SiC wafer detection device

Abstract

The utility model provides a SiC wafer detection device, which belongs to the technical field of semiconductor manufacturing and comprises a bearing platform, a detection unit, an adjusting unit, a running unit and an alarm unit. The detection unit is arranged on the bearing platform; the adjusting unit is arranged on the bearing platform, the adjusting unit comprises a plurality of groups of adjusting assemblies which are coaxially arranged, and the adjusting assemblies are used for bearing and driving the wafers to rotate around the axes of the wafers; the operation unit comprises a feeding assembly located on the upstream of the adjusting unit and a discharging assembly located on the downstream of the adjusting unit. The alarm unit comprises a controller and an alarm in communication connection with the controller, and the detection unit is also in communication connection with the controller. The SiC wafer detection device provided by the utility model aims to solve the problem that in the prior art, a Si surface and a C surface of a SiC wafer cannot be determined before cleaning, so that the SiC wafer is easily damaged or the cleaning effect is poor in the cleaning process.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor manufacturing, more specifically, it relates to a SiC wafer detection device. BACKGROUND

[0002] Since the pollutants on the wafer surface will affect the performance of the device, the wafer surface needs to be cleaned in the semiconductor manufacturing process. The wafer cleaning requires both removal of pollutants and no damage to the wafer, and the wafer cleaning equipment needs to be used to clean the wafer. The wafer cleaning equipment usually clamps the edge of the wafer with a clamp, and uses a vacuum chuck to adsorb the wafer, and then polishes the wafer surface to remove the stains on the wafer surface.

[0003] SiC wafers have a high Mohs hardness (9.2) and strong chemical inertness, and usually require polishing time of tens of minutes or even hours to remove the stains on the surface. SiC wafers are very thin, usually only about 350 um thick, which makes them easy to be damaged under stress. In addition, compared with traditional wafers, SiC wafers need to be polished on both sides, and the polishing rate of the Si side is usually less than 1 / 3 of the C side. If the Si side and the C side are confused during polishing, the Si side polishing rate will be too large and damaged, and the C side polishing rate will be insufficient and unable to effectively remove the stains. Therefore, before cleaning, the Si side and the C side of the SiC wafer need to be determined, and then the cleaning parameters are adjusted according to the cleaning surface. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a SiC wafer detection device, which aims to solve the problem that the Si side and the C side of the SiC wafer cannot be determined before cleaning in the prior art, resulting in damage to the SiC wafer or poor cleaning effect during cleaning.

[0005] To achieve the above-mentioned purpose, the utility model adopts the technical scheme of:

[0006] Provided is a SiC wafer detection device, comprising:

[0007] A bearing platform;

[0008] A detection unit provided on the bearing platform for detecting the mark of the wafer;

[0009] An adjustment unit provided on the bearing platform, the adjustment unit comprising a plurality of adjustment assemblies arranged coaxially, each adjustment assembly corresponding to a wafer of a certain size, the adjustment assembly being used to support and drive the wafer to rotate around its own axis, so that the mark of the wafer corresponds to the detection unit up and down;

[0010] The operating unit comprises an upper feeding assembly upstream of the adjusting unit and a lower discharging assembly downstream of the adjusting unit, the upper feeding assembly is used to place the wafer to be detected on the corresponding adjusting assembly, and the lower discharging assembly is used to move the wafer after detection from the adjusting assembly.

[0011] The alarm unit comprises a controller and an alarm connected with the controller, and the detection unit is also connected with the controller.

[0012] In a possible implementation, the adjusting assembly comprises:

[0013] A plurality of adjusting mechanisms are annularly distributed on the bearing platform, the adjusting mechanisms are used to support the wafer and drive the wafer to rotate around the axis of the wafer, and

[0014] A driving mechanism is connected with the plurality of adjusting mechanisms and is used to drive the adjusting mechanisms to rotate around the adjusting axis, and the adjusting axis is perpendicular to the plate surface of the bearing platform.

[0015] In a possible implementation, the adjusting mechanism comprises:

[0016] A lifting rod is arranged on the bearing platform;

[0017] A supporting piece is connected with the lifting end of the lifting rod and is used to support the wafer, and

[0018] An adjusting piece is connected with the lifting end of the lifting rod and is connected with the driving mechanism, the adjusting piece is used to contact the outer edge of the wafer, and the adjusting piece and the lifting rod are respectively connected with the controller.

[0019] In a possible implementation, the adjusting piece comprises:

[0020] An adjuster is connected with the lifting rod and is telescopic along the radial direction of the wafer, and the adjuster is connected with the controller, and

[0021] A roller is connected with the telescopic end of the adjuster and is used to abut against the outer edge of the wafer, and the roller is also connected with the driving mechanism, and the driving mechanism drives the roller to rotate around the adjusting axis.

[0022] In a possible implementation, a plurality of adjusting assemblies are sequentially distributed from inside to outside, and the adjusting mechanism comprises:

[0023] A lifting piece is a telescopic member and is telescopic along the up-down direction, and the lifting piece is perpendicular to the plate surface of the bearing platform, and

[0024] A suction disc is connected with the telescopic end of the lifting piece and is used to fix the wafer.

[0025] In a possible implementation, a plurality of guide grooves are formed on the bearing platform, the guide grooves are arranged one-to-one with the adjusting assembly, and the guide grooves are annular groove bodies and coaxially arranged with the suction disc. The lifting piece is slidingly arranged in the guide groove. The driving mechanism comprises:

[0026] a second driver arranged on the bearing platform;

[0027] a driving gear connected to the second driver, the second driver being configured to drive the driving gear to rotate about an axis thereof; and

[0028] a driven gear engaged with the driving gear and coaxially arranged with the guide groove, the lifting piece being connected to the driven gear.

[0029] In a possible implementation, the detection unit comprises:

[0030] a support arranged on the bearing platform, the support having an adjusting end extending in a horizontal direction;

[0031] an image collector connected to the adjusting end and located above the wafer, the image collector being configured to collect an image of the wafer; and

[0032] a position detector connected to the adjusting end and configured to detect position information of the wafer, the image collector and the position detector being in communication connection with the controller.

[0033] In a possible implementation, the support comprises:

[0034] a support rod rotatably connected to the bearing platform about an axis thereof;

[0035] a third driver connected to the support rod, the third driver being configured to control rotation of the support rod; and

[0036] an adjusting piece connected to an upper portion of the support rod and located above the wafer, the adjusting piece having an adjusting block movable in a horizontal direction, the adjusting block forming the adjusting end.

[0037] In a possible implementation, the adjusting piece comprises:

[0038] a guide rod connected to the upper portion of the support rod;

[0039] a screw rod connected to the support rod and parallel to the guide rod;

[0040] a drive nut threadedly connected to the screw rod and slidingly connected to the guide rod, the drive nut forming the adjusting end; and

[0041] A fifth driver is connected to the screw rod for driving the screw rod to rotate, and the fifth driver is in communication connection with the controller.

[0042] In a possible implementation, the bearing platform comprises:

[0043] An adjusting frame is fixed to the bottom surface, and the adjusting frame is capable of extending and retracting in the up-down direction; and

[0044] A support plate is connected to the top of the adjusting frame for providing a support force to the adjusting unit and the detection unit.

[0045] The detection unit comprises a level detector arranged on the bearing platform, and the level detector and the adjusting frame are respectively in communication connection with the controller.

[0046] The SiC wafer detection device has the advantages that, compared with the prior art, the SiC wafer detection device detects the Si face and the C face of the SiC wafer, the loading assembly places the wafer on the corresponding adjusting assembly, the adjusting assembly drives the wafer to rotate to correspond to the detection unit up and down. The detection unit detects the mark of the wafer, if the wafer mark is detected, the unloading assembly moves the wafer to the next station; if the wafer mark is not detected, the detection unit generates an alarm signal, the controller controls the alarm to issue an alarm according to the alarm signal, and notifies the staff to take out the wafer, so that the wafer is prevented from flowing into the next station to cause incomplete cleaning or wafer damage in the cleaning process. The SiC wafer detection device detects the Si face and the C face of the wafer before cleaning by using the mark of the wafer, and avoids the problems of wafer damage or failure to completely remove stains due to mismatching of cleaning frequency in the cleaning process. BRIEF DESCRIPTION OF DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0048] Figure 1 A top view of the SiC wafer detection device provided in the first embodiment of the present application;

[0049] Figure 2 A sectional view of the SiC wafer detection device provided in the first embodiment of the present application;

[0050] Figure 3 A front view of the SiC wafer detection device provided in the second embodiment of the present application;

[0051] Figure 4 This is a front view of the bracket used in Embodiment 3 of this utility model.

[0052] In the diagram: 1. Supporting platform; 101. Adjusting frame; 102. Support plate; 2. Operating unit; 201. Feeding assembly; 202. Unloading assembly; 3. Adjusting assembly; 301. Lifting rod; 302. Support plate; 303. Adjusting component; 3031. Adjuster; 3032. Roller; 304. Suction cup; 305. Drive mechanism; 3051. Second driver; 3052. Drive gear; 3053. Driven gear; 306. Lifting component; 4. Detection unit; 401. Support rod; 402. Image acquisition device; 403. Position detector; 404. Adjusting component; 4041. Screw; 4042. Guide rod; 4043. Drive nut; 4044. Fifth driver. Detailed Implementation

[0053] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0054] In the claims, description, and accompanying drawings of this utility model, unless otherwise expressly defined, the terms "first," "second," or "third," etc., are used to distinguish different objects, not to describe a specific order. Unless otherwise stated, other directional terms, such as "vertical," "clockwise," and "counterclockwise," indicate orientation or positional relationships based on the orientation and positional relationships shown in the accompanying drawings, and are only for the convenience of describing the utility model and simplifying the description, not to indicate or imply that the referred device or element must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of this utility model. In the claims, description, and accompanying drawings of this utility model, unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" should be interpreted broadly, that is, any connection method in which there is no displacement relationship or relative rotation relationship between the two, that is, including non-removable fixed connection, detachable fixed connection, integral connection, and fixed connection through other devices or elements. In the claims, description, and accompanying drawings of this utility model, the terms "comprising," "having," and their variations are intended to mean "including but not limited to."

[0055] It should be noted that the Si plane of a SiC wafer refers to the (0001) crystal plane of the silicon carbide wafer, that is, the surface cut along the positive c-axis, where the terminating atom is silicon. The C plane of a SiC wafer refers to the (000-1) crystal plane of the silicon carbide wafer, that is, the surface cut along the negative c-axis, where the terminating atom is carbon. The choice of the C-plane and Si plane also affects the manufacturing process and performance of silicon carbide devices, such as epitaxial growth, ion implantation, oxidation, metal deposition, and contact resistance.

[0056] Please refer to the following: Figures 1 to 4 The SiC wafer inspection device provided by this utility model will now be described. The SiC wafer inspection device includes a support platform 1, an inspection unit 4, an adjustment unit, a running unit 2, and an alarm unit. The inspection unit 4 is located on the support platform 1 and is used to inspect the markings on the wafer. The adjustment unit is located on the support platform 1 and includes multiple sets of adjustment components 3 coaxially arranged. Each set of adjustment components 3 corresponds to a wafer of a certain size. The adjustment components 3 are used to support and drive the wafer to rotate around its own axis, so that the markings on the wafer correspond vertically to the inspection unit 4. The running unit 2 includes a loading component 201 located upstream of the adjustment unit and a unloading component 202 located downstream of the adjustment unit. The loading component 201 is used to place the wafer to be inspected onto the corresponding adjustment component 3. The unloading component 202 is used to remove the inspected wafer from the adjustment component 3. The alarm unit includes a controller and an alarm connected to the controller. The inspection unit 4 is also connected to the controller.

[0057] Compared with existing technologies, the SiC wafer inspection device provided by this utility model inspects the Si and C surfaces of the SiC wafer. The loading assembly 201 places the wafer on the corresponding adjustment assembly 3, which drives the wafer to rotate until it aligns vertically with the inspection unit 4. The inspection unit 4 detects the markings on the wafer. If a marking is detected, the unloading assembly 202 moves the wafer to the next station; if no marking is detected, the inspection unit 4 generates an alarm signal. The controller then activates an alarm to notify the operator to remove the wafer, preventing it from flowing into the next station and causing incomplete cleaning or damage during the cleaning process. This utility model utilizes the markings on the wafer to inspect the Si and C surfaces before cleaning, avoiding wafer damage or incomplete removal of contaminants due to mismatched cleaning frequencies during the cleaning process.

[0058] Specifically, different sizes of wafers correspond to different adjustment components 3, thereby expanding the scope of application of this utility model and enabling the detection of wafers of different sizes.

[0059] Optionally, both the feeding assembly 201 and the unloading assembly 202 are robotic arms.

[0060] It should be noted that in order to mark the wafer's ID (identity) and facilitate wafer tracking in subsequent manufacturing, testing, and packaging processes, the wafer needs to be marked. Marking (or marking) the wafer is an indispensable step in the semiconductor manufacturing process.

[0061] It should be noted that whether the marking is on the Si side or the C side of the wafer depends on the specific application and manufacturing process.

[0062] It should be noted that this application is not only applicable to the inspection of SiC wafers, but also to transparent substrate materials with high hardness and brittleness, such as gallium nitride, sapphire, and glass, which require double-sided polishing. Therefore, the scope of protection of this utility model is not limited to the inspection of SiC wafers.

[0063] In some embodiments, please refer to Figure 3 The adjustment component 3 includes a drive mechanism 305 and multiple adjustment mechanisms. The multiple adjustment mechanisms are arranged in a ring on the support platform 1. The adjustment mechanisms are used to support the wafer and drive the wafer to rotate around its own axis. The drive mechanism 305 is connected to the multiple adjustment mechanisms and is used to drive the adjustment mechanisms to rotate around the adjustment axis. The adjustment axis is perpendicular to the surface of the support platform 1.

[0064] After the wafer is placed in the adjustment mechanism, the adjustment mechanism is controlled by the drive mechanism 305 to rotate around its own axis. The adjustment mechanism drives the wafer to rotate, thereby aligning the wafer's markings with the detection unit 4, so that the detection unit 4 can detect whether there are markings on the wafer.

[0065] In some embodiments, please refer to Figure 3 The adjustment mechanism includes a lifting rod 301, a support plate 302, and an adjustment component 303. The lifting rod 301 is located on the support platform 1. The support plate 302 is connected to the lifting end of the lifting rod 301 and is used to support the wafer. The adjustment component 303 is connected to the lifting end of the lifting rod 301 and is connected to the drive mechanism 305. The adjustment component 303 is used to contact the outer edge of the wafer. The adjustment component 303 and the lifting rod 301 are respectively connected to the controller.

[0066] The lifting rod 301 rises, thereby providing support force to the wafer via the support plate 302 and preventing interference between the wafer and other adjustment components 3. The adjustment member 303 is located on the outer periphery of the wafer and abuts against its outer edge, thus fixing the wafer radially. The drive mechanism 305 controls the adjustment member 303 to rotate, thereby rotating the wafer under the action of friction. When the detection unit 4 detects that the wafer is not level, it generates a position adjustment signal. The controller controls the lifting rod 301 to rise and fall according to the position adjustment signal, thereby adjusting the levelness of the wafer.

[0067] Optionally, the drive mechanism 305 is connected to the controller. The support plate 302 is equipped with a weight detector. When the weight detector detects that there is a wafer on the support plate 302, a movement signal is generated. The controller controls the drive mechanism 305 to start according to the movement signal and adjust the position of the wafer.

[0068] Optionally, the lifting boom 301 can be a pneumatic, hydraulic, or electric lifting component.

[0069] Optionally, the support sheet 302 is a flexible component to avoid scratching the wafer.

[0070] In some embodiments, please refer to Figure 3 The adjustment component 303 includes an adjuster 3031 and a roller 3032. The adjuster 3031 is connected to the lifting rod 301 and extends and retracts along the radial direction of the wafer. The adjuster 3031 is communicatively connected to the controller. The roller 3032 is connected to the extension end of the adjuster 3031 and is used to abut against the outer edge of the wafer. The roller 3032 is also connected to the drive mechanism 305, which drives the roller 3032 to rotate around the adjustment axis.

[0071] When there is no wafer on the support plate 302, the regulator 3031 retracts to the clearance position, and the loading assembly 201 places the wafer on the support plate 302. The regulator 3031 extends so that the roller 3032 contacts the edge of the wafer. Then, the drive mechanism 305 controls the roller 3032 to rotate, thereby rotating the wafer. After the inspection is completed, the regulator 3031 retracts, and the unloading assembly 202 removes the wafer. This embodiment avoids the problem of wafer damage caused by interference between the roller 3032 and the wafer during wafer handling.

[0072] Optionally, the drive mechanism 305 includes multiple motors, with each motor corresponding to a roller 3032.

[0073] Optionally, the regulator 3031 and the drive mechanism 305 are respectively connected to the controller for communication, and the controller can be used to start the regulator 3031 and the drive mechanism 305, which is more convenient.

[0074] Optionally, the regulator 3031 is a pneumatic, hydraulic, or electric telescopic component.

[0075] In some embodiments, please refer to Figures 1 to 2 Multiple sets of adjustment components 3 are distributed from the inside out. The adjustment mechanism includes a support 306 and a suction cup 304. The support 306 is a telescopic component that extends and retracts in the vertical direction. The support 306 is perpendicular to the surface of the support platform 1. The suction cup 304 is connected to the telescopic end of the support 306 and is used to fix the wafer.

[0076] This embodiment facilitates the suction cup 304 to adsorb the bottom of the wafer, while the detection unit 4 detects whether there are marks on the upper surface of the wafer. During wafer inspection, the lifting member 306 of the corresponding adjustment assembly 3 is raised until the suction cup 304 adsorbs the wafer, while other supports remain below the wafer to avoid interfering with the wafer inspection. After inspection is completed, the suction cup 304 releases its grip on the wafer, and the unloading assembly 202 removes the wafer.

[0077] Optionally, the suction cup 304 is connected to a gas supply pipe, and the gas supply pipe is equipped with a gas pump. By supplying or extracting gas to the suction cup 304, the suction cup 304 can adsorb or release the wafer.

[0078] Specifically, the suction cup 304 is a ring-shaped component, and the suction cups 304 of different adjustment components 3 have different diameters, and multiple suction cups 304 are coaxially arranged.

[0079] In some embodiments, please refer to Figure 2 The support platform 1 has multiple guide grooves, which correspond one-to-one with the adjustment components 3. The guide grooves are annular and coaxial with the suction cup 304. The lifting component 306 is slidably disposed in the guide groove. The drive mechanism 305 includes a second driver 3051, a drive gear 3052, and a driven gear 3053. The second driver 3051 is disposed on the support platform 1. The drive gear 3052 is connected to the second driver 3051, and the second driver 3051 is used to drive the drive gear 3052 to rotate around its own axis. The driven gear 3053 meshes with the drive gear 3052 and is coaxial with the guide groove. The lifting component 306 is connected to the driven gear 3053.

[0080] The second driver 3051 controls the rotation of the driving gear 3052, which in turn drives the driven gear 3053 to rotate. Since the driven gear 3053 is coaxially arranged with the guide groove, the lifting member 306 slides along the guide groove, realizing the rotation of the wafer. This embodiment utilizes the principle of gear meshing to drive the lifting member 306, which can precisely control the rotation angle of the wafer.

[0081] Specifically, the wafer and the guide groove are arranged coaxially.

[0082] Optionally, the second driver 3051 is a motor.

[0083] Optionally, the support platform 1 is provided with a receiving cavity, and the drive mechanism 305 corresponding to different adjustment components 3 is located at different depth positions in the receiving cavity to avoid mutual interference.

[0084] In some embodiments, please refer to Figure 2The detection unit 4 includes a support, an image acquisition unit 402, and a position detector 403. The support is mounted on the support platform 1 and has an adjustment end that extends and retracts in the horizontal direction. The image acquisition unit 402 is connected to the adjustment end and is located above the wafer for acquiring images of the wafer. The position detector 403 is connected to the adjustment end for detecting the position information of the wafer. Both the image acquisition unit 402 and the position detector 403 are communicatively connected to the controller.

[0085] The support extends and retracts horizontally to avoid interference with the wafer during loading and unloading. Image acquisition unit 402 acquires image information of the wafer and compares it with image information stored in the controller. When the comparison information matches, it indicates the presence of a mark on the wafer surface. Position detector 403 detects the wafer's position information to prevent inaccurate detection results due to wafer misalignment. When image acquisition unit 402 detects no mark on the wafer, it generates an alarm signal, and the controller activates an alarm based on the alarm signal. When position detector 403 detects a wafer position inconsistent with a preset position, it generates an offset signal, and the controller activates an offset alarm signal based on the offset information.

[0086] Optionally, the image acquisition unit 402 can be a camera, and the position detector 403 can be a distance sensor or a level sensor to ensure that the wafer is placed horizontally. When the position detector 403 is a distance sensor, multiple sensors are provided to detect the distance between the wafer and the support platform.

[0087] In some embodiments, please refer to Figures 3 to 4 The support includes a support rod 401, a third actuator, and an adjusting member 404. The support rod 401 is rotatably connected to the support platform 1 about its own axis. The third actuator is connected to the support rod 401 and is used to control the rotation of the support rod 401. The adjusting member 404 is connected to the upper part of the support rod 401 and is located above the wafer. The adjusting member 404 has an adjusting block that moves in the horizontal direction, and the adjusting block forms an adjusting end.

[0088] The third driver controls the rotation of the support rod 401. During wafer placement and removal, the rotation of the support rod 401 positions the adjusting member 404 on one side of the adjusting assembly 3 to avoid interference with the wafer. After the wafer is placed, the rotation of the support rod 401 positions the adjusting member 404 above the wafer, and the movement of the adjusting block moves the image acquisition unit 402 or the position detector 403 to the designated position.

[0089] Optional, please refer to Figure 3 Adjusting component 404 is a telescopic component, and adjusting block is located at the telescopic end of adjusting component 404.

[0090] Optionally, the adjusting component 404 has a sliding groove, and the adjusting block is slidably disposed in the sliding groove. The adjusting block is connected to a fourth driver, and the fourth driver controls the movement of the adjusting block in the sliding groove. The third driver can be a telescopic component.

[0091] In some embodiments, please refer to Figure 4 The adjusting component 404 includes a guide rod 4042, a screw 4041, a drive nut 4043, and a fifth actuator 4044. The guide rod 4042 is connected to the upper part of the support rod 401; the screw 4041 is connected to the support rod 401 and is parallel to the guide rod 4042; the drive nut 4043 is threaded to the screw 4041 and slidably connected to the guide rod 4042, forming an adjusting end; the fifth actuator 4044 is connected to the screw 4041 and is used to drive the screw 4041 to rotate, and the fifth actuator 4044 is communicatively connected to the controller.

[0092] The fifth actuator 4044 controls the rotation of the screw 4041. As the screw 4041 rotates, it drives the nut 4043 to move along the axial direction of the screw 4041, thereby adjusting the image acquisition unit 402 and the position detector 403 to acquire image and position information of the wafer. In this embodiment, the movement of the drive nut 4043 is more stable, ensuring the accuracy of information acquisition.

[0093] Optionally, the second driver 3051 is a motor.

[0094] In some embodiments, please refer to Figure 3 The support platform 1 includes an adjustment frame 101 and a support plate 102. The adjustment frame 101 is fixed to the bottom surface and can extend and retract in the vertical direction. The support plate 102 is connected to the top of the adjustment frame 101 and is used to provide support for the adjustment unit and the detection unit 4. The detection unit 4 includes a levelness detector installed on the support platform 1. The levelness detector and the adjustment frame 101 are respectively connected to the controller.

[0095] A levelness detector checks the levelness of the support plate 102. When the levelness of the support plate 102 does not meet the requirements, a leveling adjustment signal is generated. The controller controls the adjustment component 404 to extend or retract according to the leveling adjustment signal until the support plate 102 is on a horizontal plane. This embodiment can automatically adjust the levelness of the support plate 102 to ensure that the adjustment unit and the detection unit 4 on the support plate 102 are on a horizontal plane, thereby facilitating the adjustment of the wafer's position after the wafer is placed in the adjustment assembly 3.

[0096] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A SiC wafer inspection apparatus, characterized by comprising: The application relates to a wafer detection device. The device comprises a bearing platform, a detection unit arranged on the bearing platform and configured to detect a mark of a wafer, an adjusting unit arranged on the bearing platform and comprising a plurality of adjusting assemblies arranged coaxially, each adjusting assembly corresponding to a wafer of a certain size, the adjusting assembly being configured to support and drive the wafer to rotate around its own axis so that the mark of the wafer is aligned with the detection unit, a running unit comprising a feeding assembly arranged upstream of the adjusting unit and configured to place the wafer to be detected on the corresponding adjusting assembly, and a discharging assembly arranged downstream of the adjusting unit and configured to remove the wafer after detection from the adjusting assembly, and an alarm unit comprising a controller and an alarm device connected with the controller, and the detection unit is also connected with the controller. The adjusting assembly comprises a plurality of adjusting mechanisms arranged annularly on the bearing platform, the adjusting mechanism being configured to support the wafer and drive the wafer to rotate around its own axis, and a driving mechanism connected with the adjusting mechanisms and configured to drive the adjusting mechanisms to rotate around an adjusting axis perpendicular to the plate surface of the bearing platform. The adjusting mechanism comprises a lifting rod arranged on the bearing platform, a supporting piece connected with the lifting end of the lifting rod and configured to support the wafer, and an adjusting piece connected with the lifting end of the lifting rod and connected with the driving mechanism, the adjusting piece being configured to contact the outer edge of the wafer, and the adjusting piece and the lifting rod are connected with the controller respectively. The adjusting piece comprises an adjuster connected with the lifting rod and configured to stretch and contract along the radial direction of the wafer, and the adjuster is connected with the controller, and a roller connected with the stretching and contracting end of the adjuster and configured to abut against the outer edge of the wafer, the roller being also connected with the driving mechanism, and the driving mechanism drives the roller to rotate around the adjusting axis. The plurality of adjusting assemblies are arranged sequentially from inside to outside, and the adjusting mechanism comprises a lifting piece which is a stretching and contracting member and stretches and contracts along the up-down direction, and the lifting piece is perpendicular to the plate surface of the bearing platform, and a suction cup connected with the stretching and contracting end of the lifting piece and configured to fix the wafer. A plurality of guide grooves are arranged on the bearing platform, the guide grooves are arranged coaxially with the adjusting assemblies, the guide grooves are annular groove bodies, and the suction cup is arranged coaxially with the guide grooves, the lifting piece is slidingly arranged in the guide groove, and the driving mechanism comprises a second driving device arranged on the bearing platform, a driving gear connected with the second driving device and configured to be driven by the second driving device to rotate around its own axis, and a driven gear engaged with the driving gear and arranged coaxially with the guide groove, and the lifting piece is connected with the driven gear.

2. The SiC wafer inspection apparatus of claim 1, wherein The detection unit comprises a support arranged on the bearing platform, the support having an adjusting end stretching and contracting along the horizontal direction, an image collector connected with the adjusting end and arranged above the wafer and configured to collect the image of the wafer, and a light source arranged on the support and configured to provide light for the image collector. ​ ​ 3. The SiC wafer inspection apparatus of claim 2, wherein ​ ​ ​ ​ 4. The SiC wafer inspection apparatus of claim 3, wherein ​ ​ ​ 5. The SiC wafer inspection apparatus of claim 2, wherein ​ ​ ​ 6. The SiC wafer inspection apparatus of claim 5, wherein ​ ​ ​ ​ 7. The SiC wafer inspection apparatus of claim 1, wherein ​ ​ ​ A position detector is connected to the adjusting end for detecting position information of the wafer, and the image collector and the position detector are both in communication connection with the controller.

8. The SiC wafer inspection apparatus of claim 7, wherein The support includes: A support rod is rotatably connected to the bearing platform around an axis thereof; A third driver is connected to the support rod for controlling rotation of the support rod; and An adjusting member is connected to an upper portion of the support rod and located above the wafer, the adjusting member having an adjusting block moving in a horizontal direction, the adjusting block forming the adjusting end.

9. The SiC wafer inspection apparatus of claim 8, wherein The adjusting member includes: A guide rod is connected to an upper portion of the support rod; A screw rod is connected to the support rod in parallel with the guide rod; A drive nut is threadedly connected to the screw rod and slidably connected to the guide rod, the drive nut forming the adjusting end; and A fifth driver is connected to the screw rod for driving the screw rod to rotate, and the fifth driver is in communication connection with the controller.

10. The SiC wafer inspection apparatus of claim 1, wherein The bearing platform includes: An adjusting frame is fixed to the bottom surface, the adjusting frame being able to stretch and contract in an up-down direction; and A support plate is connected to a top portion of the adjusting frame for providing support force to the adjusting unit and the detecting unit; The detecting unit includes a level detector provided on the bearing platform, and the level detector and the adjusting frame are both in communication connection with the controller.

Images