Silicon wafer basket carrying mechanism

Abstract

The utility model discloses a silicon wafer basket carrying mechanism which comprises an outer frame provided with a feeding station and a processing station, and a processing mechanism is arranged at the processing station and used for washing and drying silicon wafers; the first grabbing mechanism comprises a first grabbing unit and a second grabbing unit which are arranged on the outer frame, the first grabbing unit can grab a carrier containing a silicon wafer in the first direction and place the carrier in the machining mechanism in the second direction, and after the silicon wafer in the carrier is machined by the machining mechanism, the silicon wafer in the carrier can be grabbed by the second grabbing unit. The carrier is grabbed by the first grabbing unit to the side, close to the second grabbing unit, in the machining mechanism, so that a hanging tool of the carrier can be grabbed and carried to a feeding station by the second grabbing unit in the first direction; the silicon wafer cleaning and degumming device can solve the problem that the traditional silicon wafer cleaning and degumming equipment is low in automation degree, so that the silicon wafer production efficiency is low.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of silicon wafer production, and particularly relates to a silicon wafer basket carrying mechanism. BACKGROUND

[0002] When a silicon rod is cut into a silicon wafer, the silicon rod needs to be adhered to a wafer boat, and the wafer boat can assist in positioning the silicon rod for cutting. However, when the silicon rod is cut into a silicon wafer, the silicon wafer will still be adhered to the wafer boat, and in addition, small particulate matter generated by cutting will adhere to the surface of the silicon wafer. Therefore, the silicon wafer needs to be cleaned and degummed. Conventional silicon wafer cleaning and degumming equipment has a low degree of automation, which results in low silicon wafer production efficiency. SUMMARY

[0003] To overcome the above-mentioned shortcomings, the utility model discloses a silicon wafer basket carrying mechanism.

[0004] To achieve the above-mentioned purposes, the utility model adopts the following technical scheme:

[0005] The outer frame has a feeding station and a processing station, and the processing station is provided with a processing mechanism for washing and drying the silicon wafer.

[0006] The first grabbing mechanism includes a first grabbing unit and a second grabbing unit arranged on the outer frame. The first grabbing unit can grab a carrier containing the silicon wafer in a first direction and place the carrier in the processing mechanism in a second direction. After the silicon wafer in the carrier is processed by the processing mechanism, the carrier is grabbed by the first grabbing unit to the side close to the second grabbing unit in the processing mechanism, so that the hanger of the carrier can be grabbed by the second grabbing unit and carried to the feeding station in the first direction.

[0007] In the preferred technical scheme of the above-mentioned silicon wafer basket carrying mechanism, the first grabbing unit at least includes a three-axis linear module that can walk on the outer frame and a first clamping structure driven by the three-axis linear module, and the first clamping structure is used to clamp the carrier.

[0008] In the preferred technical scheme of the above-mentioned silicon wafer basket carrying mechanism, the first clamping structure further includes a pressing unit that can press the hanger on the carrier in the vertical direction.

[0009] In the preferred technical scheme of the above-mentioned silicon wafer basket carrying mechanism, the second grabbing unit at least includes a two-axis linear module that can walk on the outer frame in the first direction and a second clamping structure driven by the two-axis linear module, and the second clamping structure is used to clamp the hanger placed on the carrier.

[0010] In the preferred technical scheme of the silicon wafer basket carrying mechanism, the processing mechanism comprises at least a base and a rinsing groove, a degumming groove and a water washing groove arranged on the base along a second direction, the water washing groove is located close to the second grabbing unit, the rinsing groove is provided with a rinsing assembly for spraying and washing the silicon wafer, and the degumming groove is provided with a drying assembly for heating the carrier and the hanger.

[0011] In the preferred technical scheme of the silicon wafer basket carrying mechanism, the degumming groove is provided with a base for placing the carrier, and the base is liftable in the degumming groove by means of a lifting device.

[0012] In the preferred technical scheme of the silicon wafer basket carrying mechanism, the degumming groove is provided with an openable top cover.

[0013] In the preferred technical scheme of the silicon wafer basket carrying mechanism, the bottom of the rinsing groove, the degumming groove and the water washing groove is provided with a concave deposition part.

[0014] In the preferred technical scheme of the silicon wafer basket carrying mechanism, the feeding station has at least one feeding position and a discharging position, and the discharging position is located close to the second grabbing unit.

[0015] The first grabbing unit grabs the carrier and places it in the rinsing groove, when the carrier and the silicon wafer are cleaned, the first grabbing unit carries the carrier to the degumming groove, the drying assembly can degum the silicon wafer and the hanger to separate them, the first grabbing unit carries the carrier in the degumming groove to the water washing groove, the water flow in the water washing groove is used for cleaning the silicon wafer, after cleaning, the second grabbing unit is used for grabbing the hanger and placing it in the discharging position, and the first grabbing unit is used for grabbing and carrying the carrier and the silicon wafer to the next station, so that the silicon wafer basket carrying mechanism has the characteristics of simple structure, high mechanization degree and convenient operation, and has practicality. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a front view of the utility model;

[0017] Figure 2 It is a top view of the utility model;

[0018] Figure 3 It is a structure schematic view of the first grabbing unit;

[0019] Figure 4 It is a schematic view of the first grabbing unit grabbing the carrier;

[0020] Figure 5 It is a schematic view of the processing mechanism;

[0021] Figure 6 It is a structure schematic view of the rinsing groove;

[0022] Figure 7 This is a schematic diagram of the water washing tank.

[0023] In the diagram: outer frame 1, processing mechanism 2, rinsing tank 21, rinsing assembly 211, degumming tank 22, drying assembly 221, base 222, water washing tank 23, first gripping mechanism 3, first gripping unit 31, three-axis linear module 311, first clamping structure 312, pressing unit 313, second gripping unit 32, two-axis linear module 321, second clamping structure 322, carrier 4, hanger 41, loading position 51, unloading position 52. Detailed Implementation

[0024] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0025] It should be noted that in the description of this utility model, terms such as "upper," "lower," "left," "right," "front," and "rear," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] like Figures 1 to 7 As shown, the silicon wafer basket handling mechanism of this utility model includes: an outer frame 1, which has a feeding station and a processing station, and a processing mechanism 2 is arranged at the processing station. The processing mechanism 2 is used to wash and dry the silicon wafers; a first gripping mechanism 3, which includes a first gripping unit 31 and a second gripping unit 32 arranged on the outer frame 1. The first gripping unit 31 can grip the carrier 4 containing the silicon wafers in a first direction and place the carrier 4 in the processing mechanism 2 in a second direction. After the silicon wafers in the carrier 4 are processed by the processing mechanism 2, the carrier 4 is gripped by the first gripping unit 31 and placed in the processing mechanism 2 near the second gripping unit 32, so that the hanging fixture 41 of the carrier 4 can be gripped and transported to the feeding station by the second gripping unit 32 in the first direction.

[0028] Referring to Figure 4 , the top of the carrier 4 is configured with a detachable hanger 41, which is used to adhere to the silicon rod, it should be noted that the silicon rod has been cut into a plurality of silicon wafers, but due to the adhesion of the hanger 41, the columnar shape of the silicon rod is still maintained.

[0029] Referring to Figure 2 , the outer frame 1 is configured with a feeding station and a processing station, the feeding station is used to place the carrier 4, and the processing mechanism 2 configured at the processing station is used to flush, degum, and wash the silicon wafer adhered to the hanger 41.

[0030] Referring to Figures 1 to 4 , the first grabbing mechanism 3 includes a first grabbing unit 31 and a second grabbing unit 32 configured on the outer frame 1, the first grabbing unit 31 can carry the carrier 4 at the feeding station into the processing mechanism 2, when the processing mechanism 2 flushes and degums the silicon wafer in the carrier 4, the first grabbing unit 31 can grab the carrier 4 in the processing mechanism 2 to the side close to the second grabbing unit 32 along the second direction, at this time, the hanger 41 is grabbed and carried to the feeding station by the second grabbing unit 32, and then the carrier 4 and the silicon wafer in the carrier 4 are grabbed and carried to the next station by the first grabbing unit 31, which has the characteristics of simple structure, high automation degree and high carrying efficiency.

[0031] In one or more embodiments, the first grabbing unit 31 at least includes a three-axis linear module 311 that can walk on the outer frame 1 and a first clamping structure 312 driven by the three-axis linear module 311, the first clamping structure 312 is used to clamp the carrier 4; the first clamping structure 312 further includes a pressing unit 313, which can press the hanger 41 on the carrier 4 along the vertical direction.

[0032] Referring to Figure 3 , Figure 4 , the three-axis linear module 311 can drive the first clamping structure 312 to move along the XYZ axis, the first clamping structure 312 at least includes a base plate connected with the driving end of the three-axis linear module 311, a clamping jaw cylinder configured on the base plate, and a clamping plate driven by the clamping jaw cylinder, wherein the clamping jaw cylinder has two and is respectively located at both ends of the length direction of the base plate; the pressing unit 313 is configured on the base plate, and the pressing unit 313 can be a driving cylinder and a pressing plate pushed by the driven cylinder, and the pressing plate is located at the lower position of the base plate.

[0033] Specifically, when the carrier 4 loaded with the silicon wafers at the feeding station is carried, first, the three-axis linear module 311 is moved to the top of the feeding station, and then the first clamping structure 312 is controlled to move downward to grab the carrier 4 placed on the trolley at the feeding station. After that, the three-axis linear module 311 moves the clamped carrier 4 along the first direction towards the processing mechanism 2, and the three-axis linear module 311 can place the carrier 4 into the processing mechanism 2. The processing mechanism 2 can sequentially perform the rinsing, degumming and cleaning operations on the silicon wafers in the carrier 4. After the rinsing is completed, the hanger 41 on the carrier 4 is grabbed by the second grabbing unit 32 and carried to the feeding station.

[0034] In one or more embodiments, the second grabbing unit 32 at least includes a two-axis linear module 321 walking on the outer frame 1 along the first direction and a second clamping structure 322 driven by the two-axis linear module 321, and the second clamping structure 322 is used to clamp the hanger 41 placed on the carrier 4.

[0035] Referring to Figure 1 , Figure 2 The two-axis linear module 321 can move along the XZ axis direction to grab the hanger 41 on the carrier 4 in the processing mechanism 2 and place the grabbed hanger 41 on the feeding station. The second clamping structure 322 can be a clamping jaw cylinder arranged at the driving end of the two-axis linear module 321 and a clamping plate driven by the clamping jaw cylinder.

[0036] In one or more embodiments, the processing mechanism 2 at least includes a base 222 and a rinsing tank 21, a degumming tank 22 and a water washing tank 23 arranged on the base 222 along the second direction, the water washing tank 23 is located close to the second grabbing unit 32 side, the rinsing tank 21 is arranged with a rinsing assembly 211 for spraying the silicon wafers, and the degumming tank 22 is arranged with a drying assembly 221 for heating the carrier 4 and the hanger 41; the degumming tank 22 is arranged with a base 222 for placing the carrier 4, the base 222 is liftable in the degumming tank 22 by means of a lifting device to facilitate the first grabbing unit 31 to grab the carrier 4; the degumming tank 22 is arranged with an openable top cover; the rinsing tank 21, the degumming tank 22 and the water washing tank 23 are all provided with a recessed deposition portion at the bottom.

[0037] Referring to Figures 1 to 7The rinsing assembly 211 arranged in the rinsing tank 21 at least comprises a spray pipe connected with an external water inlet device, the drying assembly 221 arranged in the degumming tank 22 at least comprises a heating pipe or a heating wire, and the washing tank 23 at least comprises a water inlet pipe for supplying water into the washing tank 23. The bottom of the rinsing tank 21, the degumming tank 22 and the washing tank 23 is provided with a sediment part, which can be in a "V" shape or a U shape. Through the arrangement, the impurities in the rinsing tank 21, the degumming tank 22 and the washing tank 23 can be deposited on the bottom of the respective tank, so that the impurities can be cleaned conveniently. The cover plate arranged on the top of the degumming tank 22 can seal the top of the degumming tank 22, so as to ensure that the drying assembly 221 can degum the silicon wafer from the hanger 41 and improve the degumming efficiency of the silicon wafer.

[0038] Specifically, when the silicon wafer is processed, the first grabbing unit 31 is used to grab and transport the carrier 4 at the feeding station into the rinsing tank 21. After the rinsing assembly 211 in the rinsing tank 21 finishes rinsing the silicon wafer on the carrier 4, the first grabbing unit 31 is used to grab and transport the carrier 4 into the degumming tank 22. The drying assembly 221 heats the gum solution on the hanger 41, so that the silicon wafer is separated from the hanger 41. Then, the first grabbing unit 31 is used to transport the carrier 4 into the washing tank 23, and the water flow in the washing tank 23 is used to rinse the silicon wafer again. Finally, the second grabbing unit 32 is used to grab and transport the hanger 41 to the feeding station to realize the discharging of the hanger 41. The first grabbing unit 31 is used to transport the carrier 4 and the silicon wafer to the next station. The device has the characteristics of simple structure and convenient operation, and has practicality.

[0039] In one or more embodiments, the feeding station has at least one feeding position 51 and a discharging position 52. The discharging position 52 is located close to the second grabbing unit 32. Figure 2 By dividing the feeding station into the feeding position 51 and the discharging position 52, the feeding and discharging can be realized smoothly. When feeding, the carrier 4 is pushed to the feeding position 51 by the trolley. When discharging, the second grabbing unit 32 grabs and transports the hanger 41 to the trolley.

[0040] The above embodiments are only used to illustrate the technical concept and characteristics of the device, and the purpose is to enable the person skilled in the art to understand the content of the device and implement it. The protection scope of the device cannot be limited by this. Any equivalent changes or modifications made according to the spirit and essence of the device should be covered in the protection scope of the device.

Claims

1. A silicon wafer basket handling mechanism, characterized in that, The utility model relates to a silicon wafer processing device, including: An outer frame has a feeding station and a processing station, the processing station is provided with a processing mechanism for washing and drying silicon wafers. A first grabbing mechanism includes a first grabbing unit and a second grabbing unit arranged on the outer frame, the first grabbing unit can grab a carrier containing silicon wafers in a first direction and place the carrier in the processing mechanism in a second direction, after the silicon wafers in the carrier are processed by the processing mechanism, the carrier is grabbed by the first grabbing unit to the side close to the second grabbing unit in the processing mechanism, so that the hanger of the carrier can be grabbed by the second grabbing unit in a first direction and transported to the feeding station.

2. The silicon wafer basket handling mechanism of claim 1, wherein: The first grabbing unit includes at least a three-axis linear module that can walk on the outer frame and a first clamping structure driven by the three-axis linear module, the first clamping structure is used to clamp the carrier.

3. The silicon wafer basket handling mechanism of claim 2, wherein: The first clamping structure further includes a pressing unit that can press the hanger on the carrier in the vertical direction.

4. The silicon wafer basket handling mechanism of claim 1, wherein: The second grabbing unit includes at least a two-axis linear module that can walk on the outer frame in a first direction and a second clamping structure driven by the two-axis linear module, the second clamping structure is used to clamp the hanger placed on the carrier.

5. The silicon wafer basket handling mechanism of claim 1, wherein: The processing mechanism includes at least a base and a washing tank, a degumming tank and a water washing tank arranged on the base in a second direction, the water washing tank is located on the side close to the second grabbing unit, the washing tank is provided with a washing assembly for spraying the silicon wafers, and the degumming tank is provided with a drying assembly for heating the carrier and the hanger.

6. The silicon wafer basket handling mechanism of claim 5, wherein: The degumming tank is provided with a base for placing the carrier, and the base can be lifted in the degumming tank by means of a lifting device.

7. The silicon wafer basket handling mechanism of claim 5 or 6, wherein: The top of the degumming tank is provided with an openable top cover.

8. The silicon wafer basket handling mechanism of claim 5, wherein: The bottom of the washing tank, the degumming tank and the water washing tank has a concave deposition part.

9. The silicon wafer basket handling mechanism of claim 1, wherein: The feeding station has at least one feeding position and a discharging position, the discharging position is located on the side close to the second grabbing unit.

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