Silicon carbide SIC chip test probe card

Abstract

The utility model discloses a silicon carbide SIC chip test probe card, which relates to the technical field of chip test, and comprises an installation base, a PCB substrate arranged inside the installation base, an MLO substrate and a chip positioning groove arranged on the PCB substrate, a probe card main body arranged above the MLO substrate, an upper cover arranged above the main body, a probe arranged in the probe card main body, and a resin plate arranged on the top of the upper cover and used for probe maintenance. An elastic strip is arranged in the middle of the probe and is connected through a connecting sleeve, a positioning sleeve is arranged on the outer side of the probe in a sliding mode, a positioning disc and a mounting groove are arranged in the middle of the probe card body, a fixing hole and a limiting hole are formed in the mounting groove, the elastic strip is located in the limiting hole, the upper cover and the positioning disc are fixed through a pin, a dismounting part is arranged at the top of the pin, and a positioning column is arranged at the bottom of the probe card body and is connected with a PCB substrate in an inserted mode. The probe card is simple in structure, easy to manufacture and install and accurate in probe positioning, the test precision is improved, maintenance is convenient and fast through the resin plate, the maintenance efficiency is improved, the elasticity of the probe is enhanced through the elastic strip, the service life is prolonged, and the positioning accuracy is further improved through the positioning sleeve.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor testing technology, specifically relating to a silicon carbide (SiC) chip test probe card. Background Technology

[0002] The semiconductor manufacturing process generally includes integrated circuit design, wafer fabrication, wafer testing, wafer dicing, chip packaging, and final chip testing. Wafer testing is crucial for identifying chips with functional defects beforehand. This testing primarily utilizes dedicated testing equipment and typically employs probe cards with multiple probes. A probe card is a testing interface mainly used for testing bare dies. It connects the testing equipment and the chip, transmitting signals and testing chip parameters. During testing, the probes on the probe card directly contact the solder pads or bumps on the chip to extract chip signals. Combined with peripheral testing instruments and software control, this achieves automated measurement.

[0003] However, the test probe cards for silicon carbide (SiC) chips have complex structures, inaccurate probe positioning, and are difficult to repair. Traditional probe cards cannot meet the high-precision testing requirements of SiC chips, and are prone to probe damage and unstable connections during use. Utility Model Content

[0004] The purpose of this invention is to provide a silicon carbide (SiC) chip test probe card to solve the problems of complex structure, inaccurate probe positioning, and difficult maintenance of the test probe cards for SiC chips mentioned in the background art. Traditional probe cards are difficult to meet the high-precision testing requirements of SiC chips, and are prone to probe damage and unstable connection during use.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a silicon carbide (SiC) chip test probe card, including a mounting base;

[0006] A PCB substrate is provided inside the mounting base, an MLO substrate is provided at the upper part of the PCB substrate, a chip positioning groove is provided in the middle of the MLO substrate, and a probe card body is provided at the upper part of the MLO substrate.

[0007] A top cover is provided at the top of the probe card body, a probe is provided inside the probe card body, and a resin plate is provided at the middle of the top of the top cover. The probe is inspected and repaired through the resin plate.

[0008] Preferably, an elastic strip is provided at the middle position of the probe, and the elastic strip is fixedly connected to the probe by a connecting sleeve.

[0009] Preferably, a positioning sleeve is provided at the outer position of the probe, and the probe is slidably connected to the positioning sleeve.

[0010] Preferably, the top of the probe is fixedly connected to the resin plate, and the resin plate is nested and connected to the top of the probe card body.

[0011] Preferably, a positioning disk is provided at the middle position of the probe card body, and an installation groove is provided at the outer position of the positioning disk.

[0012] Preferably, the mounting groove is provided with a ring array of fixing holes, and a limiting hole is provided inside the fixing hole, with the elastic strip located inside the limiting hole.

[0013] Preferably, a second gasket is provided at the upper and lower sides of the mounting groove, a pin is provided inside the fixing hole, the upper cover and the positioning plate are fixedly connected by the pin, and a disassembly part is provided at the top of the pin.

[0014] Preferably, a positioning post is provided at the bottom of the probe card body, and the probe card body is connected to the PCB substrate by the positioning post. First gaskets are provided on the left and right sides of the MLO substrate, and the mounting base is made of steel.

[0015] Compared with the prior art, this utility model provides a silicon carbide (SiC) chip test probe card, which has the following advantages:

[0016] 1. The probe card body features a top cover, resin plate, elastic strip, and positioning sleeve. The top cover protects the internal structure, allowing for convenient and efficient inspection of the probes via the resin plate on top of the cover. The positioning sleeve on the outside of the probes slides to the probes, further improving positioning accuracy and ensuring precise contact with the silicon carbide (SiC) chips during testing. The elastic strip in the middle of the probes is fixedly connected to the probes via a connecting sleeve, providing elastic cushioning during testing, extending the probes' lifespan, and reducing the risk of damage from external impacts. The top of the probes is fixedly connected to the resin plate, which is nested within the top of the probe card body, ensuring the stability and reliability of the probes during use.

[0017] 2. The positioning plate, mounting slot, fixing holes, limiting holes, second gaskets, pins, and disassembly parts are designed to provide an accurate installation reference for the upper cover and probes, ensuring the stability of the overall structure. The mounting slot features a circular array of fixing holes, making the connection between the upper cover and the probe card body more secure and reliable. Limiting holes within the fixing holes confine the elastic strip, preventing it from shifting during operation and ensuring the stable operation of the probe's elastic buffering function. Second gaskets on the upper and lower sides of the mounting slot provide cushioning and protection, reducing wear between components. The disassembly parts on the top of the pins facilitate quick and easy removal of the upper cover, allowing for easy opening of the cover when probe maintenance is required, thus improving maintenance efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the positioning disk in this utility model.

[0020] Figure 3 This is a schematic diagram of the resin board structure in this utility model.

[0021] Figure 4 This is a schematic diagram of the probe structure in this utility model.

[0022] Figure 5 This is a schematic diagram of the pin structure in this utility model.

[0023] In the diagram: 1. Mounting base; 2. PCB substrate; 3. Probe card body; 4. MLO substrate; 5. Top cover; 6. Chip positioning slot; 7. Positioning post; 8. First gasket; 9. Resin board; 10. Probe; 11. Positioning plate; 12. Fixing hole; 13. Limiting hole; 14. Mounting slot; 15. Second gasket; 16. Pin; 17. Disassembly part; 18. Connecting sleeve; 19. Elastic strip; 20. Positioning sleeve. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] This utility model provides, for example Figure 1-5 The silicon carbide (SiC) chip test probe card shown includes a mounting base 1;

[0026] A PCB substrate 2 is located inside the mounting base 1. An MLO substrate 4 is located at the upper part of the PCB substrate 2. A chip positioning groove 6 is located in the middle of the MLO substrate 4. A probe card body 3 is located above the MLO substrate 4.

[0027] A top cover 5 is provided above the probe card body 3, a probe 10 is provided inside the probe card body 3, and a resin plate 9 is provided at the top center of the top cover 5. The probe 10 is inspected through the resin plate 9.

[0028] An elastic strip 19 is provided at the middle position of the probe 10, and the elastic strip 19 is fixedly connected to the probe 10 through a connecting sleeve 18.

[0029] A positioning sleeve 20 is provided on the outer side of the probe 10, and the probe 10 and the positioning sleeve 20 are slidably connected.

[0030] The top of probe 10 is fixedly connected to resin plate 9, and resin plate 9 is nested and connected to the top of probe card body 3.

[0031] A positioning plate 11 is provided in the middle of the probe card body 3, and an installation groove 14 is provided on the outer side of the positioning plate 11.

[0032] The mounting slot 14 has a ring array of fixing holes 12 inside, and a limit hole 13 is provided inside the fixing hole 12. The elastic strip 19 is located inside the limit hole 13.

[0033] A second gasket 15 is provided on the upper and lower sides of the mounting groove 14, and a pin 16 is provided inside the fixing hole 12. The upper cover 5 and the positioning plate 11 are fixedly connected by the pin 16, and a disassembly part 17 is provided at the top of the pin 16.

[0034] A positioning post 7 is provided at the bottom of the probe card body 3. The probe card body 3 is connected to the PCB substrate 2 by the positioning post 7. The first pad 8 is provided on the left and right sides of the MLO substrate 4. The mounting base 1 is made of steel.

[0035] In this embodiment, the specific implementation steps of a silicon carbide (SiC) chip test probe card are as follows: Check the integrity of each component of the probe card; confirm that the mounting base 1, PCB substrate 2, MLO substrate 4, probe card body 3, top cover 5, and probe 10 are properly connected; connect the external testing equipment to the probe card to ensure stable signal transmission; accurately place the SiC chip in the chip positioning slot 6 in the middle of the MLO substrate 4; connect the probe card body 3 to the PCB substrate 2 via the bottom positioning post 7; the probe 10 accurately contacts the chip under the action of the positioning sleeve 20, and the test begins. The elastic strip 19 provides elastic buffering during the test, improving the service life of the probe 10. When the probe 10 needs maintenance, remove the top cover 5 from the probe card body 3 via the disassembly part 17 at the top of the pin 16; after opening the top cover 5, inspect the probe 10 via the resin plate 9 at the middle of the top of the top cover 5; after maintenance, re-fix the top cover 5 to the probe card body 3 via the pin 16.

[0036] like Figure 1 and Figure 3-4 As shown, a top cover 5 is provided above the probe card body 3, a probe 10 is provided inside the probe card body 3, a resin plate 9 is provided at the middle of the top of the top cover 5, the probe 10 is inspected through the resin plate 9, an elastic strip 19 is provided at the middle of the probe 10, the elastic strip 19 is fixedly connected to the probe 10 through a connecting sleeve 18, a positioning sleeve 20 is provided at the outer side of the probe 10, the probe 10 is slidably connected to the positioning sleeve 20, the top of the probe 10 is fixedly connected to the resin plate 9, and the resin plate 9 is nested and connected to the top of the probe card body 3.

[0037] Preferably, a top cover 5 is provided on the upper part of the probe card body 3 to protect the internal structure. The probe 10 is inspected through the resin plate 9 on the top of the top cover 5, which is convenient and quick and improves the inspection efficiency. A positioning sleeve 20 is provided on the outside of the probe 10 and is slidably connected to the probe 10, which further improves the positioning accuracy of the probe and ensures that it can accurately contact the chip when testing the silicon carbide (SiC) chip. An elastic strip 19 is provided in the middle of the probe 10 and is fixedly connected to the probe 10 through a connecting sleeve 18. It provides elastic buffering during the test, improves the service life of the probe, and reduces the risk of damage due to external impact. The top of the probe 10 is fixedly connected to the resin plate 9, and the resin plate 9 is nested and connected to the top of the probe card body 3, which ensures the stability and reliability of the probe during use.

[0038] like Figure 1-2 and Figure 5As shown, a positioning plate 11 is provided in the middle of the probe card body 3, and an installation groove 14 is provided on the outer side of the positioning plate 11. Fixing holes 12 are arranged in a ring array inside the installation groove 14. Limiting holes 13 are provided inside the fixing holes 12. Elastic strip 19 is located inside the limiting holes 13. Second gaskets 15 are provided on the upper and lower sides of the installation groove 14 respectively. Pins 16 are provided inside the fixing holes 12. The upper cover 5 and the positioning plate 11 are fixedly connected by pins 16. A disassembly part 17 is provided at the top of the pins 16.

[0039] Preferably, a positioning plate 11 is provided in the middle of the probe card body 3, which provides an accurate installation position reference for components such as the upper cover 5 and the probe 10, ensuring the stability of the overall structure. The mounting groove 14 is provided with a ring array of fixing holes 12, which makes the connection between the upper cover 5 and the probe card body 3 more secure and reliable. The fixing holes 12 are provided with limiting holes 13, which restrict the elastic strip 19 and ensure that the elastic strip 19 will not shift during operation, thereby ensuring the stable performance of the elastic buffering function of the probe 10. The upper and lower sides of the mounting groove 14 are provided with second gaskets 15, which can play a buffering and protective role and reduce wear between components. The top of the pin 16 is provided with a disassembly part 17, which makes the disassembly of the upper cover 5 more convenient and quick. When the probe 10 needs to be inspected, the upper cover 5 can be easily opened, improving the efficiency of inspection and maintenance.

[0040] like Figure 1-5 As shown, a positioning post 7 is provided at the bottom of the probe card body 3. The probe card body 3 is connected to the PCB substrate 2 by the positioning post 7. First pads 8 are provided on the left and right sides of the MLO substrate 4. The mounting base 1 is made of steel.

[0041] Optionally, a positioning post 7 is provided at the bottom of the probe card body 3. By plugging and connecting with the PCB substrate 2, the connection stability and accurate positioning between the probe card body 3 and the PCB substrate 2 are ensured. During the test, the connection will not become loose due to slight shaking or external force, thus ensuring the accuracy and reliability of the test. First pads 8 are provided on the left and right sides of the MLO substrate 4, which can play a buffering role, reduce the vibration and friction between the probe card body 3 and the MLO substrate 4, protect the MLO substrate 4 and other related components, and extend the service life of the probe card. The mounting base 1 is made of steel, which has high strength and good rigidity, and can provide stable support for the entire probe card. The steel material also has the characteristics of corrosion resistance and high temperature resistance, adapting to various test environments and ensuring the long-term stable operation of the probe card.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A silicon carbide (SIC) chip test probe card, comprising a mounting base (1); A PCB substrate (2) is arranged at an inner position of the mounting base (1), an MLO substrate (4) is arranged at an upper inner position of the PCB substrate (2), a chip positioning groove (6) is arranged at a middle inner position of the MLO substrate (4), and a probe card body (3) is arranged at an upper position of the MLO substrate (4); characterized in that An upper cover (5) is arranged at an upper position of the probe card body (3), a probe (10) is arranged at an inner position of the probe card body (3), a resin plate (9) is arranged at a middle top position of the upper cover (5), and the probe (10) is overhauled through the resin plate (9).

2. The silicon carbide (SIC) die test probe card of claim 1, wherein: An elastic strip (19) is arranged at a middle position of the probe (10), and the elastic strip (19) is fixedly connected with the probe (10) through a connecting sleeve (18).

3. The silicon carbide (SIC) die test probe card of claim 2, wherein: A positioning sleeve (20) is arranged at an outer position of the probe (10), and the probe (10) is slidably connected with the positioning sleeve (20).

4. The silicon carbide (SIC) die test probe card of claim 3, wherein: The probe (10) is fixedly connected with the resin plate (9), and the resin plate (9) is nestedly connected with a top portion of the probe card body (3).

5. The silicon carbide (SIC) die test probe card of claim 1, wherein: A positioning disc (11) is arranged at a middle position of the probe card body (3), and a mounting groove (14) is arranged at an outer position of the positioning disc (11).

6. The silicon carbide (SIC) die test probe card of claim 5, wherein: A plurality of fixing holes (12) are arranged in an annular array at an inner position of the mounting groove (14), a limiting hole (13) is arranged at an inner position of each fixing hole (12), and the elastic strip (19) is located at an inner position of the limiting hole (13).

7. The silicon carbide (SIC) die test probe card of claim 6, wherein: Second gaskets (15) are arranged at upper and lower positions of the mounting groove (14), respectively, a pin (16) is arranged at an inner position of each fixing hole (12), the upper cover (5) and the positioning disc (11) are fixedly connected through the pin (16), and a dismounting portion (17) is arranged at a top position of the pin (16).

8. The silicon carbide (SIC) die test probe card of claim 1, wherein: A positioning column (7) is arranged at a bottom position of the probe card body (3), the probe card body (3) is plug-in connected with the PCB substrate (2) through the positioning column (7), first gaskets (8) are arranged at left and right positions of the MLO substrate (4), respectively, and the mounting base (1) is made of steel.

Images