Device for metalizing quartz plane electrode

Abstract

The utility model belongs to the field of quartz plane electrode metallization, and particularly relates to a device for quartz plane electrode metallization, which comprises a mounting seat and a cover plate, a circle of side wall surrounds the top surface of the mounting seat, a plurality of first notches are formed in the side wall, and two opposite screw mounting tables are arranged on the outer side of the side wall; the cover plate is a disc, a center hole is formed in the center of the cover plate, a plurality of second notches are formed in the outer ring of the cover plate, and two opposite screw mounting holes are formed in the cover plate. According to the utility model, a fixing mode of two screws is adopted, so that the quartz plane electrode can be prevented from generating relative displacement with the cover plate in the plating revolution process. Besides, the fixing mode of opposite screws on the two sides instead of a center screw is adopted, one-time metallization coating of three space sections of the center hole, the upper surface and the side wall can be achieved, and the production efficiency is greatly improved.

Description

Technical Field

[0001] This invention belongs to the field of quartz planar electrode metallization, and in particular, a device for quartz planar electrode metallization. Background Technology

[0002] The hemispherical resonator gyroscope is a new generation of long-life, highly reliable, low-power, and lightweight inertial sensing element. It is a novel type of inertial navigation-grade solid-state gyroscope. It has many advantages, such as short startup preparation time, high measurement accuracy, low output signal noise, and strong long-term stability of zero bias and scale factor.

[0003] The working principle of a quartz hemispherical resonant gyroscope is the vibration effect of a harmonic oscillator. The vibration excitation and signal detection of the harmonic oscillator are achieved based on electrodes on the surface of the quartz component. Quartz glass is a non-metallic material and does not inherently possess electrical conductivity. To enable it to have conductive electrodes, and to meet the welding requirements of subsequent processes, metallization is required on the upper, lower, and side surfaces of the quartz hemispherical component. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a device for metallizing quartz planar electrodes. The main purpose is to solve the low-cost and mass production requirements of metallizing quartz planar electrodes, and ultimately form a set of process technology solutions and special devices for metallizing quartz planar electrodes, so as to realize the metallization of the upper and lower surfaces and sides of quartz planar parts.

[0005] The technical solution adopted by this utility model to solve the technical problem is:

[0006] This utility model provides a device for metallizing a quartz planar electrode, comprising: a mounting base and a cover plate. The top surface of the mounting base is surrounded by a side wall, the side wall having multiple first notches, and two opposing screw mounting platforms are provided on the outer side of the side wall. The cover plate is a disc with a central hole in the center, multiple second notches on the outer ring, and two opposing screw mounting holes. When installing the quartz planar electrode, the quartz planar electrode is installed inside the side wall of the top surface of the mounting base, the cover plate is placed on the quartz planar electrode, the first notches on the side wall of the mounting base are aligned with the second notches on the outer ring of the cover plate, and the electrode is mounted on the screw mounting platforms of the mounting base by screws passing through the screw mounting holes of the cover plate.

[0007] Furthermore, the first notch is rectangular, the second notch is the same width as the first notch, and the side closest to the center of the cover plate is a semi-circular arc.

[0008] Furthermore, both the mounting base and the cover plate undergo electrolytic polishing.

[0009] Furthermore, the contact surface between the cover plate and the quartz planar electrode is required to have a flatness of less than 3 micrometers.

[0010] Furthermore, the mounting base has a base and a support base, with the support base mounted above the base.

[0011] Furthermore, the base of the mounting seat has a cross groove at its bottom.

[0012] Furthermore, the support base of the mounting base has six peripheral through holes and one central threaded hole inside.

[0013] Furthermore, the support base of the mounting base has a raised contact area in the middle.

[0014] The advantages and positive effects of this utility model are:

[0015] 1. This utility model uses two screws for fixing, which can prevent relative displacement between the quartz planar electrode and the cover plate during the plating revolution. In addition, the use of two opposing screws on both sides instead of a single central screw allows for one-time metallization of three spatial sections: the central hole, the upper surface, and the sidewalls, greatly improving production efficiency.

[0016] 2. The hollow design of the side wall of the mounting base of this utility model can achieve coating of the upper surface and the side surface in one coating; the thin design of the side wall of the mounting base can improve the quality of the coating on the side wall.

[0017] 3. Both the mounting base and cover plate undergo electrolytic polishing to prevent damage to the quartz planar electrode during installation. The flatness of the contact surface between the cover plate and the quartz planar electrode must be less than 3 micrometers to ensure a tight fit with the quartz planar electrode during installation and improve the accuracy of the metallized pattern. The mounting base, cover plate, and screws are made of non-magnetic stainless steel to avoid affecting the magnetic field during the coating process. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the device for metallizing quartz planar electrodes according to the present invention, showing the installation of the quartz planar electrodes.

[0019] Figure 2 A top view of the device for metallizing quartz planar electrodes according to this invention, showing the installation of the quartz planar electrode;

[0020] Figure 3 A cross-sectional view of the device for metallizing quartz planar electrodes according to this invention, showing the installation of the quartz planar electrode.

[0021] Figure 4 This is a schematic diagram of the quartz planar electrode of this utility model from a first-view perspective;

[0022] Figure 5 This is a schematic diagram of the quartz planar electrode of this utility model from a second perspective;

[0023] Figure 6 This is a schematic diagram of the vacuum magnetron sputtering coating process of this utility model.

[0024] The above figures include the following reference numerals:

[0025] 1. Mounting base; 11. First notch; 12. Screw mounting platform; 13. Base; 14. Support base; 15. Cross groove; 16. Peripheral through hole; 17. Central threaded hole; 18. Contact area; 2. Cover plate; 21. Central hole; 22. Second notch; 3. Screw; 4. Metallized area; 5. Quartz planar electrode; 6. Workpiece disk; 7. Plasma bombardment; 8. Chromium plating; 9. Nickel plating; 10. Gold plating. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0028] In the description of this utility model, it should be understood that the terms "center," "thickness," "upper," "lower," "front," "rear," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] like Figures 1-5 As shown, this utility model provides a device for metallizing quartz planar electrodes, which belongs to the vacuum magnetron sputtering coating process and the special device used in the coating process, thereby realizing the metallization of the planar electrodes of quartz hemispherical resonant gyroscope, including: mounting base 1 and cover plate 2.

[0030] like Figures 1-3As shown, the top surface of the mounting base 1 is surrounded by a sidewall, which has multiple first notches 11 and two opposing screw mounting platforms 12 on its outer side. The cover plate 2 is a disc with a central hole 21, multiple second notches 22 on its outer ring, and two opposing screw mounting holes. In one specific embodiment, the first notches 11 are rectangular, the second notches 22 are the same width as the first notches 11, and the side of the second notch 22 closest to the center of the cover plate 2 is a semi-circular arc. Figures 4-5 As shown, the areas on the quartz planar electrode 5 corresponding to the central hole 21, the first notch 11, and the second notch 22 are metallized areas 4. The hollow design of the sidewall of the mounting base 1 allows for one-time coating of the upper and side surfaces; the thin sidewall design of the mounting base 1 improves the quality of the coating on the sidewall. The mounting base 1 has a base 13 and a support 14. The support 14 is mounted above the base 13. The base 13 of the mounting base 1 has a cross groove 15 at its bottom. The support 14 of the mounting base 1 has six peripheral through holes 16 and one central threaded hole 17 inside. The cross groove 15, peripheral through holes 16, and central threaded hole 17 all serve to maintain communication between the liquid inside and outside the part (quartz planar electrode 5) during ultrasonic cleaning, improving the cleaning effect. The support 14 of the mounting base 1 has a raised contact area 18 in the middle, which reduces the contact area with the machining surface of the part (quartz planar electrode 5).

[0031] When installing the quartz planar electrode 5, it is installed inside the side wall of the top surface of the mounting base 1. The cover plate 2 is placed on the quartz planar electrode 5. The first notch 11 on the side wall of the mounting base 1 is aligned with the second notch 22 on the outer ring of the cover plate 2, and the electrode is installed on the screw mounting platform 12 of the mounting base 1 by screws 3 passing through the screw mounting holes of the cover plate 2. The mounting base 1, cover plate 2, and screws 3 are made of non-magnetic stainless steel to avoid affecting the magnetic field during the coating process. This invention uses two screws 3 for fixing, which can prevent relative displacement between the quartz planar electrode 5 and the cover plate 2 during the coating revolution. Furthermore, using two opposing screws 3 instead of a single central screw allows for one-time metallization coating of three spatial sections: the central hole 21, the upper surface, and the side wall, greatly improving production efficiency.

[0032] In addition, both the mounting base 1 and the cover plate 2 undergo electrolytic polishing to prevent damage to the quartz planar electrode 5 during installation. The contact surface between the cover plate 2 and the quartz planar electrode 5 is required to have a flatness of less than 3 micrometers to ensure a tight fit with the quartz planar electrode 5 during installation and improve the accuracy of the metallization pattern.

[0033] like Figure 6The following describes the implementation method of the vacuum magnetron sputtering coating process in this invention (metallization of the inner hole, upper surface, and side surface of the quartz planar electrode 5):

[0034] 1. The cleaned quartz planar electrode 5 is installed into the device for metallizing quartz planar electrodes of this utility model.

[0035] 2. Install several of the devices for metallizing quartz planar electrodes of this utility model onto the workpiece tray 6 of the coating machine, and let the workpiece tray 6 start to rotate.

[0036] 3. The coating machine is evacuated until the pressure reaches 5×10. -4 Pa.

[0037] 4. Argon gas is introduced through a flow meter to control the vacuum level to (2±0.1)×10⁻⁶. -2 Pa.

[0038] 5. Use a voltage of 1500V to generate plasma (e.g.) Figure 6 Plasma bombardment 7) is used to bombard a dedicated device for metallizing quartz planar electrodes, thereby improving the surface activity of the quartz planar electrode 5.

[0039] 6. Use a DC power supply to plate the first layer of metallic chromium (e.g.) Figure 6 The chromium plating in the metal increases the adhesion of the metallization layer.

[0040] 7. Use a DC power supply to plate a second layer of metallic nickel (e.g.) Figure 6 The plating of nickel (9) in the metallized layer improves the welding strength of the metallized layer.

[0041] 8. Use a DC power supply to plate a third layer of gold (such as...) Figure 6 The plated metal (gold 10) in the middle achieves a metallization layer with high conductivity and high reliability.

[0042] 9. After the quartz planar electrode 5 has cooled, remove the device to complete the metallization process.

[0043] This process can meet the welding temperature requirements of the metallization layer up to 300℃. The solder joints are full, and the film layer is strong and reliable.

[0044] The features of the vacuum magnetron sputtering coating process in this invention are as follows:

[0045] 1. Low equipment requirements; the process requirements can be met using a common vacuum magnetron sputtering coating machine.

[0046] 2. Using a dedicated device for metallizing quartz planar electrodes, metallization of a specified area of ​​the quartz planar electrode 5 can be achieved;

[0047] 3. High-pressure plasma is used to bombard the surface of the quartz planar electrode 5 to improve the adhesion of the metallization film.

[0048] 4. Metallization of the quartz planar electrode 5 is achieved by magnetron sputtering of three metals.

[0049] The advantages and positive effects of the vacuum magnetron sputtering coating process in this invention are:

[0050] 1. Compared to the complex equipment requirements of MEMS processes, ordinary vacuum magnetron sputtering coating machines can meet the process requirements without the need for other auxiliary processes;

[0051] 2. Compared to MEMS processes, metallization has lower costs and is simpler to process;

[0052] 3. Multiple quartz planar electrodes can be installed per batch, enabling mass production;

[0053] 4. The dedicated device for metallizing quartz planar electrodes is quick to install and disassemble, and can be reused repeatedly;

[0054] 5. Using a dedicated device for metallizing quartz planar electrodes, one-time coating can be achieved in different spatial cross-sectional areas, resulting in high efficiency;

[0055] 6. The surface is made of metallic gold as the metallization layer, which has the advantages of stable performance, corrosion resistance, convenient storage and easy welding.

[0056] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A device for metallizing quartz planar electrodes, characterized in that, include: Mounting base (1), the top surface of the mounting base (1) is surrounded by a side wall, the side wall is provided with a plurality of first notches (11), and two opposing screw mounting platforms (12) are provided on the outside of the side wall; Cover plate (2), the cover plate (2) is a disc with a central hole (21) in the center, a plurality of second notches (22) on the outer ring, and two opposing screw mounting holes on the cover plate (2); When the quartz planar electrode (5) is installed, the quartz planar electrode (5) is installed inside the side wall of the top surface of the mounting base (1), the cover plate (2) is placed on the quartz planar electrode (5), the first notch (11) on the side wall of the mounting base (1) is aligned with the second notch (22) on the outer ring of the cover plate (2), and is installed on the screw mounting platform (12) of the mounting base (1) by passing the screw (3) through the screw mounting hole of the cover plate (2).

2. The apparatus for metallizing quartz planar electrodes according to claim 1, characterized in that, The first notch (11) is rectangular, the second notch (22) is the same width as the first notch (11), and the side closest to the center of the cover plate (2) is a semi-circular arc.

3. The apparatus for metallizing quartz planar electrodes according to claim 2, characterized in that, Both the mounting base (1) and the cover plate (2) are electrolytically polished.

4. The apparatus for metallizing quartz planar electrodes according to claim 3, characterized in that, The contact surface between the cover plate (2) and the quartz planar electrode (5) is required to have a flatness of less than 3 micrometers.

5. The apparatus for metallizing quartz planar electrodes according to claim 4, characterized in that, The mounting base (1) has a base (13) and a support (14), the support (14) being mounted above the base (13).

6. The apparatus for metallizing quartz planar electrodes according to claim 5, characterized in that, The base (13) of the mounting seat (1) has a cross groove (15) at its bottom.

7. The apparatus for metallizing quartz planar electrodes according to claim 6, characterized in that, The mounting base (1) has six peripheral through holes (16) and a central threaded hole (17) inside its support base (14).

8. The apparatus for metallizing quartz planar electrodes according to claim 7, characterized in that, The mounting base (1) has a raised contact area (18) in the middle of the support base (14).

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