp bead to the outside.
[0014] Further, the thermal interface material 8 is heat-conducting silica gel or a heat-conducting gasket.
[0015] The PCB structure for the new energy automobile charging pile indicating lamp has the advantages that the transparent substrate body 4 is used to make the light of the lamp bead can be double-side light-transmitting, the light illumination range is improved, the upper packaging layer 3 is arranged to be sealed and waterproof, meanwhile, the heat-conducting gap layer 7 is arranged between the upper packaging layer 3 and the upper lamp bead 2, heat concentration is avoided, the generation of thermal stress is controlled, and the propagation of light is helped. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is a sectional view of the PCB structure for the new energy automobile charging pile indicating lamp.
[0017] Figure 2 It is a lamp bead light schematic view of the PCB structure for the new energy automobile charging pile indicating lamp.
[0018] Explanation of main component symbols
[0019] 1. Transparent substrate; 2. Upper LED bead; 3. Upper encapsulation layer; 4. Transparent substrate body; 5. Lower LED bead; 6. Lower encapsulation layer; 7. Thermally conductive void layer; 8. Thermal interface material.
[0020] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation
[0021] The following embodiments are described to aid in understanding this application. These embodiments are not, and should not be, construed in any way as limiting the scope of protection of this application.
[0022] In the following description, those skilled in the art will recognize that throughout this discussion, components may be described as individual functional units (which may include subunits), but those skilled in the art will recognize that various components or portions thereof may be divided into individual components or may be integrated together (including integrated within a single system or component).
[0023] Furthermore, the connection between components or systems is not intended to be limited to a direct connection; on the contrary, data between these components may be modified, reformatted, or otherwise altered by intermediate components. Additionally, other or fewer connections may be used. It should also be noted that the terms "connection," "link," or "input" should be understood to include direct connections, indirect connections via one or more intermediate devices, and wireless connections. Example 1
[0024] like Figure 1 The image shown is a cross-sectional schematic diagram of a PCB board structure for an indicator light in a new energy vehicle charging pile according to this application; as shown... Figure 2 The diagram shown is a schematic of the LED light beam of a PCB board structure for an indicator light of a new energy vehicle charging pile according to this application.
[0025] A PCB board structure for indicator lights in new energy vehicle charging piles includes a transparent substrate 1, upper LED beads 2, and an encapsulation layer 3. The transparent substrate 1 includes a transparent substrate body 4 and a first copper-clad pad layer. The first copper-clad pad layer is located above the transparent substrate body 4. Multiple upper LED beads 2 are evenly spaced above the first copper-clad pad layer and soldered to the first copper-clad pad layer. An upper encapsulation layer 3 is located above the upper LED beads 2 and serves to provide waterproof sealing. The transparent substrate 1 is made of either polyester film or polycarbonate.
[0026] Below the transparent substrate body 4, there is a second copper-clad pad layer. Below the second copper-clad pad layer, there are multiple lower LED beads 5 evenly spaced. The lower LED beads 5 are welded to the second copper-clad pad layer. Above the upper LED beads 2, there is a lower encapsulation layer 6, which serves to provide waterproof sealing.
[0027] The transparent substrate body 4 has a thickness of 1.0-2.0mm.
[0028] The packaging layer 3 is made of one of the following materials: heat-conducting silica gel, heat-conducting epoxy resin and transparent heat-conducting material.
[0029] The upper packaging layer 3 and the upper lamp bead 2 are provided with a heat-conducting gap layer 7, which is used to avoid heat concentration, control the generation of thermal stress and help the propagation of light.
[0030] The heat-conducting gap layer 7 has a thickness of less than 1mm.
[0031] The heat-conducting gap layer 7 is filled with a thermal interface material 8, which is used to reduce thermal resistance and enhance the efficiency of heat conduction from the lamp bead to the outside.
[0032] The thermal interface material 8 is heat-conducting silica gel or a heat-conducting gasket.
[0033] The PCB structure for the new energy automobile charging pile indicator lamp has the following beneficial effects: the transparent substrate body 4 enables the light of the lamp bead to be double-sided light-transmitting, improves the lighting range of light, the upper packaging layer 3 is used for waterproof sealing, the heat-conducting gap layer 7 is arranged between the upper packaging layer 3 and the upper lamp bead 2 to avoid heat concentration, control the generation of thermal stress and help the propagation of light.
[0034] Although the present application has disclosed multiple aspects and embodiments, other aspects and embodiments will be apparent to those skilled in the art without departing from the concept of the present application, and several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application. The multiple aspects and embodiments disclosed by the present application are only used for illustration, and are not intended to limit the present application, and the actual protection scope of the present application is subject to the claims.
Claims
1. A PCB board structure for a new energy vehicle charging pile indicator light, comprising a transparent substrate (1), an upper lamp bead (2) and an encapsulation layer (3), characterized in that: The transparent substrate (1) comprises a transparent substrate body (4), a first copper pad layer, a plurality of upper lamp beads (2) are uniformly arranged on the upper side of the first copper pad layer, the upper lamp beads (2) are welded to the first copper pad layer, an upper packaging layer (3) is arranged on the upper side of the upper lamp beads (2), the upper packaging layer (3) is used for waterproof sealing, and the transparent substrate (1) is made of one of polyester film and polycarbonate.
2. The PCB structure for the new energy automobile charging pile indicator light according to claim 1, characterized in that: A second copper pad layer is arranged on the lower side of the transparent substrate body (4), a plurality of lower lamp beads (5) are uniformly arranged on the lower side of the second copper pad layer, the lower lamp beads (5) are welded to the second copper pad layer, and a lower packaging layer (6) is arranged on the upper side of the lower lamp beads (5), the lower packaging layer (6) is used for waterproof sealing.
3. The PCB structure for the indicator light of the charging pile of the new energy vehicle according to claim 1, wherein: The thickness of the transparent substrate body (4) is 1.0-2.0 mm.
4. The PCB structure for the indicator light of the charging pile of the new energy vehicle according to claim 1, wherein: The packaging layer (3) is made of one of heat-conducting silica gel, heat-conducting epoxy resin and transparent heat-conducting material.
5. The PCB structure for the new energy vehicle charging pile indicator light according to claim 1, characterized in that: A heat-conducting gap layer (7) is arranged between the upper packaging layer (3) and the upper lamp beads (2), the heat-conducting gap layer (7) is used for avoiding heat concentration, controlling the generation of thermal stress and helping light propagation. 6.The PCB structure of the new energy vehicle charging pile indicator light according to claim 5, characterized in that: The thickness of the heat-conducting gap layer (7) is less than 1 mm. 7.The PCB structure for the new energy vehicle charging pile indicator light of claim 6, wherein: The heat-conducting gap layer (7) is filled with a thermal interface material (8), the thermal interface material (8) is used for reducing thermal resistance and enhancing the efficiency of heat conduction from the lamp beads to the outside.
8. The PCB structure for the new energy vehicle charging pile indicator light according to claim 7, characterized in that: The thermal interface material (8) is heat-conducting silica gel or a heat-conducting gasket.
Citation Information
Patent Citations
LED lamp panel
CN109357176A