Ceramic pressure sensor structure integrated with stress buffer layer

Abstract

The utility model relates to the technical field of sensors, and discloses a ceramic pressure sensor structure integrated with a stress buffer layer, which comprises a shell, the inner wall of the shell is fixedly connected with a second buffer pad, the top end of the second buffer pad is fixedly connected with a plurality of first telescopic columns, the exteriors of the first telescopic columns are respectively sleeved with a first spring, and a second spring is fixedly connected with the top end of the second buffer pad. The bottom end of the second buffer pad is fixedly connected with a pottery piece, the exterior of the pottery piece is fixedly connected with a plurality of first buffer pads, the bottom end of the pottery piece is fixedly connected with a plurality of second telescopic columns through fixing rods, the multiple second telescopic columns are sleeved with second springs respectively, and the bottom ends of the multiple second telescopic columns are fixedly connected with a third buffer pad. And a plurality of third telescopic columns are connected to a fixing rod at the bottom end of the third buffer pad. According to the utility model, the problem that the ceramic of the ceramic pressure sensor is easy to damage is effectively solved. The stability of the sensor is improved, the service life of the ceramic pressure sensor is prolonged, and the equipment replacement frequency is reduced.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to a ceramic pressure sensor structure with an integrated stress buffer layer. Background Technology

[0002] A ceramic pressure sensor is a pressure detection device that uses a sensitive element made of ceramic material. Its core components typically consist of a ceramic diaphragm and a ceramic ring. Utilizing the high elasticity, corrosion resistance, and wear resistance of ceramic materials, it converts the sensed pressure signal into an electrical signal. In industrial applications, it is commonly used in process control to accurately monitor fluid pressure within pipelines, ensuring stable production processes. In hydraulic and pneumatic equipment, it provides real-time feedback of system pressure, facilitating efficient equipment operation. In medical instrumentation, it accurately measures physiological pressure parameters such as blood pressure, providing a basis for diagnosis and treatment. In automotive electronics, it is used to monitor tire pressure, oil pressure, and other parameters, improving driving safety and stability.

[0003] The working principle of a ceramic pressure sensor is based on the piezoresistive effect of ceramic materials. When external pressure is applied to a sensitive element composed of a ceramic diaphragm, ceramic ring, etc., the highly elastic ceramic diaphragm deforms. This deformation changes the resistance value of the resistor fabricated on the diaphragm using a thick-film process. Due to the good stability of ceramic materials, pressure changes can be accurately sensed. The change in resistance causes a change in the electrical signal in the circuit. By detecting, amplifying, and processing this electrical signal, the magnitude of the external pressure can be accurately calculated, and the corresponding pressure measurement value can be output, thereby achieving effective pressure monitoring.

[0004] However, in existing technologies, some ceramic pressure sensors are prone to damage due to sudden excessive pressure during use. Ceramic pressure sensors typically rely on the excellent properties of ceramic materials, such as high elasticity, corrosion resistance, and wear resistance, to accurately sense pressure changes. However, problems arise when faced with extreme situations where the pressure in the working environment suddenly surges. Due to limitations in the structural design and material selection of some sensors, although the ceramic materials used are stable under normal operating conditions, their inherent brittleness is amplified when subjected to excessively high pressure impacts far exceeding their rated withstand range. The sudden surge in pressure will subject key components such as the ceramic diaphragm to enormous stress. This stress exceeding their tolerance limit can easily cause the ceramic components to crack or shatter, directly leading to sensor failure and severely interfering with the normal operation of various equipment and systems that rely on it for pressure monitoring and feedback. To address this issue, a ceramic pressure sensor structure with an integrated stress buffer layer is proposed. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a ceramic pressure sensor structure with an integrated stress buffer layer, aiming to improve the problem of easy damage to ceramic pressure sensors in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a ceramic pressure sensor structure with an integrated stress buffer layer, comprising a housing, a buffer pad II fixedly connected to the inner wall of the housing, a plurality of telescopic columns I fixedly connected to the top of the buffer pad II, a spring I respectively sleeved on the outside of the plurality of telescopic columns I, a ceramic plate fixedly connected to the bottom of the buffer pad II, a plurality of buffer pads I fixedly connected to the outside of the ceramic plate, a plurality of telescopic columns II connected to the bottom fixing rod of the ceramic plate, a spring II respectively sleeved on the outside of the plurality of telescopic columns II, a buffer pad III fixedly connected to the bottom of the plurality of telescopic columns II, a plurality of telescopic columns III connected to the bottom fixing rod of the buffer pad III, a spring III respectively sleeved on the outside of the plurality of telescopic columns III, and a wire harness assembly for wire harnessing fixedly connected to the top of the inner wall of the housing.

[0007] As a further description of the above technical solution: the cable assembly includes multiple retractable rods, the distal ends of the multiple retractable rods are fixedly connected to the inner wall of the housing, the distal ends of the multiple retractable rods are respectively fixedly connected to a protective pad I, the exterior of the multiple retractable rods is respectively sleeved with a spring IV, the exterior of the proximal ends of the multiple retractable rods is respectively fixedly connected to a protective pad II, and the proximal ends of the multiple retractable rods are fixedly connected to a guide tube.

[0008] As a further description of the above technical solution: the inner wall of the guide tube is fixedly connected with a circuit, the top end of the circuit is fixedly connected with an upper interface, and the bottom end of the circuit is fixedly connected with an electronic component.

[0009] As a further description of the above technical solution: a top cover is fixedly connected to the outer bottom of the upper interface, the bottom of the top cover is fixedly connected to the top of the outer shell, and a lower interface is fixedly connected to the bottom of the outer shell.

[0010] As a further description of the above technical solution: the opposite sides of the plurality of protective pads are fixedly connected to the inner wall of the outer shell, and the adjacent sides of the plurality of protective pads are fixedly connected to the opposite ends of the plurality of springs.

[0011] As a further description of the above technical solution: the adjacent sides of the plurality of protective pads 2 are fixedly connected to the outside of the guide tube, and the distant sides of the plurality of protective pads 2 are fixedly connected to the adjacent ends of the plurality of springs 4.

[0012] As a further description of the above technical solution: the external parts of the plurality of buffer pads one are fixedly connected to the inside of the housing, and the external parts of the buffer pad three are fixedly connected to the inside of the housing.

[0013] As a further description of the above technical solution: the outer surfaces of the plurality of springs one are slidably connected inside the housing, and the bottom ends of the plurality of springs one are fixedly connected to the top of the buffer pad two.

[0014] This utility model has the following beneficial effects:

[0015] 1. In this utility model, when the ceramic piece is impacted by pressure, firstly, the buffer pad three moves multiple telescopic columns three under pressure, and the spring three compresses and buffers part of the pressure; then, the displacement of the ceramic piece moves the buffer pad one and the telescopic column two, and the spring two further buffers it; finally, the buffer pad two moves the telescopic column one, and the spring one dampens the shock again. Through the multi-layer buffer structure composed of buffer pads, telescopic columns and springs, the pressure impact is offset step by step, thereby achieving the buffering and shock-absorbing protection effect for the ceramic piece.

[0016] 2. In this utility model, when cable bundling is required, the cable is inserted into the guide tube, and the cable pushes the guide tube to drive the retractable rod to be smoothly suspended inside the outer shell, while the fourth spring is compressed. Through the synergistic action of the retractable rod, the fourth spring, the protective pad, and the guide tube, the cable is neatly and securely bundled, avoiding the tangled and messy cable bundling effect. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of a ceramic pressure sensor structure with an integrated stress buffer layer proposed in this utility model;

[0018] Figure 2 This is a schematic diagram of the housing of a ceramic pressure sensor structure with an integrated stress buffer layer proposed in this utility model.

[0019] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0020] Figure 4 for Figure 2 Enlarged view of point B in the middle.

[0021] Legend:

[0022] 1. Outer shell; 2. Ceramic tile; 3. Buffer pad one; 4. Buffer pad two; 5. Telescopic column one; 6. Spring one; 7. Telescopic column two; 8. Spring two; 9. Buffer pad three; 10. Telescopic column three; 11. Spring three; 12. Electronic components; 13. Retractable rod; 14. Spring four; 15. Protective pad one; 16. Protective pad two; 17. Guide tube; 18. Wiring; 19. Top cover; 20. Upper interface; 21. Lower interface. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Reference Figures 1 to 3 This utility model provides an embodiment of a ceramic pressure sensor structure with an integrated stress buffer layer, comprising a housing 1. A buffer pad 4 is fixedly connected to the inner wall of the housing 1, utilizing its elastic deformation to initially absorb and disperse impact energy. Multiple telescopic columns 5 are fixedly connected to the top of the buffer pad 4. When the buffer pad 4 is deformed by external force, it drives the telescopic columns 5 to move synchronously. Springs 6 are respectively fitted onto the outside of the multiple telescopic columns 5, with one end connected to the buffer pad 4 and the other end in contact with a fixed point on the inner wall of the housing 1. When the telescopic columns 5 extend and retract under the action of the buffer pad 4, the springs 6 are compressed or stretched accordingly. A ceramic plate 2 is fixedly connected to the bottom of the buffer pad 4, and multiple buffer pads 3 are fixedly connected to the outside of the ceramic plate 2. When the ceramic plate 2 is subjected to pressure transmitted from the outside via the buffer pad 4, the buffer pads 3 bear the pressure together with the ceramic plate 2. The bottom fixing rod of the ceramic slab 2 is connected to multiple telescopic columns 2 7. The multiple telescopic columns 2 7 are evenly distributed at the bottom of the ceramic slab 2. The material is similar to that of the telescopic column 1 5, and has good strength and toughness.

[0025] When the ceramic piece 2 deforms under pressure, it causes the telescopic column 7 to move downwards. Each of the multiple telescopic columns 7 is fitted with a spring 8, which is made of the same material and operates on the same principle as spring 6, and is tightly fitted around the telescopic column 7. When the telescopic column 7 extends or retracts under the influence of the ceramic piece 2, the spring 8 is compressed or stretched accordingly. A buffer pad 9 is fixedly connected to the bottom end of each of the multiple telescopic columns 7. When the telescopic column 7 moves downwards under the influence of the ceramic piece 2, it transmits force to the buffer pad 9. The buffer pad 9 works by using its own elastic deformation to further buffer and disperse the force transmitted from the telescopic column 7.

[0026] The bottom fixing rod of the buffer pad 3 9 is connected to multiple telescopic columns 3 10. When the buffer pad 3 9 is subjected to pressure transmitted from the telescopic column 2 7, it will drive the telescopic columns 3 10 to move downward. The telescopic columns 3 10 adapt to the deformation of the buffer pad 3 9 by their own extension and contraction, further buffering the pressure impact. Springs 3 11 are respectively sleeved on the outside of the multiple telescopic columns 3 10. Under pressure impact, the springs 3 11 store energy through compression, reducing the impact force on the buffer pad 3 9 and the telescopic columns 3 10; when the pressure weakens, the springs 3 11 release elastic potential energy, helping the telescopic columns 3 10 return to their original position and maintaining the stability of the entire structure. A wire harness assembly for harnessing is fixedly connected to the top of the inner wall of the outer shell 1.

[0027] Reference Figures 2 to 4 The cable harness assembly includes multiple retractable rods 13, with their distal ends fixedly connected to the inner wall of the housing 1. The retractable rods 13 extend stably outward from the inner wall of the housing 1, providing a stable support foundation for the subsequent cable harness structure and ensuring the stability of the entire cable harness assembly within the sensor. Even if vibration or shaking occurs during device operation, the retractable rods 13 will not separate from the housing 1, thus ensuring the continuous and effective cable harness function. Protective pads 15 are fixedly connected to the distal ends of each of the multiple retractable rods 13. Springs 14 are fitted around the outside of each of the multiple retractable rods 13, with one end connected to the protective pad 15 and the other end contacting a fixing point on the retractable rod 13 near the guide tube 17. When the cable is inserted into the guide tube 17 and pushes the guide tube 17 towards the inner wall of the housing 1, the retractable rods 13 are compressed, and the springs 14 are also compressed. Protective pads 16 are fixedly connected to the exterior of adjacent ends of the plurality of retractable rods 13. The protective pads 16 are mainly used to further protect the retractable rods 13 from frictional damage during the movement of the guide tube 17. The guide tube 17 is fixedly connected to the adjacent ends of the plurality of retractable rods 13. This provides a clear guiding path for the cable, facilitating cable storage and organization, and preventing the cable from becoming tangled inside the sensor.

[0028] Reference Figures 1 to 3A circuit 18 is fixedly connected to the inner wall of the guide tube 17. The guide tube 17 protects and guides the circuit 18, preventing it from becoming tangled inside the sensor. An upper interface 20 is fixedly connected to the top of the circuit 18, and an electronic component 12 is fixedly connected to the bottom of the circuit 18. Data is transmitted through the upper interface 20 via the circuit 18. A top cover 19 is fixedly connected to the bottom of the upper interface 20, and the bottom of the top cover 19 is fixedly connected to the top of the outer shell 1. This provides comprehensive protection for the precision components inside the sensor, improving its waterproof, dustproof, and corrosion-resistant capabilities, ensuring normal operation even in harsh environments, extending its lifespan, and reducing maintenance costs. A lower interface 21 is fixedly connected to the bottom of the outer shell 1. Multiple protective pads 15 are fixedly connected to the inner wall of the outer shell 1 on opposite sides. When the sensor is subjected to external vibration or impact, the protective pads 15 can absorb some of the vibration energy, reducing the impact of vibration on the internal structure of the outer shell 1. Multiple protective pads 15 are fixedly connected to the opposite ends of multiple springs 14 on opposite sides.

[0029] When spring 4 14 is compressed or stretched, protective pad 15 can move accordingly, providing cushioning and protection. The adjacent sides of multiple protective pads 2 16 are fixedly connected to the outside of the guide tube 17, ensuring that the protective pads 2 16 tightly surround the guide tube 17. The adjacent sides of the protective pads 2 16 are in close contact with the guide tube 17, further protecting the guide tube 17 during its movement. The distant sides of multiple protective pads 2 16 are fixedly connected to the adjacent ends of multiple springs 4 14. When spring 4 14 is compressed or stretched, the protective pads 2 16 can move with the movement of spring 4 14, providing stable support and cushioning for the extension and contraction of spring 4 14. The outer sides of multiple buffer pads 1 3 are fixedly connected to the inside of the outer shell 1, further cushioning and dispersing pressure when the ceramic plate 2 is subjected to pressure impact, preventing damage to the ceramic plate 2 due to excessive local pressure.

[0030] The external of the buffer pad 3 9 is fixedly connected to the inside of the outer shell 1. When the ceramic piece 2 is subjected to pressure impact and undergoes downward displacement, the buffer pad 3 9 can bear the pressure transmitted from the ceramic piece 2 and further buffer the pressure impact through its own elastic deformation. The external of the multiple springs 1 6 is slidably connected to the inside of the outer shell 1, and the bottom ends of the multiple springs 1 6 are fixedly connected to the top of the buffer pad 2 4. When an external impact or pressure change is transmitted to the buffer pad 2 4, the buffer pad 2 4 will drive the springs 1 6 to compress or stretch. The working principle of the springs 1 6 is to utilize their own elastic potential energy conversion. When subjected to external impact, they store energy through compression to reduce the impact force transmitted from the buffer pad 2 4. When the external force weakens, they release elastic potential energy to help the buffer pad 2 4 return to its original position.

[0031] Working Principle: When external pressure impacts the ceramic pressure sensor, the pressure first acts on the buffer pad 9. Under pressure, the buffer pad 9 drives multiple telescopic columns 10 to move downwards, compressing the springs 11 sleeved on the outside of the telescopic columns 10. The elastic deformation of the springs 11 absorbs some of the pressure energy. At the same time, the buffer pad 9 transmits the pressure to the ceramic plate 2 above. Multiple buffer pads 3 fixedly connected to the outside of the ceramic plate 2 also participate in buffering. Under pressure, the buffer pads 3 drive the ceramic plate 2 to produce a certain displacement. During this process, multiple telescopic columns 7 fixedly connected to the bottom of the ceramic plate 2 move downwards, compressing the springs 8 sleeved on the outside of the telescopic columns 7, further absorbing pressure energy. In addition, the buffer pad 4 fixedly connected to the inner wall of the outer shell 1 also plays a role. Under pressure transmission, the buffer pad 4 drives multiple telescopic columns 5 to move, compressing the springs 6, further buffering the pressure. The buffer pads 1-3, 2-4, 3-9, and telescopic columns 1-5, 2-7, 3-10, along with the corresponding springs 1-6, 2-8, and 3-11, work together to absorb and disperse pressure energy, thereby achieving a buffering and shock-absorbing protection effect for the ceramic slab 2 and effectively preventing damage to the ceramic slab 2 due to excessive pressure impact.

[0032] In this cable bundling assembly, when cable bundling is required, the cable is inserted into the guide tube 17. As the cable is placed, the movement of the guide tube 17 causes multiple retractable rods 13 to extend, stretching the springs 14 sleeved on the outside of the retractable rods 13. Simultaneously, the protective pad 16, fixedly connected to the end near the retractable rod 13, moves along with the guide tube 17, providing a certain degree of cushioning and protection for the cable. Meanwhile, the protective pad 15, fixedly connected to the inner wall of the outer casing 1 at the end far from the retractable rod 13, provides protection for the cable from the other side during the bundling process, preventing hard friction between the cable and the inner wall of the outer casing 1. Through the extension and contraction of the retractable rods 13, the elastic deformation of the springs 14, and the synergistic effect of the protective pads 15 and 16, the orderly guidance and bundling of the cable are achieved, while protecting the cable from damage during the bundling process.

[0033] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A ceramic pressure sensor structure with an integrated stress buffer layer, comprising a housing (1), characterized in that: The inner wall of the outer shell (1) is fixedly connected to a second buffer pad (4). The top of the second buffer pad (4) is fixedly connected to a plurality of telescopic posts (5). The outer sides of the plurality of telescopic posts (5) are respectively fitted with springs (6). The bottom end of the second buffer pad (4) is fixedly connected to a ceramic piece (2). The outer side of the ceramic piece (2) is fixedly connected to a plurality of first buffer pads (3). The bottom end of the ceramic piece (2) is fixedly connected to a plurality of second telescopic posts (7). The outer side of the plurality of second telescopic posts (7) is respectively fitted with springs (8). The bottom end of the plurality of second telescopic posts (7) is fixedly connected to a third buffer pad (9). The bottom end of the third buffer pad (9) is fixedly connected to a plurality of third telescopic posts (10). The outer side of the plurality of third telescopic posts (10) is respectively fitted with springs (11). The top of the inner wall of the outer shell (1) is fixedly connected to a wire harness assembly for harnessing wires.

2. The ceramic pressure sensor structure with an integrated stress buffer layer according to claim 1, characterized in that: The cable assembly includes multiple retractable rods (13), with the distal ends of the multiple retractable rods (13) fixedly connected to the inner wall of the outer shell (1), and protective pads (15) fixedly connected to the distal ends of the multiple retractable rods (13), with springs (14) respectively sleeved on the outside of the multiple retractable rods (13), and protective pads (16) fixedly connected to the outside of the proximal ends of the multiple retractable rods (13), and guide tubes (17) fixedly connected to the proximal ends of the multiple retractable rods (13).

3. The ceramic pressure sensor structure with an integrated stress buffer layer according to claim 2, characterized in that: The inner wall of the guide tube (17) is fixedly connected to a line (18), the top of the line (18) is fixedly connected to an upper interface (20), and the bottom of the line (18) is fixedly connected to an electronic component (12).

4. The ceramic pressure sensor structure with an integrated stress buffer layer according to claim 3, characterized in that: The upper interface (20) is fixedly connected to the outer bottom end of the top cover (19), the bottom end of the top cover (19) is fixedly connected to the top end of the outer shell (1), and the bottom end of the outer shell (1) is fixedly connected to the lower interface (21).

5. The ceramic pressure sensor structure with an integrated stress buffer layer according to claim 2, characterized in that: The far sides of the plurality of protective pads (15) are fixedly connected to the inner wall of the outer shell (1), and the near sides of the plurality of protective pads (15) are fixedly connected to the far ends of the plurality of springs (14).

6. The ceramic pressure sensor structure with an integrated stress buffer layer according to claim 2, characterized in that: The adjacent sides of the plurality of protective pads 2 (16) are fixedly connected to the outside of the guide tube (17), and the distant sides of the plurality of protective pads 2 (16) are fixedly connected to the adjacent ends of the plurality of springs 4 (14).

7. The ceramic pressure sensor structure with an integrated stress buffer layer according to claim 1, characterized in that: The external parts of the plurality of buffer pads one (3) are fixedly connected to the inside of the housing (1), and the external parts of the buffer pad three (9) are fixedly connected to the inside of the housing (1).

8. The ceramic pressure sensor structure with an integrated stress buffer layer according to claim 1, characterized in that: The outer surfaces of the plurality of springs (6) are slidably connected inside the housing (1), and the bottom ends of the plurality of springs (6) are fixedly connected to the top of the buffer pad (4).

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