Wafer carrying disc of cleaning machine and cleaning machine

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer carrying disc of a cleaning machine and the cleaning machine, and aims to solve the problem that acid liquor is easy to damage the front surface of a wafer in the back wet etching process. The round slide glass disc provided by the utility model comprises an outer slide glass disc and an inner slide glass disc, a mounting opening is formed in the outer wafer carrying disc, and the outer wafer carrying disc is arranged to be capable of carrying wafers; the inner slide glass disc is arranged in the mounting opening and is provided with a liquid spraying hole, and the liquid spraying hole is arranged to be capable of spraying cleaning liquid to the edge of the wafer. According to the utility model, cleaning liquid is sprayed to the edge area of the front surface of the wafer through the liquid spraying holes, so that acid liquid flowing to the edge of the front surface of the wafer can be removed, and damage of the acid liquid to a die pattern on the front surface of the wafer is avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically providing a wafer carrier for a cleaning machine and the cleaning machine itself. Background Technology

[0002] In semiconductor manufacturing, wafers that have undergone front-end processing and passed testing first undergo back grinding (also known as back thinning). Then, depending on the product type, back metallization is performed, followed by dicing and packaging. Currently, after back grinding, backside wet etching (also known as wet chemical etching) is typically performed on the wafer's backside to remove damage from the grinding process, reduce stress and warpage, increase the roughness of the wafer's backside, and improve the adhesion between the backside metal layer and the wafer's backside.

[0003] Currently, foundries mostly use single-sided, single-wafer wet etching machines, which mainly include a control system, motor, wafer carrier tray, and ventilation piping. For example... Figures 1 to 4 As shown, a wafer carrier typically includes an inner wafer carrier and an outer wafer carrier. The inner wafer carrier is circular and located in the center of the outer wafer carrier. It is connected to a motor via a first screw and can be raised and lowered under the motor's drive. The inner wafer carrier has several air vents connected to a ventilation pipe. The outer wafer carrier is annular and is connected to a motor via a second screw. It can be raised, lowered, and rotated under the motor's drive. The outer wafer carrier has multiple pins for supporting the edges of the wafer.

[0004] During the processing, the polished wafer is placed on a wafer carrier with the back side facing up. Process gases, such as clean dry air (CDA) or inert gases like nitrogen, are sprayed onto the front side of the wafer through jet holes located in the middle area of ​​the inner carrier. This allows the inner carrier to flatten the wafer using the Bernoulli principle. At the same time, acid is sprayed from the top of the wafer onto the back side to complete the wet etching of the back side of the wafer.

[0005] However, the inventors discovered in practice that during the aforementioned wet etching process, acid inevitably flows from the back edge of the wafer to the front edge, causing damage or even failure of the wafer's die. Utility Model Content

[0006] The present invention aims to solve the above-mentioned technical problems, namely, to at least solve the problem that acid solution can easily damage the die on the wafer during the back wet etching process.

[0007] In a first aspect, the present invention provides a wafer carrier tray for a cleaning machine, the wafer carrier tray including an outer wafer carrier tray and an inner wafer carrier tray; the outer wafer carrier tray is provided with an mounting port and is configured to hold a wafer; the inner wafer carrier tray is disposed in the mounting port and is provided with a spray hole, the spray hole being configured to spray cleaning fluid onto the edge of the wafer.

[0008] The wafer carrier tray of the cleaning machine provided by this utility model has spray holes on its inner tray, and the spray holes are configured to spray cleaning liquid (such as ultrapure water) onto the edge of the wafer. During the wet etching process on the back side of the wafer, the cleaning liquid is sprayed onto the edge area of ​​the front side of the wafer through the spray holes, which can remove the acid that flows to the edge of the front side of the wafer and avoid the acid from damaging the die pattern on the front side of the wafer.

[0009] In some feasible embodiments of the wafer carrier disk of the aforementioned cleaning machine, the liquid outlet of the spray hole is located in the edge region of the inner carrier disk.

[0010] In some feasible embodiments of the wafer carrier disk of the cleaning machine described above, the edge region of the inner carrier disk includes the top edge of the inner carrier disk and the outer peripheral wall of the inner carrier disk. That is, the liquid outlet end of the spray hole is located at the top edge of the inner carrier disk, or at the outer peripheral wall of the inner carrier disk, or spray holes are provided at both the top edge of the inner carrier disk and the outer peripheral wall of the inner carrier disk.

[0011] In some feasible embodiments of the wafer carrier disk of the cleaning machine described above, part or all of the outer peripheral wall of the inner carrier disk is inclined and thus forms a first inclined surface, the first inclined surface facing the wafer, and the liquid outlet end of the spray hole is disposed on the first inclined surface.

[0012] In some feasible embodiments of the wafer carrier disk of the aforementioned cleaning machine, there are multiple spray holes, which are evenly distributed on the edge area of ​​the inner carrier disk.

[0013] In some feasible embodiments of the wafer carrier disk of the cleaning machine described above, the axis of the spray hole is perpendicular to the first inclined plane.

[0014] In some feasible embodiments of the wafer carrier disk of the cleaning machine described above, part or all of the inner peripheral wall of the outer carrier disk is inclined and thus forms a second inclined surface facing the wafer.

[0015] In some feasible embodiments of the wafer carrier disk of the cleaning machine described above, the inner wafer carrier disk is provided with a liquid equalization chamber; the liquid inlet end of the spray hole is connected to the liquid equalization chamber.

[0016] In some feasible embodiments of the wafer carrier tray of the cleaning machine described above, the inner carrier tray is provided with an air jet hole, which is configured to spray gas onto the wafer; the inner carrier tray is provided with an isolation member, and the liquid equalization chamber and the isolation member are both arranged around the air jet hole, with the isolation member located inside the liquid equalization chamber.

[0017] In some feasible embodiments of the wafer carrier disk of the cleaning machine described above, the air vent includes a first air vent and a second air vent; the first air vent is disposed in the central region of the inner carrier disk; there are multiple second air vents, which are disposed around the periphery of the first air vent.

[0018] In some feasible embodiments of the wafer carrier tray of the cleaning machine described above, the second vent is inclined, and the outlet end of the second vent is closer to the edge of the wafer than its inlet end.

[0019] In some feasible embodiments of the wafer carrier disk of the cleaning machine described above, the air jet hole also includes a third air hole, there are multiple third air holes, and they are arranged together around the periphery of the second air hole; the third air hole is inclined, the air outlet end of the third air hole is closer to the edge of the wafer than its air inlet end, and the inclination angle of the third air hole is greater than the inclination angle of the second air hole.

[0020] In some feasible embodiments of the wafer carrier tray of the cleaning machine described above, the outer carrier tray is provided with a pin, which is configured to carry the wafer; the pin includes a columnar body and a needle body, the bottom end of the needle body is connected to the columnar body, and the top end of the needle body protrudes to form a support surface.

[0021] In some feasible embodiments of the wafer carrier disk of the cleaning machine described above, the distance between the pin body and the outer peripheral wall of the wafer is 2mm to 5mm.

[0022] In some feasible embodiments of the wafer carrier disk of the cleaning machine described above, the ejector pin is a one-piece molded structure.

[0023] In a second aspect, the present invention also provides a cleaning machine, characterized in that the cleaning machine includes a drive mechanism, a liquid passage, and a wafer carrier disk as described in any of the aforementioned technical solutions. The drive mechanism is driven and connected to the outer wafer carrier disk and the inner wafer carrier disk respectively, and the liquid passage is connected to the spray nozzle.

[0024] Those skilled in the art will understand that, since the cleaning machine includes the wafer carrier disk described in any of the aforementioned technical solutions, it possesses all the technical effects that the aforementioned wafer carrier disk can achieve, and will not be repeated here. Attached Figure Description

[0025] The preferred embodiments of this utility model are described below with reference to the accompanying drawings, in which:

[0026] Figure 1A 3D structural diagram of the wafer carrier disk in an existing cleaning machine;

[0027] Figure 2 A top view of the wafer carrier disk of an existing cleaning machine;

[0028] Figure 3 Left view of the wafer carrier disk of an existing cleaning machine;

[0029] Figure 4 for Figure 3 A cross-sectional view along the AA direction;

[0030] Figure 5 A front view of the ejector pins of a wafer carrier disk in an existing cleaning machine;

[0031] Figure 6 A top view of the ejector pins on the wafer carrier tray of an existing cleaning machine;

[0032] Figure 7 A three-dimensional structural diagram of the wafer carrier disk of the cleaning machine provided in an embodiment of this utility model;

[0033] Figure 8 A top view of the wafer carrier disk of the cleaning machine provided in an embodiment of this utility model;

[0034] Figure 9 A left view of the wafer carrier disk of the cleaning machine provided in an embodiment of this utility model;

[0035] Figure 10 for Figure 9 A cross-sectional view along the BB direction;

[0036] Figure 11 for Figure 10 A magnified view of a portion at point M;

[0037] Figure 12 A schematic diagram showing the tilt angle of the jet nozzles on the wafer carrier disk of the cleaning machine provided in this embodiment of the present invention;

[0038] Figure 13 A front view of the ejector pin of the wafer carrier disk of the cleaning machine provided in this embodiment of the utility model;

[0039] Figure 14 A top view of the ejector pins of the wafer carrier disk of the cleaning machine provided in this embodiment of the utility model.

[0040] Figure label:

[0041] 100, outer wafer tray; 110, mounting port; 120, second bevel; 130, ejector pin; 131, columnar body; 132, pin body; 140, side pin; 150, second screw; 200, inner wafer tray; 210, liquid spray hole; 220, first bevel; 230, liquid equalization chamber; 240, air jet hole; 241, first vent hole; 242, second vent hole; 243, third vent hole; 250, first screw; 300, wafer. Detailed Implementation

[0042] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art can make adjustments as needed to adapt to specific applications. To better illustrate the present invention, numerous specific details are provided in the following detailed description. Those skilled in the art should understand that the present invention can be implemented even without certain specific details.

[0043] In the description of this utility model, terms such as "upper," "lower," "inner," "outer," "left," "right," "front," and "rear," which indicate direction or positional relationships, are based on the actual direction or positional relationships in practical application. These terms are used merely for ease of description and do not indicate or imply that the device to be protected must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, ordinal numbers such as "first" and "second" are used only for convenience of explanation and are not used to indicate or imply relative importance.

[0044] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0045] As mentioned earlier, most foundries in the semiconductor integrated circuit field currently use single-sided, single-wafer wet etching machines, which mainly include a control system, motor, wafer carrier tray (also known as a "chuck"), and ventilation piping. Figures 1 to 4As shown, a wafer carrier typically includes an inner carrier 200 and an outer carrier 100. The inner carrier 200 is generally circular and located in the middle of the outer carrier 100. The inner carrier 200 is connected to a motor via a first screw 250 and can be raised and lowered under the drive of the motor. The inner carrier 200 has several air vents 240, which are connected to a ventilation pipe. The outer carrier 100 is annular and is connected to a motor via a second screw 150, allowing it to be raised, lowered, and rotated under the drive of the motor. The outer carrier 100 has multiple pins 130, the structure of which is as follows: Figure 5 and Figure 6 As shown, it includes a columnar body 131, one end of which is inserted into a mounting hole on the outer substrate 100, and the other end is provided with a needle 132 protruding from the end face of the columnar body 131 to support the edge portion of the wafer 300.

[0046] During the processing, the polished wafer 300 is placed on a wafer carrier disk with its back side facing upwards (i.e., the back side of wafer 300 faces away from the wafer carrier disk, and the front side of wafer 300 faces the wafer carrier disk). Process gases, such as inert gases including nitrogen, or clean, dry air, are sprayed onto the front side of wafer 300 through jet holes 240 located in the middle region of the inner wafer carrier disk 200. This allows wafer 300 to levitate above the wafer carrier disk due to the Bernoulli effect. Simultaneously, acid is sprayed from above wafer 300 onto its back side to complete the wet etching of the back side of wafer 300. However, the inventors discovered in practice that during the above process, acid inevitably flows from the edge of the back side of wafer 300 to the front side, causing damage or even failure of the die.

[0047] Furthermore, after analyzing the damage level on the front side of wafer 300, the inventors discovered that acid marks are very likely to appear on the front side of wafer 300 corresponding to the position of pin 130. This is presumably because acid tends to accumulate between pin 132 and the front side of wafer 300; if the top surface of pin 132 is uneven, acid residue is more likely to remain. Moreover, if the area where pin 132 contacts the front side of wafer 300 is a valid pattern, it will damage the die, causing abnormal electrical parameters or even failure of the die.

[0048] Therefore, how to modify the structure of the wafer carrier and the cleaning machine to avoid damage to the front side of the wafer 300 caused by acid during the back wet etching process, and to avoid abnormal or failed die electrical parameters, is an urgent problem to be solved.

[0049] To address the aforementioned problems, this utility model provides a wafer carrier disk (or "chuck") for a cleaning machine. Please refer to the following for details. Figures 7 to 14The wafer carrier includes an outer wafer carrier 100 and an inner wafer carrier 200. The outer wafer carrier 100 has a mounting port 110 and multiple ejector pins 130 for supporting the edge portion of the wafer 300, enabling the outer wafer carrier 100 to support the wafer 300. The inner wafer carrier 200 is disposed within the mounting port 110 and has multiple jet nozzles 240 and multiple liquid injection nozzles 210. The inlet end of each jet nozzle 240 is connected to a ventilation pipe, and the outlet end of the jet nozzle 240 is located in the middle region of the inner wafer carrier 200. The jet direction of the jet nozzle 240 is towards the front side of the wafer 300, for spraying process gas onto the front side of the wafer 300 to suspend the wafer 300 above the wafer carrier 200 through the Bernoulli effect. The inlet end of each spray hole 210 is used to connect with the liquid flow pipeline. The spray direction of the spray hole 210 is towards the edge of the wafer 300, so that the inner wafer tray 200 can spray cleaning liquid towards the edge of the wafer 300, effectively preventing acid liquid flowing from the back of the wafer 300 to the front of the wafer 300 from contaminating or even damaging the dies on the wafer 300.

[0050] In one or more embodiments, the liquid outlet end of the spray hole 210 can be located on the edge region of the inner slide tray 200. Preferably, the multiple spray holes 210 are evenly distributed on the edge region of the inner slide tray 200. For example, there can be four spray holes 210 arranged in a cross shape on the inner slide tray 200; or there can be eight spray holes 210 arranged in a star shape on the inner slide tray 200. The specific number of spray holes 210 can be designed according to actual needs, and will not be elaborated further in this embodiment.

[0051] In other embodiments, the liquid outlet of the spray hole 210 can also be located in the middle area of ​​the top of the inner wafer disk 200. In this case, the spray hole 210 is distributed in the outer area of ​​the jet hole 240. The spray hole 210 is tilted and the spray direction of the spray hole 210 is towards the edge of the front side of the wafer 300. This can also achieve the effect of removing the acid liquid flowing to the edge of the front side of the wafer 300.

[0052] It should be noted that the liquid sprayed from the spray nozzle 210 can be a cleaning solution that has virtually no adverse effect on the die of the wafer 300, such as ultrapure water. Spraying ultrapure water onto the front side of the wafer 300, especially the area near the edge of the wafer 300, through the spray nozzle 210 can not only remove acid flowing to the edge of the front side of the wafer 300, preventing the acid from damaging the die pattern on the front side of the wafer 300, but also prevent the cleaning solution itself from contaminating or damaging the front side of the wafer 300.

[0053] In one or more embodiments, the edge region of the inner tablet tray 200 specifically includes the top edge of the inner tablet tray 200 and the outer peripheral wall of the inner tablet tray 200. That is, the liquid outlet end of the spray hole 210 can be provided on the outer peripheral wall of the inner tablet tray 200, or on the top edge of the inner tablet tray 200, or the liquid outlet end of the spray hole 210 can be provided on both the top edge of the inner tablet tray 200 and the outer peripheral wall of the inner tablet tray 200.

[0054] Furthermore, when the liquid outlet end of the spray hole 210 is located on the outer peripheral wall of the inner slide disk 200, such as Figure 7 and Figure 8 As shown, the outer peripheral wall of the inner wafer disk 200 is entirely inclined, thus forming a first inclined surface 220, which faces the wafer 300. The liquid outlet of the spray hole 210 is located on the first inclined surface 220, and specifically, the axis of the spray hole 210 is perpendicular to the first inclined surface 220. This arrangement guides the sprayed cleaning fluid, allowing the cleaning fluid ejected from the spray hole 210 to flow towards the edge area of ​​the front side of the wafer 300 to the maximum extent. In this way, not only can acid flowing to the edge of the front side of the wafer 300 be removed more effectively, but the efficiency and quality of the cleaning process are also significantly improved.

[0055] Alternatively, the outer peripheral wall of the inner wafer disk 200 can also be partially inclined. For example, a small-area first inclined surface 220 can be provided at the position corresponding to the liquid outlet of each spray hole 210. That is, multiple mutually spaced first inclined surfaces 220 are provided on the outer peripheral wall of the inner wafer disk 200, and each first inclined surface 220 faces the edge region of the wafer 300 in the corresponding direction. By setting the liquid outlet of each spray hole 210 on the corresponding first inclined surface 220, the cleaning liquid sprayed from the spray hole 210 can also be guided as much as possible towards the front edge of the wafer 300, thereby better removing the acid liquid flowing to the front edge of the wafer 300.

[0056] In addition, considering that after removing the acid from the front edge of the wafer 300, a small amount of cleaning fluid will drip back onto the inner wafer tray 200, the first inclined surface 220 can also guide the cleaning fluid to drain out from the gap between the inner wafer tray 200 and the outer wafer tray 100.

[0057] Further, please refer to Figures 7 to 11The inner peripheral wall of the outer wafer tray 100 is partially or entirely inclined, thus forming a second inclined surface 120, which faces the wafer 300. When the cleaning fluid ejected from the spray hole 210 of the inner wafer tray 200 touches the front surface of the wafer 300, most of the cleaning fluid will fall back onto the outer wafer tray 100 due to the action of the wafer 300 surface. At this time, the second inclined surface 120 on the outer wafer tray 100 can effectively guide this falling cleaning fluid, along with any accompanying acid, to flow smoothly along the direction of the second inclined surface 120 towards the bottom of the wafer tray and finally drain out. This design not only optimizes the liquid flow path during the cleaning process but also improves the cleaning efficiency and effect on the wafer 300, ensuring the cleanliness and quality of the wafer 300 surface.

[0058] Based on the fact that multiple liquid spray holes 210 are provided in the edge area of ​​the inner slide disk 200, please refer to Figure 10 and Figure 11 The inner wafer tray 200 has a liquid equalization chamber 230 inside, and the liquid inlet end of each spray hole 210 is connected to the liquid equalization chamber 230. The liquid equalization chamber 230 can serve as a buffer and distribution area before the cleaning fluid enters the spray hole 210, which helps to ensure that the cleaning fluid flowing out of the liquid equalization chamber 230 can be evenly distributed to each spray hole 210, so that the flow rate of the cleaning fluid sprayed from each spray hole 210 can be more consistent and uniform. This can effectively avoid the problem that some spray holes 210 may not have a good acid cleaning effect on the front side of the wafer 300 due to insufficient cleaning fluid supply.

[0059] Specifically, the liquid equalization chamber 230 is annular and surrounds the jet hole 240 located in the middle region of the inner wafer disk 200. That is, the liquid equalization chamber 230 is located in the outer region of the jet hole 240, and the center of the liquid equalization chamber 230 coincides with the center of the inner wafer disk 200. The liquid equalization chamber 230 is provided with a liquid inlet communicating with the liquid passage. In particular, when the bottom wall of the liquid equalization chamber 230 is completely open to form a liquid inlet, the liquid equalization chamber 230 is a first annular groove on the back side of the inner wafer disk 200 (the side away from the wafer 300), and the liquid inlet end of the jet hole 210 can be located either at the bottom of the first annular groove or on the side wall of the first annular groove facing the outer wafer disk 100.

[0060] In addition, the inner wafer tray 200 is also provided with an isolator, which is annular and surrounds the jet hole 240. That is, the isolator is located in the outer region of the jet hole 240 and inside the liquid equalization chamber 230, i.e., between the jet hole 240 and the liquid equalization chamber 230. Specifically, the back of the inner wafer tray 200 has a second annular groove, which is located inside the first annular groove. The isolator is installed in the second annular groove and protrudes from the back of the inner wafer tray 200. The isolator can be made of a polymer material resistant to acid corrosion, such as polytetrafluoroethylene (PTFE) or polyvinylidene fluoride (PVDF). By providing the isolator, the liquid inlet position of the jet hole 210 and the gas inlet position of the jet hole 240 can be isolated from each other, thereby achieving gas-liquid isolation. This helps to prevent liquids (such as acid and cleaning fluid) at the edge of the wafer 300 from affecting the process gas in the middle area of ​​the wafer 300 surface.

[0061] In one embodiment, please refer to Figure 7 and Figure 8 The jet nozzle 240 includes a first nozzle 241 and a second nozzle 242. The first nozzle 241 is located in the central region of the inner wafer disk 200, and multiple second nozzles 242 are arranged around the first nozzle 241. Both the first nozzle 241 and the second nozzle 242 are used to jet process gas onto the front side of the wafer 300. Compared with the existing solution, this embodiment increases the overall number of jet nozzles 240 by adding second nozzles 242 around the first nozzle 241, which helps to enhance the Bernoulli effect.

[0062] The inner wafer disk 200 has a plurality of first vents 241 in its central region. One first vent 241 is located at the center of the inner wafer disk 200, and the remaining first vents 241 are arranged in a circle or regular polygon and arranged around the center of the inner wafer disk 200. A plurality of second vents 242 are arranged to form at least one circle and arranged around the center of the inner wafer disk 200, with the center of this circle coinciding with the center of the inner wafer disk 200. A group of multiple second vents 242 forming the same circle is defined as a set. The inner wafer disk 200 has one or more sets of second vents 242. The specific number of sets of second vents 242 can be determined based on factors such as the weight (thickness, area) of the thinned wafer 300, for example... Figure 7 and Figure 8 In the structure shown, there are 60-80 second pores 242 arranged in a circle; for example, there are two groups of second pores 242, each group having 60-80 second pores 242, and the two groups of second pores 242 are arranged in concentric circles.

[0063] Further, please refer to Figure 12Each of the second vents 242 is inclined, and the outlet end of the second vent 242 is closer to the edge of the wafer 300 than its inlet end; that is, the inclination angle α of the axis of the second vent 242 is greater than 90 degrees. With this design, the ejected process gas can cover and act on a wider area of ​​the front side of the wafer 300 to the maximum extent, thereby further enhancing the Bernoulli effect. This allows the wafer 300 to be supported and leveled more stably, improving the stability and accuracy of the processing.

[0064] In another embodiment, please refer to Figure 7 , Figure 8 and Figure 12 In addition to the first vent 241 and the second vent 242 in the inner wafer disk 200, the air jet vent 240 also includes a third vent 243. Multiple third vents 243 are arranged around the periphery of the second vent 242. Both the third vent 243 and the second vent 242 are inclined. The outlet end of the second vent 242 is closer to the edge of the wafer 300 than its inlet end, and the inclination angle of the second vent 242 is smaller than that of the third vent 243. That is, the outlet end of the third vent 243 is closer to the edge of the wafer 300 than its inlet end. The inclination angle α of the axis of the second vent 242 and the inclination angle β of the axis of the third vent 243 are both greater than 90 degrees, and the value of inclination angle α is smaller than the value of inclination angle β, i.e., 90° < α < β. The third vent 243, designed in this way, allows the ejected process gas to act more directly on the edge region of the wafer 300. This design helps to form a more stable airflow at the edge of the wafer 300, thereby enhancing edge support and flattening, and reducing edge warping or deformation of the wafer 300 during processing.

[0065] It should be noted that, in this embodiment of the present invention, a fourth vent, a fifth vent, or other vents with a larger inclination angle than the third vent 243 may also be provided around the third vent 243. The specific design can be selected according to actual needs, and will not be described in detail in this embodiment of the present invention.

[0066] Please see Figure 13 and Figure 14 The ejector pin 130 includes a columnar body 131 and a pin body 132. One end of the columnar body 131 is inserted into a mounting hole on the outer substrate 100, and the other end of the columnar body 131 is provided with a insertion hole. One end (bottom end) of the pin body 132 is inserted into the insertion hole, and the other end (top end) protrudes from the columnar body 131 to support the edge portion of the wafer 300.

[0067] Furthermore, the tip of the needle 132 protrudes to form a supporting curved surface. Specifically, the end of the needle 132 that contacts the front side of the wafer 300 protrudes upwards to form a supporting curved surface for supporting the wafer 300. This effectively reduces the contact area between the needle 132 and the wafer 300, thereby preventing acid residue in the contact area and reducing the risk of damage to the front side die of the wafer 300 caused by the needle 132. In addition, the supporting curved surface at the top of the needle 132 also has a flow guiding function, guiding the acid to flow smoothly along the surface of the needle 132, which helps prevent acid accumulation or retention at the top of the needle 132.

[0068] Compared to existing solutions, this embodiment also changes the ejector pin 130 to a one-piece molded structure to improve the overall structural stability. Furthermore, the ejector pin 130 is made of corrosion-resistant materials; for example, the ejector pin 130 can be made entirely of polychlorotrifluoroethylene (PCTFE), which offers better corrosion resistance and a longer lifespan.

[0069] There are multiple ejector pins 130, which are evenly distributed on the inner edge of the outer substrate 100. The specific number of ejector pins 130 can be selected according to actual needs. For example, the number of ejector pins 130 can be 4, 8 or 16.

[0070] The outer wafer tray 100 is also provided with multiple side pins 140, which are used to position the wafer 300 and prevent the wafer 300 from shifting during rotation. The specific number of side pins 140 can also be selected according to actual needs. The specific structure of the side pins 140 can be the same as that of the ejector pins 130. In addition, compared with the ejector pins 130, the side pins 140 can be closer to the outer edge of the outer wafer tray 100.

[0071] Furthermore, the inventors discovered that if the position of the ejector pin 130 corresponds to the effective area of ​​the wafer 300, that is, if the ejector pin 130 may correspond to the position of the die, the residual acid at the ejector pin 130 may damage the normal die. Therefore, in this embodiment of the invention, the ejector pin 130 is positioned to correspond to the ineffective area of ​​the wafer 300, that is, at a position 2mm to 5mm from the edge of the wafer 300. In other words, the distance between the pin body 132 of the ejector pin 130 and the outer peripheral wall of the wafer 300 is 2mm to 5mm. This ensures that the ejector pin 130 contacts the ineffective pattern of the wafer 300, avoiding damage to the effective pattern in the central area of ​​the wafer 300.

[0072] This utility model embodiment also provides a cleaning machine, including a drive mechanism, a liquid passage, and components / mechanisms such as the wafer carrier disk in any of the aforementioned technical solutions. The drive mechanism is driven and connected to the outer wafer carrier disk 100 and the inner wafer carrier disk 200 respectively. The drive mechanism can be a motor or other driving method, so that the outer wafer carrier disk 100 can be raised, lowered, and rotated under drive, and the inner wafer carrier disk 200 can be raised and lowered under drive. One end of the liquid passage can be used to connect to a centralized water supply system, and the other end of the liquid passage is connected to the spray hole 210 so that cleaning liquid (e.g., ultrapure water) can be sprayed onto the front side of the wafer 300 through the spray hole 210.

[0073] In one or more embodiments, the cleaning machine further includes a venting line. One end of the venting line is connected to a centralized gas supply system, and the other end is connected to a jet nozzle 240 (e.g., including a first nozzle 241, a second nozzle 242, and a third nozzle 243) to spray process gases onto the front side of the wafer 300 through the jet nozzle 240. In one or more embodiments, the cleaning machine also retains a spray assembly for spraying an acid solution (such as a mixture of hydrofluoric acid and nitric acid) onto the wafer 300 for wet etching.

[0074] In one or more embodiments, the cleaning machine further includes a control system. The control system is used to control whether the drive mechanism, spray assembly, air supply line, and liquid supply line operate. For example, a pneumatic valve is provided on the liquid supply line, and the control system can control whether the spray nozzle 210 sprays cleaning fluid by controlling the opening and closing of the pneumatic valve.

[0075] It should be noted that, without conflict, the aforementioned embodiments can be combined to form one or more embodiments, and this utility model will not elaborate on them one by one.

[0076] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A wafer carrier disk for a cleaning machine, characterized in that, The wafer carrier disk includes: An external wafer tray (100) is provided with a mounting port (110) and is configured to hold a wafer (300); An inner wafer tray (200) is disposed within the mounting port (110), and the inner wafer tray (200) is provided with a spray hole (210) which is configured to spray cleaning fluid onto the edge of the wafer (300).

2. The wafer carrier disk of the cleaning machine according to claim 1, characterized in that, The liquid outlet of the spray hole (210) is located on the edge region of the inner slide plate (200).

3. The wafer carrier disk of the cleaning machine according to claim 2, characterized in that, The edge region of the inner tray (200) includes the top edge of the inner tray (200) and the outer peripheral wall of the inner tray (200).

4. The wafer carrier disk of the cleaning machine according to claim 3, characterized in that, The outer peripheral wall is partially or entirely inclined to form a first inclined surface (220), the first inclined surface (220) facing the wafer (300), and the liquid outlet end of the liquid spray hole (210) is disposed on the first inclined surface (220).

5. The wafer carrier disk of the cleaning machine according to claim 4, characterized in that, The spray holes (210) are multiple and evenly distributed on the edge region of the inner slide disk (200); and / or The axis of the spray hole (210) is perpendicular to the first inclined surface (220).

6. The wafer carrier disk of the cleaning machine according to claim 1, characterized in that, The inner peripheral wall of the outer substrate disk (100) is partially or entirely inclined, thus forming a second inclined surface (120) facing the wafer (300).

7. The wafer carrier disk of the cleaning machine according to claim 1, characterized in that, The inner slide plate (200) is provided with a liquid equalization chamber (230); the liquid inlet end of the liquid spraying hole (210) is connected to the liquid equalization chamber (230).

8. The wafer carrier disk of the cleaning machine according to claim 7, characterized in that, The inner wafer disk (200) is provided with a jet hole (240), which is configured to jet gas onto the wafer (300); The inner slide plate (200) is provided with an isolation member. The liquid equalization chamber (230) and the isolation member are both arranged around the jet hole (240), and the isolation member is located inside the liquid equalization chamber (230).

9. The wafer carrier disk of the cleaning machine according to claim 8, characterized in that, The jet hole (240) includes a first air hole (241) and a second air hole (242); The first vent (241) is located in the central region of the inner substrate disk (200); There are multiple second air holes (242), which are arranged around the periphery of the first air hole (241).

10. The wafer carrier disk of the cleaning machine according to claim 9, characterized in that, The second vent (242) is inclined, and the outlet end of the second vent (242) is closer to the edge of the wafer (300) than its inlet end.

11. The wafer carrier disk of the cleaning machine according to claim 9, characterized in that, The jet hole (240) also includes a third air hole (243), and there are multiple third air holes (243), which are arranged around the periphery of the second air hole (242); The third vent (243) is inclined, and the outlet end of the third vent (243) is closer to the edge of the wafer (300) than its inlet end, and the inclination angle of the third vent (243) is greater than the inclination angle of the second vent (242).

12. The wafer carrier disk of the cleaning machine according to any one of claims 1-11, characterized in that, The outer substrate disk (100) is provided with a push pin (130), which is configured to carry the wafer (300); The pin (130) includes a columnar body (131) and a needle body (132). The bottom end of the needle body (132) is connected to the columnar body (131), and the top end of the needle body (132) protrudes to form a supporting curved surface.

13. The wafer carrier disk of the cleaning machine according to claim 12, characterized in that, The distance between the pin body (132) of the ejector pin (130) and the outer peripheral wall of the wafer (300) is 2mm to 5mm; and / or, the ejector pin (130) is an integrally formed structure.

14. A cleaning machine, characterized in that, It includes a driving mechanism, a liquid passage, and a wafer carrier disk as described in any one of claims 1-13. The driving mechanism is drivingly connected to the outer wafer carrier disk (100) and the inner wafer carrier disk (200), respectively, and the liquid passage is connected to the liquid spray hole (210).

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