Double-table-board exposure machine

Abstract

The utility model discloses a double-table-board exposure machine and relates to the technical field of exposure machines. The device specifically comprises a platform, a carrying table piece, an exposure module and an alignment module, wherein the platform comprises an exposure area and conversion areas distributed on the two sides of the exposure area; the carrying table piece at least comprises two carrying tables arranged in the corresponding conversion areas, and the carrying tables can reciprocate from the corresponding conversion areas and the exposure areas; the exposure module is arranged in the exposure area and is used for exposing the wafer moved to the carrying table of the exposure area; the alignment module is arranged in the conversion area and used for aligning the wafer on the carrying table. The wafers on the carrying tables on the two sides can be seamlessly switched among feeding, discharging, alignment and exposure operation, the advantages of the double-table-board design are fully played, the overall working efficiency is remarkably improved, height adjustment does not need to be conducted on the wafers on the carrying tables, and the exposure precision of the wafers is fundamentally guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of exposure machine technology, and in particular to a dual-table exposure machine. Background Technology

[0002] Dual-table exposure machines are high-precision photolithography equipment used in semiconductor manufacturing, PCB production, and other fields. Compared with traditional single-table exposure machines, dual-table exposure machines, by setting up two independent substrate-bearing tables, allow for simultaneous exposure operations on one table and loading / unloading or other preparatory work on the other table, thereby significantly improving equipment utilization and production efficiency.

[0003] In existing technologies, the substrate support platform of a dual-table direct-write exposure machine adopts a two-layer structure, one on top of the other. While this design saves space to some extent, the alignment and exposure systems at both ends of the substrate movement allow for exposure at one end and loading / unloading operations at the other, greatly improving equipment utilization efficiency and effectively increasing the exposure machine's production capacity.

[0004] However, in the above scheme, the two substrate support platforms are at different heights, which requires frequent adjustments to the height of the Z-axis motion component during actual operation to ensure that the exposure focal plane can be accurately aligned with the substrate on each platform. This height difference not only increases the complexity and adjustment difficulty of the equipment, but also affects the accuracy and stability of exposure, thereby reducing production efficiency. In addition, the alignment and exposure systems of the dual-platform exposure machine need to switch between different platform heights, resulting in increased alignment and exposure time, thus partially offsetting the efficiency improvement brought by the dual-platform design.

[0005] Therefore, this application aims to address how to optimize the structure of a dual-stage exposure machine, solve the problem of reduced production efficiency due to inconsistent wafer stage heights, and also address the impact of height differences on accuracy. Utility Model Content

[0006] The main purpose of this invention is to provide a dual-stage exposure machine, which aims to avoid the reduction of dual-stage production efficiency due to uneven wafer stage heights, and also to avoid the impact of height difference on accuracy.

[0007] To achieve the above objectives, this utility model proposes a dual-stage exposure machine, comprising:

[0008] The platform includes an exposure area and conversion areas distributed on both sides of the exposure area;

[0009] A stage component, comprising at least two stages disposed corresponding to the conversion area, the stages being capable of reciprocating between the conversion area and the exposure area;

[0010] An exposure module, disposed in the exposure area, is used to expose a wafer moved to the stage in the exposure area; and

[0011] An alignment module is provided in the conversion area for aligning the wafer on the stage.

[0012] Furthermore, when the number of stages is two, the stages include a first stage and a second stage, and the first stage and the second stage alternately move into or out of the exposure area from the conversion area.

[0013] Furthermore, the platform includes a frame and a support frame mounted on the frame, on which the exposure module is mounted.

[0014] Furthermore, the alignment module is installed at one end of the rack near the conversion area, and the alignment module is used to grip and align the wafer on the stage.

[0015] Furthermore, a clamping member is provided on one side of the platform, which is capable of picking up and placing wafers on the stage of the conversion area.

[0016] Furthermore, the clamping member includes a transverse axis arranged along the movement direction of the stage and a robotic arm mounted on the output end of the transverse axis. The robotic arm can extend to the conversion area and pick up and place wafers on the stage.

[0017] Furthermore, vibration isolation components are also installed on the support surface of the frame, which are used to monitor and dynamically adjust the vibration response of the frame.

[0018] Furthermore, the support surface of the frame is provided with a support member, and the vibration isolation member is disposed between the support member and the frame.

[0019] Furthermore, the bottom of the support member is also provided with an adjustment member, which can adjust the lifting height of the support member.

[0020] Furthermore, casters are also installed at the bottom of the frame.

[0021] The above technical solution has the following advantages:

[0022] This invention features an exposure area and a conversion area on a platform, with the two conversion areas positioned on either side of the exposure area. This enables efficient reciprocating movement of the stage between the exposure and conversion areas. Wafers on both stages can seamlessly switch between loading / unloading, alignment, and exposure operations, fully leveraging the advantages of the dual-stage design and significantly improving overall work efficiency. Simultaneously, there is no need for height adjustments to the wafers on the stages, fundamentally ensuring wafer exposure accuracy. Furthermore, by optimizing the stage's movement path, the travel distance between the exposure and conversion areas is significantly reduced, enabling precise wafer alignment during low-speed movement, lowering system latency, and effectively improving the overall operating efficiency and stability of the equipment. Attached Figure Description

[0023] The present invention will now be described in detail with reference to specific embodiments and accompanying drawings, wherein:

[0024] Figure 1 This is a side view of the present invention;

[0025] Figure 2 This is a front view diagram of the present invention;

[0026] Figure 3 This is a schematic diagram of the structure of this utility model;

[0027] Figure 4 This is a top-view schematic diagram of the present invention.

[0028] In the diagram: 1. Platform; 11. Frame; 12. Support frame; 13. Conversion area; 14. Exposure area; 2. Exposure module; 3. Alignment module; 4. Stage; 41. First stage; 42. Second stage; 5. Clamping component; 51. Robotic arm; 52. Lateral axis; 6. Vibration isolation component; 7. Support component; 8. Adjusting component; 9. Casters. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the following specific embodiments are only used to explain this utility model and do not constitute a limitation on this utility model.

[0030] like Figures 1 to 3As shown, a dual-stage exposure machine includes a platform 1, a stage 4, an exposure module 2, and an alignment module 3. The platform 1 includes an exposure area 14 and conversion areas 13 distributed on both sides of the exposure area 14. The stage 4 includes at least two stages disposed in the corresponding conversion areas 13, and the stages are capable of reciprocating between the corresponding conversion areas 13 and the exposure area 14. The exposure module 2 is disposed in the exposure area 14 and is used to expose the wafers on the stages that have been moved to the exposure area 14. The alignment module 3 is disposed in the conversion area 13 and is used to align the wafers on the stages.

[0031] Specifically, the platform 1 is divided into two conversion areas 13 at both ends, which are used for loading and unloading wafers on the stage. The middle part of the platform 1 is the exposure area 14, which is located between the two conversion areas 13. The exposure area 14 is used for exposing the wafers on the stage. When the stage moves to the conversion area 13 and the stage is used to place the wafer, the alignment module 3 aligns the wafers on the stage to ensure that the wafers are aligned before each exposure.

[0032] like Figure 3 As shown, when there are two stages, the stages include a first stage 41 and a second stage 42. The first stage 41 and the second stage 42 alternately move into or out of the exposure area 14 from the conversion area 13. Specifically, a wafer is placed on the first stage 41 in the conversion area 13, aligned by the alignment module 3, and then moved into the exposure area 14. At the same time, a wafer is placed on the second stage 42 in the other conversion area 13 and aligned by the alignment module 3. After the wafer on the first stage 41 is exposed, it moves to the corresponding conversion area 13, and then the second stage 42 moves to the exposure area 14 for exposure operation. This allows the first stage 41 and the second stage 42 to alternately perform loading / unloading or exposure operations, which can greatly save working time. At the same time, the exposure area 14 is located in the middle of the platform 1, which greatly shortens the moving position of the first stage 41 and the second stage 42, saving the moving distance and avoiding the need for accelerated movement over long distances, thus avoiding the impact of acceleration on wafer alignment.

[0033] like Figure 3 and Figure 4 As shown, in one embodiment of this application, two platforms can be provided, such as two, three or more platforms in the conversion area 13 on each side. The two platforms symmetrical about the exposure area 14 can alternately perform exposure or loading / unloading operations, which can meet the working requirements of the exposure machine. The specific number can be selected and set according to those skilled in the art.

[0034] like Figure 1 and Figure 3As shown, platform 1 includes a frame 11 and a support frame 12 mounted on the frame 11. Exposure module 2 is mounted on the support frame 12. The frame 11 is the base of platform 1, with the top center portion being the exposure area 14. The exposure area 14 is divided into conversion areas 13 on both sides. The stage can move back and forth between the corresponding conversion area 13 and exposure area 14 via guide rails. The support frame 12 is mounted on top of the exposure area 14. It is preferably made of marble and fixed to the exposure area 14. It can be moved only by the stage, avoiding the back and forth movement of the exposure module 2 and reducing the exposure error of the wafer.

[0035] like Figure 2 As shown, an alignment module 3 is installed at one end of the rack 11 near the conversion area 13. The alignment module 3 is used to grip the wafer on the target alignment stage. The alignment module 3 is installed on both sides of the marble support frame 12 and faces the corresponding conversion area 13. When the stage moves in the conversion area 13, the wafer on the stage is aligned and calibrated by the alignment module 3. The alignment module 3 can be determined according to the number of stages. For example, each stage corresponds to one alignment module 3, so that each stage is calibrated and positioned by the alignment module 3, ensuring that each stage can be aligned in the conversion area 13.

[0036] like Figure 1 and Figure 3 As shown, a clamping member 5 is provided on one side of the platform 1. The clamping member 5 can pick up and place wafers on the stage of the conversion area 13. The clamping member 5 can use a three-coordinate robot 51 to hold the wafers, or it can be manually picked up from the stage. In this application, the clamping member 5 includes a transverse axis 52 arranged along the stage moving direction and a robot 51 installed at the output end of the transverse axis 52. The robot 51 can extend to the conversion area 13 and pick up and place wafers on the stage. The transverse axis 52 drives the robot 51 to move back and forth, and the robot 51 picks up the wafers that have been exposed in the conversion area 13, and picks up the wafers to be exposed and places them on the stage of the conversion area 13. Then it moves to the other side of the conversion area 13 to perform loading and unloading processing on another stage, and repeats the cycle.

[0037] like Figure 1 and Figure 2As shown, vibration isolation components 6 are also installed on the support surface of the rack 11. Vibration isolation components 6 are used to monitor and dynamically adjust the vibration response of the rack 11. Specifically, vibration isolation components 6 can detect the vibration signal of the rack 11 and make corresponding feedback adjustments, such as active vibration isolation. Specifically, by monitoring the vibration in real time and calculating an appropriate control signal through a controller, the actuator is driven to generate a force opposite to the vibration, thereby offsetting or reducing the vibration. The support surface of the rack 11 is provided with a support component 7, and the vibration isolation component 6 is disposed between the support component 7 and the rack 11. The support component 7 can be a support leg, support column, or support frame. The support component 7 is in contact with the ground and compensates for the vibration of the platform 1 through active vibration isolation, improving the exposure accuracy and stability of the wafer, improving the uniformity of load distribution and structural rigidity on the platform 1, and preventing vibration and torsion from affecting the exposure accuracy.

[0038] like Figure 2 As shown, the bottom of the support member 7 is also equipped with an adjusting member 8. The adjusting member 8 can adjust the lifting height of the support member 7. The adjusting member 8 can be tightened by bolts, and the height of the support member 7 at different positions can be adjusted by the tightening depth. In addition, the adjusting member 8 can also be replaced by a telescopic rod, such as a hydraulic cylinder, so that the hydraulic cylinder is installed inside the support frame to hide the entire hydraulic cylinder. The bottom of the frame 11 is also equipped with casters 9, which facilitate the movement of the platform 1 and help to change its position.

[0039] In use, the first stage 41 moves to the conversion area 13 on one side, where a robot arm 51 loads a wafer. The first stage 41 then passes through the alignment module 3 for target alignment and moves into the exposure area 14, where it is exposed by the exposure module 2. Simultaneously, the second stage 42 is in the conversion area 13 on the other side. Here, the robot arm 51 loads a wafer, and the alignment module 3 handles target alignment. Once the first stage 41 has completed exposure and moves out of the exposure area 14, the second stage 42 directly moves into the exposure area 14 for exposure. The robot arm 51 performs unloading and loading of the first stage 41, repeating this process cyclically. This reduces the moving distance between the first stage 41 and the second stage 42, improving the efficiency of exposure and alignment, and significantly enhancing the efficiency of the dual-stage design.

[0040] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A dual-stage exposure machine, characterized in that, include: Platform (1), which includes an exposure area (14) and a conversion area (13) distributed on both sides of the exposure area (14); The stage (4) includes at least two stages disposed in the corresponding conversion area (13), the stages being reciprocally movable from the corresponding conversion area (13) and the exposure area (14); An exposure module (2) is disposed in the exposure area (14) for exposing a wafer on the stage that has been moved to the exposure area (14); as well as Alignment module (3) is provided in the conversion area (13) for aligning the wafer on the stage.

2. The dual-stage exposure machine as described in claim 1, characterized in that, When the number of stages is two, the stages include a first stage (41) and a second stage (42), and the first stage (41) and the second stage (42) alternately move into or out of the exposure area (14) from the conversion area (13).

3. The dual-stage exposure machine as described in claim 1, characterized in that, The platform (1) includes a frame (11) and a support frame (12) mounted on the frame (11), on which the exposure module (2) is mounted.

4. The dual-stage exposure machine as described in claim 3, characterized in that, The alignment module (3) is mounted on one end of the rack (11) near the conversion area (13). The alignment module (3) is used to grip and align the wafer on the stage.

5. The dual-stage exposure machine as described in claim 1, characterized in that, A clamping member (5) is provided on one side of the platform (1), and the clamping member (5) is capable of picking up and placing wafers on the stage of the conversion area (13).

6. The dual-stage exposure machine as described in claim 5, characterized in that, The clamping member (5) includes a transverse axis (52) arranged along the moving direction of the stage and a robot (51) installed at the output end of the transverse axis (52). The robot (51) can extend to the conversion area (13) and pick up and place wafers on the stage.

7. The dual-stage exposure machine as described in claim 3, characterized in that, The support surface of the frame (11) is also equipped with a vibration isolation component (6), which is used to monitor and dynamically adjust the vibration response of the frame (11).

8. The dual-stage exposure machine as described in claim 7, characterized in that, The support surface of the frame (11) is provided with a support member (7), and the vibration isolation member (6) is disposed between the support member (7) and the frame (11).

9. The dual-stage exposure machine as described in claim 8, characterized in that, The bottom of the support member (7) is also provided with an adjustment member (8), which can adjust the lifting height of the support member (7).

10. The dual-stage exposure machine as described in claim 3, characterized in that, The bottom of the frame (11) is also equipped with casters (9).

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