Novel anti-skid structure of induction cooker cookware
By setting a heat insulation ring on the induction cooker to limit the movement of the cookware, the problems of cookware sliding and cleaning are solved, achieving efficient heat utilization and convenient cleaning.
Patent Information
- Application Number
- CN202520409961.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-03-10
AI Technical Summary
Existing induction cookware tends to slip during cooking, resulting in low heat transfer efficiency and difficulty in cleaning. Furthermore, traditional anti-slip structures are prone to accumulating dirt.
The heat insulation ring is located above the microcrystalline plate and limits the position of the cookware, replacing the traditional protruding point limiting structure. The heat insulation ring is flat and easy to clean.
It improves the stability of cookware, enhances heat utilization efficiency, reduces stain residue, and simplifies the cleaning process.
Smart Images

Figure CN223795339U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an induction cooker structure, and more particularly to a novel anti-slip structure for induction cooker cookware. Background Technology
[0002] Existing induction cookers have smooth surfaces. When cooking, the cookware tends to slide, and oil stains on the surface exacerbate this, preventing the bottom of the pot from consistently heating in the center of the cooker. This significantly reduces heat transfer efficiency, and to prevent the pot from slipping off, a larger cooking area is often needed, directly increasing the overall size of the induction cooker. To address this issue, patent application 202421148786.7 discloses an anti-slip structure for induction cookers, using multiple heat-insulating protrusions to prevent the pot from slipping on a microcrystalline plate. However, this anti-slip structure, due to the multiple protrusions, often results in food residue accumulating on the protrusions as cooking progresses, and the unevenness of these protrusions makes cleaning difficult. Utility Model Content
[0003] The purpose of this utility model is to provide a novel anti-slip structure for induction cookware that can solve at least one of the above problems.
[0004] According to one aspect of this utility model, a novel anti-slip structure for induction cookware is provided, comprising a cooker body, the cooker body including a base, an upper shell, an electromagnetic coil, a microcrystalline plate, and a heat insulation ring. The upper shell is mounted on the base, the electromagnetic coil is installed in the mounting cavity between the base and the upper shell, the upper shell is provided with a mounting groove, the microcrystalline plate is disposed in the mounting groove and located above the electromagnetic coil, and the heat insulation ring is fixed to the top of the upper shell, the heat insulation ring is located above the microcrystalline plate, and the top of the heat insulation ring is higher than the top of the upper shell.
[0005] The beneficial effects of this utility model are as follows: By providing a heat insulation ring located above the microcrystalline plate, the heat insulation ring can limit the position of the cookware placed on the microcrystalline plate, preventing the cookware from sliding and helping to fix the cookware in the center of the cooking area, thus maximizing the utilization of the cooking area. Since the heat insulation ring replaces the existing method of using protrusions for limiting the position, the entire heat insulation ring is relatively flat and acts more evenly on the cookware, preventing stains from accumulating on a single point, reducing stains falling on the heat insulation ring, and facilitating cleaning of the entire ring, making cleaning convenient.
[0006] In some embodiments, an inclined surface is provided on the inner side of the top of the upper shell, located above the microcrystalline plate, and the heat insulation ring is fixed on the inclined surface. Therefore, by providing the inclined surface, the heat insulation ring can be easily installed and effectively retain its position.
[0007] In some embodiments, an annular groove is provided on the inclined surface, and the bottom of the heat insulation ring is fixed in the annular groove. Thus, by providing an annular groove, it is convenient to fix the heat insulation ring on the annular groove.
[0008] In some embodiments, a mounting post is provided at the bottom of the heat insulation ring, and the mounting post is fixed in the annular groove. Thus, by providing the mounting post, it is convenient to fix the heat insulation ring to the annular groove, thereby securing the entire heat insulation ring to the upper shell and preventing displacement of the heat insulation ring.
[0009] In some implementations, the heat insulation ring and the mounting post are integrally molded. This facilitates the molding and processing of the mounting post.
[0010] In some embodiments, the top surface of the heat insulation ring is horizontal, and the inner wall of the heat insulation ring is inclined in the opposite direction to the inclination direction of the inclined surface. Therefore, by inclining the inner wall of the heat insulation ring, the microcrystalline plate below is not obstructed.
[0011] In some embodiments, a glue applicator groove is provided at the bottom of the mounting slot, located below the microcrystalline board. This glue applicator groove facilitates the application of glue, ensuring the microcrystalline board is securely installed within the mounting slot and preventing displacement.
[0012] In some embodiments, the mounting post is arranged in a ring below the heat insulation ring, engaging with the annular groove. This facilitates the complete engagement of the mounting post with the annular groove, increasing the contact area between the mounting post and the annular groove, thereby improving the tightness of the fit between them. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of a novel anti-slip structure for induction cookware according to this utility model.
[0014] Figure 2 This is a schematic diagram of a novel anti-slip structure for induction cookware of this utility model, without the installation of a heat insulation ring.
[0015] Figure 3 This is a cross-sectional schematic diagram of a novel anti-slip structure for induction cookware according to this utility model.
[0016] Figure 4 This is a cross-sectional view of a novel anti-slip structure for induction cookware that is designed to work in conjunction with the cookware. Detailed Implementation
[0017] The present invention will now be described in further detail with reference to the accompanying drawings.
[0018] Reference Figures 1-4A novel anti-slip structure for induction cookware includes a cooker body 10. The cooker body 10 includes a base 1, an upper shell 2, an electromagnetic coil, a microcrystalline plate 3, and a heat insulation ring 4. The upper shell 2 covers the base 1. The electromagnetic coil is installed in the mounting cavity between the base 1 and the upper shell 2. The upper shell 2 has a mounting groove 21. The microcrystalline plate 3 is located in the mounting groove 21 and above the electromagnetic coil. The heat insulation ring 4 is fixed to the top of the upper shell 2, and the top of the heat insulation ring 4 is higher than the top of the upper shell 2. The electromagnetic coil is not shown in the figure. The working principle of this induction cooker is the same as that of existing induction cookers. After the electromagnetic coil is installed in the corresponding position on the base 1, the upper shell 2 and the base 1 can be locked together with screws.
[0019] When in use, since the heat insulation ring 4 is located above the microcrystalline plate 3, when the cookware is placed above the microcrystalline plate 3, the heat insulation ring 4 can limit the cookware around its perimeter, preventing it from sliding. This confines the cookware to the cooking area of the induction cooker, improving the efficiency of heat utilization and reducing the surface area of the microcrystalline plate, thus facilitating the reduction of the overall size of the cooker body 1.
[0020] Meanwhile, since the top of the heat insulation ring 4 is higher than the top of the upper shell 2, when the cookware is placed, the heat insulation ring 4 separates the cookware from the top of the upper shell 2, thus preventing the cookware from directly contacting the upper shell 2 and protecting the upper shell 2.
[0021] Because the heat insulation ring 4 is a complete circle above the microcrystalline plate 3, it avoids the effect of a single protrusion on the bottom of the cookware. This prevents stains on the bottom of the cookware from being scratched by the corresponding protrusions, and avoids stains accumulating on the protrusions, greatly reducing stain residue. It also facilitates cleaning the entire circle of the heat insulation ring 4, making cleaning easier. At the same time, the fact that the heat insulation ring 4 is a complete circle in contact with the cookware further enhances its restraining effect on the cookware.
[0022] An inclined surface 22 is provided on the inner side of the top of the upper shell 2. The inclined surface 22 is located above the microcrystalline plate 3, and the heat insulation ring 4 is fixed on the inclined surface 22. By providing the inclined surface 22, the heat insulation ring 4 can be easily installed on the inner side of the upper shell 2 to limit the position of the cookware.
[0023] An annular groove 221 is formed on the inclined surface 22, and the bottom of the heat insulation ring 4 is fixed in the annular groove 221.
[0024] The bottom of the heat insulation ring 4 is provided with a mounting post 41, which is fixed in the annular groove 221.
[0025] The heat insulation ring 4 and the mounting post 41 are integrally injection molded structures. The heat insulation ring 4 can be made of commonly used high-temperature resistant silicone material, which has corresponding high-temperature resistance. At the same time, through the contact between the heat insulation ring 4 and the cookware, it can provide a certain buffering and protection for the cookware, reduce wear and tear, and help extend the service life of the cookware.
[0026] The mounting post 41 is arranged in a ring below the heat insulation ring and cooperates with the annular groove 221, which can simplify the structure of the mounting post 41.
[0027] In the actual production process, in order to facilitate the fixing of the heat insulation ring 4 in the annular groove 221 of the upper shell 2, the upper shell 2 is first injection molded; after the upper shell 2 is molded, the heat insulation ring 4 is then injection molded at the annular groove 221, that is, a second injection molding is performed, so that when the mounting post 41 is injection molded at the annular groove 221, it can be tightly fixed with the annular groove 221, thereby ensuring the tightness of the heat insulation ring 4 installed on the upper shell 2.
[0028] In addition to the above-mentioned method of fixing the heat insulation ring 4 to the upper shell 2 in the annular groove 221 during the assembly process, the mounting post 41 can also be directly inserted into the annular groove 221 for fixation. By clamping the mounting post 41 to the side wall of the annular groove 221, the heat insulation ring 4 is fixed on the upper shell 2, which meets different usage requirements.
[0029] The top surface of the heat insulation ring 4 is horizontal, and the inner wall of the heat insulation ring 4 is inclined in the opposite direction to that of the inclined surface 22. The inclination directions of the inner wall of the heat insulation ring 4 and the inclined surface 22 are respectively inclined towards the microcrystalline plate 3 (i.e., inward) and away from the microcrystalline plate (i.e., outward). The inclined arrangement of the inner wall of the heat insulation ring 4 prevents the bottom end of the heat insulation ring 4 from pressing tightly against the microcrystalline plate 3.
[0030] The bottom of the mounting slot 21 is provided with a glue applicator 211, which is located below the microcrystalline board 3. Therefore, when the microcrystalline board 3 needs to be installed in the mounting slot 21, glue is applied to the glue applicator 211 beforehand, and then the microcrystalline board 3 is glued and fixed above the mounting slot 21, thus achieving the fixed installation of the microcrystalline board 3.
[0031] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of this utility model, and these all fall within the protection scope of this utility model.
Claims
1. A novel anti-skid structure for a pot on an electromagnetic cooker, characterized in that, The application relates to a stove body (10) which comprises a base (1), an upper shell (2), an electromagnetic wire disc, a microcrystal plate (3) and a heat insulation ring (4), the upper shell (2) is arranged on the base (1), the electromagnetic wire disc is arranged in a mounting cavity between the base (1) and the upper shell (2), the upper shell (2) is provided with a mounting groove (21), the microcrystal plate (3) is arranged in the mounting groove (21) and above the electromagnetic wire disc, the heat insulation ring (4) is fixed to the top end of the upper shell (2) and above the microcrystal plate (3), and the top end of the heat insulation ring (4) is higher than the top end of the upper shell (2).
2. The novel anti-skid structure for an electromagnetic cooker utensil according to claim 1, characterized in that, An inclined surface (22) is arranged on the inner side of the top end of the upper shell (2) and above the microcrystal plate (3), and the heat insulation ring (4) is fixed to the inclined surface (22).
3. The novel anti-skid structure for an electromagnetic cooker utensil according to claim 2, characterized in that, An annular groove (221) is arranged on the inclined surface (22), and the bottom of the heat insulation ring (4) is fixed in the annular groove (221).
4. The novel anti-skid structure of a cookware for an electromagnetic cooker according to claim 3, characterized in that, The bottom of the heat insulation ring (4) is provided with a mounting column (41), and the mounting column (41) is fixed in the annular groove (221).
5. The novel anti-skid structure for an electromagnetic cooker utensil according to claim 4, characterized in that, The heat insulation ring (4) and the mounting column (41) are integrally formed.
6. The novel anti-skid structure of a cookware for an electromagnetic cooker according to any one of claims 2 to 5, characterized in that, The top end surface of the heat insulation ring (4) is horizontally arranged, the inner side wall of the heat insulation ring (4) is arranged in an inclined manner, and the inclined direction is opposite to that of the inclined surface (22).
7. The novel anti-skid structure of a cookware for an electromagnetic cooker according to claim 6, wherein The bottom of the mounting groove (21) is provided with a glue injection groove (211), and the glue injection groove (211) is below the microcrystal plate (3).
8. The novel anti-skid structure of a cookware for an electromagnetic cooker according to claim 4 or 5, characterized in that, The mounting column (41) is annularly arranged below the heat insulation ring and cooperates with the annular groove (221).
Citation Information
Patent Citations
Anti-skid structure of induction cooker cookware
CN222256723U