High-precision film thickness measuring equipment and system

Abstract

The utility model provides high-precision film thickness measuring equipment and a high-precision film thickness measuring system. The high-precision film thickness measuring equipment comprises a crystal control probe, a film thickness gauge, a first cavity and a vacuum cavity, the first cavity is internally provided with an oscillation bag and is filled with air; the vacuum cavity at least comprises a first cavity and a crystal control probe; the oscillation bag is arranged in the first cavity, and the crystal control probe is installed on the first side face of the first cavity. The crystal control probe is welded with the oscillation bag; the oscillation bag is connected with a film thickness gauge; the crystal control probe is used for collecting a measurement signal of the to-be-measured material, and the measurement signal is an analog signal; the oscillation packet is used for converting the measurement signal into a digital signal; and the film thickness meter is used for determining a film thickness parameter of the to-be-measured material according to the digital signal. According to the high-precision film thickness measuring device, the accuracy of film thickness measurement can be improved by setting the connection mode of the oscillation bag and the crystal control probe, and the precision of film thickness measurement can be improved by adjusting the position structure between the oscillation bag and the film thickness gauge.

Description

Technical Field

[0001] This utility model relates to the field of vacuum coating film thickness control technology, and in particular to a high-precision film thickness measurement device and system. Background Technology

[0002] Currently, in optical film products, the thickness of the film directly affects the performance of the manufactured film. Therefore, precise control of film thickness is extremely important in the production of optical films. The commonly used method for measuring film thickness is the quartz crystal thickness measurement method. This method calculates the coating quality based on the change in the oscillation frequency of the quartz crystal during the coating process. The film thickness is then calculated using the density of the coating material and the coating area. The quartz crystal thickness measurement method offers high accuracy in film thickness measurement.

[0003] Existing quartz crystal film thickness measurement equipment mainly includes a crystal control probe, a vacuum flange, an oscillating package, and a film thickness gauge. The crystal control probe is placed inside a vacuum chamber, while the oscillating package and film thickness gauge are placed on the atmospheric side. The signal from the crystal control probe is transmitted to the oscillating package through the vacuum flange, and the oscillating package transmits the signal to the film thickness gauge to complete the film thickness measurement. However, the signal line from the crystal control probe to the oscillating package transmits an analog signal. The connections between the crystal control probe and the vacuum flange, and between the vacuum flange and the oscillating package, are all made using pluggable signal cables. When transmitting analog signals, the pluggable connection points often experience impedance changes due to loosening of the connections, which affects the amplitude and frequency of the analog signal. This causes errors in the digital signal output by the oscillating package, resulting in inaccurate film thickness measurement.

[0004] Therefore, improving the accuracy and precision of film thickness measurement is an urgent problem to be solved. Utility Model Content

[0005] This utility model provides a high-precision film thickness measurement device and system. By setting the connection method between the oscillation package and the crystal control probe, and adjusting the positional structure between the oscillation package and the film thickness gauge, the accuracy and precision of film thickness measurement are improved.

[0006] In a first aspect, this utility model provides a high-precision film thickness measurement device, which includes: a crystal-controlled probe, a film thickness gauge, a first cavity, and a vacuum cavity; the first cavity is provided with an oscillation bag and filled with air; the vacuum cavity includes at least the first cavity and the crystal-controlled probe;

[0007] The oscillation pack is placed inside the first cavity, and the crystal control probe is mounted on the first side of the first cavity; the crystal control probe and the oscillation pack are welded together; the oscillation pack is connected to the film thickness gauge;

[0008] The crystal-controlled probe is used to acquire measurement signals of the material under test, and the measurement signals are analog signals.

[0009] The oscillation packet is used to convert the measurement signal into a digital signal;

[0010] The film thickness gauge is used to determine the film thickness parameters of the material to be tested based on the digital signal.

[0011] Furthermore, the high-precision film thickness measurement device also includes: a vacuum flange; a first surface of the vacuum cavity has a first groove, the vacuum flange is embedded in the first groove, and the first surface of the vacuum flange is located inside the vacuum cavity, while the second surface of the vacuum flange is located outside the vacuum cavity; the film thickness gauge is placed outside the vacuum cavity; the oscillation package is connected to the film thickness gauge through the vacuum flange; the vacuum flange is used to transmit the digital signal from inside the vacuum cavity to the film thickness gauge outside the vacuum cavity.

[0012] Furthermore, a first transparent window is provided on the first surface of the vacuum cavity, and the film thickness gauge and the first transparent window are arranged parallel to each other along the first surface of the vacuum cavity and are positioned opposite each other; the first transparent window is used to provide a channel for the film thickness gauge to collect optical signals, so that the film thickness gauge can collect the optical information of the material under test and observe the forming condition of the material under test.

[0013] Furthermore, the first groove is located at the center of the top of the vacuum chamber, and the outer contour of the vacuum flange is interference-fitted with the inner contour of the first groove, so that the vacuum flange can be tightly embedded in the first groove.

[0014] Furthermore, a first fixed bracket is provided inside the first cavity, and the first fixed bracket is fixedly connected to the first inner wall of the first cavity. The oscillation pack is installed on the first fixed bracket, and the connection between the oscillation pack and the first fixed bracket is made of shock-resistant material to reduce the vibration of the oscillation pack during operation, thereby improving the stability of the high-precision film thickness measurement device.

[0015] Furthermore, the ultimate pressure range within the vacuum chamber is 10. -3 Pa-10 -5 Pa; at the first moment, the vacuum chamber is filled with a first volume of a first gas, the first gas including at least one of argon, nitrogen or oxygen.

[0016] Furthermore, the surface of the first cavity is provided with a heat-insulating material, which is used to reduce the impact of temperature changes inside the vacuum cavity on the internal structure of the oscillating package.

[0017] Furthermore, the oscillation package integrates a signal processing module and an analog-to-digital conversion module. The oscillation package is designed as a multilayer printed circuit board, and the analog-to-digital conversion module is vertically arranged on the upper layer of the signal processing module. The signal processing module is used to filter the measurement signal acquired by the crystal control probe to obtain a first analog signal. The analog-to-digital conversion module is used to convert the first analog signal into the digital signal, thereby reducing the impedance generated during the transmission of the measurement signal acquired by the crystal control probe to the film thickness gauge.

[0018] Furthermore, the first cavity is placed inside the vacuum cavity, and the first cavity and the crystal control probe are horizontally arranged along the first plane of the vacuum cavity. The first cavity is made of metal and is kept internally sealed. The first cavity includes at least an oscillation package. The first cavity is used to seal the oscillation package to prevent the multilayer printed circuit board structure of the oscillation package from contaminating the gas inside the vacuum cavity.

[0019] Secondly, this utility model embodiment also provides a high-precision film thickness measurement system, which includes the high-precision film thickness measurement equipment described above.

[0020] It can be seen that the following beneficial effects are achieved by adopting the embodiments of this utility model:

[0021] The high-precision film thickness measurement device of this utility model embodiment includes: a crystal-controlled probe, a film thickness gauge, a first cavity, and a vacuum cavity; an oscillation pack is disposed in the first cavity and filled with air; the vacuum cavity includes at least the first cavity and the crystal-controlled probe; the oscillation pack is placed in the first cavity, and the crystal-controlled probe and the oscillation pack are welded together; the oscillation pack is connected to the film thickness gauge; the crystal-controlled probe is used to acquire measurement signals of the material to be measured, and the measurement signals are analog signals; the oscillation pack is used to convert the measurement signals into digital signals; the film thickness gauge is used to determine the film thickness parameters of the material to be measured based on the digital signals. Thus, this high-precision film thickness measurement device improves the accuracy of film thickness measurement by setting the connection method of the oscillation pack and the crystal-controlled probe, and improves the precision of film thickness measurement by adjusting the positional structure between the oscillation pack and the film thickness gauge. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1This is a schematic diagram of the structure of a high-precision film thickness measuring device provided in an embodiment of this utility model;

[0024] Figure 2 This is another structural schematic diagram of a high-precision film thickness measuring device provided in this embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of the architecture of a high-precision film thickness measurement device provided in an embodiment of this utility model. Detailed Implementation

[0026] To enable those skilled in the art to better understand the present application, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0027] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0028] It should be understood that the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document indicates that the preceding and following related objects are in an "or" relationship. In the embodiments of this utility model, "multiple" refers to two or more.

[0029] In this embodiment of the invention, "at least one item" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. "One or more" refers to one or more items, while "multiple" refers to two or more items. For example, "at least one item" of a, b, or c can represent the following seven cases: a, b, c; a and b; a and c; b and c; a, b, and c. Each of a, b, and c can be an element or a set containing one or more elements.

[0030] The term "connection" in this embodiment refers to various connection methods, such as direct connection or indirect connection, to achieve communication between devices. This embodiment does not limit the scope of the term.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] The high-precision film thickness measurement system of this invention can include any high-precision film thickness measurement device.

[0033] The following is an explanation of the relevant terms used in this application:

[0034] Oscillator Packet: In a quartz crystal oscillator system, it is usually connected in series with the crystal control probe and the film thickness gauge. The oscillator pack can include components such as transistors, capacitors, and inductors. Through the switching action of transistors and the energy storage principle of inductors and the discharge principle of capacitors, electrical energy is converted into magnetic energy and then back into electrical energy, thereby driving the crystal oscillator to achieve high-speed vibration. It also processes the vibration signal monitored by the crystal control probe and transmits it to the film thickness gauge to calculate the film thickness.

[0035] Film thickness gauge: Also known as a thin film thickness meter, it is a device used to measure the thickness of thin films and coatings. In a quartz crystal oscillator system, the film thickness gauge calculates the film thickness by monitoring changes in the vibration state of the crystal oscillator.

[0036] Film thickness measurement equipment in related technologies mainly includes a crystal control probe, a vacuum flange, an oscillating package, and a film thickness gauge. The crystal control probe is placed inside a vacuum chamber, while the oscillating package and film thickness gauge are placed on the atmospheric side. The signal from the crystal control probe is transmitted to the oscillating package through the vacuum flange, and the oscillating package transmits the signal to the film thickness gauge to complete the film thickness measurement. However, the signal line from the crystal control probe to the oscillating package transmits an analog signal. The connections between the crystal control probe and the vacuum flange, and between the vacuum flange and the oscillating package, are all made using pluggable signal cables. When transmitting analog signals, the pluggable connection points often experience impedance changes due to loosening of the connections, which affects the amplitude and frequency of the analog signal. This causes errors in the digital signal output by the oscillating package, resulting in inaccurate film thickness measurement.

[0037] To address the aforementioned problems, this utility model provides a high-precision film thickness measurement device, comprising: a crystal-controlled probe, a film thickness gauge, a first cavity, and a vacuum cavity; an oscillation chamber is disposed within the first cavity and filled with air; the vacuum cavity includes at least the first cavity and the crystal-controlled probe; the oscillation chamber is placed within the first cavity, and the crystal-controlled probe and the oscillation chamber are welded together; the oscillation chamber is connected to the film thickness gauge; the crystal-controlled probe is used to acquire measurement signals of the material under test, the measurement signals being analog signals; the oscillation chamber is used to convert the measurement signals into digital signals; and the film thickness gauge is used to determine the film thickness parameters of the material under test based on the digital signals. Thus, this high-precision film thickness measurement device improves the accuracy of film thickness measurement by setting the connection method between the oscillation chamber and the crystal-controlled probe, and further improves the precision of film thickness measurement by adjusting the positional structure between the oscillation chamber and the film thickness gauge.

[0038] The following is combined with Figure 1 The structure of a high-precision film thickness measuring device according to an embodiment of this utility model will be described. Figure 1 This is a schematic diagram of the structure of a high-precision film thickness measuring device provided in an embodiment of the present invention. The high-precision film thickness measuring device 10 includes a vacuum chamber 101, a crystal control probe 102, a first connecting component 103, an oscillation package 104, a first cavity 105, a vacuum flange 106, a film thickness gauge 107, and a first transparent window 108.

[0039] The oscillating package 104 is connected to the crystal control probe 102 via the first connecting component 103. The connection between the crystal control probe 102 and the signal line of the oscillating package 104 is a soldered connection. In the soldering area between the crystal control probe 102 and the oscillating package 104 and the wire, the soldered part is protected with a material that is resistant to thermal expansion and contraction. This ensures that the soldered connection can maintain stability in the high-temperature environment of the coating and avoids loosening or breakage due to temperature changes. This material that is resistant to thermal expansion and contraction can not only cope with changes under high-temperature conditions, but also enhance the mechanical strength of the soldered area and improve the overall reliability of the equipment.

[0040] The first connecting component 103 has a through hole inside, through which one end of a signal line can be connected to the crystal control probe 102, and the other end of the signal line can be connected to the oscillator 104. The first connecting component 103 is used to mount the crystal control probe 102 on the first side of the first cavity 105, with the crystal control probe 102 and the first cavity 105 tightly mounted back-to-back to reduce the signal transmission distance between the crystal control probe 102 and the oscillator 104. The material of the first connecting component 103 can be copper, nickel-plated alloy, etc., and is not limited thereto.

[0041] The oscillator 104 is placed inside the first cavity 105, which is a sealed metal cylindrical cavity. The oscillator 104 is connected to the vacuum flange 106 via a wire. The main function of the vacuum flange 106 is to transmit the digital signal output from the oscillator 104 from inside the vacuum cavity 101 to the external film thickness gauge 107 for accurate film thickness measurement, ensuring stable signal transmission and efficient system operation. Furthermore, the oscillator 104 has a multi-layer printed circuit board (PCB) structure. The connection between the oscillator 104 and the vacuum flange 106 uses shielded signal wires, and the wire length is controlled based on the distance between the first cavity 105 and the vacuum flange 106 to ensure interference-free signal transmission. One side of the vacuum cavity 101 has a first transparent window 108, made of a high-transmittance and high-strength material, such as quartz glass or coated glass, which is not limited here. The vacuum cavity 101 is filled with a pressure range 10... -3 Pa~10 -5 Vacuum pressure Pa.

[0042] In one possible embodiment, the limiting pressure range within the vacuum chamber is 10. -3 Pa-10 -5 Pa; at the first moment, the vacuum chamber is filled with a first volume of a first gas, the first gas including at least one of argon, nitrogen or oxygen.

[0043] The first moment is the moment when the material under test begins to work during the coating process. The first volume is smaller than the volume of the vacuum chamber 101, and the first volume is determined based on the pressure inside the vacuum chamber 101.

[0044] The vacuum environment design effectively isolates the testing process from impurities and water vapor in the air, reducing measurement errors. Precise pressure control within the vacuum chamber ensures high stability of the measurement results. Furthermore, the primary gas filling the vacuum chamber can be argon, nitrogen, or oxygen, with no specific limitation. Using a primary gas further reduces measurement deviations caused by chemical factors on the inner wall of the vacuum chamber and the material under test. Simultaneously, the uniform distribution of the primary gas helps maintain a consistent measurement environment, improving the overall reliability and accuracy of the measurement.

[0045] In one possible embodiment, the oscillation packet is designed as a multilayer printed circuit board structure, and the analog-to-digital conversion module is vertically disposed on the upper layer of the signal processing module. The signal processing module is used to filter the measurement signal acquired by the crystal control probe to obtain a first analog signal. The analog-to-digital conversion module is used to convert the first analog signal into the digital signal, thereby reducing the impedance generated during the transmission of the measurement signal acquired by the crystal control probe to the film thickness gauge.

[0046] The oscillator 104 employs a multi-layer printed circuit board structure to reduce mutual interference between signals. The vertical arrangement of the signal processing module and the analog-to-digital conversion module effectively shortens the physical connection distance between them, reducing signal transmission losses. Furthermore, the multi-layer printed circuit board provides a better ground plane and power distribution network, enhancing the electromagnetic compatibility of the entire oscillator and enabling stable operation in complex electromagnetic environments. This ensures efficient and accurate conversion and transmission of the measurement signals acquired by the crystal-controlled probe 102.

[0047] In one possible embodiment, the high-precision film thickness measuring device further includes: a vacuum flange; a first surface of the vacuum cavity has a first groove, the vacuum flange is embedded in the first groove, and the first surface of the vacuum flange is located inside the vacuum cavity, while the second surface of the vacuum flange is located outside the vacuum cavity; the film thickness gauge is placed outside the vacuum cavity; the oscillation package is connected to the film thickness gauge through the vacuum flange; the vacuum flange is used to transmit the digital signal from inside the vacuum cavity to the film thickness gauge outside the vacuum cavity.

[0048] The vacuum flange 106 is essentially a connector, which can be made of metallic materials such as stainless steel or aluminum alloy, possessing good structural strength and rigidity to ensure the airtightness of the vacuum chamber. Its internal structure includes a signal transmission channel to ensure that digital signals are not interfered with when switching between internal and external environments.

[0049] In one possible embodiment, the first groove is located at the center of the top of the vacuum chamber, and the outer contour of the vacuum flange is interference-fitted with the inner contour of the first groove, so that the vacuum flange can be tightly embedded in the first groove.

[0050] The vacuum flange 106 is embedded in the first groove, which is located at the top center of the vacuum chamber 101. The outer contour of the vacuum flange 106 is interference-fitted with the inner contour of the first groove, so that the vacuum flange can be tightly embedded in the first groove to prevent the vacuum gas in the vacuum chamber 101 from being contaminated.

[0051] In one possible embodiment, a first transparent window is provided on the first surface of the vacuum cavity, and the film thickness gauge and the first transparent window are arranged parallel to each other and opposite to each other along the first surface of the vacuum cavity; the first transparent window is used to provide a channel for the film thickness gauge to collect optical signals, so that the film thickness gauge can collect the optical information of the material under test and observe the forming condition of the material under test.

[0052] The first transparent window 108 serves to provide an unobstructed optical signal acquisition channel for the thickness gauge, ensuring accurate and clear observation of the forming condition of the material under test in a vacuum environment. Specifically, since the vacuum chamber 101 is typically kept highly sealed to avoid interference from the external environment, but the thickness gauge needs to perform non-contact observation of the material under test through optical means, the first transparent window 108 is made of a high-transmittance material, such as quartz glass or coated glass. Its material properties can reduce the reflection and refraction loss of light signals, while also possessing high strength and corrosion resistance to meet the requirements of the vacuum chamber.

[0053] The first transparent window 108 is positioned parallel to and opposite to the film thickness gauge 107, allowing the film thickness gauge to directly observe the material under test through this window. Through the first transparent window 108, the film thickness gauge 107 can collect real-time data on the forming status of the material under test, such as whether the forming is uniform and whether there are defects, etc., without limitation, thereby ensuring the accuracy and reliability of the measurement.

[0054] As can be seen, this embodiment of the invention improves the accuracy of film thickness measurement by employing a welding connection between the crystal-controlled probe and the oscillating package, and by placing the oscillating package inside a vacuum chamber. Furthermore, by adjusting the signal output method of the oscillating package, it is ensured that the signal from the oscillating package can be stably transmitted to the film thickness gauge, thereby guaranteeing the accuracy of film thickness measurement.

[0055] Please see Figure 2 , Figure 2 This is another structural schematic diagram of a high-precision film thickness measuring device provided in this utility model embodiment. The high-precision film thickness measuring device 20 includes a vacuum chamber 201, a crystal control probe 202, a first connecting component 203, an oscillation package 204, a film thickness gauge 205, a first chamber 206, and a first fixed bracket 207.

[0056] The oscillation pack 204 and the film thickness gauge 205 are placed inside the first cavity 206 and connected by wires. The crystal control probe 202 and the first cavity 206 are located inside the vacuum cavity 201. The first cavity 206 integrates a first connecting component 203, which connects to the crystal control probe 202, and the crystal control probe 202 is mounted back-to-back with the first cavity 206. The first cavity 206 is made of metal, possessing high strength and sealing performance, effectively preventing contamination of the gas inside the vacuum cavity. The oscillation pack 204 is sealed within the first cavity 206, preventing the PCB board structure of the oscillation pack from contacting the vacuum environment of the vacuum cavity during operation, reducing potential contamination risks.

[0057] In one possible embodiment, the first cavity is placed inside the vacuum cavity, and the first cavity and the crystal control probe are horizontally arranged along a first plane of the vacuum cavity. The first cavity is made of metal and is kept internally sealed. The first cavity includes at least an oscillation package. The first cavity is used to seal the oscillation package to prevent the multilayer printed circuit board structure of the oscillation package from contaminating the gas inside the vacuum cavity.

[0058] In one possible embodiment, a first fixed bracket is disposed inside the first cavity, and the first fixed bracket is fixedly connected to the first inner wall of the first cavity. The oscillation pack is mounted on the first fixed bracket, and the connection between the oscillation pack and the first fixed bracket is made of shock-resistant material to reduce the vibration of the oscillation pack during operation, thereby improving the stability of the high-precision film thickness measurement device.

[0059] The first cavity 206 has a first fixed bracket 207 installed inside, which is fixed to the inner wall of the first cavity 206. The oscillation pack 204 is fixed to the first fixed bracket 207 and is connected to the first fixed bracket 207 by a vibration-damping material. The use of the vibration-damping material can effectively reduce the vibration experienced by the oscillation pack during operation, thereby improving the stability of the precision film thickness measurement equipment.

[0060] The first cavity 206 can be a cylinder, cuboid, cube, frustum, or truncated cone, or a combination of a cylinder and a cuboid, or a combination of a cylinder and a truncated cone, etc., without limitation. The first cavity 206 is made of high-strength metal material to prevent the PCB board from contaminating the vacuum environment inside the vacuum cavity. These high-strength metal materials can be copper-nickel alloy, stainless steel alloy, or titanium alloy, etc., without limitation.

[0061] In one possible embodiment, the surface of the first cavity is provided with a heat-insulating material, which is used to reduce the impact of temperature changes within the vacuum cavity on the internal structure of the oscillating package.

[0062] The thermal insulation material possesses key characteristics such as low thermal conductivity and high stability. It can be either ceramic fiber or silicon dioxide, with no specific limitation. When a temperature difference exists between the inside and outside of the first chamber, the thermal insulation material effectively hinders heat transfer, preventing the performance changes, parameter drift, or even damage to the precision electronic components inside the oscillator pack, such as capacitors, resistors, and chips, due to thermal expansion and contraction caused by high or low temperatures. This ensures that the oscillator pack maintains stable signal processing capabilities and accuracy. Furthermore, the thermal insulation material can maintain a relatively constant local ambient temperature around the oscillator pack, reducing signal noise caused by temperature fluctuations. This makes the measurement signals acquired by the crystal-controlled probe more stable and reliable during transmission and conversion, thereby improving the measurement accuracy and reliability of the entire high-precision film thickness measurement equipment.

[0063] As can be seen, the structural design of this utility model embodiment, by innovatively setting the oscillation package and film thickness gauge inside the first cavity, ensures that the measurement signal can be stably and reliably transmitted to the film thickness gauge, reduces the impedance generated on the signal transmission line of the high-precision film thickness measurement equipment, thereby improving the accuracy and precision of film thickness measurement.

[0064] Please see Figure 3 , Figure 3 This is a schematic diagram of the architecture of a high-precision film thickness measurement device provided in an embodiment of the present invention. The high-precision film thickness measurement device 30 includes: a vacuum chamber 301, a workpiece frame 302, a material to be measured 303, a crystal control probe 304, a first connecting component 305, an oscillation package 306, a first chamber 307, a second connecting line 308, a vacuum flange 309, a third connecting line 310, a film thickness gauge 311, an industrial control computer 312, and a sputtering target 313.

[0065] The crystal control probe 304 and the oscillator 306 are connected via a first connecting component 305. The first connecting component 305 includes a signal transmission line for transmitting the analog signal from the crystal control probe 304 to the oscillator 306 for processing. The first connecting component is integrated into a first cavity 307 and fixes the crystal control probe 304, with the crystal control probe 304 and the first cavity 307 connected back-to-back. This back-to-back connection reduces the length of the signal connection line from the crystal control probe to the oscillator, and the placement of the signal line in the first connecting component 305 reduces signal noise interference, thus improving the accuracy of film thickness detection. Furthermore, the connection between the first connecting component 305 and the crystal control probe 304 and the oscillator 306 is a welded connection to reduce impedance changes at the connection point caused by vibration of the crystal control probe 304.

[0066] The oscillation pack 306 is placed inside the first cavity 307, which is placed on the workpiece frame 302. The material to be tested 303 is placed on the crystal control probe 304. The crystal control probe 304 and the first cavity 307 are fixed on the workpiece frame 302 and rotate together with the workpiece frame 302. The sputtering target 313 sprays source material onto the material to be tested 303 to adjust the film thickness of the material to be tested 303.

[0067] The signal lines, second connecting line 308, and third connecting line 310 in the first connecting component 305 can be of the same type or different types; this is not limited here. Furthermore, since the signal lines in the first connecting component 305 transmit analog signals, the metal structure of the first connecting component 305 can provide anti-interference for the connection signal lines between the crystal control probe 304 and the oscillator package 306, thereby reducing signal interference. The second connecting line 308 and the third connecting line 310 transmit digital signals. The lengths of the second connecting line 308 and the third connecting line 310 should be less than 50 meters; the specific lengths are set according to the measurement conditions and are not limited here.

[0068] In one possible embodiment, when the operation begins, the user operates the industrial control computer 312 to execute the film thickness parameter detection process. The industrial control computer 312 sends a series of instructions to the film thickness gauge 311, including: film thickness initialization instructions, film thickness calculation parameters (material density) of the source material, and the industrial control computer 312 also sends a film thickness zeroing command to the film thickness gauge 311 and transmits the film thickness acquisition position parameters to the film thickness gauge 311. Then, the workpiece frame 302 rotates, and the crystal control probe 304 fixed on the workpiece frame 302 also rotates with the workpiece frame. At this time, the sputtering target 313 can spray the coating source material onto the material to be tested 303. When the crystal control probe 304 is in the set position and its frequency reaches a stable state, the film thickness gauge 311 begins to acquire the frequency data of the crystal control probe 304. Then, the film thickness gauge 311 uses the calibrated frequency value to calculate the film thickness and sends the film thickness data to the industrial control computer 312.

[0069] This invention also provides a high-precision film thickness measurement system, which includes the aforementioned high-precision film thickness measurement device.

[0070] In the above embodiments, the descriptions of each embodiment of the present invention have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0071] It should be noted that all electronic components, circuits, integrated modules and materials involved in this embodiment are existing technologies. Professionals in related fields can fully implement them according to the process and principle of this utility model. The assembly process of the device will not be described in detail here, and the protection content of this utility model does not involve the improvement of electronic components, software, etc.

[0072] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A high-precision film thickness measuring device, characterized in that, The high-precision film thickness measurement device includes: a crystal-controlled probe, a film thickness gauge, a first cavity, and a vacuum cavity; the first cavity is equipped with an oscillation chamber and filled with air; the vacuum cavity includes at least the first cavity and the crystal-controlled probe; The oscillation pack is placed inside the first cavity, and the crystal control probe is mounted on the first side of the first cavity; the crystal control probe and the oscillation pack are welded together; the oscillation pack is connected to the film thickness gauge; The crystal-controlled probe is used to acquire measurement signals of the material under test, and the measurement signals are analog signals. The oscillation packet is used to convert the measurement signal into a digital signal; The film thickness gauge is used to determine the film thickness parameters of the material to be tested based on the digital signal.

2. The high-precision film thickness measuring device as described in claim 1, characterized in that, The high-precision film thickness measurement device further includes: a vacuum flange; the first surface of the vacuum cavity has a first groove, the vacuum flange is embedded in the first groove, and the first surface of the vacuum flange is located inside the vacuum cavity, while the second surface of the vacuum flange is located outside the vacuum cavity; the film thickness gauge is placed outside the vacuum cavity; the oscillation package is connected to the film thickness gauge through the vacuum flange; The vacuum flange is used to transmit the digital signal from inside the vacuum chamber to the film thickness gauge outside the vacuum chamber.

3. The high-precision film thickness measuring device as described in claim 2, characterized in that, The first surface of the vacuum chamber is provided with a first transparent window, and the film thickness gauge and the first transparent window are arranged parallel to each other along the first surface of the vacuum chamber and are positioned opposite each other. The first transparent window provides a channel for the film thickness gauge to acquire optical signals, enabling the film thickness gauge to acquire optical information of the material under test and observe the forming condition of the material under test.

4. The high-precision film thickness measuring device as described in claim 2, characterized in that, The first groove is located at the center of the top of the vacuum chamber, and the outer contour of the vacuum flange is interference-fitted with the inner contour of the first groove, so that the vacuum flange can be tightly embedded in the first groove.

5. The high-precision film thickness measuring device as described in claim 1, characterized in that, The first cavity is provided with a first fixed bracket, which is fixedly connected to the first inner wall of the first cavity. The oscillation pack is installed on the first fixed bracket, and the connection between the oscillation pack and the first fixed bracket is made of shock-resistant material to reduce the vibration of the oscillation pack during operation, thereby improving the stability of the high-precision film thickness measurement device.

6. The high-precision film thickness measuring device according to any one of claims 1-5, characterized in that, The ultimate pressure range within the vacuum chamber is 10. -3 Pa-10 -5 Pa; At the first moment, the vacuum chamber is filled with a first volume of a first gas, the first gas including at least one of argon, nitrogen or oxygen.

7. The high-precision film thickness measuring device according to any one of claims 1-5, characterized in that, The surface of the first cavity is provided with a heat-insulating material, which is used to reduce the impact of temperature changes in the vacuum cavity on the internal structure of the oscillating package.

8. The high-precision film thickness measuring device according to any one of claims 1-5, characterized in that, The oscillation package integrates a signal processing module and an analog-to-digital converter module. The oscillation package is designed as a multilayer printed circuit board, and the analog-to-digital converter module is vertically positioned above the signal processing module. The signal processing module is used to filter the measurement signal acquired by the crystal control probe to obtain a first analog signal; The analog-to-digital conversion module is used to convert the first analog signal into the digital signal, thereby reducing the impedance generated during the transmission of the measurement signal acquired by the crystal control probe to the film thickness gauge.

9. The high-precision film thickness measuring device as described in any one of claims 1-5, characterized in that, The first cavity is placed inside the vacuum cavity, and the first cavity and the crystal control probe are horizontally arranged along the first plane of the vacuum cavity. The first cavity is made of metal and is kept internally sealed. The first cavity includes at least an oscillation pack. The first cavity is used to seal the oscillating package to prevent the multilayer printed circuit board structure of the oscillating package from contaminating the gas inside the vacuum cavity.

10. A high-precision film thickness measurement system, characterized in that, The high-precision film thickness measurement system includes the high-precision film thickness measurement device as described in any one of claims 1-9.

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