Micro-fluidic chip packaging structure

Abstract

The utility model discloses a micro-fluidic chip packaging structure, which is applied to the field of chip packaging and comprises a PCB (Printed Circuit Board), the top of the PCB is provided with a lower-stage board, the top of the lower-stage board is adhered with UV (Ultraviolet) glue I, small pearl powder is mixed in the UV glue I, and the top of the UV glue I is adhered with an upper-stage board; the lower-level board and the upper-level board are tightly attached through the first UV glue, the small pearl powder is mixed in the first UV glue, it can be guaranteed that no gap or bubble exists in the attaching process, and use of holes in the upper-level board is not affected; the production and preparation efficiency and the operation convenience are improved, and meanwhile pollution to the surface and the interior of the chip is avoided.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging, and in particular to microfluidic chip packaging structure. Background Technology

[0002] Microfluidic chips, also known as lab-on-a-chip, are chips that can precisely perform various experimental functions such as molecular biology and detection at the micron and submicron scales. Compared with traditional analytical detection, microfluidic chips have the advantages of controllable liquid flow, low reagent consumption of samples, and significantly increased analysis speed. They can also realize the entire process of sample pretreatment and analysis. Currently, microfluidic chips have shown great potential in biological and chemical detection, as well as in IVD and cell sorting. Microfluidic chips require packaging.

[0003] The packaging of microfluidic chips mainly involves two key processes: alignment and bonding. In addition, during the testing of some microfluidic chips, it is necessary to control the temperature and humidity of the chip surface or internal channels.

[0004] Currently, the microfluidic packaging alignment process relies on the visual feedback results of optical cameras and high-precision mechanical coordinate adjustment. The bonding process involves using filler adhesives to bond the chip to the bottom carrier plate for packaging, or using mechanical fixtures, such as limiters, to package and fix the chip to the bottom carrier plate.

[0005] During the implementation of this technical solution, the following problems were found in the existing technology:

[0006] First, using optical systems for packaging alignment is costly and inefficient.

[0007] Second, using mechanical fixtures for packaging can easily lead to chip displacement, and there is a risk of leakage and contamination of the chip's internal environment during the testing process.

[0008] To address the aforementioned issues, we propose a microfluidic chip packaging structure. Utility Model Content

[0009] The purpose of this invention is to provide a microfluidic chip packaging structure.

[0010] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a microfluidic chip packaging structure, including a lower board and an upper board arranged sequentially from bottom to top on the upper surface of a PCB board, the lower board and the upper board being bonded by UV adhesive one, and the PCB board and the lower board being bonded by UV adhesive two, wherein small pearl powder is mixed inside UV adhesive one and UV adhesive two.

[0011] By using the above technical solution, mixing small amounts of pearl powder into UV adhesive one and UV adhesive two can ensure that there are no gaps or air bubbles during the bonding process, and does not affect the use of the holes in the upper board.

[0012] The present invention is further configured such that: the upper plate has two through holes inside, the two through holes being a liquid inlet hole and a liquid outlet hole respectively.

[0013] Using the above technical solution, through the setting of through holes, the top of the lower board will first be set with flow channels by photolithography and other methods; reagent liquid can be injected through the liquid inlet of the through hole, and after the reagent liquid flows and fills the flow channel, the reagent liquid will overflow through the liquid outlet of the through hole to indicate that the liquid is full.

[0014] The present invention is further configured such that: two spring contacts are attached to the top of the PCB board by SMT, and the tops of the two spring contacts are in contact with the upper board.

[0015] Using the above technical solution, the bottom of the spring contact with the two upper plates can form a circuit; when the lower plate is inserted into the groove, the bottom of the upper plate will squeeze the two springs, and the two springs can form a circuit with the lower plate, so that the microfluidic chip can be detected normally.

[0016] The present invention is further configured such that: a groove is provided on the top of the PCB board, the inside of the groove is engaged with the lower board, and UV adhesive is bonded to the bottom of the lower board.

[0017] Using the above technical solution, the groove is used to limit the lower plate, and after the lower plate is inserted into the groove, the bottom of the upper plate can just contact the two spring pieces.

[0018] The present invention is further configured such that: two pressure plates are welded to the top of the PCB board, and the bottom of the two pressure plates contacts the top of the lower board.

[0019] The above technical solution uses a pressing plate to press down the lower plate and to allow the lower plate to form a circuit.

[0020] In summary, this utility model has the following beneficial effects:

[0021] This invention uses UV adhesive to tightly bond the lower and upper boards. By mixing small amounts of pearl powder into the UV adhesive, it ensures that there are no gaps or air bubbles during the bonding process and does not affect the use of the holes in the upper board. This improves the efficiency of production and the convenience of operation, while avoiding contamination of the chip surface and interior. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural view of the present invention;

[0023] Figure 2 This is an exploded view of the structure of this utility model;

[0024] Figure 3 This is a schematic diagram of the UV adhesive and small pearl powder of this utility model.

[0025] Attached labels: 1. PCB board; 2. Lower stage board; 3. Upper stage board; 4. Spring; 5. Pressure plate; 6. Through hole; 7. Groove; 8. UV glue one; 9. Small pearl powder; 10. UV glue two. Detailed Implementation

[0026] The present invention will be further described in detail below with reference to the accompanying drawings.

[0027] Example 1:

[0028] refer to Figure 1 , Figure 2 and Figure 3 The microfluidic chip packaging structure includes a PCB board 1, a lower stage board 2 mounted on top of the PCB board 1, a UV adhesive 8 bonded to the top of the lower stage board 2, and a pearl powder 9 mixed inside the UV adhesive 8. An upper stage board 3 is bonded to the top of the UV adhesive 8. By using UV adhesive 8 to tightly bond the lower stage board 2 and the upper stage board 3, and by mixing the pearl powder 9 into the UV adhesive 8, gaps and air bubbles can be ensured during the bonding process, and the use of the holes in the upper stage board 3 is not affected. This improves the efficiency of production and the convenience of operation, while avoiding contamination of the chip surface and interior.

[0029] Furthermore, the upper plate 3 has two through holes 6 inside, which are the liquid inlet and the liquid outlet, respectively. Through the through holes 6, the top of the lower plate 2 will first be set with flow channels by photolithography and other methods. The reagent liquid can be injected through the liquid inlet of the through hole 6. After the reagent liquid flows and fills the flow channel, the reagent liquid will overflow through the liquid outlet of the through hole 6 to indicate that the liquid is full.

[0030] Furthermore, two spring contacts 4 are attached to the top of the PCB board 1 via SMT. The tops of the two spring contacts 4 contact the upper board 3. Through the setting of the spring contacts 4, the bottom of the spring contacts 4 and the two upper boards 3 can form a passage. When the lower board 2 is inserted into the groove 7, the bottom of the upper board 3 will squeeze the two spring contacts 4. The two spring contacts 4 can form a circuit with the lower board 2, so that the microfluidic chip can be detected normally.

[0031] Furthermore, a groove 7 is provided on the top of the PCB board 1. The inside of the groove 7 is engaged with the lower board 2. UV glue 10 is adhered to the bottom of the lower board 2. The groove 7 is used to limit the lower board 2. After the lower board 2 is engaged with the inside of the groove 7, the bottom of the upper board 3 can just contact the two spring pieces 4.

[0032] Furthermore, two pressure plates 5 are soldered to the top of the PCB board 1. The bottom of the two pressure plates 5 contacts the top of the lower board 2. The pressure plates 5 are used to press down the lower board 2 and to allow the lower board 2 to form a circuit.

[0033] Brief description of usage:

[0034] The spring 4 is fixed to the PCB board 1 by SMT bonding. The PCB board 1 adopts a frame structure, which facilitates positioning and batch operation.

[0035] A groove 7 is set in the middle of the top of the PCB board 1. The four corners of the groove 7 are rounded. The upper board 3 and the lower board 2 are bonded together by applying UV glue 8. Small pearl powder 9 is mixed into the UV glue 8 to eliminate bubbles and other phenomena that may occur during the bonding process and maintain the flatness of the top and bottom. The upper board 3 is set with flow channels by photolithography and other methods. The lower board 2 is set with two through holes 6. The reagent liquid is injected into the lower board 2 through the liquid inlet hole. The reagent liquid can form a flow channel with the lower board 2 and overflow from the liquid outlet hole of the upper board 3.

[0036] After the upper board 3 and the lower board 2 are attached together, a layer of UV glue 10 is evenly applied to the bottom of the lower board 2. Then, the attached upper board 3 and the lower board 2 are attached and inserted into the groove 7. The top of the spring 4 set on the PCB board 1 will touch the upper board 3, forming a passage.

[0037] Two springs 4 are squeezed by the upper board 3, and a circuit is formed between the springs 4 on one side and the springs 4 on the other side, so that the microfluidic chip can detect normally. The upper board 3 and the lower board 2 are encapsulated and fixed with the PCB board 1, and can remain fixed under the action of external force.

[0038] The specific operation is as follows: Take out the upper plate 3 and the lower plate 2, mix UV glue 8 with small pearl powder 9 in the four-sided edge area of ​​the lower plate 2, then press the upper plate 3 onto the lower plate 2 by vacuum adsorption, and then cure the glue with ultraviolet light.

[0039] After curing, glue is evenly filled at the bottom of the lower board 2. The lower board 2 is then embedded into the groove 7 by pressing. The pressure plate 5 is soldered to both sides of the PCB board 1. The pressure plate 5 is used to press down on the top of the lower board 2 to form a circuit.

[0040] This microfluidic chip package uses UV adhesive 8 mixed with small pearl powder 9 to tightly bond the upper and lower plates. The small pearl powder 9 ensures that there are no gaps or air bubbles during the bonding process, and does not affect the use of the two through holes 6 inside the upper board 3. The lower board 2 and the PCB board 1 achieve the alignment and bonding process of the microfluidic chip quickly through the principle of liquid bridge nesting, and the process will not cause the chip to shift. By soldering two pressure plates 5 and attaching two springs 4 by SMT, the microfluidic chip is fixed and the circuit is conductive, which is convenient for operation.

[0041] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. A microfluidic chip packaging structure comprising a PCB board (1), characterized in that: The lower level board (2) and the upper level board (3) are sequentially arranged on the upper surface of the PCB board (1) from bottom to top, the lower level board (2) and the upper level board (3) are bonded by UV glue I (8), the PCB board (1) and the lower level board (2) are bonded by UV glue II (10), wherein the UV glue I (8) and the UV glue II (10) internally mix small pearl powder (9).

2. The microfluidic chip packaging structure of claim 1, wherein: The upper level board (3) is internally provided with two through holes (6), and the two through holes (6) are respectively liquid inlet holes and liquid outlet holes.

3. The microfluidic chip package structure of claim 1, wherein: The top of the PCB board (1) is attached with two elastic sheets (4) through SMT, and the top of the two elastic sheets (4) is in contact with the upper level board (3).

4. The microfluidic chip package structure of claim 1, wherein: The top of the PCB board (1) is provided with a groove (7), the groove (7) is internally clamped with the lower level board (2), and the bottom of the lower level board (2) is bonded with the UV glue II (10).

5. The microfluidic chip package structure of claim 1, wherein: The top of the PCB board (1) is welded with two pressing sheets (5), and the bottom of the two pressing sheets (5) is in contact with the top of the lower level board (2).

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