Circuit board capable of being used for identifying operation electrode
By employing an upper and lower cover plate structure on the surgical electrode recognition circuit board, combined with a sealing ring and heat sink design, the problems of chip overheating and waterproofing are solved, achieving effective heat dissipation and sealing, and improving the safety and reliability of the circuit board.
Patent Information
- Application Number
- CN202520224390.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-13
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-02-13
AI Technical Summary
Existing surgical electrode recognition circuit boards have no heat dissipation structure when the chip heats up during use, and lack a sealed and waterproof design.
It adopts an upper and lower cover plate structure, combined with a sealing ring and heat sink design. The sealing ring wraps the chip to make it waterproof, while the heat sink is used for heat dissipation.
This achieves effective heat dissipation and waterproof sealing of the chip, improving the safety and reliability of the circuit board.
Smart Images

Figure CN223786251U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of surgical instrument technology, specifically to a circuit board that can be used for surgical electrode identification. Background Technology
[0002] Surgical electrodes are important tools in surgery, used to monitor and record bioelectrical signals and perform electrosurgery during surgery. They can cut tissues and coagulate blood vessels to achieve surgical treatment goals. They mainly consist of a working end, insulating sleeve, handle, cable, connector, and circuit board to ensure the precision and safety of the surgery.
[0003] A search revealed Chinese patent document CN219021500U, which discloses an identification circuit for a medical surgical electrode, comprising an electrode plug and a main unit. The electrode plug has a single-bus memory chip U9, which is connected to a transformer circuit, an optically isolated read circuit, and an optically isolated write circuit. The optically isolated read circuit has a data read input, and the single-bus memory chip U9 is electrically connected to the data read input via the optically isolated read circuit. The optically isolated write circuit has a data write input, and the single-bus memory chip U9 is electrically connected to the data write input via the optically isolated write circuit. Data is stored in the single-bus memory chip U9, and the electrode model is identified. The data stored in the single-bus memory chip U9 is then input to a microcontroller system for data analysis via the data write input. However, the following problems remain:
[0004] When the aforementioned circuit board used for surgical electrode recognition is in use, the processed chip generates heat, and there is no auxiliary heat dissipation structure. Furthermore, the circuit board is not sealed and waterproof during use. Utility Model Content
[0005] The purpose of this invention is to provide a circuit board for surgical electrode identification, in order to solve the problems mentioned in the background art regarding the circuit board for surgical electrode identification, where the processed chip generates heat during use, there is no auxiliary heat dissipation structure, and the circuit board lacks a sealed and waterproof structure during use.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a reinforced electrical insulation board for preventing dispersion, comprising an upper cover plate, a lower cover plate at the bottom of the upper cover plate, a board body between the lower cover plate and the upper cover plate, a support pad at the connection between the board body and the lower cover plate, a chip installed on the board body near the center of the lower cover plate, and a heat dissipation plate at the connection between the lower cover plate and the chip.
[0007] The outer side of the upper cover plate is provided with a first sealing ring, and the outer side of the lower cover plate near the upper cover plate is covered with a second sealing ring. The positions and shapes of the first sealing ring and the second sealing ring are corresponding, and a rectangular connection hole is opened on one side of both the first sealing ring and the second sealing ring.
[0008] Preferably, four sets of connecting plates are fixed to the top of the upper cover plate, and the sides of the connecting plates are in the shape of "「". A first positioning plate is fixed to the end of the connecting plate away from the upper cover plate, and the first positioning plate is horizontally set, with a first positioning hole in the center of the first positioning plate.
[0009] Preferably, the bottom of the lower cover plate is fixed with a "U"-shaped support frame, and two sets of support frames are provided, with two sets of second positioning plates fixed on the side of each set of support frames.
[0010] Preferably, the second positioning plate has a second positioning hole at its center, and the position distribution of the second positioning plate corresponds to the position distribution of the first positioning plate, and the positions and shapes of the first positioning hole and the second positioning hole are consistent.
[0011] Preferably, the heat sink has heat dissipation windows on both sides of its bottom, and the heat dissipation windows are located between the two sets of support frames.
[0012] Preferably, the heat sink is in contact with the chip, and the thickness of the support pad is consistent with the thickness of the chip.
[0013] Preferably, a sealing head is provided on the side of the plate near the connecting hole, and a connecting wire is provided inside the sealing head. The shape and size of the sealing head are consistent with the shape and size of the connecting hole.
[0014] Preferably, the outer dimensions of the plate are consistent with the internal shape dimensions of the first sealing ring and the second sealing ring, and the first sealing ring, the second sealing ring and the plate are engaged and connected.
[0015] Compared with the prior art, the beneficial effects of this utility model are:
[0016] By setting an upper cover plate and a lower cover plate on the outside of the board, and using the first and second sealing rings on the outside to wrap the inside of the board, the internal chip is waterproofed and sealed. The side of the board is provided with a connecting line wrapped with a sealing head, which connects the inside of the board to the outside. The chip is connected to the heat sink through contact, so the heat sink can dissipate heat from the chip, making the use of the board safer and more reliable. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the main structure of this utility model;
[0018] Figure 2 This is a schematic diagram of the bottom structure of this utility model;
[0019] Figure 3 This is a schematic diagram of the side cross-sectional structure of this utility model;
[0020] Figure 4 This is a schematic diagram of the internal structure of the lower cover plate in this utility model;
[0021] Figure 5 This is a schematic diagram of the side structure of this utility model.
[0022] In the diagram: 1. Upper cover plate; 101. First sealing ring; 102. Connecting plate; 103. First positioning plate; 104. First positioning hole; 2. Lower cover plate; 201. Second sealing ring; 202. Support frame; 203. Second positioning plate; 204. Second positioning hole; 3. Heat sink; 301. Heat dissipation window; 4. Plate body; 401. Sealing head; 402. Connecting wire; 5. Chip; 6. Support pad; 7. Connecting hole. Detailed Implementation
[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
[0024] Example 1, please refer to Figure 1-5 This utility model provides a circuit board for surgical electrode recognition, including an upper cover plate 1, a first sealing ring 101, a connecting plate 102, a first positioning plate 103, a first positioning hole 104, a lower cover plate 2, a second sealing ring 201, a support frame 202, a second positioning plate 203, a second positioning hole 204, a heat sink 3, a heat dissipation window 301, a plate body 4, a sealing head 401, a connecting wire 402, a chip 5, a support pad 6, and a connecting hole 7. The lower cover plate 2 is provided at the bottom of the upper cover plate 1, and four sets of connecting plates 102 are fixed at the top of the upper cover plate 1. The sides of the connecting plates 102 are "「" shaped. The first positioning plate 103 is fixed at the end of the connecting plate 102 away from the upper cover plate 1. The first positioning plate 103 is horizontally set, and the center of the first positioning plate 103 is provided with a first positioning hole 104. The first positioning plate 103 can be fixed through the first positioning hole 104, thus completing the fixation of the lower cover plate 2.
[0025] Specifically, such as Figure 2 and Figure 3 As shown, a U-shaped support frame 202 is fixed to the bottom of the lower cover plate 2, and two sets of support frames 202 are provided. Two sets of second positioning plates 203 are fixed to the side of each set of support frames 202. The support frame 202 can support the bottom of the device, leaving space at the bottom of the heat sink 3 for heat dissipation.
[0026] Specifically, such as Figure 1 and Figure 2 As shown, the second positioning plate 203 has a second positioning hole 204 in the center, and the position distribution of the second positioning plate 203 corresponds to the position distribution of the first positioning plate 103. The position and shape of the first positioning hole 104 and the second positioning hole 204 are consistent, which makes it convenient for the second positioning plate 203 and the first positioning plate 103 to be stacked. Then, screws are used to pass through the second positioning hole 204 and the first positioning hole 104, so that the lower cover plate 2 and the upper cover plate 1 can be fixed at the same time, thus fixing the internal plate 4.
[0027] Specifically, such as Figure 3 and Figure 5 As shown, a plate 4 is provided between the lower cover plate 2 and the upper cover plate 1. A sealing head 401 is provided on the side of the plate 4 near the connecting hole 7. A connecting line 402 is provided inside the sealing head 401. The shape and size of the sealing head 401 are consistent with the shape and size of the connecting hole 7. In this way, when the lower cover plate 2 and the upper cover plate 1 are closed, the sealing head 401 inside can seal the inner plate 4 while also connecting it to the outside.
[0028] Specifically, such as Figure 1 and Figure 3 As shown, the external dimensions of the plate 4 are consistent with the internal shape dimensions of the first sealing ring 101 and the second sealing ring 201, and the first sealing ring 101 and the second sealing ring 201 are engaged with the plate 4, which facilitates the assembly of the external lower cover plate 2 and upper cover plate 1 with the plate 4.
[0029] Example 2, specifically, as follows Figure 3 , Figure 4 and Figure 5 As shown, a support pad 6 is provided at the connection between the board body 4 and the lower cover plate 2. A chip 5 is installed near the center of the board body 4 and the lower cover plate 2. A heat sink 3 is provided at the connection between the lower cover plate 2 and the chip 5. Heat sink 3 is provided on both sides of the bottom of the heat sink 3. The heat sink 301 is located between two sets of support frames 202, which can increase the heat dissipation channel on the side and achieve the effect of heat dissipation inside.
[0030] Specifically, such as Figure 2 As shown, the heat sink 3 is in contact with the chip 5, and the thickness of the support pad 6 is consistent with the thickness of the chip 5. This allows the chip 5 to be connected to the heat sink 3, and then the heat sink 3 dissipates heat from the chip 5.
[0031] Specifically, such as Figure 1 and Figure 5As shown, a first sealing ring 101 is provided on the outer side of the upper cover plate 1, and a second sealing ring 201 is provided on the outer side of the lower cover plate 2 near the upper cover plate 1. The positions and shapes of the first sealing ring 101 and the second sealing ring 201 are corresponding, and a rectangular connecting hole 7 is provided on one side of both the first sealing ring 101 and the second sealing ring 201.
[0032] In this embodiment, the following is how it is used: An upper cover plate 1 and a lower cover plate 2 are provided on the outer side of the board body 4. The lower cover plate 2 and the upper cover plate 1 can wrap around the inner board body 4 using the first sealing ring 101 and the second sealing ring 201 on the outer side. A connecting line 402 wrapped with a sealing head 401 is provided on the side of the board body 4, allowing connection between the inside and outside of the board body 4. The upper cover plate 1 and the lower cover plate 2 are then fixedly installed by screws passing through the second positioning hole 204 and the first positioning hole 104. During use, the internal chip 5 will generate heat, and the chip 5 will contact and connect with the heat sink 3. The heat sink 3 can then dissipate heat from the chip 5, providing waterproof sealing for the internal chip 5. This ensures heat dissipation for chip 5, making the use of board 4 safer and more reliable. Thus, a circuit board for surgical electrode identification is complete. It should be noted that this utility model is a circuit board for surgical electrode identification; all components are general standard parts or parts known to those skilled in the art. Its structure and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods. In the idle spaces of this device, all the aforementioned electrical components (referring to power elements, electrical components, and the compatible monitoring computer and power supply) are connected by wires. The specific connection methods should refer to the working principle described above, where the electrical connections are completed according to the sequential operation of each component. The detailed connection methods are well-known technologies in this field.
[0033] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A circuit board for surgical electrode recognition, comprising an upper cover plate (1), characterized in that: The bottom of the upper cover plate (1) is provided with a lower cover plate (2), and a plate body (4) is provided between the lower cover plate (2) and the upper cover plate (1). A support pad (6) is provided at the connection between the plate body (4) and the lower cover plate (2). A chip (5) is installed on the plate body (4) near the center of the lower cover plate (2). A heat sink plate (3) is provided at the connection between the lower cover plate (2) and the chip (5). The outer side of the upper cover plate (1) is provided with a first sealing ring (101), and the outer side of the lower cover plate (2) near the upper cover plate (1) is covered with a second sealing ring (201). The positions and shapes of the first sealing ring (101) and the second sealing ring (201) correspond to each other, and a rectangular connecting hole (7) is opened on one side of both the first sealing ring (101) and the second sealing ring (201).
2. The circuit board for surgical electrode recognition according to claim 1, characterized in that: The top of the upper cover plate (1) is fixed with four sets of connecting plates (102), and the side of the connecting plate (102) is a "「" shaped structure. The end of the connecting plate (102) away from the upper cover plate (1) is fixed with a first positioning plate (103), and the first positioning plate (103) is horizontally set. The center of the first positioning plate (103) is provided with a first positioning hole (104).
3. A circuit board for surgical electrode recognition according to claim 1, characterized in that: The bottom of the lower cover plate (2) is fixed with a "U" shaped support frame (202), and the support frame (202) is provided in two sets, with two sets of second positioning plates (203) fixed on the side of each set of support frame (202).
4. A circuit board for surgical electrode recognition according to claim 3, characterized in that: The second positioning plate (203) has a second positioning hole (204) at its center, and the position distribution of the second positioning plate (203) corresponds to the position distribution of the first positioning plate (103), and the position and shape of the first positioning hole (104) and the second positioning hole (204) are consistent.
5. A circuit board for surgical electrode recognition according to claim 1, characterized in that: The heat sink (3) has heat dissipation windows (301) on both sides of its bottom, and the heat dissipation windows (301) are located between two sets of support frames (202).
6. A circuit board for surgical electrode recognition according to claim 1, characterized in that: The heat sink (3) is in contact with the chip (5), and the thickness of the support pad (6) is consistent with the thickness of the chip (5).
7. A circuit board for surgical electrode recognition according to claim 1, characterized in that: A sealing head (401) is provided on the side of the plate (4) near the connecting hole (7). A connecting line (402) is provided inside the sealing head (401). The shape and size of the sealing head (401) are consistent with the shape and size of the connecting hole (7).
8. A circuit board for surgical electrode recognition according to claim 1, characterized in that: The outer dimensions of the plate (4) are consistent with the internal shape dimensions of the first sealing ring (101) and the second sealing ring (201), and the first sealing ring (101), the second sealing ring (201) and the plate (4) are engaged and connected.
Citation Information
Patent Citations
Recognition circuit of medical operation electrode
CN219021500U