Package structure
By designing a special structure for the heat sink, the problem of sputtering of the heat-conducting layer during high-temperature processes was solved, thereby improving the performance and heat dissipation of the packaging structure.
Patent Information
- Application Number
- CN202423206697.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-12-24
AI Technical Summary
In existing semiconductor packaging structures, the thermal conductive layer is prone to melting and sputtering during high-temperature processes, which can damage the substrate and components, affecting the performance and heat dissipation of the packaging structure.
Design a heat dissipation cover, including an annular fixing part, a first top cover and a second top cover. The first top cover is higher than the second top cover and forms a receiving cavity to accommodate the heat-conducting layer. The connecting part increases the heat dissipation area, and a groove is provided on the second top cover to increase the heat dissipation area.
It effectively blocks the thermal conductive layer from sputtering during high-temperature processes, reduces the probability of damage to the substrate and components, and improves the performance and heat dissipation of the packaging structure.
Smart Images
Figure CN223786515U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a heat sink and packaging structure. Background Technology
[0002] With technological advancements, the computing speed of chips within semiconductor packaging structures has significantly improved. However, this rapid processing also leads to increased heat generation during operation. This increased heat can reduce chip efficiency or even damage the chip, thus affecting the performance of the semiconductor packaging structure.
[0003] To address the heat dissipation problem in semiconductor packaging structures, mounting heat sinks has become an effective solution. Heat sinks primarily increase heat dissipation efficiency by increasing the surface area, thereby protecting the chip from overheating.
[0004] However, although mounting heat sinks alleviates the heat dissipation problem to some extent, the performance of semiconductor packaging structures still faces challenges. Utility Model Content
[0005] The problem solved by this utility model embodiment is to provide a heat dissipation cover and packaging structure, which is beneficial to improving the performance and heat dissipation of the packaging structure.
[0006] To address the aforementioned problems, this utility model provides a heat dissipation cover, comprising: a cover body, the cover body including an annular fixing part and a top cover located on top of the annular fixing part, the top cover including a first top cover, a second top cover, and a connecting part connecting the first top cover and the second top cover, the distance from the first top cover to the bottom surface of the annular fixing part being greater than the distance from the second top cover to the bottom surface of the annular fixing part, and the first top cover and the connecting part forming a receiving cavity.
[0007] Optionally, the cover is a metal cover.
[0008] Optionally, the second top cover surrounds the first top cover and is connected to the annular fixing portion.
[0009] Optionally, the heat dissipation cover further includes a heat sink located on the second top cover, the heat sink having a groove.
[0010] Optionally, the number of grooves is multiple, and the multiple grooves are arranged sequentially at intervals along the direction from the center of the top cover to the edge, or the multiple grooves are distributed at intervals along the contour of the connecting part.
[0011] Optionally, the material of the heat sink includes one or more of copper, aluminum, gold, nickel, steel, stainless steel, graphite, graphene, and carbon nanotubes.
[0012] Optionally, the heat sink further includes a thermal interface layer located between the heat sink and the second top cover.
[0013] Optionally, the angle between the first top cover and the connecting portion is greater than or equal to 60 degrees and less than or equal to 90 degrees.
[0014] Optionally, the cover is a one-piece structure.
[0015] Accordingly, this utility model embodiment also provides a packaging structure, including: a substrate; a heat dissipation cover as described in any embodiment of this utility model, wherein the annular fixing portion of the heat dissipation cover is fixed to the substrate, and the heat dissipation cover and the substrate form a cavity; a first chip, located in the cavity, the first chip being located on the substrate directly below the first top cover and electrically connected to the substrate; and a thermally conductive layer, located within the receiving cavity, the thermally conductive layer being located between the top of the first chip and the first top cover.
[0016] Optionally, the bottom surface of the connection portion is lower than the surface of the first chip facing away from the substrate.
[0017] Optionally, there is a gap between the sidewall of the heat-conducting layer and the sidewall of the connecting part, and the width of the minimum gap is less than or equal to 5 mm.
[0018] Optionally, the thermally conductive layer may include one or more layers of an indium layer, an indium-silver alloy layer, a silver layer, a tin layer, a tin-silver alloy layer, or a tin-lead alloy layer.
[0019] Optionally, the packaging structure further includes: components located in the cavity, the components being located on a substrate directly below the second top cover and electrically connected to the substrate.
[0020] Optionally, the components include one or both of passive components and a second chip.
[0021] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:
[0022] This utility model provides a heat dissipation cover, comprising: a cover body, the cover body including an annular fixing part and a top cover located on top of the annular fixing part, the top cover including a first top cover, a second top cover, and a connecting part connecting the first top cover and the second top cover, the distance from the first top cover to the bottom surface of the annular fixing part being greater than the distance from the second top cover to the bottom surface of the annular fixing part, the first top cover and the connecting part forming a receiving cavity; by making the first top cover higher than the second top cover, the first top cover and the connecting part can form a receiving cavity, so that when the heat dissipation cover is used for packaging, the receiving cavity can accommodate the thermally conductive layer on the top of the first chip, thereby enabling the connecting part to effectively prevent the material of the thermally conductive layer from sputtering towards the substrate due to melting in subsequent high-temperature processes, thereby reducing the probability of damage to the substrate or other components on the substrate, and thus improving the performance of the packaging structure; in addition, the cover body also includes a connecting part connecting the first top cover and the second top cover, the connecting part increases the heat dissipation area of the cover body, thereby further improving the heat dissipation capacity of the heat dissipation cover, and correspondingly improving the heat dissipation performance of the packaging structure.
[0023] Optionally, the heat dissipation cover also includes a heat sink located on the second top cover, the heat sink having a groove; on the one hand, the heat sink being located on the second top cover helps to ensure the uniformity of the surface height of the entire packaging structure and is also beneficial for packaging and transportation; on the other hand, the groove in the heat sink effectively increases the heat dissipation area of the heat sink, thereby improving the heat dissipation effect.
[0024] This utility model embodiment also provides a packaging structure in which the annular fixing part of the heat sink is fixed to the substrate, the heat sink and the substrate form a cavity, the first chip is located in the cavity, and the first chip is located on the substrate directly below the first top cover, and the thermally conductive layer is located in the receiving cavity and between the top of the first chip and the first top cover; since the thermally conductive layer is located in the receiving cavity, the connecting part of the heat sink can effectively prevent the material of the thermally conductive layer from sputtering towards the substrate due to melting in the subsequent high-temperature process, thereby reducing the probability of damage to the substrate or other components on the substrate, and thus improving the performance of the packaging structure. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of a packaging structure;
[0026] Figure 2 This is a schematic diagram of the structure of one embodiment of the heat dissipation cover of this utility model;
[0027] Figure 3 This is a schematic diagram of one embodiment of the packaging structure of this utility model;
[0028] Figure 4 yes Figure 3 A magnified view of a portion at point A. Detailed Implementation
[0029] Currently, the performance and heat dissipation of packaging structures still need improvement. This paper analyzes the reasons why the performance and heat dissipation of a packaging structure need further improvement, using a schematic diagram of such a structure as an example. Figure 1 This is a schematic diagram of a packaging structure.
[0030] refer to Figure 1 The packaging structure includes: a substrate 10; a heat dissipation cover 11, the heat dissipation cover 11 including a top cover plate 12 and a side plate 13 connected to the top cover plate 12, the side plate 13 being located between the top cover plate 12 and the substrate 10 and located on the periphery of the top cover plate 12, the heat dissipation cover 11 and the substrate 10 forming a cavity 14; a chip 15 located in the cavity 14, the chip 15 being soldered to the substrate 10 and electrically connected to the substrate 10; a thermally conductive layer 16 located between the top of the chip 15 and the heat dissipation cover 11; a metal plating layer 18 located between the thermally conductive layer 16 and the chip 15; and a component 17 located in the cavity 14, the component 17 being soldered to the side of the chip 15 on the substrate 10 and electrically connected to the substrate 10.
[0031] Research has revealed that in the packaging structure, the thermal conductive layer 16 is typically made of indium. However, during the reflow soldering process (e.g., during the soldering of the heat sink 11 to the substrate 10, the placement of solder balls on the back of the substrate 10, and the subsequent soldering of the solder balls located on the back of the substrate 10 to the printed circuit board), the process temperature is relatively high, while the melting point of the thermal conductive layer 16 is relatively low. This makes it easy for the thermal conductive layer 16 to melt and sputter to the sides. When there are components 17 on the side of the chip 15, the components 17 are easily damaged, thus affecting the performance of the packaging structure.
[0032] To solve the aforementioned technical problem, this utility model provides a heat dissipation cover, comprising: a cover body, the cover body including an annular fixing part and a top cover located on top of the annular fixing part, the top cover including a first top cover, a second top cover, and a connecting part connecting the first top cover and the second top cover, the distance from the first top cover to the bottom surface of the annular fixing part being greater than the distance from the second top cover to the bottom surface of the annular fixing part, and the first top cover and the connecting part forming a receiving cavity.
[0033] In the solution disclosed in this utility model embodiment, by making the first top cover higher than the second top cover, the first top cover and the connecting portion can form a receiving cavity. When the heat dissipation cover is used for packaging, the receiving cavity can accommodate the thermally conductive layer on the top of the first chip. This allows the connecting portion to effectively prevent the material of the thermally conductive layer from sputtering towards the substrate due to melting during subsequent high-temperature processes, thereby reducing the probability of damage to the substrate or other components on the substrate and improving the performance of the packaging structure. In addition, the cover also includes a connecting portion connecting the first top cover and the second top cover. Through the connecting portion, the heat dissipation area of the cover is increased, thereby further improving the heat dissipation capacity of the heat dissipation cover and correspondingly improving the heat dissipation performance of the packaging structure.
[0034] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0035] Figure 2 This is a schematic diagram of the structure of one embodiment of the heat dissipation cover of this utility model.
[0036] refer to Figure 2 The heat dissipation cover 301 includes: a cover body 100, the cover body 100 including an annular fixing part 101 and a top cover 102 located on top of the annular fixing part 101, the top cover 102 including a first top cover 103, a second top cover 104, and a connecting part 105 connecting the first top cover 103 and the second top cover 104, the distance from the first top cover 103 to the bottom surface of the annular fixing part 101 is greater than the distance from the second top cover 104 to the bottom surface of the annular fixing part 101, and the first top cover 103 and the connecting part 105 form a receiving cavity 106.
[0037] It should be noted that the distance from the first top cover 103 to the bottom surface of the annular fixing part 101 is greater than the distance from the second top cover 104 to the bottom surface of the annular fixing part 101, which means that the first top cover 103 is higher than the second top cover 104 relative to the bottom surface of the annular fixing part 101.
[0038] By making the first top cover 103 higher than the second top cover 104, the first top cover 103 and the connecting portion 105 can form a receiving cavity 106. When the heat sink 301 is used for packaging, the receiving cavity 106 can accommodate the thermally conductive layer on the top of the first chip. This allows the connecting portion 105 to effectively prevent the material of the thermally conductive layer from sputtering towards the substrate due to melting during subsequent high-temperature processes, thereby reducing the probability of damage to the substrate or other components on the substrate and improving the performance of the packaging structure. In addition, the cover 100 also includes a connecting portion 105 connecting the first top cover 103 and the second top cover 104. The connecting portion 105 increases the heat dissipation area of the cover 100, thereby further improving the heat dissipation capacity of the heat sink 301 and correspondingly improving the heat dissipation performance of the packaging structure.
[0039] The cover 100 is subsequently fixed to the substrate, on which the first chip is usually disposed. The cover 100 is used to dissipate heat from the first chip and the substrate, and also to protect the components on the substrate.
[0040] In this embodiment, the cover 100 is a metal cover.
[0041] It should be noted that the metal cover has a good thermal conductivity coefficient, which is conducive to the rapid conduction of heat away from the packaging structure, thereby effectively improving the heat dissipation efficiency of the packaging structure. In addition, the metal cover can be formed by various processing techniques (such as stamping process), which makes it easy to obtain the first top cover 103, the second top cover 104 and the connecting part 105.
[0042] In this embodiment, the cover 100 is an integral structure.
[0043] Specifically, the integrated structure of the cover 100 means that the annular fixing part 101, the first top cover 103, the second top cover 104, and the connecting part 105 are formed in the same step, which helps to simplify the process steps and reduce production costs.
[0044] It should be noted that the cover 100 is a one-piece structure, which helps to reduce seams or connection points, thereby reducing costs, while improving the mechanical strength and durability of the cover 100.
[0045] In other embodiments, depending on actual process requirements, the cover may not be a one-piece structure. For example, the first top cover, the second top cover, and the connecting part may be a one-piece structure and welded to the annular fixing part. Or, for example, the first top cover and the connecting part may be a one-piece structure and welded to the second top cover.
[0046] The annular fixing part 101 is used to support the cover 100, and the bottom surface of the annular fixing part 101 is subsequently fixed to the substrate.
[0047] The top cover 102 and the annular fixing part 101 are used to form a cavity 302, so that after the heat dissipation cover 301 is fixed on the substrate, the cavity 302 can accommodate the first chip and components on the substrate, that is, provide space for the first chip and components.
[0048] The first top cover 103 is used to contact the first chip and also to dissipate the heat generated by the first chip during operation.
[0049] The second top cover 104 is lower than the first top cover 103, which facilitates improving the thickness consistency between the second top cover 104 and the first top cover 103 during processing, thereby simplifying the manufacturing process of the heat sink 301. For example, the heat sink 301 can be obtained directly through a stamping process.
[0050] The connecting part 105 is used to support the first top cover 103 and also to connect the first top cover 103 and the second top cover 104.
[0051] In this embodiment, the included angle α between the first top cover 103 and the connecting portion 105 should not be too large or too small. If the included angle α between the first top cover 103 and the connecting portion 105 is too large, the connecting portion 105 may not effectively prevent the material of the heat-conducting layer from sputtering towards the substrate 300 due to melting during subsequent high-temperature processes when the heat sink 301 is used for packaging. If the included angle α between the first top cover 103 and the connecting portion 105 is too small, the process difficulty of placing the heat-conducting layer on top of the first chip into the receiving cavity may increase accordingly when the heat sink 301 is used for packaging. Therefore, in this embodiment, the included angle α between the first top cover 103 and the connecting portion 105 is greater than or equal to 60 degrees and less than or equal to 90 degrees.
[0052] In this embodiment, the second top cover 104 surrounds the first top cover 103 and is connected to the annular fixing part 101, which helps to improve the stability of the heat dissipation cover 301 and facilitates the layout of other components on the substrate.
[0053] It should be noted that the second top cover is not limited to surrounding the first top cover. In other embodiments, the second top cover and the first top cover may be arranged side by side, or the second top cover and the first top cover may be arranged alternately. Specifically, the position of the second top cover on the heat sink can be determined according to the position of the components on the substrate.
[0054] In this embodiment, the second top cover 104 is also used to provide space for welding the radiator.
[0055] Accordingly, the heat dissipation cover 301 also includes a heat sink 107 located on the second top cover 104, the heat sink 107 having a groove 108.
[0056] It should be noted that, on the one hand, the heat sink 107 is disposed on the second top cover 104, which helps to ensure the uniformity of the surface height of the entire packaging structure and is also beneficial for packaging and transportation. On the other hand, the heat sink 107 has a groove 108, which effectively increases the heat dissipation area of the heat sink 107, thereby improving the heat dissipation effect.
[0057] It should also be noted that since the heat sink 107 has a groove 108, not only the top surface of the heat sink 107 and the bottom area of the groove 108 can be used as heat dissipation surfaces, but the side wall of the groove 108 can also be used as heat dissipation surfaces, thereby increasing the heat dissipation area.
[0058] In this embodiment, there are multiple grooves 108, thereby further increasing the heat dissipation area of the radiator 107.
[0059] In this embodiment, the plurality of grooves 108 are arranged sequentially at intervals along the direction from the center of the top cover 102 to the edge, which is beneficial to improving the uniformity of heat dissipation and thus reducing the probability of local overheating; in addition, it is also beneficial to reduce the process difficulty of forming the grooves 108, thereby reducing the process difficulty of forming the heat sink 107.
[0060] Specifically, since the second top cover 104 surrounds the first top cover 103 and connects to the annular fixing part 101, the corresponding groove 108 is annular, and a plurality of annular grooves 108 are arranged at intervals and sequentially surround the first top cover 103 along the direction from the center of the top cover 102 to the edge.
[0061] In other embodiments, the plurality of grooves may also be spaced apart along the contour of the connection.
[0062] In this embodiment, the heat sink 107 is made of one or more of the following materials: copper, aluminum, gold, nickel, steel, stainless steel, graphite, graphene, and carbon nanotubes.
[0063] It should be noted that copper, aluminum, gold, nickel, steel, stainless steel, graphite, graphene, and carbon nanotubes have good thermal conductivity, which is conducive to the rapid conduction of heat away from the encapsulation structure, thereby effectively improving the heat dissipation efficiency of the encapsulation structure.
[0064] In this embodiment, the heat dissipation cover 301 further includes a thermal interface layer 109 located between the heat sink 107 and the second top cover 104.
[0065] The thermal interface layer 109 is used to fix the heat sink 107 onto the second top cover 104.
[0066] It should be noted that after subsequent packaging, the heat emitted by the first chip is transferred to the thermal interface layer 109 through the cover 100, and then transferred to the heat sink 107 through the thermal interface layer 109. The heat sink 107, which has a large heat dissipation area, dissipates the heat, thereby cooling the first chip and ensuring its normal operation.
[0067] It should also be noted that in other embodiments, the heat sink cover may not have a heat sink.
[0068] Accordingly, this utility model embodiment also provides a packaging structure. Figure 3 This is a schematic diagram of one embodiment of the packaging structure of this utility model. Figure 4 yes Figure 3 A magnified view of a portion at point A.
[0069] refer to Figure 3 Referring to Reference 2, the packaging structure includes: a substrate 300; a heat dissipation cover 301 as described in any embodiment of the present invention, wherein the annular fixing portion 101 of the heat dissipation cover 301 is fixed to the substrate 300, and the heat dissipation cover 301 and the substrate 300 form a cavity 302; a first chip 303 located in the cavity 302, the first chip 303 being located on the substrate 300 directly below the first top cover 103 and electrically connected to the substrate 300; and a thermally conductive layer 304 located within the receiving cavity 106, the thermally conductive layer 304 being located between the top of the first chip 303 and the first top cover 103.
[0070] The substrate 300 serves as a packaging carrier, providing support for the first chip 303 and providing an electrical connection path between the first chip 303 and external circuitry. The substrate 300 may include a package substrate, an interposer, or a printed circuit board (PCB). As an example, the substrate 300 is a package substrate.
[0071] The heat sink 301 is used to dissipate heat from the package structure and also to protect the first chip 303 located inside the cavity 302.
[0072] Specifically, the first chip 303 consumes a certain amount of power during operation, and thus generates corresponding heat. The heat sink 301 is used to conduct the heat generated by the first chip 303 during operation to the outside, so as to prevent the first chip 303 from being damaged due to the accumulation of heat during operation, and thus help to extend the working stability and life of the package structure.
[0073] In this embodiment, the packaging structure further includes: component 305, located in the cavity 302, the component 305 being located on the substrate 300 directly below the second top cover 104 and electrically connected to the substrate 300.
[0074] It should be noted that components are a general term for elements and devices. Components can be either passive components (i.e., passive parts) or active components.
[0075] It should also be noted that in other embodiments, depending on the actual situation, the cavity may not contain any components.
[0076] In this embodiment, the bottom surface of the annular fixing part 101 is welded to the substrate 300.
[0077] In other embodiments, the annular fixing part can be fixed to the substrate using other processes, for example, the annular fixing part can be fixed to the substrate using thermally conductive adhesive.
[0078] Cavity 302 is used to accommodate the first chip 303 and components 305.
[0079] The connecting part 105 is used to support the first top cover 103 and also to connect the first top cover 103 and the second top cover 104.
[0080] In this embodiment, the bottom surface 306 of the connecting portion 105 is lower than the surface 307 of the first chip 303 facing away from the substrate 300.
[0081] Specifically, the bottom surface 306 of the connecting portion 105 refers to the surface of the connecting portion 105 that is close to the substrate 300.
[0082] It should be noted that the bottom surface 306 of the connecting portion 105 is lower than the surface 307 of the first chip 303 facing away from the substrate 300. This means that the distance from the bottom surface 306 of the connecting portion 105 to the substrate 300 is less than the distance from the surface 307 of the first chip 303 facing away from the substrate 300 to the substrate 300. This is beneficial because the cavity 106 can completely enclose the heat-conducting layer 304, thereby enabling the connecting portion 105 of the heat sink 301 to effectively prevent the material of the heat-conducting layer 304 from sputtering towards the substrate 300 due to melting during subsequent high-temperature processes.
[0083] In this embodiment, the first chip 303 is a chip with a specific function. Specifically, the type of the first chip 303 depends on the actual functional requirements or application scenario. For example, the first chip 303 includes one or more of the following: radio frequency chip, memory chip, ASIC (Application-Specific Integrated Circuit) chip, CPU (Central Processing Unit) chip, GPU (Graphics Processing Unit) chip, and FPGA (Field-Programmable Gate Array) chip.
[0084] In other embodiments, the first chip 303 may be other chips depending on the actual process requirements.
[0085] The thermal conductive layer 304 is used to dissipate heat from the first chip 303 during its operation.
[0086] The cross-section of the thermal conductive layer 304 is adapted to the cross-section of the first chip 303 to achieve a tight fit between the thermal conductive layer 304 and the first chip 303, thereby improving the heat dissipation effect of the thermal conductive layer 304 on the first chip 303.
[0087] The thermally conductive layer 304 comprises one or more layers selected from the following: an indium layer, an indium-silver alloy layer, a silver layer, a tin layer, a tin-silver alloy layer, and a tin-lead alloy layer. As an example, the thermally conductive layer 304 is an indium layer.
[0088] It should be noted that the indium layer, indium-silver alloy layer, silver layer, tin layer, tin-silver alloy layer, and tin-lead alloy layer have excellent thermal conductivity, which can quickly conduct the heat generated by the first chip 303 during operation to the outside, thus improving heat dissipation.
[0089] In this embodiment, reference Figure 4 A gap 308 is provided between the sidewall of the heat-conducting layer 304 and the sidewall of the connecting part 105.
[0090] It should be noted that there is a gap 308 between the sidewall of the heat-conducting layer 304 and the sidewall of the connecting part 105, which is beneficial to improving the installation reliability of the heat-conducting layer 304 and also helps to reduce the assembly difficulty of the heat-conducting layer 304.
[0091] It should also be noted that since the thermal conductive layer 304 is located inside the receiving cavity 106, the connecting portion 105 of the heat dissipation cover 301 can effectively prevent the material of the thermal conductive layer 304 from sputtering towards the substrate 300 due to melting during subsequent high-temperature processes, thereby reducing the probability of damage to the substrate 300 or other parts on the substrate 300, and thus improving the performance of the packaging structure.
[0092] The width W of the gap 308 should not be too large. If the width W of the gap 308 is too large, the connecting portion 105 may not effectively prevent the material of the heat-conducting layer 304 from sputtering towards the substrate 300 due to melting during subsequent high-temperature processes. Therefore, in this embodiment, there is a gap 308 between the sidewall of the heat-conducting layer 304 and the sidewall of the connecting portion 105, and the minimum width W of the gap 308 is less than or equal to 5 mm. It can be understood that the minimum gap 308 is the distance between the sidewall of the heat-conducting layer 304 and the lowest point of the connecting portion 105, that is, the minimum distance between the heat-conducting layer 304 and the connecting portion 105.
[0093] Component 305 includes one or both of a passive component and a second chip. As an example, component 305 is a passive component.
[0094] It should be noted that passive components are electronic components that can exhibit their characteristics without the need for an external power supply. They mainly include one or more of the following: capacitors, resistors, inductors, filters, and couplers.
[0095] It should also be noted that the second chip is a chip with a specific function. Specifically, the type of the second chip depends on the actual functional requirements or application scenario. For example, the second chip may include one or more of the following: radio frequency chip, memory chip, ASIC chip, CPU chip, GPU chip, and FPGA chip. In other embodiments, the second chip may also be other chips depending on the actual process requirements.
[0096] In this embodiment, the packaging structure further includes a metal plating layer 309, located between the thermally conductive layer 304 and the first chip 303.
[0097] The metal plating layer 309 is used to connect the first chip 303 and the thermal conductive layer 304.
[0098] It should be noted that, under the influence of high-temperature processing, the metal plating layer 309 and the thermal conductive layer 304 usually form a eutectic layer at the interface due to mutual diffusion between materials. Therefore, the metal plating layer 309 can be used to improve the connection strength between the first chip 303 and the thermal conductive layer 304.
[0099] The metal plating 309 comprises one or any number of layers of gold and silver. As an example, the metal plating 309 is a gold layer.
[0100] It should be noted that both the gold and silver layers have excellent thermal conductivity, which is beneficial for transferring the heat generated by the first chip 303 to the thermally conductive layer 304. They also help to reduce voids between the metal plating layer 309 and the thermally conductive layer 304 during the bonding process, thereby improving the bonding quality between the metal plating layer 309 and the thermally conductive layer 304.
[0101] In this embodiment, the packaging structure further includes a conductive bump 310, located between the first chip 303 and the substrate 300, and electrically connected to the first chip 303 and the substrate 300.
[0102] The conductive bump 310 is used for thermal conduction of the first chip 303 and electrical connection between the first chip 303 and the substrate 300.
[0103] The conductive bump 310 may be made of materials including tin, copper, aluminum, tungsten, cobalt, nickel, titanium, tantalum, titanium nitride, or tantalum nitride. As an example, the conductive bump 310 may be made of tin.
[0104] It should be noted that the packaging structure in this embodiment of the present invention adopts the heat dissipation cover in the foregoing embodiment. For a detailed description of the heat dissipation cover in this embodiment of the present invention, please refer to the relevant records of the heat dissipation cover in the foregoing embodiment.
[0105] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. A packaging structure, characterized in that, include: substrate; A heat dissipation cover includes: a cover body, the cover body including an annular fixing part and a top cover located on top of the annular fixing part, the top cover including a first top cover, a second top cover, and a connecting part connecting the first top cover and the second top cover, the distance from the first top cover to the bottom surface of the annular fixing part being greater than the distance from the second top cover to the bottom surface of the annular fixing part, the first top cover and the connecting part forming a receiving cavity; the annular fixing part of the heat dissipation cover is fixed to the substrate, and the heat dissipation cover and the substrate form a cavity; The first chip is located in the cavity and is located on a substrate directly below the first top cover and is electrically connected to the substrate. A thermally conductive layer is located within the receiving cavity, and the thermally conductive layer is located between the top of the first chip and the first top cover; The heat dissipation cover further includes: a heat sink located on the second top cover, the heat sink having a groove; the number of the grooves is multiple, the multiple grooves are arranged sequentially at intervals along the direction from the center of the top cover to the edge, or the multiple grooves are distributed at intervals along the contour of the connecting portion; The bottom surface of the connector is lower than the surface of the first chip facing away from the substrate.
2. The packaging structure as described in claim 1, characterized in that, There is a gap between the sidewall of the heat-conducting layer and the sidewall of the connecting part, and the width of the minimum gap is less than or equal to 5 mm.
3. The packaging structure as described in claim 1, characterized in that, The thermally conductive layer includes one or more layers of indium, indium-silver alloy, silver, tin, tin-silver alloy, or tin-lead alloy.
4. The packaging structure as described in claim 1, characterized in that, The packaging structure further includes: components located in the cavity, the components being located on a substrate directly below the second top cover and electrically connected to the substrate.
5. The packaging structure as described in claim 4, characterized in that, The components include one or both of passive components and a second chip.
6. The packaging structure as described in claim 1, characterized in that, The cover is a metal cover.
7. The packaging structure as described in claim 1, characterized in that, The second top cover surrounds the first top cover and is connected to the annular fixing part.
8. The packaging structure as described in claim 1, characterized in that, The heat sink is made of materials including copper, aluminum, gold, nickel, steel, stainless steel, graphite, graphene, or carbon nanotubes.
9. The packaging structure as described in claim 1, characterized in that, The heat dissipation cover further includes a thermal interface layer located between the heat sink and the second top cover.
10. The packaging structure as described in claim 1, characterized in that, The angle between the first top cover and the connecting part is greater than or equal to 60 degrees and less than or equal to 90 degrees.
11. The packaging structure as described in claim 1, characterized in that, The cover is a one-piece structure.