Liquid cooling plate for vehicle-mounted refrigerator and heat dissipation device of liquid cooling plate
By combining a liquid cooling plate structure and a semiconductor cooling chip in the vehicle refrigerator, the problem of low heat dissipation efficiency in vehicle refrigerators is solved, and the efficiency of heat dissipation and cooling effect is improved.
Patent Information
- Application Number
- CN202520145779.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-01-22
AI Technical Summary
Existing vehicle refrigerators have inefficient heat dissipation devices, especially when there are large temperature differences, resulting in poor cooling efficiency and a poor user experience.
It adopts a liquid-cooled plate structure, including a left-side transverse flow channel, a right-side transverse flow channel and a longitudinal flow channel. It combines a semiconductor cooling chip and cold-end fins, and is connected to the vehicle compressor through the liquid-cooled plate to dissipate heat using refrigerant.
It improves the heat dissipation efficiency of the vehicle refrigerator, ensuring stable operation in high-temperature environments and enhancing the cooling effect.
Smart Images

Figure CN223795574U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the field of semiconductor refrigeration, specifically relates to a liquid cooling plate for vehicle refrigerator and heat sink thereof. BACKGROUND
[0002] Vehicle refrigerator is widely used in long-distance driving, travel and other scenes, and is used for storing food and drinks to keep low temperature. However, due to the complex use environment of vehicle refrigerator, the temperature inside the refrigerator and the external environment temperature change greatly, which leads to the prominent heat dissipation problem of the refrigerator. Most of the existing heat dissipation devices of vehicle refrigerator adopt air cooling or semiconductor refrigeration mode, and the semiconductor refrigeration refrigerator is limited by the characteristics of the semiconductor refrigeration sheet itself, and the larger the temperature difference between the inside and outside of the refrigerator, the lower the refrigeration efficiency. The low refrigeration performance of the refrigerator leads to that the temperature in the cavity cannot reach the ideal temperature, and the user experience is poor. SUMMARY
[0003] The technical problem to be solved by the utility model is how to improve the heat dissipation efficiency of the vehicle refrigerator, so as to improve the refrigeration efficiency of the vehicle refrigerator, and therefore a liquid cooling plate heat dissipation device for vehicle refrigerator is provided.
[0004] To solve the above problems, the utility model is realized by the following technical scheme:
[0005] A liquid cooling plate for vehicle refrigerator, comprising a liquid cooling plate body, a left side and a right side of the liquid cooling plate body are both provided with a horizontal flow channel, that is, a left side horizontal flow channel and a right side horizontal flow channel, at least one vertical flow channel is arranged between the left side horizontal flow channel and the right side horizontal flow channel, and the vertical flow channel is in communication with the left side horizontal flow channel and the right side horizontal flow channel respectively.
[0006] The left side horizontal flow channel comprises a left side first horizontal flow channel and a left side second horizontal flow channel, wherein the left side of the left side first horizontal flow channel is in communication with the outside and is provided with a liquid inlet corresponding, the liquid inlet is connected with a liquid inlet pipe, and the right side of the left side first horizontal flow channel is connected with at least one vertical flow channel; the left side of the left side second horizontal flow channel is in communication with the outside and is provided with a liquid outlet corresponding, the liquid outlet is connected with a liquid outlet pipe, and the right side of the left side second horizontal flow channel is connected with at least one vertical flow channel; the right side horizontal flow channel is in communication with all the vertical flow channels.
[0007] The right side of the left side first horizontal flow channel is connected with three vertical flow channels, the right side of the left side second horizontal flow channel is connected with three vertical flow channels, six vertical flow channels are arranged in total, and the right side horizontal flow channel is in communication with the six vertical flow channels.
[0008] The left side first horizontal flow channel, the left side second horizontal flow channel, the vertical flow channel and the right side horizontal flow channel are all straight flow channels.
[0009] At least one mounting hole is arranged on the liquid cooling plate body.
[0010] A heat dissipation device using the above-mentioned liquid cooling plate includes a semiconductor refrigeration chip, the hot end of which is provided with a hot end fin, and a liquid cooling plate is provided at the cold end of the semiconductor refrigeration chip, the liquid cooling plate being provided with a cold end fin; the liquid cooling plate is connected to an inlet pipe and an outlet pipe respectively.
[0011] The liquid cooling plate is connected to the vehicle's compressor refrigeration system via inlet and outlet pipes.
[0012] A cooling fan is installed on the hot end fin.
[0013] The semiconductor cooling chip and cold end fins are installed inside the refrigerator cavity.
[0014] Compared with existing technologies, this invention has the following advantages: the device achieves this by connecting the refrigerant in the vehicle's compressor to a liquid cooling plate. Liquid cooling technology has higher heat dissipation efficiency than traditional air cooling, effectively improving the heat dissipation effect of the vehicle refrigerator and ensuring that the TEC semiconductor refrigeration refrigerator can operate stably in high-temperature environments. Attached Figure Description
[0015] Figure 1 This is a structural diagram of the heat dissipation device of this utility model;
[0016] Figure 2 This is a structural diagram of the liquid cooling plate;
[0017] Figure 3 This is a schematic diagram illustrating the working principle of this utility model. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0020] like Figure 2As shown, a liquid cooling plate 2 for a vehicle refrigerator includes a liquid cooling plate body 18. Transverse flow channels are provided on both the left and right sides of the liquid cooling plate body, namely, a left transverse flow channel and a right transverse flow channel 16. At least one longitudinal flow channel 15 is provided between the left transverse flow channel and the right transverse flow channel 16, and the longitudinal flow channel 15 is connected to the left transverse flow channel and the right transverse flow channel 16 respectively.
[0021] The aforementioned left-side transverse flow channel includes a left-side first transverse flow channel 13 and a left-side second transverse flow channel 14. The left-side first transverse flow channel 13 extends through and connects to the outside and is provided with a corresponding liquid inlet 11, which is connected to the liquid inlet pipe 3. The right side of the left-side first transverse flow channel 13 is connected to at least one longitudinal flow channel. The left-side second transverse flow channel 14 extends through and connects to the outside and is provided with a corresponding liquid outlet 12, which is connected to the liquid outlet pipe 4. The right side of the left-side second transverse flow channel 14 is connected to at least one longitudinal flow channel. The right-side transverse flow channel 16 extends through and connects to all the longitudinal flow channels.
[0022] Furthermore, in a preferred embodiment, the right side of the first transverse flow channel 13 on the left is connected to three longitudinal flow channels, and the right side of the second transverse flow channel 14 on the left is connected to three longitudinal flow channels, that is, a total of six longitudinal flow channels 15 are provided, and the right transverse flow channel 16 connects the six longitudinal flow channels 15.
[0023] During operation, the coolant flows into the first transverse flow channel 13 on the left side from the inlet 11 on one side, and then flows into the transverse flow channel 16 on the right side through multiple longitudinal flow channels 15. It then flows into the second transverse flow channel 14 on the left side through the remaining longitudinal flow channels, and finally flows out from the outlet 12. Compared with only a single meandering disc-shaped flow channel, this arrangement can better improve the uneven temperature of the coolant flowing through the liquid cooling plate, and effectively ensure the cooling effect of the liquid cooling plate.
[0024] It should be noted that the first transverse flow channel 13 on the left, the second transverse flow channel 14 on the left, the longitudinal flow channel 15, and the transverse flow channel 16 on the right are all straight flow channels. This makes the overall processing more convenient.
[0025] Better still, at least one mounting hole 17 is provided on the liquid cooling plate body 18 for mounting the liquid cooling plate.
[0026] like Figure 1 , Figure 3 As shown, a heat dissipation device for a vehicle refrigerator includes a thermoelectric cooler 7. The hot end 8 of the thermoelectric cooler 7 is provided with hot end fins 5, and a liquid cooling plate 2 is provided at the cold end 9 of the thermoelectric cooler 7. The liquid cooling plate 2 is provided with cold end fins 1. The liquid cooling plate 2 is connected to an inlet pipe 3 and an outlet pipe 4. It should be noted that, under normal circumstances, the thermoelectric cooler 7 is powered on.
[0027] In this invention, the liquid cooling plate 2, as a liquid cooling structure, is the core component of the heat dissipation device. The liquid cooling plate 2 is installed on the semiconductor cooling chip 7. The liquid cooling plate 2 is connected to the vehicle compressor refrigeration system through the liquid inlet pipe 3 and the liquid outlet pipe 4. It can maintain the hot surface temperature of the semiconductor cooling chip 7 at a minimum of 5°C. Compared with air cooling, it greatly reduces the cold surface temperature of the cooling chip, thereby improving the refrigeration effect of the refrigerator.
[0028] Even better, a cooling fan 6 is provided on the hot end fin 5 for air cooling of the hot end fin 5.
[0029] In this invention, the semiconductor cooling chip 7 and the cold end fin 1 are installed inside the refrigerator cavity; the refrigerator structure will not be described further here.
[0030] The beneficial effects of this invention are as follows: the device achieves cooling by connecting the refrigerant in the vehicle's compressor via a liquid cooling plate. Liquid cooling technology has higher heat dissipation efficiency than traditional air cooling, effectively improving the heat dissipation of the vehicle refrigerator and ensuring that the TEC semiconductor refrigeration refrigerator can operate stably in high-temperature environments.
[0031] The above description is only a preferred embodiment of the present utility model. It should be noted that those skilled in the art can make several changes and improvements without departing from the overall concept of the present utility model, and these should also be considered within the protection scope of the present utility model.
Claims
1. A liquid cooling plate for a vehicle-mounted refrigerator, characterized in that: The liquid cooling plate body (18) includes a transverse flow channel on both the left and right sides of the liquid cooling plate body, namely a left transverse flow channel and a right transverse flow channel (16). At least one longitudinal flow channel (15) is provided between the left transverse flow channel and the right transverse flow channel (16), and the longitudinal flow channel (15) is connected to the left transverse flow channel and the right transverse flow channel (16) respectively. The left transverse flow channel includes a left first transverse flow channel (13) and a left second transverse flow channel (14). The left first transverse flow channel (13) is connected to the outside on the left and has a corresponding inlet (11). The inlet (11) is connected to the inlet pipe (3). The right side of the left first transverse flow channel (13) is connected to at least one longitudinal flow channel. The left second transverse flow channel (14) is connected to the outside on the left and has a corresponding outlet (12). The outlet (12) is connected to the outlet pipe (4). The right side of the left second transverse flow channel (14) is connected to at least one longitudinal flow channel. The right transverse flow channel (16) is connected to all the longitudinal flow channels.
2. The liquid cooling plate for a vehicle-mounted refrigerator according to claim 1, characterized in that: The right side of the first transverse flow channel (13) on the left is connected to three longitudinal flow channels, and the right side of the second transverse flow channel (14) on the left is connected to three longitudinal flow channels, for a total of six longitudinal flow channels (15). The right transverse flow channel (16) connects the six longitudinal flow channels (15).
3. A liquid cooling plate for a vehicle-mounted refrigerator according to claim 1, characterized in that: The first transverse flow channel (13) on the left, the second transverse flow channel (14) on the left, the longitudinal flow channel (15) and the transverse flow channel (16) on the right are all straight flow channels.
4. A liquid cooling plate for a vehicle-mounted refrigerator according to claim 1, characterized in that: At least one mounting hole (17) is provided on the liquid cooling plate body (18).
5. A heat dissipation device employing the liquid cooling plate according to any one of claims 1-4, characterized in that: It includes a semiconductor cooling chip (7), the hot end (8) of the semiconductor cooling chip (7) is provided with a hot end fin (5), and a liquid cooling plate (2) is provided at the cold end (9) of the semiconductor cooling chip (7), and a cold end fin (1) is provided on the liquid cooling plate (2); the liquid cooling plate (2) is connected to the liquid inlet pipe (3) and the liquid outlet pipe (4) respectively.
6. The heat dissipation device according to claim 5, characterized in that: The liquid cooling plate (2) is connected to the vehicle compressor refrigeration system through the liquid inlet pipe (3) and the liquid outlet pipe (4).
7. The heat dissipation device according to claim 5, characterized in that: A cooling fan (6) is installed on the hot end fin (5).
8. The heat dissipation device according to claim 5, characterized in that: The semiconductor cooling chip (7) and the cold end fin (1) are installed inside the refrigerator cavity.