Film probe card structure capable of reducing interference among probes
By creating segmented grooves in the thin-film probe card structure and embedding spacer fillers of different materials, the problem of interference between probes is solved, contact performance and test stability are improved, and signal integrity is ensured.
Patent Information
- Application Number
- CN202520143223.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-01-21
AI Technical Summary
In existing thin-film probe card structures, severe interference between probes leads to inconsistent contact performance, and some probes cannot make stable and reliable contact, affecting the test results.
Dividing grooves are created between probe groups, especially those reaching the first metal layer, to reduce the proportion of thin film and metal structure between probes. Different groove shapes, such as strips, arcs, or crosses, are used, and even different materials of placeholder fillers are embedded to reduce interference.
It effectively reduces interference between probes, improves contact performance, avoids problems of excessively deep or shallow local probe marks, and reduces the risk of wafer damage and test signal loss.
Smart Images
Figure CN223796586U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to semiconductor detection probe card technical field especially, relate to a thin film probe card structure of reducing needle interference. BACKGROUND
[0002] In recent years, with the development and popularization of 5G and big data technology, the working frequency of semiconductor devices is continuously increasing, and wafer-level testing for high frequency has gradually become an indispensable part of chip production. Thin film probe card adopts an integrated process to directly manufacture probes and signal lines on a thin film, greatly reducing parasitic problems in the needle card testing process, shortening the signal transmission path, reducing impedance discontinuity, and having excellent signal integrity, and is widely used in radio frequency wafer testing
[0003] During testing, the first probe is usually in contact with the wafer to produce a needle mark or electrical conduction as a zero point, and a Z-direction stroke is required to ensure that each probe can stably and reliably contact the tested pad or bump, and the test is completed.
[0004] In the prior art, the thin film probe card structure includes a support body providing an action surface, a thin film covering the action surface, a signal metal layer and a ground metal layer disposed in the thin film, and a ground probe and a signal probe protruding from the surface of the thin film; the signal metal layer is divided into signal lines and ground planes that are disconnected from each other, the signal probe is connected to the signal line, and the ground probe is connected to the ground plane, and the ground plane is connected to the ground metal layer through a hole. Since the thin film probe is prepared by an integrated process, each probe is distributed on a thin film, and mutual interference exists between each probe, especially the ground probe, which is connected to a ground plane, so the interference is more serious, resulting in poor contact performance of the thin film at certain positions, requiring a large stroke or always failing to obtain sufficient contact force to achieve stable and reliable electrical connection, causing uneven needle marks or contact failure of some probes, and failing to meet the testing requirements. UTILITY MODEL CONTENTS
[0005] The utility model aims to provide a thin film probe card structure for reducing needle interference, which can reduce needle interference and provide more consistent contact performance without deteriorating electrical performance.
[0006] To achieve the above object, the utility model discloses technical scheme is: a kind of thin film probe card structure for reducing needle interference, including providing a support body of action surface, thin film on the action surface, first metal layer and second metal layer being spaced apart and being arranged in thin film, and probe protruding from the surface of thin film;First metal layer is closer to the probe than second metal layer;Multiple probes with spacing less than or equal to 250 μm are set as probe group, and segmentation groove is set between the probe of the probe group on the surface of thin film, and the segmentation groove is at least deep as the first metal layer.
[0007] In the above scheme, the segmentation groove is a long slot.
[0008] In the above scheme, the segmentation groove is an arc-shaped groove.
[0009] In the above scheme, the segmentation groove is composed of a plurality of point groove arrangements.
[0010] In the above scheme, when the probe group is a plurality of rows and columns of matrix arranged probes, the segmentation groove is a cross-shaped groove arranged at the intersection of rows and columns. Alternatively, the segmentation groove is a plurality of point groove arrangements arranged in a cross shape and arranged at the intersection of rows and columns.
[0011] In the above scheme, the segmentation groove is deep as the second metal layer, which is a preferred scheme.
[0012] In the above scheme, the segmentation groove 3 is embedded with a space-filling material different from the thin film material.
[0013] The utility model has the following effects: the utility model is provided with segmentation groove, effectively reduces the thin film and metal structure ratio between probes, weakens the needle interference, improves the needle card contact performance, avoids local needle marks too deep, too shallow or missing, etc. Problem, reduce the risk of wafer and test signal loss. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is structure schematic diagram of the utility model embodiment one, and the drawing is the schematic diagram of probe card thin film surface, expresses the distribution position relationship of probe and segmentation groove;
[0015] Figure 2 It is structure schematic diagram of the utility model embodiment two, and the drawing is the schematic diagram of probe card thin film surface, expresses the distribution position relationship of probe and segmentation groove;
[0016] Figure 3 It is structure schematic diagram of the utility model embodiment three, and the drawing is the schematic diagram of probe card thin film surface, expresses the distribution position relationship of probe and segmentation groove;
[0017] Figure 4This is a schematic diagram of the structure of Embodiment 4 of the present invention. The diagram is a schematic diagram of the probe card film surface, showing the positional relationship between the probe and the dividing groove.
[0018] Figure 5 This is a schematic diagram of the structure of Embodiment 5 of the present invention. The diagram is a schematic diagram of the probe card film surface, showing the positional relationship between the probe and the dividing groove.
[0019] Figure 6 This is a schematic diagram of the structure of Embodiment Six of the present invention. The diagram is a schematic diagram of the probe card film surface, showing the positional relationship between the probe and the dividing groove.
[0020] Figure 7 These are partial cross-sectional views of the thin film in embodiments one to six of this utility model, showing the cross-section of the thin film.
[0021] In the above figures: 1. Thin film; 11. First metal layer; 12. Second metal layer; 2. Probe; 3. Dividing groove. Detailed Implementation
[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0023] Example 1, see Figure 1 and Figure 7 As shown, a thin-film probe card structure for reducing inter-pin interference is described:
[0024] The thin-film probe card structure includes a support providing an active surface, a thin film 1 covering the active surface, a first metal layer 11 and a second metal layer 12 disposed within the thin film 1 and spaced apart from each other, and a probe 2 protruding from the surface of the thin film 1.
[0025] The structure of the thin film 1 is as follows: Figure 7 As shown, it has a first metal layer 11 and a second metal layer 12 spaced apart from each other, with the first metal layer 11 being closer to the probe 2 than the second metal layer 12.
[0026] Multiple probes with a spacing of 250 μm or less are designated as a probe group. Specifically, as follows... Figure 1 As shown, there are a total of six probes 2, three of which are grouped together with a spacing of less than 250 μm. Therefore, they are divided into two groups, each with probe A, probe B, and probe C.
[0027] See Figure 1 As shown, a dividing groove 3 is formed on the surface of the thin film 1 between the probes 2 of each probe group, that is, a dividing groove 3 is provided between probe A and probe B, and a dividing groove 3 is also provided between probe B and probe C. The dividing groove 3 is an elongated groove.
[0028] See Figure 7As shown, the dividing groove 3 is at least deep to the first metal layer 11, meaning that the bottom of the dividing groove 3 at least touches the surface of the first metal layer 11. Of course, in practice, a deeper depth is better, such as... Figure 7 The example is the depth of the bottom of the groove 3 and the second metal layer 12, that is... Figure 7 For example, the dividing groove 3 touches the surface of the second metal layer 12 and intersects with the first metal layer 11, thus dividing the first metal layer 11.
[0029] This embodiment effectively reduces the proportion of thin film and metal structure between probes 2 by setting the dividing groove 3, weakens the interference between probes, improves the contact performance of the probe card, avoids problems such as excessively deep, shallow or missing local needle marks, and reduces the risk of damaging the wafer and missing test signals.
[0030] Example 2, see Figure 2 and Figure 7 As shown, a thin-film probe card structure for reducing inter-pin interference is described:
[0031] The thin-film probe card structure includes a support body providing an active surface, a thin film 1 covering the active surface, a first metal layer 11 and a second metal layer 12 disposed within the thin film 1 and spaced apart from each other, and a probe 2 protruding from the surface of the thin film 1. The difference from Embodiment 1 is that the dividing groove 3 is an arc-shaped groove.
[0032] The rest is the same as in Example 1, and will not be repeated here.
[0033] Example 3, see Figure 3 and Figure 7 As shown, a thin-film probe card structure for reducing inter-pin interference is described:
[0034] The thin-film probe card structure includes a support body providing an active surface, a thin film 1 covering the active surface, a first metal layer 11 and a second metal layer 12 disposed within the thin film 1 and spaced apart from each other, and a probe 2 protruding from the surface of the thin film 1. The difference from Embodiment 1 is that the dividing groove 3 is an elongated groove composed of multiple grooves arranged in a row.
[0035] The rest is the same as in Example 1, and will not be repeated here.
[0036] Example 4, see Figure 4 and Figure 7 As shown, a thin-film probe card structure for reducing inter-pin interference is described:
[0037] The thin-film probe card structure includes a support providing an active surface, a thin film 1 covering the active surface, a first metal layer 11 and a second metal layer 12 disposed within the thin film 1 and spaced apart from each other, and probes 2 protruding from the surface of the thin film 1. The difference from Embodiment 1 is that there are a total of twelve probes 2, six of which are grouped together with a spacing of less than 250 μm, thus they are divided into two groups, such as... Figure 4 As shown, each probe group consists of probe A, probe B, probe C, probe D, probe E, and probe F, arranged in a 2x3 matrix. The dividing groove 3 comprises one horizontally elongated dividing groove 3 between the rows and two vertically elongated dividing grooves 3 between the columns. The horizontally elongated dividing groove 3 and the vertically elongated dividing groove 3 intersect and communicate with each other. This is a preferred solution.
[0038] The rest is the same as in Example 1, and will not be repeated here.
[0039] Example 5, see Figure 5 and Figure 7 As shown, a thin-film probe card structure for reducing inter-pin interference is described:
[0040] The thin-film probe card structure includes a support providing an active surface, a thin film 1 covering the active surface, a first metal layer 11 and a second metal layer 12 disposed within the thin film 1 and spaced apart from each other, and probes 2 protruding from the surface of the thin film 1. The difference from Embodiment 1 is that there are a total of twelve probes 2, six of which are grouped together with a spacing of less than 250 μm, thus they are divided into two groups, such as... Figure 4 As shown, each probe group consists of probe A, probe B, probe C, probe D, probe E, and probe F. These probes A, B, C, D, E, and F are arranged in a matrix of two rows and three columns. The dividing groove 3 is set as a short line dividing groove 3. A short line dividing groove 3 is set at the adjacent position of each probe in the probe group, that is, a total of seven short line dividing grooves 3 are set.
[0041] The rest is the same as in Example 1, and will not be repeated here.
[0042] Example 6, see Figure 6 and Figure 7 As shown, a thin-film probe card structure for reducing inter-pin interference is described:
[0043] The thin-film probe card structure includes a support providing an active surface, a thin film 1 covering the active surface, a first metal layer 11 and a second metal layer 12 disposed within the thin film 1 and spaced apart from each other, and probes 2 protruding from the surface of the thin film 1. The difference from Embodiment 1 is that there are a total of eight probes 2, of which probes A, B, C, and D are spaced less than 250 μm apart and are designated as the first probe group, while probes F and G are spaced less than 250 μm apart and are designated as the second probe group. In addition, probes E and H are isolated and do not form a probe group. In the first probe group, probes A, B, C, and D are arranged in a two-row, two-column rectangular arrangement, with a dividing groove 3 in the center, which is cross-shaped. In the second probe group, probes F and G are adjacent, that is, a long strip dividing groove 3 is provided between probes F and G, and no dividing groove is provided next to probes E and H.
[0044] The rest is the same as in Example 1, and will not be repeated here.
[0045] The above embodiments are merely limited examples. In practice, the probes 2 are arranged according to the requirements of the chip being tested, and can be arranged in various ways, either regularly or irregularly. In any case, when the spacing between the probes 2 is less than or equal to 250μm, they should be set as a probe group, which requires a dividing groove 3 between each probe 2 in the probe group to achieve the purpose of this invention.
[0046] Specifically, the form of the dividing groove 3 is not limited. It can be a long strip that runs through (e.g., an arc-shaped long groove or a rectangular strip), or it can be composed of multiple points arranged (e.g., circular points, rectangular points, or irregular points).
[0047] In terms of manufacturing process, the segmented groove 3 can be formed by laser removal of the thin film PI material and metal material at the corresponding groove position, or by processing a placeholder structure at the corresponding groove position in the processing process, and then removing it by etching or other methods after the thin film is prepared.
[0048] In practice, a spacer material different from the film material can also be embedded in the dividing groove 3. Usually, a material with a larger elastic coefficient than the film material is used.
[0049] The embodiments described are merely illustrative of the technical concept and features of this utility model, intended to enable those skilled in the art to understand its contents and implement it accordingly, and should not be construed as limiting the scope of protection of this utility model. All equivalent transformations or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.
Claims
1. A thin film probe card structure for reducing the needle-needle interference, comprising a support body for providing an active surface, a thin film (1) covering the active surface, a first metal layer (11) and a second metal layer (12) arranged in the thin film (1) and spaced from each other, and a probe (2) protruding from the surface of the thin film (1); the first metal layer (11) is closer to the probe (2) than the second metal layer (12); characterized in that: A plurality of probes (2) with a distance less than or equal to 250 μm are arranged as a probe group, and a separation groove (3) is formed on the surface of the film (1) between the probes (2) of the probe group, and the separation groove (3) is at least as deep as the first metal layer (11). 2. The thin film probe card structure of claim 1, wherein: The separation groove (3) is an elongated groove.
3. The thin film probe card structure of claim 1, wherein: The separation groove (3) is an arc-shaped groove.
4. The thin film probe card structure of claim 1, wherein: The separation groove (3) is formed by a multi-point groove arrangement.
5. The thin-film probe card structure for reducing inter-needle interference according to claim 1, characterized in that: When the probe group is a plurality of rows and columns of matrix-arranged probes (2), the separation groove (3) is a cross-shaped groove arranged at the intersection of the rows and columns.
6. The thin film probe card structure of claim 1, wherein: When the probe group is a plurality of rows and columns of matrix-arranged probes (2), the separation groove (3) is a multi-point groove arranged in a cross shape and arranged at the intersection of the rows and columns.
7. The thin film probe card structure of claim 1, wherein: The separation groove (3) is as deep as the second metal layer (12).
8. The thin film probe card structure of claim 1, wherein: The separation groove (3) is embedded with a space-filling material different from the film material.