Anti-blocking BSG blanking turnover disc

Abstract

The utility model relates to the technical field of silicon wafer processing, and discloses an anti-blocking BSG blanking turnover disc which comprises a turnover wheel main body, and a first silicon wafer clamping block is fixedly arranged on one side of the outer surface of the turnover wheel main body. According to the anti-blocking BSG discharging turnover disc, by arranging twelve groups of silicon wafer clamping blocks, the number of traditional turnover wheels is increased from twelve silicon wafer inserting grooves to eighteen silicon wafer inserting grooves, and the traditional turnover wheels are adjusted to be turned over by 20 degrees each time from being turned over by 30 degrees each time, so that the turnover action range of the turnover wheels is reduced, more silicon wafers can be temporarily stored, and the turnover efficiency is improved. The design of two groups of PEEK friction blocks is matched, two supporting points are added for placement of silicon wafers, the contact area of the silicon wafers is increased, so that the silicon wafers are placed more stably, the problem that the silicon wafers shake when a traditional turnover disc is turned over is solved through the combined action of the two groups of PEEK friction blocks, and the production efficiency is improved. The situation that fragments are blocked due to shaking of the silicon wafers can be avoided, and the practicability and economic benefits of the overturning disc are improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, specifically to an anti-jamming BSG feeding and turning plate. Background Technology

[0002] During the processing of silicon wafers, it is necessary to remove the dead layer of BSG (borosilicate glass) that forms on the front, back and edges of the silicon wafers.

[0003] In existing technologies, BSG feeding uses a flipping wheel to flip the silicon wafer. The original flipping wheel has problems such as large vibration of the silicon wafer during flipping, which causes the silicon wafer to tilt and get stuck, resulting in fragments and a small number of wafers inserted, which is not conducive to increasing production.

[0004] Currently, equipment manufacturers have made multiple adjustments and optimizations to address the issue of silicon wafer jitter during flipping, but this problem has not been effectively solved. The problem of jitter causing debris to get stuck and preventing further production increases still exists.

[0005] In response to this background, we provide an anti-jamming BSG feeding tilting disc. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] The purpose of this invention is to provide an anti-jamming BSG feeding and turning disc to solve the problem of jamming and fragmentation caused by silicon wafer vibration during the turning process of existing turning wheels mentioned in the background art.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, this utility model provides the following technical solution: an anti-jamming BSG feeding and turning disc, comprising a turning wheel body, wherein a No. 1 silicon wafer clamping block is fixedly arranged on one side of the outer surface of the turning wheel body, and twelve sets of the No. 1 silicon wafer clamping blocks are evenly distributed.

[0010] A silicon wafer slot is fixedly provided between two adjacent sets of silicon wafer clamping blocks. Stabilizing mechanisms are provided on both sides of the main body of the rotating wheel, and a supporting mechanism is provided on the outer side of the main body of the rotating wheel.

[0011] Preferably, the stabilizing mechanism includes a first PEEK friction block, which is fixedly disposed on one side of the main body of the rotating wheel.

[0012] Preferably, a second PEEK friction block is fixedly installed on the side of the rotating wheel body away from the first PEEK friction block.

[0013] Preferably, the support mechanism includes a tilting wheel cavity, which is fixedly disposed on the inner side of the tilting wheel body.

[0014] Preferably, a second silicon wafer clamping block is fixedly disposed on the side of the outer surface of the rotating wheel body away from the first silicon wafer clamping block.

[0015] Preferably, the twelve sets of No. 2 silicon wafer clamping blocks are evenly distributed, and the No. 2 silicon wafer clamping blocks correspond fully to the No. 1 silicon wafer clamping blocks.

[0016] Preferably, a second silicon wafer slot is fixedly provided between two sets of adjacent second silicon wafer clamping blocks, and the second silicon wafer slot fully corresponds to the first silicon wafer slot.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] This anti-jamming BSG unloading and reversing tray, by setting up twelve sets of silicon wafer clamping blocks, increases the number of silicon wafer slots from twelve to eighteen in the traditional reversing wheel. The rotation angle is adjusted from 30° per rotation to 20° per rotation, reducing the rotation amplitude of the wheel and allowing for the temporary storage of more silicon wafers, thus increasing production capacity. Combined with the design of two sets of PEEK friction blocks, two additional support points are added for silicon wafer placement, increasing the contact area and making the placement of silicon wafers more stable. Together, these features solve the problem of silicon wafer vibration during rotation in traditional reversing trays, preventing jamming and fragmentation caused by silicon wafer vibration, and improving the practicality and economic efficiency of this reversing tray. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram of the main body of the tilting wheel of this utility model;

[0021] Figure 3 This is a schematic diagram of the three-dimensional structure of the No. 1 silicon wafer clamping block of this utility model;

[0022] Figure 4 This is an enlarged structural diagram showing a partial detail of the stabilizing mechanism of this utility model;

[0023] Figure 5 This is a magnified structural diagram showing a partial detail of the No. 1 PEEK friction block of this utility model.

[0024] In the diagram: 1. Rotation wheel body; 2. No. 1 silicon wafer clamping block; 3. No. 1 silicon wafer slot; 4. Stabilizing mechanism; 401. No. 1 PEEK friction block; 402. No. 2 PEEK friction block; 5. Supporting mechanism; 501. Rotation wheel inner cavity; 502. No. 2 silicon wafer clamping block; 503. No. 2 silicon wafer slot. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1 - Figure 5 This utility model provides a technical solution: an anti-jamming BSG feeding and turning disc, including a turning wheel body 1, a No. 1 silicon wafer clamping block 2 is fixedly arranged on one side of the outer surface of the turning wheel body 1, and twelve sets of No. 1 silicon wafer clamping blocks 2 are evenly distributed.

[0027] A No. 1 silicon wafer slot 3 is fixedly installed between two adjacent sets of No. 1 silicon wafer clamping blocks 2. A stabilizing mechanism 4 is installed on both sides of the rotating wheel body 1, and a supporting mechanism 5 is installed on the outer side of the rotating wheel body 1. When using the rotating wheel to position and support the processed silicon wafers, twelve sets of No. 1 silicon wafer clamping blocks 2 are set on the outer surface of the rotating wheel body 1, and the twelve sets of silicon wafer clamping blocks are evenly distributed. A No. 1 silicon wafer slot 3 is formed between two adjacent sets of No. 1 silicon wafer clamping blocks 2. The operator inserts eighteen sets of processed silicon wafers into the No. 1 silicon wafer slot 3, so that the silicon wafers are clamped in the middle of two sets of adjacent No. 1 silicon wafer clamping blocks 2. Driven by the power equipment (not shown in the figure), the rotating wheel body 1 is rotated 20° each time to adjust the position of the silicon wafers, which facilitates the removal of the dead layer of BSG (borosilicate glass) by-products on the front and back sides and edges of the silicon wafers.

[0028] The stabilizing mechanism 4 includes a first PEEK friction block 401, which is fixedly mounted on one side of the rotating wheel body 1. A second PEEK friction block 402 is fixedly mounted on the side of the rotating wheel body 1 away from the first PEEK friction block 401. The supporting mechanism 5 includes a rotating wheel cavity 501, which is fixedly mounted inside the rotating wheel body 1. A second silicon wafer clamp 502 is fixedly mounted on the outer surface of the rotating wheel body 1 away from the first silicon wafer clamp 2. Twelve sets of second silicon wafer clamps 502 are evenly distributed, and the second silicon wafer clamps 502 correspond fully to the first silicon wafer clamps 2. A second silicon wafer slot 503 is fixedly mounted between two adjacent sets of second silicon wafer clamps 502, and the second silicon wafer slot 503 corresponds fully to the first silicon wafer slot 3. The silicon wafers are processed using the rotating wheel. When the wafers are positioned and supported, twelve sets of No. 2 silicon wafer clamping blocks 502 are set on the outer surface of the main body 1 of the rotating wheel. The twelve sets of silicon wafer clamping blocks are evenly distributed. The twelve sets of No. 1 silicon wafer clamping blocks 2 and the twelve sets of No. 2 silicon wafer clamping blocks 502 correspond fully. The No. 1 silicon wafer slot 3 between two adjacent sets of No. 1 silicon wafer clamping blocks 2 corresponds fully to the No. 2 silicon wafer slot 503 between two adjacent sets of No. 2 silicon wafer clamping blocks 502. The workers insert the eighteen sets of processed silicon wafers into the No. 1 silicon wafer slot 3 and the No. 2 silicon wafer slot 503, so that the silicon wafers are clamped in the middle of the two sets of connected No. 1 silicon wafer clamping blocks 2 and No. 2 silicon wafer clamping blocks 502. At the same time, the side of the silicon wafer close to the main body 1 of the rotating wheel makes full contact with the No. 1 PEEK friction block 401 and the No. 2 PEEK friction block 402, which increases the contact area when the silicon wafers are clamped, thereby reducing the vibration amplitude during the rotation of the silicon wafers.

[0029] Working principle: When using the flipping disc to position and support the processed silicon wafers, twelve sets of No. 1 silicon wafer clamping blocks 2 and twelve sets of No. 2 silicon wafer clamping blocks 502 are set on both sides of the outer surface of the flipping disc body 1. The twelve sets of silicon wafer clamping blocks are evenly distributed, and the twelve sets of No. 1 silicon wafer clamping blocks 2 and the twelve sets of No. 2 silicon wafer clamping blocks 502 correspond fully. The No. 1 silicon wafer slot 3 between two adjacent sets of No. 1 silicon wafer clamping blocks 2 corresponds fully to the No. 2 silicon wafer slot 503 between two adjacent sets of No. 2 silicon wafer clamping blocks 502. The operator inserts eighteen sets of processed silicon wafers into the No. 1 silicon wafer slot 3 and the No. 2 silicon wafer slot. Within 503, the silicon wafer is clamped in the middle of two adjacent sets of silicon wafer clamping blocks 2 and 502. At the same time, the side of the silicon wafer close to the rotating wheel body 1 is in full contact with the first PEEK friction block 401 and the second PEEK friction block 402, which increases the contact area when the silicon wafer is clamped and reduces the vibration amplitude during the rotation of the silicon wafer. Driven by the power equipment (not shown in the figure), the rotating wheel body 1 is rotated 20° each time to adjust the position of the silicon wafer, which facilitates the removal of the dead layer of BSG (borosilicate glass) by-products on the front and back sides and edges of the silicon wafer.

[0030] Finally, it should be noted that the above content is only used to illustrate the technical solution of this utility model, and is not intended to limit the scope of protection of this utility model. Simple modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model do not depart from the essence and scope of the technical solution of this utility model.

Claims

1. A BSG feeding tilting disc for preventing jamming, comprising a tilting wheel body (1), characterized in that: A first silicon wafer clamping block (2) is fixedly installed on one side of the outer surface of the main body (1) of the flipping wheel, and the twelve sets of the first silicon wafer clamping blocks (2) are evenly distributed. A first silicon wafer slot (3) is fixedly arranged between two adjacent sets of the first silicon wafer clamping blocks (2), and a stabilizing mechanism (4) is provided on both sides of the flipping wheel body (1), and a support mechanism (5) is provided on the outside of the flipping wheel body (1).

2. The anti-jamming BSG feeding tilting disc according to claim 1, characterized in that: The stabilizing mechanism (4) includes a first PEEK friction block (401), which is fixedly installed on one side of the rotating wheel body (1).

3. The anti-jamming BSG feeding tilting disc according to claim 2, characterized in that: The second PEEK friction block (402) is fixedly installed on the side of the main body (1) away from the first PEEK friction block (401).

4. The anti-jamming BSG feeding tilting disc according to claim 3, characterized in that: The support mechanism (5) includes a rotating wheel cavity (501), which is fixedly disposed on the inner side of the rotating wheel body (1).

5. The anti-jamming BSG feeding tilting disc according to claim 4, characterized in that: A second silicon wafer clamp (502) is fixedly installed on the outer surface of the main body (1) of the rotating wheel away from the first silicon wafer clamp (2).

6. The anti-jamming BSG feeding tilting disc according to claim 5, characterized in that: The twelve sets of No. 2 silicon wafer clamping blocks (502) are evenly distributed, and the No. 2 silicon wafer clamping blocks (502) correspond fully to the No. 1 silicon wafer clamping block (2).

7. The anti-jamming BSG feeding tilting disc according to claim 6, characterized in that: A second silicon wafer slot (503) is fixedly provided between two adjacent sets of second silicon wafer clamping blocks (502), and the second silicon wafer slot (503) corresponds fully to the first silicon wafer slot (3).

Images