Position detection device for base disc in semiconductor equipment chamber

Abstract

The utility model provides a position detection device for a base plate in a semiconductor equipment chamber, the base plate and a reference object are arranged in the chamber, the position detection device comprises a support structure, a motion structure and a detection mechanism, the support structure comprises an upper cover plate, a lower cover plate and a mounting base which are sequentially stacked from top to bottom, and the upper cover plate and the lower cover plate are arranged on the mounting base. The upper cover plate is arranged on the upper surface of the lower cover plate, and the lower cover plate is arranged on the upper surface of the mounting base; the upper cover plate, the lower cover plate and the mounting base are concentrically arranged; the moving structure comprises a guide rail and a sliding block sliding along the guide rail, the guide rail is installed on the upper surface of the lower cover plate, and the guide rail is arranged along the edge of the upper cover plate; the detection mechanism is fixedly connected with the sliding block, and the measurement area of the detection mechanism is at least aligned with the gap between the base disc and the reference object. According to the utility model, the relative position of the base disc and the reference object can be accurately and conveniently detected.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor equipment, and in particular to a position detection device for the base plate inside a semiconductor equipment cavity. Background Technology

[0002] Epitaxial growth plays a crucial role in semiconductor device manufacturing. For example, silicon epitaxy is used to grow a pure and precisely controlled silicon layer on a silicon substrate, which is extremely important for manufacturing advanced integrated circuits. However, in actual epitaxial growth processes, uneven temperature distribution within the process chamber can lead to defects such as uneven epitaxial layer thickness. For instance, in the process chamber, the position of the substrate-supporting disk must be carefully monitored. Is the disk centered within the chamber? Is its height equal to that of the preheating ring? The preheating ring, positioned around the disk, heats it, and the relative level between the disk and the preheating ring affects the temperature distribution on the disk. Poor levelness can result in different temperatures at different locations on the substrate, negatively impacting the uniformity of the epitaxial layer thickness. Therefore, it is necessary to monitor the position of the disk within the process chamber.

[0003] To accurately determine the positional relationship between the base plate and the preheating ring, multiple detection points need to be selected. The choice of detection points directly affects the accuracy of the results. Specifically, if the center of the detection path formed by multiple detection points does not fall on the symmetrical center line of the process chamber, the accuracy of the final result will be affected. Utility Model Content

[0004] The purpose of this invention is to provide a position detection device for the base plate inside a semiconductor device cavity, which can accurately and conveniently detect the relative position of the base plate and the reference object.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0006] A position detection device for a base plate within a semiconductor device cavity, wherein the cavity contains a base plate and a reference object, and the position detection device includes a support structure, a motion structure, and a detection mechanism.

[0007] The support structure includes an upper cover plate, a lower cover plate, and a mounting base stacked sequentially from top to bottom. The upper cover plate is a transparent circular plate, which is disposed on the upper surface of the lower cover plate, and the lower cover plate is disposed on the upper surface of the mounting base. The upper cover plate, the lower cover plate, and the mounting base are concentrically arranged.

[0008] The motion structure includes a guide rail and a slider that slides along the guide rail, wherein the guide rail is mounted on the upper surface of the lower cover plate and is arranged along the edge of the upper cover plate;

[0009] The detection mechanism is fixedly connected to the slider, and the measurement area of ​​the detection mechanism is at least aligned with the gap between the base plate and the reference object.

[0010] Preferably, the upper cover plate is a transparent circular plate, and the upper cover plate has a first mounting hole on its edge, which is equidistantly distributed along the edge of the upper cover plate.

[0011] Preferably, the lower cover plate is a transparent annular shape, and a circular through hole is provided in the center of the lower cover plate. The size of the circular through hole is adapted to the size of the upper cover plate. A second mounting hole corresponding to the first mounting hole is provided near the inner edge of the circular through hole of the lower cover plate. The first mounting hole and the second mounting hole are connected by a first fastener.

[0012] Preferably, the lower cover plate is provided with a guide rail mounting hole, which is located on the side of the second mounting hole away from the circular through hole; the outer edge of the lower cover plate is provided with a third mounting hole, which is equidistantly distributed along the outer edge of the lower cover plate; a detection positioning hole is provided between the guide rail mounting hole and the third mounting hole.

[0013] Preferably, the mounting base is an annular mounting plate, and the upper surface of the mounting base is provided with a fourth mounting hole corresponding to the third mounting hole. The third mounting hole and the fourth mounting hole are connected by a second fastener. The mounting base has a lower surface opposite to the upper surface, and the lower surface of the mounting base is provided with an annular groove arranged circumferentially. An elastic element is provided in the annular groove.

[0014] Preferably, the detection mechanism and the slider are fixedly connected by an adapter plate. The adapter plate includes a slider mounting surface, a detection mechanism mounting surface, and a size adjustment part connecting the slider mounting surface and the detection mechanism mounting surface. The slider mounting surface is provided with a fifth mounting hole, and the adapter plate is fixedly connected to the slider through the fifth mounting hole. The detection mechanism mounting surface is provided with a sixth mounting hole, and the adapter plate is fixedly connected to the detection mechanism through the sixth mounting hole.

[0015] Preferably, the size adjustment part is further provided with at least one fifth mounting hole, the size adjustment part aligns the measuring area of ​​the detection mechanism with the gap between the base plate and the reference object; the size adjustment part is provided with a seventh mounting hole, the seventh mounting hole being fixedly connected to the slider limiting member.

[0016] Preferably, the slider limiting component is a spring pin; a rivet nut is provided in the seventh mounting hole, the spring pin is fixedly connected to the rivet nut, and a hexagonal nut is also provided between the spring pin and the rivet nut.

[0017] Preferably, the guide rail is a circular guide rail, which is integrally formed or is composed of multiple segments spliced ​​together.

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] (1) The position detection device provided by this utility model can be used to measure the distance between the detection point on the base plate and the detection point on the reference object and the detection mechanism, and / or the distance between the detection point on the base plate and the detection point on the reference object. The position detection device has high accuracy.

[0020] (2) The position detection device of this utility model includes a support structure, a motion structure, and a detection mechanism. The support structure includes an upper cover plate, a lower cover plate, and a mounting base stacked sequentially from top to bottom. The support structure is made of transparent material, which facilitates the detection mechanism to measure the position of the base plate and the reference object through the support structure. The upper cover plate, the lower cover plate, and the mounting base are concentrically arranged, and the annular guide rail is installed along the edge of the upper cover plate. The detection mechanism moves along the annular guide rail to ensure that the center of the detection path formed by multiple detection points can fall on the symmetrical center line of the process chamber, thus ensuring the accuracy of the final result. The upper cover plate, the lower cover plate, and the mounting base of the support structure are stacked sequentially to form a complete support surface, which avoids damage to the upper dome and the base plate caused by the falling of the workpiece during the installation of the position detection device.

[0021] (3) The detection mechanism of this utility model is connected to the moving structure through an adapter plate. By adjusting the guide rail size of the moving structure and the length of the adapter plate, the measurement area of ​​the detection mechanism is aligned with the gap between the base plate and the reference object. By setting guide rails of different sizes and adapter plates of different lengths, this position detection device can meet the position detection of the base plate in process chambers of different sizes. Attached Figure Description

[0022] To more clearly illustrate the technical solution of this utility model, the drawings used in the description will be briefly introduced below. Obviously, the drawings in the following description are one embodiment of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort:

[0023] Figure 1 This is a schematic diagram of the structure of a semiconductor device chamber;

[0024] Figure 2 This is a schematic diagram of the position detection device of this utility model;

[0025] Figure 3 This is an exploded view of the position detection device of this utility model.

[0026] Figure 4 This is a top view of the lower cover plate of this utility model;

[0027] Figure 5 This is a top view of the mounting base of this utility model;

[0028] Figure 6 This is a bottom view of the mounting base of this utility model;

[0029] Figure 7 This is a schematic diagram of the structure of the adapter plate of this utility model. Detailed Implementation

[0030] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, further illustrates the proposed solution of this utility model. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, intended only to facilitate and clearly illustrate the embodiments of this utility model. Please refer to the drawings to make the objectives, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model.

[0031] A schematic diagram of the semiconductor device in this application is shown below. Figure 1As shown, the semiconductor device 100 can be a deposition device, such as an epitaxial device, but the embodiments of this application do not limit its specific type. The semiconductor device includes a process chamber, an inlet assembly 101, an exhaust assembly 102, a heating assembly 103, and a rotating support assembly 106. The process chamber includes a sidewall 113, a bushing assembly (including an upper ring body 111 and a lower ring body 112), an upper dome 105, a lower dome 104, an upper flange 114, and a lower flange 115. The sidewall 113 is generally annular, with its inner surface being a cylindrical shape extending vertically. The sidewall 113 is made of metal. The upper ring 111 and lower ring 112 are both generally annular and are respectively disposed on the inner surface of the sidewall. The upper ring 111 is disposed above the lower ring 112 to form a bushing assembly. The upper dome 105 is generally circular or pot-lid shaped, while the corresponding lower dome 104 is generally conical or funnel shaped. The upper dome 105 is disposed above the upper ring 111 and is fixed to the upper sidewall 113 by the upper flange 114. The lower dome 104 is disposed below the lower ring 112 and is fixed to the lower sidewall 113 by the lower flange 115. The upper ring 111, upper dome 105, lower ring 112, and lower dome 104 constitute the process space 120. All three components are made of quartz. Gas inlets and outlets are located on opposite sides of the bushing assembly to allow process gases to enter and exit. A heating assembly 103 is positioned above and / or below the process chamber. This heating assembly includes multiple lamps and generates radiant heat, which passes through the upper dome 105 and / or lower dome 104 to provide thermal energy to the process space 120. The heating assembly 103 heats and decomposes the process gases entering the process space, which then deposit on the substrate surface, forming an epitaxial layer on the substrate surface.

[0032] The rotating support assembly 106 includes a base disk 117, a rotating support shaft, a lifting support frame 106, and a lifting pin. The base disk 117 is horizontally disposed inside the process chamber to horizontally support the substrate to be processed. Specifically, the base disk 117 can be a disc made of graphite material. The base disk 117 is located at the center of the ring of the bushing assembly, meaning the center of the base disk 117 falls on the symmetry center line of the bushing assembly. Further, a preheating ring 116 is provided around the base disk 117. The preheating ring 116 is fixedly installed on the bushing assembly and is used to preheat the process gas entering the process space 120. The center of the base disk also falls on the symmetry center line of the preheating ring. The base disk 117 is located between the gas inlet and the gas outlet, and its upper surface is on the same horizontal plane as the gas inlet, gas outlet, and preheating ring 116. The rotating support shaft is used to support the rotation and lifting of the base disk 117, and the lifting support frame is used to support the lifting pin when the rotating support shaft descends, thereby separating the substrate from the base disk 117 during substrate transfer.

[0033] A position detection device for a base plate inside a semiconductor device cavity, such as Figure 2 and Figure 3 As shown, the chamber contains a base plate and a reference object, which can be a preheating ring 116 disposed around the base plate. After measuring the levelness between the base plate 117 and the preheating ring 116, the levelness between them can be adjusted if their relative levelness is poor, so as to ensure that the levelness between the base plate and the preheating ring is relatively high, thereby maximizing the process uniformity during epitaxial processes.

[0034] like Figure 2 and Figure 3 As shown, the position detection device includes a support structure, a motion structure, and a detection mechanism. The support structure includes an upper cover plate 201, a lower cover plate 202, and a mounting base 203 stacked sequentially from top to bottom. The upper cover plate 201 is disposed on the upper surface of the lower cover plate 202, and the lower cover plate 202 is disposed on the upper surface of the mounting base 203. The upper cover plate 201, the lower cover plate 202, and the mounting base 203 are concentrically arranged. The motion structure includes a guide rail 204 and a slider 210 that slides along the guide rail. The guide rail 204 is mounted on the upper surface of the lower cover plate 202 and is disposed along the edge of the upper cover plate 201. The detection mechanism 207 is fixedly connected to the slider 210, and the measuring area of ​​the detection mechanism is at least aligned with the gap between the base plate and the reference object.

[0035] When position detection of the substrate is required, the mounting base 203 can replace the upper flange 114 and be installed in the process chamber, thereby fixing the position detection device on the semiconductor equipment. Since the position detection device is located outside the process space 120, it is not necessary to open the upper dome 105 when measuring the position of the substrate 117, which can effectively avoid substrate contamination and damage.

[0036] In some embodiments, the reference object is arranged around the base plate, and the detection mechanism measures the distances between the detection points on the base plate and the detection points on the reference object and the detection mechanism, and / or the distances between the detection points on the base plate and the detection points on the reference object. Specifically, the detection mechanism can be one of an infrared ranging sensor, an ultrasonic ranging sensor, or a laser ranging sensor. The detection points on the base plate are located at the edge of the base plate and facing the surface of the upper dome 105. When the reference object is a preheating ring, the detection points of the reference object are located on the surface of the preheating ring near the edge of the base plate and facing the upper dome. The detection mechanism 207 measures the distances between multiple detection points on the base plate and the detection mechanism, referred to as the first distance; the detection mechanism 207 measures the distances between multiple detection points on the corresponding reference object and the detection mechanism, referred to as the second distance. If the first distance and the second distance are equal or approximately equal, the base plate and the reference object are considered to be in a parallel state, with good levelness; if the first distance and the second distance are not equal, the levelness between the base plate and the reference object is poor, and the levelness of the base plate can be appropriately adjusted according to the measurement results. The testing mechanism 207 measures the distances between multiple testing points on the base plate and the corresponding testing points on the reference object, which are called the first gaps. If the multiple first gaps are equal or approximately equal, the base plate is considered to be basically at the center of the process chamber. When the reference object is a preheating ring, the distance between the edge of the preheating ring and the edge of the base plate is the same, and the preheating ring can uniformly heat the base plate.

[0037] In some embodiments, the upper cover plate 201 is a transparent circular plate, and the upper cover plate has first mounting holes on its edge, which are equidistantly distributed along the edge of the upper cover plate. To reduce the overall weight of the position detection device, the upper cover plate can be made of plastic, such as polyethylene terephthalate (PET) or polycarbonate (PC), or other transparent lightweight materials, and is not limited thereto. The upper cover plate 201 provides positioning for the subsequent installation of the guide rail 204. The outer diameter of the upper cover plate is the same as the inner diameter of the circular guide rail. During installation, the inner edge of the guide rail abuts against the edge of the upper cover plate to complete the positioning, providing convenience for installation. The upper cover plate has first mounting holes on its edge, which are four threaded holes. The number and type of the first mounting holes are not limited and can be determined according to the size of the upper cover plate.

[0038] In some embodiments, the circular upper cover plate 201 and lower cover plate 202 are integrally formed, and a mounting groove is formed between the upper cover plate 201 and the lower cover plate 202. The mounting groove can provide positioning for subsequent guide rail installation. The structure of the upper cover plate 201 and the lower cover plate 202 not only provides support for the installation of the detection mechanism 207, but also prevents the workpiece from falling and damaging the upper dome or base plate during the subsequent installation and detection of the position detection device.

[0039] In some embodiments, such as Figure 4 As shown, the lower cover plate 202 is a transparent annular or nearly circular ring. A circular through hole 2021 is provided at the center of the lower cover plate. The size of the circular through hole 2021 is adapted to the size of the upper cover plate 201. A second mounting hole 2022, corresponding to the first mounting hole, is provided on the inner edge of the lower cover plate near the circular through hole. The first mounting hole and the second mounting hole 2022 are connected by a first fastener. The first mounting hole and the second mounting hole are fixedly connected by screws.

[0040] In some embodiments, the lower cover plate 202 is provided with guide rail mounting holes 2023, which are located on the side of the second mounting hole 2022 away from the circular through hole. In some embodiments, when the circular guide rail 204 is a one-piece molded guide rail, the distance between adjacent guide rail mounting holes is equal; in some embodiments, the guide rail is composed of multiple segments spliced ​​together, and further, the circular guide rail is composed of 6 single-segment guide rails at 60° spliced ​​together, and the guide rail mounting holes 2023 are set according to the needs of the guide rail.

[0041] The outer edge of the lower cover plate 202 is provided with a third mounting hole 2025. The third mounting holes are equidistantly distributed along the outer edge of the lower cover plate, and there are three third mounting holes 2025. The number of third mounting holes can be determined according to the size of the lower cover plate and is not limited thereto. A detection positioning hole 2024 is provided between the guide rail mounting hole and the third mounting hole. There are eight detection positioning holes 2024, and the number of detection positioning holes can be determined according to actual needs.

[0042] In some embodiments, such as Figure 5 and Figure 6As shown, the mounting base 203 is an annular mounting plate, and its dimensions are adapted to the dimensions of the sidewalls and upper dome 105 of the process chamber. The upper surface of the mounting base 203 has a fourth mounting hole 2031 corresponding to the third mounting hole. The third mounting hole 2025 and the fourth mounting hole 2031 are fixedly connected by a second fastener, which is a screw. The mounting base 203 has a lower surface opposite to the upper surface, and the lower surface has a circumferentially arranged annular groove 2032. An elastic element is installed within the annular groove 2032. The annular groove is a dovetail groove, and an annular elastic element is installed within it. The annular elastic element is used to separate the mounting base from the quartz upper dome, preventing the upper dome from breaking due to contact. To reduce the overall weight of the position detection device and improve disassembly convenience, the mounting base is made of transparent plastic material, such as polycarbonate (PC), but other transparent lightweight materials can also be used, and are not limited to this.

[0043] In some embodiments, the mounting base is further provided with a handle 208, which allows the entire position detection device to be removed from the semiconductor device and to assist in its installation on the semiconductor device. To improve the ease of use of the handle 208, multiple handles can be provided, and these handles can be fixed to the mounting base with screws. Specifically, the number of handles can be two, three, or four, with each handle installed at a different position on the mounting base. The handles provide good assistance during the installation and removal of the position detection device.

[0044] In some embodiments, such as Figure 1 and Figure 7 As shown, the detection mechanism 207 and the slider 210 are fixedly connected by an adapter plate 205. The adapter plate includes a slider mounting surface 2056, a detection mechanism mounting surface 2051, and a size adjustment part 2053 connecting the slider mounting surface and the detection mechanism mounting surface. The slider mounting surface is provided with a fifth mounting hole 2055, and the slider is provided with a mounting hole corresponding to the fifth mounting hole. The fifth mounting hole and the mounting hole on the slider are fixedly connected by screws. The detection mechanism mounting surface is provided with a sixth mounting hole, and the adapter plate is provided with a mounting hole corresponding to the sixth mounting hole. The sixth mounting hole and the mounting hole on the adapter plate are fixedly connected by screws.

[0045] In some embodiments, the size adjustment part is further provided with at least one fifth mounting hole 2055. By selecting the fifth mounting hole 2055 at different positions, the relative position of the detection mechanism and the slider can be changed, thereby changing the detection position of the detection mechanism so that the detection position of the detection mechanism is aligned with the gap between the base plate and the reference object. Furthermore, the detection position of the detection mechanism can be adjusted by changing the length of the size adjustment part, that is, by selecting adapter plates of different lengths as needed. The size adjustment part is provided with a seventh mounting hole 2054, which is fixedly connected to the slider limiting member 206.

[0046] In some embodiments, the slider limiting component is a spring pin 206; a rivet nut is provided in the seventh mounting hole 2054, and the spring pin 206 is fixedly connected to the rivet nut. A hexagonal nut is also provided between the spring pin and the rivet nut. By fixing the spring pin in the detection positioning hole, the detection point of the detection mechanism can be defined. By providing a hexagonal nut between the spring pin and the rivet nut, the posture of the spring pin can be adjusted so that the spring pin faces the operator, facilitating positioning operations.

[0047] In some embodiments, the detection mechanism is a laser rangefinder sensor. The laser rangefinder sensor is mounted on the top of the upper dome via a support structure and a motion structure. Driven by a slider, the laser rangefinder sensor moves along a guide rail. The slider can be manually driven or driven in other ways, sequentially passing through multiple detection and positioning holes on the surface of the lower cover plate. The laser beam emitted by the laser rangefinder sensor forms a measurement area, which is aligned with the gap between the base plate and the preheating ring. The gap refers to the first clearance between the base plate and the preheating ring. The laser rangefinder sensor can measure the gap between the base plate and the preheating ring, as well as the height difference between them. By comparing the relevant data, it can determine whether the base plate is installed in a suitable position.

[0048] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. Additionally, the term "connection" in this document indicates a direct connection between A and B, or an indirect connection between A and B, such as an indirect connection between A and B via C, or even via C and D, or more components. The connection between A and B can be integral or separate, detachable or fixed. The term "optional" in this document indicates that the technical feature can be combined with or not combined with any feature in the document.

[0049] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A position detection device for a base plate within a semiconductor device cavity, wherein the cavity contains a base plate and a reference object, characterized in that, The position detection device includes a support structure, a motion structure, and a detection mechanism, wherein, The support structure includes an upper cover plate, a lower cover plate, and a mounting base stacked sequentially from top to bottom. The upper cover plate is a circular plate, which is disposed on the upper surface of the lower cover plate, and the lower cover plate is disposed on the upper surface of the mounting base. The upper cover plate, the lower cover plate, and the mounting base are concentrically arranged. The motion structure includes a guide rail and a slider that slides along the guide rail, wherein the guide rail is mounted on the upper surface of the lower cover plate and is arranged along the edge of the upper cover plate; The detection mechanism is fixedly connected to the slider, and the measurement area of ​​the detection mechanism is at least aligned with the gap between the base plate and the reference object.

2. The position detection device for the base plate inside a semiconductor device cavity according to claim 1, characterized in that, The upper cover plate is a transparent plate, and the upper cover plate has a first mounting hole on its edge, which is equidistantly distributed along the edge of the upper cover plate.

3. The position detection device for the base plate inside a semiconductor device cavity according to claim 2, characterized in that, The lower cover plate is a transparent ring with a circular through hole at its center. The size of the circular through hole is adapted to the size of the upper cover plate. The lower cover plate has a second mounting hole corresponding to the first mounting hole near the inner edge of the circular through hole. The first mounting hole and the second mounting hole are connected by a first fastener.

4. The position detection device for the base plate inside a semiconductor device cavity according to claim 3, characterized in that, The lower cover plate is also provided with a guide rail mounting hole, which is located on the side of the second mounting hole away from the circular through hole; the outer edge of the lower cover plate is provided with a third mounting hole, which is equidistantly distributed along the outer edge of the lower cover plate; a detection positioning hole is provided between the guide rail mounting hole and the third mounting hole.

5. The position detection device for the base plate inside a semiconductor device cavity according to claim 4, characterized in that, The mounting base is an annular mounting plate. The upper surface of the mounting base is provided with a fourth mounting hole corresponding to the third mounting hole. The third mounting hole and the fourth mounting hole are connected by a second fastener. The mounting base has a lower surface opposite to the upper surface. The lower surface of the mounting base is provided with an annular groove arranged circumferentially. An elastic element is provided in the annular groove.

6. The position detection device for the base plate inside a semiconductor device cavity according to claim 5, characterized in that, The detection mechanism and the slider are fixedly connected by an adapter plate. The adapter plate includes a slider mounting surface, a detection mechanism mounting surface, and a size adjustment part connecting the slider mounting surface and the detection mechanism mounting surface. The slider mounting surface is provided with a fifth mounting hole, and the adapter plate is fixedly connected to the slider through the fifth mounting hole. The detection mechanism mounting surface is provided with a sixth mounting hole, and the adapter plate is fixedly connected to the detection mechanism through the sixth mounting hole.

7. The position detection device for the base plate inside a semiconductor device cavity according to claim 6, characterized in that, The size adjustment part is also provided with at least one fifth mounting hole, which makes the measuring area of ​​the detection mechanism face the gap between the base plate and the reference object; the size adjustment part is also provided with a seventh mounting hole, which is fixedly connected to the slider limiting member.

8. The position detection device for the base plate inside a semiconductor device cavity according to claim 7, characterized in that, The slider limiting component is a spring pin; a rivet nut is provided in the seventh mounting hole, the spring pin is fixedly connected to the rivet nut, and a hexagonal nut is also provided between the spring pin and the rivet nut.

9. The position detection device for the base plate inside a semiconductor device cavity according to claim 8, characterized in that, The guide rail is a circular guide rail, which is integrally formed or is composed of multiple segments spliced ​​together.

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