Electronic component production and test integrated device

Abstract

The utility model discloses an electronic component production and test integrated device comprising a positioning assembly used for clamping and positioning a processed electronic component; the testing assembly comprises two groups of symmetrically arranged conduction testers and a first driving device; the conduction test piece is mounted at the power output end of the first driving device; the two first driving devices are used for driving the two conduction test pieces to be relatively close to clamp or away from each other; the pin shearing assembly is arranged between the testing assembly and the positioning assembly; the pin shearing assembly comprises two groups of symmetrically arranged second driving devices, pin shearing cutters and wire drawing clamps; the pin cutting tool and the wire drawing clamp are arranged at the power output end of the second driving device, and the pin cutting tool and the wire drawing clamp are arranged in a staggered mode; the two groups of second driving devices are used for driving the two groups of pin cutting tools to be oppositely combined or away from the pin wires of the processed electronic element; the first driving device is arranged in an inclined and staggered mode relative to the second driving device and runs in a staggered and avoiding mode to drive and conduct the test piece, and the pin cutting tool conducts testing and pin cutting on the machined electronic element.

Description

Technical Field

[0001] This application relates to the field of automated production equipment technology, specifically an integrated device for the production and testing of electronic components. Background Technology

[0002] After the initial assembly and production of electronic components, such as common-mode coils (common-mode inductors) or magnetic ring coils (magnetic ring inductors), they still need to be tested and have unnecessary lead lengths trimmed before they can be packaged and shipped. Current production equipment requires additional moving conveyor mechanisms to sequentially transport the electronic components to be tested to different workstations for testing and lead trimming, which is time-consuming and inefficient. Utility Model Content

[0003] This utility model addresses the above-mentioned problems by proposing an integrated device for the production and testing of electronic components, aiming to solve the technical problems in the background art.

[0004] To achieve the above objectives, this utility model provides an integrated device for electronic component production and testing, comprising:

[0005] A positioning component for clamping and positioning the electronic component being processed;

[0006] The test assembly includes two sets of symmetrically arranged continuity test pieces and a first driving device; the continuity test pieces are installed on the power output end of the first driving device; the two first driving devices are used to drive the two continuity test pieces to move closer to or away from the leads of the electronic component being processed.

[0007] A lead-cutting assembly is disposed between the testing assembly and the positioning assembly. The lead-cutting assembly includes two symmetrically arranged second driving devices, lead-cutting cutters, and wire-pulling clamps. The lead-cutting cutters and wire-pulling clamps are disposed at the power output end of the second driving devices and are staggered. The two sets of second driving devices are used to drive the two sets of lead-cutting cutters to align or move away from the leads of the electronic component being processed.

[0008] The first driving device is tilted and offset relative to the second driving device, and operates in an alternating manner to drive the continuity test piece and the lead-cutting tool to test and cut the electronic components being processed.

[0009] Furthermore, it includes a tin-plating assembly for tin-plating the leads of the processed electronic components after testing and lead trimming.

[0010] Furthermore, the tin plating assembly includes a moving platform and a tin furnace device. The moving platform is used to pick up the electronic component to be processed from the positioning assembly and place it into the tin furnace device for tin plating the leads of the electronic component.

[0011] Furthermore, it includes a flux supply box, which is disposed between the solder pot device and the test component.

[0012] Furthermore, the mobile platform includes a linear module, a lifting device installed at the power output end of the linear module, a rotating device installed at the power output end of the lifting device, and a gripping device installed at the power output end of the rotating device.

[0013] Furthermore, the tin furnace device includes a tin melting furnace and a scraping device, which is located beside the tin melting furnace and is used to scrape oxides and / or impurities from the surface of the furnace pool of the tin melting furnace.

[0014] Furthermore, the system includes a frame, which includes a work platform, on which the positioning component, testing component, and lead trimming component are all mounted; the work platform is provided with a finished electronic component placement area.

[0015] Furthermore, the frame includes a cabinet door and a material preparation platform, the material preparation platform being located below the working platform; the tin furnace device is installed on the material preparation platform; the cabinet door is rotatably connected to the frame; the material preparation platform is equipped with material preparation and / or replacement parts corresponding to each component.

[0016] Furthermore, the first drive device is tunably connected to the working platform; the power output end of the first drive device is provided with a redirection connection frame, and the continuity test piece is connected to the first drive device through the redirection connection frame.

[0017] Furthermore, it includes a baffle disposed adjacent to the positioning component; the baffle is provided with a clearance groove for avoiding the lead wires of the electronic component being processed; the blade of the lead shearing tool runs against the baffle.

[0018] Compared with the prior art, the integrated production and testing device for electronic components provided by this utility model can solve the problems of long time consumption and low production efficiency, and reduce equipment costs, unlike the production equipment in the prior art. It does not require the setting of an additional moving conveyor mechanism, and the common mode coil to be tested needs to be transported to different work positions in sequence. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the integrated production and testing device for electronic components in this application.

[0020] Figure 2This is a schematic diagram of the cabinet door of the integrated electronic component production and testing device of this application when it is open.

[0021] Figure 3 This is a schematic diagram of the structure of the integrated electronic component production and testing device of this application during the replacement and processing of the magnetic ring coil.

[0022] Figure 4 This is a schematic diagram of the structure below the working platform of the integrated electronic component production and testing device of this application.

[0023] Figure 5 This is a schematic diagram of half of the test component structure of the integrated electronic component production and testing device of this application.

[0024] Figure 6 This is a schematic diagram of half of the lead-cutting component structure of the integrated electronic component production and testing device of this application.

[0025] Figure 7 This is a schematic diagram of the positioning components and baffle structure of the integrated electronic component production and testing device of this application.

[0026] Figure 8 This is a schematic diagram of the structure of the integrated electronic component production and testing device during the common mode coil replacement process.

[0027] Figure 9 This is a schematic diagram of the lead-cutting assembly, lead-cutting slide, and wire-pulling protrusion structure of the integrated electronic component production and testing device of this application.

[0028] Figure 10 This is a schematic diagram of another embodiment of the baffle of the integrated electronic component production and testing device of this application.

[0029] The reference numerals in the figure are as follows: 1. Positioning component; 110. Conductor wire; 120. Material holding platform; 121. Connecting hole; 2. Testing component; 210. Conductivity tester; 211. Left and right first conductivity test pieces; 212. Left and right second conductivity test pieces; 220. First drive device; 230. Redirecting connection frame; 3. Cutting rod assembly; 310. Second drive device; 320. Cutting rod cutter; 330. Wire pulling clamp; 331. Wire pulling protrusion; 4. Tin plating component; 410. Transfer... 411. Moving platform; 412. Linear module; 413. Lifting device; 414. Rotating device; 415. Gripping device; 420. Solder furnace device; 421. Solder melting furnace; 422. Scraping and pushing device; 5. Baffle; 510. Alternating groove; 6. Flux supply box; 7. Frame; 710. Working platform; 711. Finished product placement area; 720. Cabinet door; 730. Material preparation platform; 8. Material preparation and / or replacement parts; 810. Shearing slide; 811. Alignment groove; 9. Scrap drawer. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model. It is understood that the accompanying drawings are provided for reference and illustration only and are not intended to limit the present utility model. The connection relationships shown in the drawings are only for clear description and do not limit the connection method.

[0031] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component, or there may be an intervening component. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be noted that, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; as a mechanical connection or an electrical connection; or as a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention.

[0032] It should also be noted that in the description of this utility model, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] Please refer to Figure 1 - Figure 7 This embodiment provides an integrated device for electronic component production and testing, including:

[0034] Positioning component 1, the positioning component 1 being used to clamp and position the electronic component being processed;

[0035] Test component 2 includes two sets of symmetrically arranged continuity testers 210 and a first driving device 220; the continuity testers 210 are installed at the power output end of the first driving device 220; the two first driving devices 220 are used to drive the two continuity testers 210 to move closer to or away from the leads of the electronic component being processed.

[0036] A lead-cutting assembly 3 is disposed between the test assembly 2 and the positioning assembly 1. The lead-cutting assembly 3 includes two symmetrically arranged second drive devices 310, lead-cutting cutters 320, and wire-pulling clamps 330. The lead-cutting cutters 320 and wire-pulling clamps 330 are disposed at the power output end of the second drive devices 310, and the lead-cutting cutters 320 and wire-pulling clamps 330 are staggered. The two sets of second drive devices 310 are used to drive the two sets of lead-cutting cutters 320 to align or move away from the leads of the electronic components being processed.

[0037] The first driving device 220 is tilted and offset relative to the second driving device 310, and operates in an alternating manner to drive the continuity tester 210 and the lead-cutting cutter 320 to test and cut the leads of the processed electronic components.

[0038] In some embodiments, the positioning component 1 can be used to clamp and position the electronic component being processed using existing technologies.

[0039] The positioning component 1 includes a conductive wire 110 for threading through the inner ring of a common mode coil or a magnetic ring coil and a material holding platform 120. The material holding platform 120 is provided with a plurality of connecting holes 121. The conductive wire 110 is connected to the material holding platform 120 through the connecting holes 121.

[0040] The conductive wire 110 can be connected to the connecting holes 121 at different positions, corresponding to different specifications of common mode coil lead lengths. The connecting holes 121 have different diameters, corresponding to conductive wires 110 with different outer diameters, and thus to different specifications of common mode coils. The material holding platform 120 consists of two separate conductive clamping block structures. The conductive wire 110 is electrically connected to the material holding platform 120. The conductive wire 110 can be made of copper.

[0041] By tilting and offsetting the first driving device 220 relative to the second driving device 310, the continuity tester 210, driven by the first driving device 220, can reach the position where the positioned component 1 clamps and positions the electronic component being processed, making an electrical connection with the positioning component 1 and abutting against the lead of the electronic component being processed. Simultaneously, the second driving device 310 of the lead-cutting component 3 drives the lead-cutting cutter 320 to a position away from the positioning component 1 to clamp and position the electronic component being processed, avoiding spatial collision and interference with the test component 2. When the first driving device 220 drives the continuity tester 210 away from the positioning component 1 to clamp and position the electronic component being processed, it also does not interfere with the second driving device 310 driving the lead-cutting cutter 320 and the wire-pulling clamp 330 to straighten and fix the lead of the electronic component being processed before cutting it to the predetermined length.

[0042] Thus, compared with existing production equipment, this integrated electronic component production and testing device does not require additional moving conveyor mechanisms. Instead, it sequentially transports the common mode coils to be tested to different workstations, solving the problems of long time consumption and low production efficiency, and reducing equipment costs.

[0043] In some embodiments, the second driving device 310 is a linear cylinder, and the wire pull clamp 330 includes a wire pull protrusion and a pair of alignment grooves, which are respectively connected to the power output ends of the two linear cylinders. When the piston rods of both linear cylinders are extended, the wire pull protrusion and the alignment grooves engage to provide sufficient clamping for the common mode coil lead, keeping the lead end taut and fixed. When the two lead-cutting cutters 320, driven synchronously by the piston rods, engage, the lead is cut.

[0044] Please refer to Figure 1 and Figure 2 It includes a tin-plating component 4, which is used to tin-plat the ends of the leads of the processed electronic components after testing and lead trimming.

[0045] As an electronic component, the common-mode coil is soldered onto the circuit board. Therefore, customers need to tin-plate the coil before soldering to ensure a smoother soldering process. By adding a tin-plating component to tin-plate the leads of four pairs of processed electronic components, the product's market competitiveness and customer experience are further enhanced.

[0046] Please refer to Figure 1 and Figure 2 The tin plating assembly 4 includes a moving platform 410 and a tin furnace device 420. The moving platform 410 is used to pick up the electronic component to be processed from the positioning assembly 1 and place it into the tin furnace device 420 for tin plating the ends of the leads of the electronic component to be processed.

[0047] The tin furnace device 420 is used to heat and keep tin metal at a liquid temperature, so that the moving platform 410 can move the electronic components to be processed and allow the lead ends of the components to enter the tin pool of the tin furnace device 420 for tin plating.

[0048] Please refer to Figure 1 and Figure 2 It includes a flux supply box 6, which is located between the solder pot device 420 and the test component 2.

[0049] Flux supply box 6 contains flux. Before tinning the leads of the electronic component being processed, the moving platform 410 picks up the electronic component being processed from the positioning assembly 1 and places it into the flux supply box 6 so that the leads of the electronic component being processed are coated with flux. Then the moving platform 410 picks up the electronic component being processed and moves it from the flux supply box 6 to the tin pot device 420 for tinning.

[0050] Please refer to Figure 1 and Figure 2 The mobile platform 410 includes a linear module 411, a lifting device 412 installed at the power output end of the linear module 411, a rotating device 413 installed at the power output end of the lifting device 412, and a gripping device 414 installed at the power output end of the rotating device 413.

[0051] In some embodiments, the linear module 411 and the lifting device 412 are both drive structures composed of a motor and a lead screw and nut assembly.

[0052] In some embodiments, the rotating device 413 is a tilting cylinder. Since the removal of the electronic component to be processed from the positioning assembly 1, and the gripping device 414 holding the electronic component to be processed to the solder pot device 420 or the flux supply box 6 for swivel tinning or flux application, both involve reversing or swivel rotational movements, the rotating device 413 provides corresponding movement range support.

[0053] In some embodiments, the gripping device 414 is a finger cylinder.

[0054] In some embodiments, the mobile platform 410 may also be a multi-axis robotic arm.

[0055] Please refer to Figure 1 and Figure 2 The tin furnace device 420 includes a tin melting furnace 421 and a scraping device 422. The scraping device 422 is located beside the tin melting furnace 421 and is used to scrape oxides and / or impurities from the surface of the furnace pool of the tin melting furnace 421.

[0056] In some embodiments, the scraping device 422 includes a linear cylinder and a scraper mounted on the end of the linear cylinder telescopic rod. Driven by the telescopic extension of the linear cylinder, the scraper passes over the upper surface of the solder melting furnace 421, maintaining a surface free of tin oxides or impurities, thereby improving the tin plating quality of the leads of the processed electronic components.

[0057] Please refer to Figure 1 and Figure 2 The system includes a frame 7, which includes a work platform 710. The positioning component 1, the testing component 2, and the lead-cutting component 3 are all mounted on the work platform 710. The work platform 710 is provided with a finished electronic component placement area 711.

[0058] Preferably, the work platform 710 is provided with a waste through hole corresponding to the shearing cutter 320, and the lower end face of the work platform 710 is provided with a waste drawer 9 for collecting wire waste.

[0059] The mobile platform 410 is also used to transport the tin-plated electronic components to the finished product placement area 711.

[0060] Please refer to Figure 1 and Figure 2 The frame 7 includes a cabinet door 720 and a material preparation platform 730, which is located below the working platform 710. The tin furnace device 420 is installed on the material preparation platform 730. The cabinet door 720 is rotatably connected to the frame 7. The material preparation platform 730 is provided with material preparation and / or replacement parts 8 corresponding to each component.

[0061] Various control buttons and controllers can be installed on the work platform 710 and cabinet door 720. The material preparation platform 730 is equipped with air source, pipelines, and control valves for controlling the operation of each drive cylinder.

[0062] Please refer to Figure 3 and Figure 5 The first drive device 220 is tunably connected to the working platform 710; the power output end of the first drive device 220 is provided with a redirection connection frame 230, and the continuity tester 210 is connected to the first drive device 220 through the redirection connection frame 230.

[0063] In some embodiments, the first driving device 220 includes a fixed base and a driving cylinder connected to the fixed base. The fixed base is provided with a strip hole, and the working platform 710 is provided with a threaded hole. By passing screws through the strip hole and the threaded hole, the first driving device 220 and the working platform 710 are adjustablely connected, so that the continuity tester 210 driven by the first driving device 220 reaches a precise position.

[0064] The continuity tester 210 includes two sets of continuity test components: left and right first continuity test components 211 and left and right second continuity test components 212. The first continuity test components are used to clamp and electrically connect with the conductive wire 110 passing through the inner hole of the common mode coil in the positioning assembly 1 to form a test circuit. Among the left and right second continuity test components 212, one has a pad structure and the other has a blade structure. When the two are engaged, they cut the insulation on the surface of the lead wire of the electronic component being processed and make it electrically conductive.

[0065] Since the conductive line 110 and the lead wire of the processed electronic component are located at different positions, the left and right first conductive test pieces 211 and the left and right second conductive test pieces 212 are also distributed at different positions on the first driving device 220. The redirecting connection frame 230, through the adapted tilting redirecting frame structure, further rationally allocates the positions of the left and right first conductive test pieces 211 and the left and right second conductive test pieces 212 based on the tilting design of the first driving device 220, so that it can reach the location of the processed electronic component to test it, and will not interfere with the lead-cutting assembly 3.

[0066] Please refer to Figure 3 and Figure 7 The device includes a baffle 5 disposed adjacent to the positioning component 1; the baffle 5 is provided with a relief groove 510 for avoiding the lead wires of the electronic component being processed; the blade of the lead shearing tool 320 runs against the baffle 5.

[0067] Based on the positional relationship between the baffle 5 and the lead-cutting cutter 320, the baffle 5 and the lead-cutting cutter 320 work together to cut off the leads of the electronic components being processed.

[0068] The baffle 5 in the material preparation and / or replacement parts 8 has two clearance slots 510, corresponding to the two pins of the common mode coil; when the processed electronic component is a magnetic induction coil, the number of clearance slots 510 is one.

[0069] When the electronic component being processed is a common-mode coil, the preparation and / or changeover accessories 8 include a lead-cutting slide 810, and the wire-pulling fixture 330 includes two wire-pulling protrusions 331. Alignment grooves 811 that mate with the wire-pulling protrusions 331 are located on both sides of the lead-cutting slide 810. The two wire-pulling protrusions 331 are respectively connected to the power output ends of two linear cylinders. The lead-cutting slide 810 serves both as a pad for cutting the leads of the electronic component being processed and as a tool for tightening the leads in conjunction with the wire-pulling protrusions 331, thus serving a dual purpose. In this way, the preparation and / or changeover accessories 8 allow for the processing and testing of two types of electronic components with a single device, a clever design.

[0070] Operating principle of this integrated electronic component production and testing device:

[0071] The electronic component is inserted into the conductor 110 on the material holding platform 120 by manual or automated means, and the control switch is pressed.

[0072] The first driving device 220 pushes the left and right first continuity test pieces 211 and the left and right second continuity test pieces 212 to engage synchronously. At the same time, the blades on the left and right sides of the left and right second continuity test pieces 212 press against the lead wire and the left and right first continuity test pieces 211 clamp the upper end of the continuity wire 110. Meanwhile, the upper and lower blades on one side of the left and right second continuity test pieces 212 press against the lead wire and cut through the outer layer of insulation paint to make electrical contact with the inner copper wire. At the same time, the test clamp can complete the test. The end of the continuity wire 110 connected to the connection hole 121 is directly connected to the test filter. At this time, the display value of the observation coil test filter and the test prompt sound are read to determine whether the electronic component being tested is good.

[0073] After the above test actions are completed, when the first drive device 220 uses the drive cylinder, the piston rod will automatically retract. The pause time of the drive cylinder can be preset in the control program to control the operation of the solenoid valve.

[0074] After the first drive device 220 pulls the left and right first conduction test pieces 211 and the left and right second conduction test pieces 212 back to their original positions, the second drive device 310 automatically extends according to the set action sequence, pushing the lead cutting blade 320 and the wire pulling clamp 330 to engage and cut the lead. Under the clamping of the lead by the wire pulling protrusion of the wire pulling clamp 330 and the alignment groove, the lead is pulled before cutting, thereby ensuring that the lead length is consistent after cutting.

[0075] After the lead trimming is completed, the linear module 411 drives the lifting device 412, rotating device 413, and gripping device 414 to move above the positioning component 1. As the lifting device 412 descends, the automatic tin scraping device 422 next to the tin melting furnace 421 automatically scrapes off the slag from the previous tin plating on the surface of the molten tin in the furnace, ensuring that there are no impurities on the leads of the tin-plated product and that the product meets quality requirements. The interval and start time of the automatic tin scraping can be set on the linear cylinder control based on the time required from placing the electronic component after tin plating to grabbing the next electronic component.

[0076] After the gripping device 414 picks up the coil, the lifting device 412 rises while the linear module 411 synchronously drives the entire unit to move towards the flux supply box 6. The rotating device 413 will then rotate 90 degrees, turning the coil leads downwards. After moving to the center position above the flux supply box 6 containing flux, the slide of the lifting device 412 shaft descends, immersing the leads into the flux. The immersion depth and pause time can be adapted to different specifications of electronic products, and the stroke of the lifting device 412 can be set.

[0077] After flux application, the lifting device 412 rises while the linear module 411 moves towards the solder melting furnace 421. Once above the furnace, the lifting device 412 moves downwards, immersing the electronic component leads in the solder bath. The linear module 411 can then continue to move laterally for 6-9 mm to ensure effective solder plating. The immersion depth, dwell time, and movement distance of the leads can be adjusted according to the specific specifications of different electronic products by controlling the operating parameters of each device in the moving platform 410.

[0078] After tin plating is completed, the lifting device 412 drives the electronic product to rise while the rotating device 413 flips and the linear module 411 drives the whole to move towards the finished product placement area 711. After reaching the finished product placement area 711, the gripping device 414 releases the product and puts it down.

[0079] After the product is placed down, the mobile platform 410 resets and begins transporting the next electronic component to be processed, and this cycle repeats continuously.

[0080] The operating speed, pause time, and lifting and lowering time of the cylinder, as well as the forward and backward speeds and pause duration for each step above, can all be set and saved on the slide and cylinder controllers.

[0081] The above describes the testing and manufacturing process for electronic components that are magnetic ring coils. When the electronic component is a common-mode coil, the difference lies in the testing steps. This is because magnetic ring coils have two leads, while common-mode coils have two sets of four leads. The specific differences are as follows:

[0082] The first driving device 220 pushes the left and right first continuity test pieces 211 and the left and right second continuity test pieces 212 to engage synchronously. While the blades on both sides of the left and right second continuity test pieces 212 press against the lead wires and the left and right first continuity test pieces 211 clamp the upper end of the continuity wire 110, the upper and lower blades on one side of the left and right second continuity test pieces 212 respectively press the upper and lower lead wires on both sides against the side of the lead shearing slide 810, cutting through the outer insulating varnish of the lead wires and making electrical contact with the inner copper wires. Simultaneously, the test chuck completes the test on one side. At this time, the displayed value of the observation coil test filter and the test prompt sound are read to determine whether the electronic component on the currently tested side is a good product. After the test is qualified, the continuity test start button is pressed to test the two lead wires on the other side of the common mode coil, paying attention to the test value of the test filter and the test prompt sound. The lead shearing slide 810 is a plate structure, detachably connected to the work platform 710, and is located above the waste through hole.

[0083] Because electronic components have different sizes and specifications, different sizes of baffles 5, cutting slides and continuity testers 210 and other parts need to be replaced. The spare parts and / or replacement parts 8 provide replacement parts.

[0084] Therefore, this integrated electronic component production and testing device improves upon the traditional work model where five workers were required to complete testing, lead trimming, and tin plating. Instead, it integrates these three processes into a single, high-performance automated production machine operated by a single worker. This saves time and labor, is convenient and efficient, and reduces both production efficiency and labor costs while also reducing worker workload. Compared to traditional methods, it also saves production space and more than doubles the efficiency of testing, lead trimming, tin plating, and solder scraping, increasing production capacity to 400-430 pieces per hour.

[0085] In the specification and claims of this application, the terms "comprising / including" and "having / including" and variations thereof are used to specify the presence of the stated features, values, steps or components, but do not exclude the presence or addition of one or more other features, values, steps, components or combinations thereof.

[0086] Some features of this invention are described in different embodiments for clarity; however, these features may also be described in combination in a single embodiment. Conversely, some features of this invention are described only in a single embodiment for brevity; however, these features may also be described individually or in any suitable combination in different embodiments.

[0087] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An electronic component production and test integrated device, characterized by comprising: The application relates to a tinning device for electronic components. The device comprises a positioning assembly for clamping and positioning the electronic components to be processed, a testing assembly comprising two groups of symmetrical on-off testers and first driving devices, wherein the on-off testers are installed on the power output ends of the first driving devices, and the two first driving devices are used for driving the two on-off testers to approach or move away from the pin lines of the electronic components to be processed. The device further comprises a pin shearing assembly arranged between the testing assembly and the positioning assembly, wherein the pin shearing assembly comprises two groups of symmetrical second driving devices, pin shearing cutters and pin pulling clamps, the pin shearing cutters and the pin pulling clamps are installed on the power output ends of the second driving devices, and the pin shearing cutters and the pin pulling clamps are arranged in a staggered mode, and the two groups of second driving devices are used for driving the two groups of pin shearing cutters to approach or move away from the pin lines of the electronic components to be processed. The first driving devices are arranged in a staggered mode relative to the second driving devices, and the first driving devices and the second driving devices are used for driving the on-off testers and the pin shearing cutters to test and shear the pin lines of the electronic components to be processed. The device further comprises a tinning assembly for tinning the pin line ends of the electronic components after testing and pin shearing. The tinning assembly comprises a moving platform and a tin furnace device, wherein the moving platform is used for holding the electronic components from the positioning assembly to the tin furnace device to tin the pin line ends of the electronic components.

2. The electronic component production and test integrated device according to Claim 1, wherein The device further comprises a flux supply box arranged between the tin furnace device and the testing assembly.

3. The integrated device for testing electronic components according to claim 2, wherein The moving platform comprises a linear module, a lifting device installed on the power output end of the linear module, a rotating device installed on the power output end of the lifting device, and a grabbing device installed on the power output end of the rotating device.

4. The integrated device for testing electronic components according to claim 3, wherein The tin furnace device comprises a tin melting furnace and a scraping device arranged beside the tin melting furnace and used for scraping the oxide and / or impurities on the surface of the furnace pool of the tin melting furnace.

5. The integrated device for testing electronic components according to claim 3, wherein The device further comprises a rack comprising a working platform, wherein the positioning assembly, the testing assembly and the pin shearing assembly are arranged on the working platform, and the working platform is provided with a finished product placement area for the electronic components.

6. The integrated device for testing electronic components according to claim 3, wherein The rack comprises a cabinet door and a material preparation platform, wherein the material preparation platform is arranged below the working platform, the tin furnace device is installed on the material preparation platform, the cabinet door is rotationally connected with the rack, and the material preparation platform is provided with material preparation and / or replacement accessories corresponding to each assembly.

7. The integrated device for testing electronic components according to claim 3, wherein The first driving devices are adjustably connected with the working platform, the power output end of the first driving device is provided with a redirection connecting frame, and the on-off testers are connected with the first driving devices through the redirection connecting frame.

8. The integrated device for testing electronic components according to claim 7, wherein The device further comprises a baffle arranged adjacent to the positioning assembly, wherein the baffle is provided with an avoidance groove for avoiding the pin lines of the electronic components to be processed, and the cutter plate of the pin shearing cutter abuts against the baffle during operation.

9. The integrated device for testing electronic components according to claim 7, wherein ​ 10. The integrated device for testing electronic components according to claim 1, wherein ​

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