Turnover adsorption mechanism and automatic inspection wafer front surface film pasting equipment

Abstract

The utility model relates to the technical field of turnover workpieces, in particular to a turnover adsorption mechanism and automatic inspection wafer front surface film pasting equipment, which comprises a lead screw, a lead screw nut is sleeved on the lead screw, a servo motor is mounted on the side surface of the lead screw nut, and a working box is mounted at one end of the servo motor; a vacuum chuck is mounted below one end of the suction and release arm and connected with a miniature vacuum pump, and a rotating motor is mounted at the other end of the suction and release arm; the beneficial effects are that the servo motor can drive the lead screw nut to move up and down on the lead screw so as to drive the integral suction and release arm to move up and down, when the vacuum chuck at the lower end of the suction and release arm is in contact with the surface of a wafer, the micro vacuum pump is started to adsorb and fix the wafer through the vacuum chuck, and then the wafer is driven to move to a proper position; the wafer is subjected to reverse inspection through the rotating motor at one end of the suction and release arm, and the wafer does not need to be manually touched and taken in the inspection process.

Description

Technical Field

[0001] This utility model relates to the field of workpiece flipping technology, specifically a flipping adsorption mechanism and an automatic inspection equipment for wafer front-side film application. Background Technology

[0002] Before the wafer is thinned by back-side grinding, a protective film needs to be applied to the front side to ensure that the front side of the wafer is free from contamination, scratches, and pressure marks during back-side grinding. The application effect of the protective film is particularly important, as it directly affects the quality and reliability of the final product. Therefore, ensuring that the film is completely adhered to the wafer surface without any gaps is a crucial step.

[0003] In existing technologies, the traditional method for inspecting whether the wafer adhesive film is fully bonded involves inspectors manually picking up the wafer and visually checking whether the surface is bonded.

[0004] However, in the traditional method of inspecting the film on the surface of wafers, the main method relies on the inspector to pick up the wafer by hand and flip it over for inspection. In this process, manually picking up the wafer may cause it to fall and cause unnecessary economic losses. To address this problem, this utility model proposes a flipping adsorption mechanism and an automatic wafer front film inspection device. Utility Model Content

[0005] The purpose of this invention is to provide a flipping adsorption mechanism and an automatic inspection equipment for wafer front-side film application, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a flipping adsorption mechanism, the flipping adsorption mechanism comprising: a lead screw, a lead screw nut fitted on the lead screw, a servo motor mounted on the side of the lead screw nut, and a working box mounted on one end of the servo motor;

[0007] The suction and release arm has a vacuum suction cup installed at one end, which is connected to a miniature vacuum pump. A rotary motor is installed at the other end of the suction and release arm.

[0008] Preferably, the lead screw is located entirely within the operating chamber, and fixing blocks are fixedly installed at both the upper and lower ends of the lead screw, with the lower fixing block fixedly installed on the surface of the operating chamber.

[0009] Preferably, the operating compartment is located inside the main body box, the main body box is a rectangular parallelepiped structure, several support legs are fixedly installed at the bottom of the main body box, and a control panel is installed on the surface of the main body box.

[0010] Preferably, the lead screw nut is fitted onto the lead screw, and the lead screw nut has an overall "convex" shaped structure. The outer wall of the lead screw nut fits against the inner wall of the track frame, and the upper and lower ends of the track frame are fixedly connected to fixing blocks. The lead screw nut can move up and down within the track frame.

[0011] Preferably, one end of the servo motor is fixedly connected to the side of the lead screw nut, and the other end of the servo motor is equipped with a connector. The surface of the connector has several holes, and a connecting screw is provided in the hole. The mating surface of the servo motor and the connector has several threaded holes, and a connecting screw is screwed into the threaded holes.

[0012] Preferably, the work box has a rectangular parallelepiped structure. One end of the work box is fixedly connected to the end of the connector away from the lead screw. A rotary motor is fixedly installed inside the work box. A mounting hole is opened on the surface of the work box located directly in front of the output end of the rotary motor, and a fixed bearing is installed in the mounting hole.

[0013] Preferably, the suction and discharge arm has an overall "Y" shaped structure. Two sets of symmetrical holes are opened on the surface of the branch end of the suction and discharge arm. One end of the connecting tube is fixedly connected to the hole. A micro vacuum pump is installed at the other end of the connecting tube. A vacuum suction cup is screwed into the end of the connecting tube away from the micro vacuum pump. The other end of the suction and discharge arm passes through the fixed bearing and is fixedly connected to the output end of the rotary motor. The outer wall of the suction and discharge arm is fixedly connected to the inner ring surface of the fixed bearing.

[0014] An automatic wafer front-side film-coating inspection device includes the aforementioned flipping and adsorption mechanism.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This invention discloses a flipping adsorption mechanism and an automatic wafer front-side film bonding inspection device. In use, a servo motor drives a lead screw nut to move up and down on the lead screw, thereby driving the overall suction and release arm to move up and down. When the vacuum suction cup at the lower end of the suction and release arm contacts the wafer surface, a micro vacuum pump is activated to adsorb and fix the wafer through the vacuum suction cup. Then, the wafer is moved to a suitable position, and the wafer is flipped for inspection by a rotary motor at one end of the suction and release arm. The inspection process does not require manual touching of the wafer, thus avoiding the economic loss caused by the wafer falling due to manual handling. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is an exploded view of the connection between the lifting structure and the tilting component of this utility model.

[0019] Figure 3 This is an exploded view of the lifting structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the adsorption structure of this utility model.

[0021] In the diagram: 1. Lead screw; 2. Lead screw nut; 3. Servo motor; 4. Working box; 5. Suction and release arm; 6. Vacuum suction cup; 7. Rotary motor; 8. Miniature vacuum pump; 9. Fixing block; 10. Operating chamber; 11. Main body box; 12. Support foot; 13. Control board; 14. Track frame; 15. Threaded hole; 16. Connector; 17. Fixed bearing; 18. Connecting pipe. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0023] In the description of this utility model, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," and "horizontal," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "a," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] For purposes of simplicity and illustration, the principles of the embodiments are described primarily by way of example. In the following description, numerous specific details are set forth to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that these embodiments may not be limited to these specific details in practice. In some instances, well-known methods and structures have not been described in detail to avoid unnecessarily obscuring these embodiments. Furthermore, all embodiments can be used in combination with each other.

[0026] Embodiment 1: Please refer to Figures 1 to 4 , the present utility model provides a technical solution: a flipping and adsorbing mechanism, the flipping and adsorbing mechanism includes: a screw rod 1, a screw nut 2 is sleeved on the screw rod 1, a servo motor 3 is installed on the side of the screw nut 2, and a working box 4 is installed at one end of the servo motor 3;

[0027] A suction and release arm 5, a vacuum chuck 6 is installed below one end of the suction and release arm 5, the vacuum chuck 6 is connected to a micro vacuum pump 8, and a rotating motor 7 is installed at the other end of the suction and release arm 5. An automatic wafer front side film pasting inspection device includes the flipping and adsorbing mechanism;

[0028] During use, the servo motor 3 can be used to drive the screw nut 2 to move up and down on the screw rod 1, so as to drive the overall up and down movement of the suction and release arm 5. When the vacuum chuck 6 at the lower end of the suction and release arm 5 contacts the surface of the wafer, the micro vacuum pump 8 is started to adsorb and fix the wafer through the vacuum chuck 6, and then the wafer is moved to a suitable position, and the rotating motor 7 at one end of the suction and release arm 5 is used to reverse and inspect the wafer. The wafer does not need to be touched manually during the inspection process, thus avoiding the problem that the wafer may fall and cause economic losses when manually picking up the wafer.

[0029] Embodiment 2: On the basis of Embodiment 1, in order to enable the device to perform reverse adsorption on the wafer, a screw rod 1 is provided. The screw rod 1 is entirely located inside the operation chamber 10. Fixed blocks 9 are fixedly installed at the upper and lower ends of the screw rod 1, and the fixed block 9 at the lower end is fixedly installed on the surface of the operation chamber 10; the operation chamber 10 is located inside the main body box 11. The main body box 11 is of an overall rectangular parallelepiped structure. A plurality of support feet 12 are fixedly installed at the bottom of the main body box 11, and a control board 13 is installed on the surface of the main body box 11; the screw nut 2 is sleeved on the screw rod 1, and the screw nut 2 is of an overall "convex" shape structure. The outer wall of the screw nut 2 fits with the inner wall of the track frame 14. Fixed blocks 9 are fixedly connected to both the upper and lower ends of the track frame 14, and the screw nut 2 can displace up and down inside the track frame 14; during use, the servo motor 3 is used to control the screw nut 2 to displace up and down on the screw rod 1, so that the vacuum chuck 6 at one end of the suction and release arm 5 connected to the working box 4 can contact the surface of the wafer, thereby adsorbing the wafer.

[0030] The working box 4 is of an overall rectangular parallelepiped structure. One end of the working box 4 is fixedly connected to the end of the connecting member 16 away from the screw rod 1. A rotating motor 7 is fixedly installed inside the working box 4. An installation hole is opened on the surface of the working box 4 directly in front of the output end of the rotating motor 7, and a fixed bearing 17 is installed in the installation hole; a rotating motor 7 is installed inside the working box 4, and the output end of the rotating motor 7 is fixedly connected to one end of the suction and release arm 5. If the wafer needs to be flipped and inspected, the rotating motor 7 is controlled to perform a flipping inspection on the wafer, thereby realizing the flipping of the wafer.

[0031] Example 3: Based on Example 2, a connector 16 is provided to facilitate the disassembly of the overall device. The connector 16 is fixedly connected to one end of the servo motor 3, and the other end of the servo motor 3 is fixedly connected to the side of the lead screw nut 2. Several holes are opened on the surface of the connector 16, and connecting screws are installed in the holes. Several threaded holes 15 are opened on the mating surface of the servo motor 3 and the connector 16, and connecting screws are screwed into the threaded holes 15. The connector 16 is located between the servo motor 3 and the working box 4. The connecting screw on the connector 16 is threadedly connected to the threaded hole 15 at one end of the servo motor 3. If it is necessary to disassemble the working box 4 later, the connecting screw can be disconnected from the threaded hole 15 at one end of the servo motor 3, thereby making the overall device easier to disassemble.

[0032] The suction and discharge arm 5 has a Y-shaped structure. Two sets of symmetrical holes are opened on the surface of the branch end of the suction and discharge arm 5. The holes are fixedly connected to one end of the connecting tube 18. A miniature vacuum pump 8 is installed at the other end of the connecting tube 18. A vacuum suction cup 6 is screwed into the end of the connecting tube 18 away from the miniature vacuum pump 8. The other end of the suction and discharge arm 5 passes through the fixed bearing 17 and is fixedly connected to the output end of the rotary motor 7. The outer wall of the suction and discharge arm 5 is fixedly connected to the inner ring surface of the fixed bearing 17. The vacuum suction cup 6 at one end of the suction and discharge arm 5 is threadedly connected to one end of the connecting tube 18. If it is necessary to replace or disassemble the vacuum suction cup 6, the entire vacuum suction cup 6 can be rotated to remove it from one end of the connecting tube 18, thereby achieving the effect of convenient device disassembly.

[0033] Working principle: In actual use, the servo motor 3 drives the lead screw nut 2 to move up and down on the lead screw 1, thereby driving the overall suction and release arm 5 to move up and down. When the vacuum suction cup 6 at the lower end of the suction and release arm 5 contacts the wafer surface, the micro vacuum pump 8 is started to pick up and fix the wafer through the vacuum suction cup 6. Then, the wafer is moved to a suitable position, and the wafer is reversed for inspection by the rotary motor 7 at one end of the suction and release arm 5. The inspection process does not require manual touching of the wafer, thus avoiding the economic loss caused by the wafer falling when manually picked up.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flipping adsorption mechanism, characterized in that: The flipping adsorption mechanism includes: a lead screw (1), a lead screw nut (2) sleeved on the lead screw (1), a servo motor (3) mounted on the side of the lead screw nut (2), and a work box (4) mounted on one end of the servo motor (3); The suction and discharge arm (5) has a vacuum suction cup (6) installed at one end of the suction and discharge arm (5), and a micro vacuum pump (8) connected to the vacuum suction cup (6). A rotary motor (7) is installed at the other end of the suction and discharge arm (5).

2. The flipping adsorption mechanism according to claim 1, characterized in that: The lead screw (1) is located inside the operating chamber (10). Fixed blocks (9) are fixedly installed at both the upper and lower ends of the lead screw (1), with the lower fixed block (9) fixedly installed on the surface of the operating chamber (10).

3. The flipping adsorption mechanism according to claim 2, characterized in that: The operating compartment (10) is located inside the main body box (11). The main body box (11) has a rectangular structure. Several support feet (12) are fixedly installed at the bottom of the main body box (11). A control panel (13) is installed on the surface of the main body box (11).

4. The flipping adsorption mechanism according to claim 1, characterized in that: The lead screw nut (2) is fitted on the lead screw (1). The lead screw nut (2) has a "convex" shaped structure. The outer wall of the lead screw nut (2) fits against the inner wall of the track frame (14). The upper and lower ends of the track frame (14) are fixedly connected with fixing blocks (9). The lead screw nut (2) can move up and down within the track frame (14).

5. The flipping adsorption mechanism according to claim 1, characterized in that: One end of the servo motor (3) is fixedly connected to the side of the lead screw nut (2), and the other end of the servo motor (3) is equipped with a connector (16). The surface of the connector (16) has several holes, and a connecting screw is provided in the hole. The mating surface of the servo motor (3) and the connector (16) has several threaded holes (15), and a connecting screw is screwed into the threaded hole (15).

6. The flipping adsorption mechanism according to claim 1, characterized in that: The work box (4) is a rectangular parallelepiped structure. One end of the work box (4) is fixedly connected to the end of the connector (16) away from the lead screw (1). A rotary motor (7) is fixedly installed inside the work box (4). The surface of the work box (4) located directly in front of the output end of the rotary motor (7) has a mounting hole, and a fixed bearing (17) is installed in the mounting hole.

7. The flipping adsorption mechanism according to claim 1, characterized in that: The suction and discharge arm (5) is in the shape of a "Y". Two sets of symmetrical holes are opened on the surface of the branch end of the suction and discharge arm (5). The holes are fixedly connected to one end of the connecting pipe (18). A micro vacuum pump (8) is installed at the other end of the connecting pipe (18). A vacuum suction cup (6) is screwed into the end of the connecting pipe (18) away from the micro vacuum pump (8). The other end of the suction and discharge arm (5) passes through the fixed bearing (17) and is fixedly connected to the output end of the rotary motor (7). The outer wall of the suction and discharge arm (5) is fixedly connected to the inner ring surface of the fixed bearing (17).

8. An automatic wafer front-side film bonding inspection device, characterized in that: Includes the flipping adsorption mechanism described in any one of claims 1-7 above.

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