Semiconductor cleaning device

Abstract

The utility model discloses a semiconductor cleaning device which comprises a workbench. An opening is formed in the top of the cleaning box, the cleaning box is arranged on the workbench, and an ultrasonic generator is arranged in the cleaning box; the cover body is arranged above the opening end of the cleaning box in a lifting mode, and a plurality of hooks are arranged at the bottom end of the cover body; a hanging ring is arranged at the position, corresponding to the hook, of the top of the bearing frame, and the hook is detachably connected with the hanging ring. According to the semiconductor cleaning device, the cover body and the bearing frame are movably arranged, during cleaning, the cover body descends to drive the bearing frame to descend until a semiconductor in the bearing frame enters the position below the liquid level of cleaning liquid to be cleaned, meanwhile, the cover body covers the opening end of the cleaning box, the cleaning liquid can be prevented from being splashed out, and the cleaning efficiency is improved. And meanwhile, the possibility that external pollutants enter the cleaning box is reduced, and the purity of the cleaning environment is guaranteed.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor cleaning technology, and in particular relates to a semiconductor cleaning device. Background Technology

[0002] Semiconductor cleaning equipment is a device specifically designed to clean the surface of semiconductor materials or components, with the aim of removing various contaminants generated during the manufacturing process, such as particles, organic matter, metal ions, and oxides.

[0003] Chinese Patent No. CN216420376U discloses a cleaning device for semiconductor production, including a cleaning tank with a cleaning frame that can move up and down driven by a lifting mechanism inside. The cleaning device is equipped with hot water pipes and cold water pipes, which can add hot water or cold water into the cleaning tank and quickly adjust the temperature inside the cleaning tank, facilitating ultrasonic cleaning and subsequent cleaning of semiconductor products.

[0004] However, when the semiconductors are placed in the cleaning tank for cleaning, the top of the cleaning tank is open, which makes the inside of the cleaning tank susceptible to external dust, particulate matter and other contaminants, increasing the risk of secondary pollution, affecting the cleaning effect and product quality. In addition, the cleaning fluid may splash due to vibration, which not only wastes the cleaning fluid, but may also pollute the surrounding environment or equipment. Utility Model Content

[0005] This utility model addresses the problems in the prior art by proposing the following technical solution:

[0006] This utility model provides a semiconductor cleaning device, comprising:

[0007] Workbench;

[0008] A cleaning tank, the top of which is open and placed on a workbench, and an ultrasonic generator is installed inside the cleaning tank;

[0009] The cover is lifted and positioned above the opening of the cleaning tank, and the bottom of the cover is provided with multiple hooks.

[0010] The support frame has a lifting ring at the top corresponding to the position of the hook, and the hook and the lifting ring are detachably connected.

[0011] As a preferred embodiment of the above technical solution, the bottom ends of the cover are symmetrically provided with extension feet on both sides, and a driving component is provided on the worktable at the position corresponding to the extension feet, with the output end of the driving component fixedly connected to the extension feet.

[0012] As a preferred embodiment of the above technical solution, a spray assembly is also provided at the bottom of the cover. The spray assembly includes a water storage box and multiple nozzles connected to the bottom of the water storage box, with the nozzles corresponding to the positions of the support frame.

[0013] As a preferred embodiment of the above technical solution, a liquid storage tank is also provided below the workbench. The cleaning tank and the liquid storage tank are connected by a connecting pipe, and the liquid storage tank and the water storage box are connected by a connecting pipe. A filter screen is detachably installed inside the liquid storage tank.

[0014] As a preferred embodiment of the above technical solution, one section of the connecting pipe two is a telescopic flexible hose.

[0015] As a preferred embodiment of the above technical solution, the cover has an internal cavity, and the section of the connecting pipe away from the liquid storage tank extends into the cavity and its end is connected to the water storage box.

[0016] The beneficial effects of this utility model are as follows:

[0017] This invention features a movable cover and a support frame. During cleaning, the cover descends, causing the support frame to descend until the semiconductor in the support frame is below the surface of the cleaning solution for cleaning. At the same time, the cover closes the opening of the cleaning tank, preventing the cleaning solution from splashing out and reducing the possibility of external contaminants entering the cleaning tank, thus ensuring the purity of the cleaning environment. Attached Figure Description

[0018] Figure 1 The diagram shown is a front view of the cleaning device in the embodiment;

[0019] Figure 2 The diagram shown is a cross-sectional view of the cleaning device in the embodiment;

[0020] Figure 3 What is shown is Figure 2 Enlarged schematic diagram of the structure at point A in the diagram;

[0021] Figure 4 The diagram shown is a schematic representation of the cleaning device in the cleaning state in the embodiment.

[0022] Reference numerals: 10. Workbench; 20. Cleaning tank; 21. Ultrasonic generator; 30. Cover; 31. Traction rope; 32. Hook; 33. Extension foot; 34. Drive unit; 35. Cavity; 40. Support frame; 41. Lifting ring; 50. Spray assembly; 60. Liquid storage tank; 70. Connecting pipe one; 80. Connecting pipe two; 51. Water storage box; 52. Spray head; 62. Filter screen; 71. Valve; 81. Telescopic hose. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0024] Example

[0025] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, Figure 1 The diagram shown is a front view of the cleaning device in the embodiment; Figure 2 The diagram shown is a cross-sectional view of the cleaning device in the embodiment; Figure 3 What is shown is Figure 2 Enlarged schematic diagram of the structure at point A in the diagram; Figure 4 The diagram shown is a schematic representation of the cleaning device in the cleaning state in the embodiment.

[0026] This device includes:

[0027] Workbench 10;

[0028] Cleaning tank 20, with an open top and mounted on workbench 10, and an ultrasonic generator 21 installed inside the cleaning tank 20;

[0029] The cover 30 is lifted and positioned above the opening of the cleaning tank 20, and the bottom of the cover 30 is provided with multiple hooks 32.

[0030] The support frame 40 has a lifting ring 41 at the top corresponding to the position of the hook 32. The hook 32 and the lifting ring 41 are detachably connected.

[0031] The workbench 10 serves as the basic structure of the entire cleaning device, providing a stable operating platform. The support frame 40 is detachably suspended from the lower end of the cover 30. The support frame 40 is a mesh frame, and the semiconductor material or component to be cleaned is placed in the support frame 40. The ultrasonic generator 21 is used to generate high-frequency vibrations, which are transmitted to the semiconductor material or component to be cleaned through a liquid medium (usually water or a specific cleaning solution), using cavitation to remove surface contaminants such as tiny particles and grease.

[0032] During cleaning, the cover 30 descends, causing the support frame 40 to descend until the semiconductor in the support frame 40 is below the surface of the cleaning fluid for cleaning. Simultaneously, the cover 30 closes the opening of the cleaning tank 20. Figure 4 As shown, this can prevent cleaning fluid from splashing out and also reduce the possibility of external contaminants entering the cleaning tank 20, ensuring the purity of the cleaning environment.

[0033] After cleaning, the cover 30 rises, allowing the support frame 40 to be lifted out of the cleaning solution. Operators do not need to directly contact the cleaning solution. Then, the connection between the hook 32 and the lifting ring 41 is released, and the cleaned semiconductor materials or components are removed, thus speeding up the workflow and improving production efficiency. Simultaneously, it facilitates quick replacement of new items to be cleaned, further enhancing equipment utilization.

[0034] Specifically, the bottom of the cover 30 is provided with multiple traction ropes 31, and the hook 32 is set at the bottom of the cover 30 through the traction ropes 31.

[0035] The bottom of the cover 30 is symmetrically provided with extension feet 33 on both sides. The worktable 10 is provided with a drive unit 34 at the position corresponding to the extension feet 33. The output end of the drive unit 34 is fixedly connected to the extension feet 33.

[0036] The driving component 34 is an electric telescopic rod or cylinder in the prior art, which drives the cover 30 to move up and down.

[0037] like Figure 1 , Figure 2 , Figure 3 As shown, Figure 1 The diagram shown is a front view of the cleaning device in the embodiment; Figure 2 The diagram shown is a cross-sectional view of the cleaning device in the embodiment.

[0038] The bottom end of the cover 30 is also provided with a spray assembly 50, which includes a water storage box 51 and multiple nozzles 52 connected to the bottom of the water storage box 51. The nozzles 52 correspond to the positions of the support frame 40.

[0039] After ultrasonic cleaning, the semiconductors inside the support frame 40 can be rinsed by spraying the nozzle 52. By combining ultrasonic cleaning with spray cleaning, various contaminants on the surface of the semiconductor material can be removed more thoroughly.

[0040] Below the workbench 10, there is also a liquid storage tank 60. The cleaning tank 20 is connected to the liquid storage tank 60 through a connecting pipe 70. The liquid storage tank 60 is connected to the water storage box 51 through a connecting pipe 80. A filter screen 62 is detachably installed inside the liquid storage tank 60.

[0041] Specifically, valves 71 are installed on both connecting pipe 70 and connecting pipe 80.

[0042] The liquid storage tank 60 is located below the workbench 10 and is used to store the liquid used in the cleaning process (such as water or a specific cleaning solution). The connecting pipe 70 connects the cleaning tank 20 to the liquid storage tank 60, allowing the cleaning liquid to flow back into the liquid storage tank 60. After passing through the filter screen 62, the returned liquid can effectively filter out impurities, particles and other contaminants in the cleaning liquid. The filtered cleaning liquid can be transported to the water storage box 51 through the connecting pipe 80 to provide cleaning liquid for the spray assembly 50, realizing the repeated recycling of the cleaning liquid.

[0043] Specifically, a slot is provided on the side wall of the liquid storage tank 60, and the filter screen 62 is movably inserted into the slot;

[0044] Furthermore, to ensure the quality of the recycled cleaning fluid, the storage tank 60 can also be equipped with other existing filtration structures; to ensure that the cleaning fluid can be transported smoothly, the storage tank 60 is also equipped with a pump body, which is common in the prior art.

[0045] One section of connecting pipe 2 80 is a flexible telescopic hose 81;

[0046] The flexible telescopic hose 81 ensures that the cover 30 is not restricted by rigid pipes during lifting and lowering, thus guaranteeing smooth operation.

[0047] The cover 30 has a cavity 35 inside, and a section of the connecting pipe 80 away from the liquid storage tank 60 extends into the cavity 35 and its end is connected to the water storage box 51.

[0048] The cavity 35 provides path space for the end section of the connecting pipe 80, making the whole system more compact and efficient, reducing the complexity of the external pipe layout, and also reducing the risk of damage caused by exposed pipes.

[0049] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A semiconductor cleaning apparatus characterized by comprising: Include: Workbench (10); Cleaning tank (20), the top of the cleaning tank (20) is open and arranged on the workbench (10), the inside of the cleaning tank (20) is provided with an ultrasonic generator (21); Cover (30), the cover (30) is arranged above the open end of the cleaning tank (20), and the bottom end of the cover (30) is provided with a plurality of hooks (32); Support frame (40), the top of the support frame (40) is provided with a lifting ring (41) corresponding to the position of the hook (32), and the hook (32) and the lifting ring (41) are detachably connected.

2. The semiconductor cleaning apparatus according to claim 1, wherein The bottom end of the cover (30) is also provided with extension feet (33) on both sides, and the workbench (10) is provided with a driving member (34) corresponding to the position of the extension feet (33), and the output end of the driving member (34) is fixedly connected with the extension feet (33).

3. The semiconductor cleaning apparatus according to claim 1, wherein The bottom end of the cover (30) is also provided with a spraying assembly (50), and the spraying assembly (50) comprises a water storage box (51) and a plurality of spray heads (52) communicated with the bottom of the water storage box (51), and the spray heads (52) correspond to the position of the support frame (40).

4. The semiconductor cleaning apparatus according to claim 3, wherein The bottom of the workbench (10) is also provided with a liquid storage tank (60), the cleaning tank (20) and the liquid storage tank (60) are communicated through the connecting pipe (70), the liquid storage tank (60) and the water storage box (51) are communicated through the connecting pipe (80), and the inside of the liquid storage tank (60) is detachably provided with a filter screen (62).

5. The semiconductor cleaning apparatus according to claim 4, wherein One section of the connecting pipe (80) is a flexible hose (81).

6. The semiconductor cleaning apparatus according to claim 4, wherein The inside of the cover (30) is provided with a cavity (35), and the section of the connecting pipe (80) away from the liquid storage tank (60) extends into the cavity (35) and is communicated with the water storage box (51) at the end.

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