Multi-layer PCB embedded power module

Abstract

The utility model relates to the technical field of PCBs (printed circuit boards), in particular to a multi-layer PCB embedded power module, which comprises a PCB body, a power module body is embedded on the PCB body, a plurality of heat conduction strips are mounted on the power module body and extend to the PCB body, and the heat conduction strips are arranged on the PCB body. And the heat conduction strip comprises a ceramic sheet positioned at the lower part and a copper sheet positioned at the upper part. According to the utility model, the power module comprises the PCB body, the power module body embedded in the PCB body and the plurality of heat conduction strips installed on the power module body, and the heat conduction strips extend to the PCB body and comprise the ceramic chips located at the lower parts and the copper sheets located at the upper parts, so that efficient heat conduction is realized. Meanwhile, a heat dissipation assembly is arranged above the heat conduction strip attached to the PCB body, the heat dissipation assembly comprises a mounting plate and a plurality of air blowing assemblies arranged in the mounting plate, and the mounting plate is fixedly connected with the PCB, so that an active heat dissipation system is formed.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, specifically to a multilayer PCB embedded power module. Background Technology

[0002] In the current field of electronics technology, PCBs (Printed Circuit Boards) serve as fundamental components of electronic devices, housing various electronic components and enabling their electrical connections. With the continuous development of electronic technology, the component density on PCBs is increasing, and power modules, as a crucial component, are facing increasingly prominent heat dissipation challenges.

[0003] Traditional power module cooling methods often rely on natural heat dissipation or simple heat sink designs, which are inadequate when dealing with high-density, high-power components. Especially in applications with extremely high heat dissipation requirements, such as industrial control, automotive electronics, and communication equipment, the heat dissipation of power modules directly affects the stability and reliability of the entire device.

[0004] Power modules generate a significant amount of heat during operation. If this heat cannot be dissipated in time, the module temperature will rise, affecting its performance and lifespan. In severe cases, it can even cause the module to burn out, leading to equipment failure. Therefore, effectively solving the heat dissipation problem of power modules has become a pressing technical challenge in the current PCB design field. In light of this, we propose a multilayer PCB embedded power module. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a multilayer PCB embedded power module.

[0006] The technical solution of this utility model is:

[0007] A multilayer PCB embedded power module includes a PCB board body, on which a power module body is embedded and mounted. The power module body has several heat-conducting strips mounted on it, extending onto the PCB board body. Each heat-conducting strip includes a ceramic sheet at the bottom and a copper sheet at the top. A heat dissipation assembly is provided above the heat-conducting strips that are in contact with the PCB board body. The heat dissipation assembly includes a mounting plate and several air-blowing components disposed inside the mounting plate. The mounting plate is fixedly connected to the PCB board body. Several equally spaced heat dissipation grooves are formed on the top of the heat-conducting strips that are in contact with the power module body.

[0008] As a preferred technical solution, the mounting plate has a number of ventilation holes, and a horizontal plate is fixedly connected to each ventilation hole, and the blower assembly is mounted on the horizontal plate.

[0009] As a preferred technical solution, the blower assembly includes a drive motor fixed on a horizontal plate and fan blades fixed coaxially with the output shaft of the drive motor.

[0010] As a preferred technical solution, an upper protective net and a lower protective net are fixedly installed on the top and bottom of the mounting plate, respectively.

[0011] As a preferred technical solution, each of the four corners of the bottom of the mounting plate has an integrally formed support leg, and a fixing screw is installed at each of the support legs, and the fixing screw is fixedly connected to the PCB board.

[0012] As a preferred technical solution, the height of the support leg is equal to the thickness of the heat-conducting strip, and when the fixing screws are tightened on the PCB board, the bottom of the mounting plate is in contact with the top of the heat-conducting strip.

[0013] As a preferred technical solution, the top of the mounting plate is flush with the top of the power module body, and the width of the mounting plate is equal to the width of the power module body.

[0014] As a preferred technical solution, the heat dissipation groove has a V-shaped or U-shaped structure, and the bottom of the groove is provided with multiple tiny protrusions or grooves.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This invention achieves efficient heat conduction by designing a PCB board, a power module body embedded in the PCB board, and several heat-conducting strips mounted on the power module body. These heat-conducting strips extend onto the PCB board and include a ceramic plate at the bottom and a copper plate at the top. Simultaneously, a heat dissipation assembly is positioned above the heat-conducting strips that are in contact with the PCB board. This heat dissipation assembly includes a mounting plate and multiple air-blowing components located inside the mounting plate. The mounting plate is fixedly connected to the PCB, thus forming an active cooling system. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 In this utility model Figure 1 One of the schematic diagrams of a local structure;

[0019] Figure 3 In this utility model Figure 1 The second partial structural diagram;

[0020] Figure 4 This is a partial structural diagram of the heat dissipation component in this utility model;

[0021] The meanings of the labels in the diagram are as follows:

[0022] 1. PCB board; 2. Power module body; 3. Heat conduction strip; 30. Heat dissipation groove; 4. Mounting plate; 40. Lower guard mesh; 41. Upper guard mesh; 42. Ventilation hole; 43. Horizontal plate; 44. Fan blade; 45. Drive motor; 46. Fixing screw; 47. Support leg. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1-4 This utility model provides a technical solution:

[0025] A multilayer PCB embedded power module includes a PCB board 1, a power module body 2 embedded in the PCB board 1, and several heat-conducting strips 3 mounted on the power module body 2. The heat-conducting strips 3 extend onto the PCB board 1 and include a ceramic sheet at the bottom and a copper sheet at the top. A heat dissipation assembly is provided above the heat-conducting strips 3 that are in contact with the PCB board 1. The heat dissipation assembly includes a mounting plate 4 and several air blowing components disposed inside the mounting plate 4. The mounting plate 4 is fixedly connected to the PCB. Several equally spaced heat dissipation slots 30 are formed on the top of the heat-conducting strips 3 that are in contact with the power module body 2. By designing the PCB board 1, the power module body 2 embedded in the PCB board 1, and the several heat-conducting strips 3 mounted on the power module body 2, which extend onto the PCB board 1 and include a ceramic sheet at the bottom and a copper sheet at the top, efficient heat conduction is achieved. Meanwhile, a heat dissipation component is set above the heat-conducting strip 3 that is attached to the PCB board 1. The heat dissipation component includes a mounting plate 4 and multiple air blowing components located inside the mounting plate 4. The mounting plate 4 is fixedly connected to the PCB board 1, thereby forming an active heat dissipation system.

[0026] In a preferred embodiment, the mounting plate 4 has several vent holes 42, and a horizontal plate 43 is fixedly connected to each vent hole 42. The blower assembly is mounted on the horizontal plate 43. By opening several vent holes 42 in the mounting plate 4 and fixing a horizontal plate 43 to each vent hole 42, and then mounting the blower assembly on the horizontal plate 43, the blower assembly can operate stably and the airflow can be evenly blown to the heat guide strip 3 and the heat dissipation groove 30, thereby improving the uniformity and efficiency of heat dissipation.

[0027] As a preferred embodiment, the blower assembly includes a drive motor 45 fixed on the horizontal plate 43 and a fan blade 44 coaxially fixed with the output shaft of the drive motor 45. The structure of the blower assembly is specifically described, including the drive motor 45 fixed on the horizontal plate 43 and the fan blade 44 coaxially fixed with the output shaft of the drive motor 45. This design enables the blower assembly to generate sufficient airflow to effectively remove heat.

[0028] As a preferred embodiment, an upper protective net 41 and a lower protective net 40 are fixedly installed on the top and bottom of the mounting plate 4, respectively. The fixed installation of the upper protective net 41 and the lower protective net 40 on the top and bottom of the mounting plate 4 protects the blower assembly from interference from external foreign objects, while preventing dust and other impurities in the airflow from entering the power module, thus improving the cleanliness and reliability of the module.

[0029] In a preferred embodiment, each of the four corners of the bottom of the mounting plate 4 has an integrally formed support leg 47, and a fixing screw 46 is installed at each support leg 47, which is fixedly connected to the PCB board 1. By designing support legs 47 at the four corners of the bottom of the mounting plate 4 and installing fixing screws 46 at each support leg 47, a stable connection between the heat dissipation component and the PCB board 1 is achieved, ensuring the stability of the heat dissipation component during operation.

[0030] In this preferred embodiment, the height of the support leg 47 is equal to the thickness of the heat-conducting strip 3, and when the fixing screw 46 is tightened on the PCB board 1, the bottom of the mounting plate 4 is in contact with the top of the heat-conducting strip 3. The design that the height of the support leg 47 is equal to the thickness of the heat-conducting strip 3, and the requirement that the bottom of the mounting plate 4 is in contact with the top of the heat-conducting strip 3 when the fixing screw 46 is tightened on the PCB board 1, ensures close contact between the heat dissipation component and the heat-conducting strip 3, and improves the efficiency of heat transfer.

[0031] In this preferred embodiment, the top of the mounting plate 4 is flush with the top of the power module body 2, and the width of the mounting plate 4 is equal to the width of the power module body 2. This design, where the top of the mounting plate 4 is flush with the top of the power module body 2 and the width of the mounting plate 4 is equal to the width of the power module body 2, makes the entire power module appear neater and more aesthetically pleasing.

[0032] As a preferred embodiment, the heat dissipation slot 30 has a V-shaped or U-shaped structure, and the bottom of the slot is provided with multiple tiny protrusions or grooves. Designing the heat dissipation slot 30 as a V-shaped or U-shaped structure and providing multiple tiny protrusions or grooves on the bottom of the slot increases the heat dissipation area and the turbulence effect during airflow, further improving the heat dissipation efficiency, enabling the power module to maintain stable operation in harsher working environments.

[0033] When using the multilayer PCB embedded power module of this utility model:

[0034] When the power module body 2 starts working, it generates a large amount of heat. This heat is first conducted through the heat-conducting strip 3. The heat-conducting strip 3 consists of a lower ceramic plate and an upper copper plate. The ceramic plate has good insulation properties, which can prevent electrical connection between the power module body 2 and the copper plate.

[0035] The heat dissipation grooves 30, which are evenly spaced at the top of the heat-conducting strip 3, provide channels for further heat dissipation. These heat dissipation grooves 30 increase the contact area between the heat-conducting strip 3 and the air, making it easier for heat to be dissipated through air convection.

[0036] Simultaneously, the heat dissipation assembly begins to operate. The heat dissipation assembly includes a mounting plate 4 and multiple air-blowing components housed within the mounting plate 4. The mounting plate 4 is fixedly connected to the PCB board 1 via legs 47 and fixing screws 46, ensuring the stability and reliability of the heat dissipation assembly. Each air-blowing component consists of a drive motor 45 fixed to a horizontal plate 43 and fan blades 44 coaxially fixed to the output shaft of the drive motor 45. When the drive motor 45 starts, it drives the fan blades 44 to rotate, thereby generating a strong airflow.

[0037] In addition, the upper protective net 41 and lower protective net 40, which are fixedly installed on the top and bottom of the mounting plate 4 respectively, effectively protect the blower assembly from interference from external foreign objects and prevent dust and other impurities in the airflow from entering the power module, thus maintaining the cleanliness and reliability of the module.

[0038] In summary, the multilayer PCB embedded power module of this invention achieves efficient heat conduction and dissipation through the coordinated operation of the heat-conducting strip 3, the heat dissipation groove 30, and the heat dissipation components. This design enables the power module to maintain stable operation under high load and long-term working conditions, improving its service life and reliability.

[0039] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A multi-layer PCB embedded power module, characterized by: Including PCB board body (1), install power module body (2) on the PCB board body (1) embedded, install several heat conduction strips (3) on the power module body (2), the heat conduction strip (3) extends to the PCB board body (1), the heat conduction strip (3) includes the ceramic sheet in lower part and the copper sheet in upper part, and the heat conduction strip (3) above the PCB board body (1) is equipped with heat dissipation assembly, the heat dissipation assembly includes mounting plate (4) and multiple blowing assemblies in the mounting plate (4), the mounting plate (4) is fixedly connected with the PCB board body (1), and the heat conduction strip (3) top above the power module body (2) is equipped with several equally spaced heat dissipation grooves (30).

2. The multi-layer PCB embedded power module of claim 1, wherein: Several air holes (42) are formed in the mounting plate (4), and one transverse plate (43) is fixedly connected in each air hole (42), and the blowing assembly is installed on the transverse plate (43).

3. The multi-layer PCB embedded power module of claim 2, wherein: The blowing assembly includes a driving motor (45) fixed on the transverse plate (43) and a fan blade (44) coaxially fixed with the output shaft of the driving motor (45).

4. The multi-layer PCB embedded power module of claim 3, wherein: The mounting plate (4) top and bottom are respectively fixedly installed with upper guard net (41) and lower guard net (40).

5. The multi-layer PCB embedded power module of claim 4, wherein: The mounting plate (4) bottom four corners are integrally formed with a supporting leg (47), and a fixing screw (46) is installed at each supporting leg (47), and the fixing screw (46) is fixedly connected with the PCB board body (1).

6. The multi-layer PCB embedded power module of claim 5, wherein: The height of the supporting leg (47) is equal to the thickness of the heat conduction strip (3), and when the fixing screw (46) is tightened on the PCB board body (1), the mounting plate (4) bottom is attached to the heat conduction strip (3) top.

7. The multi-layer PCB embedded power module of claim 6, wherein: The mounting plate (4) top is flush with the power module body (2) top, and the width of the mounting plate (4) is equal to the width of the power module body (2).

8. The multi-layer PCB embedded power module of claim 7, wherein: The heat dissipation groove (30) is V-shaped or U-shaped structure, and the groove bottom is provided with multiple tiny convex points or grooves.

Images