Multi-layer heat conduction type flexible circuit board

Abstract

The utility model discloses a multilayer heat conduction type flexible circuit board, comprising a supporting seat, two ends of the supporting seat are provided with a plurality of first screws, the supporting seat is fixedly installed in an external equipment shell through the first screws, the upper end of the supporting seat is provided with a multilayer flexible circuit board, the multilayer flexible circuit board is placed on the supporting seat, and the supporting seat is provided with a plurality of second screws. The end, close to the supporting base, of the multi-layer flexible circuit board is a welding end, and the welding end of the multi-layer flexible circuit board is welded to an external hard circuit board. Outer edge thin film parts are fixed to the outer surfaces of the two sides of the multi-layer flexible circuit board, two sets of symmetrically-distributed fixing mechanisms are arranged at the upper end of the supporting base, and the outer edge thin film parts of the multi-layer flexible circuit board are fixed, so that external tension acts on the outer edge thin film parts; and external tension is prevented from directly acting on the welding part of the multi-layer flexible circuit board and the hard circuit board. The fragile welding position can be protected, and the situation that the welding position between the multi-layer flexible circuit board and the circuit board hard board is broken is reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of circuit boards, specifically to a multilayer thermally conductive flexible circuit board. Background Technology

[0002] Flexible printed circuit boards (FPCBs), also known as "flexible boards," are printed circuits made from flexible insulating substrates. Flexible circuits offer excellent electrical performance, meeting the design needs for smaller and higher-density installations, and also help reduce assembly steps and enhance reliability. FPCBs are the only solution for meeting the miniaturization and mobility requirements of electronic products. They can be freely bent, rolled, and folded, withstand millions of dynamic bends without damaging the wires, can be arranged arbitrarily according to spatial layout requirements, and can move and stretch freely in three-dimensional space, thereby achieving integration of component assembly and wire connection.

[0003] Existing multilayer flexible circuit boards (FPCBs) often require bending or deformation in practical applications. This means that each end of the FPCB is connected to a different structure, one of which needs frequent movement, causing the FPCB to bend simultaneously. Currently, the FPCB is welded to the rigid circuit board. When the movement range of the moving end exceeds a preset limit, the FPCB is accidentally stretched. Furthermore, the weld joints between the FPCB and the rigid circuit board are relatively weak, leading to breakage. Therefore, a corresponding structure needs to be designed to solve these problems. To address this, we propose a multilayer thermally conductive flexible circuit board. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a multilayer thermally conductive flexible circuit board.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] This utility model discloses a multilayer thermally conductive flexible circuit board, including a support base. Both ends of the support base are provided with multiple first screws. The support base is fixedly installed in the housing of an external device by the first screws. The upper end of the support base is provided with a multilayer flexible circuit board, which is placed on the support base. The end of the multilayer flexible circuit board near the support base is a welding end, which is welded to an external rigid circuit board.

[0007] The outer surfaces of both sides of the multilayer flexible circuit board are fixed with an outer edge film portion. An anti-slip film is fixed on the upper surface of the outer edge film portion. The upper end of the support base is provided with two sets of symmetrically distributed fixing mechanisms. The fixing mechanisms are used to press the outer edge film portion on the same side onto the support base.

[0008] The fixing mechanism includes a vertical block fixed on a support base, a movable block on one side of the vertical block, the movable block and the vertical block being fixed together by a second screw, a pressure plate pressing on an anti-slip film at the lower end of the movable block, and two symmetrically distributed elastic sheets fixed between the pressure plate and the movable block.

[0009] As a preferred embodiment of this invention, a thermally conductive metal layer is added to the surface of the multilayer flexible circuit board.

[0010] As a preferred embodiment of this invention, the thermally conductive metal layer on the surface of the multilayer flexible circuit board is a copper layer, which is deposited on the surface of the multilayer flexible circuit board by electroplating.

[0011] As a preferred embodiment of this utility model, two spaced guide rods are fixed on the pressure plate, and the upper ends of the guide rods pass through the movable block.

[0012] As a preferred embodiment of this utility model, the upper end of the movable block is provided with a connecting piece, and the connecting piece is fixedly connected to two guide rods.

[0013] As a preferred technical solution of this utility model, the vertical block is provided with a plurality of through holes that are equally spaced vertically, and the second screw can pass through the through holes and be threaded onto the movable block.

[0014] As a preferred embodiment of this utility model, the top end of the support base is rounded.

[0015] As a preferred embodiment of this utility model, the top of the support base is provided with several equally spaced heat dissipation grooves, all of which penetrate the support base.

[0016] The beneficial effects of this utility model are:

[0017] This type of multilayer thermally conductive flexible circuit board uses a pressure plate and support base to clamp and fix the outer thin film portion. The outer thin film portion is integrated with the multilayer flexible circuit board. Therefore, when the multilayer flexible circuit board is subjected to horizontal tensile force, the external tensile force is concentrated on the outer thin film portion by fixing it, preventing the external tensile force from acting directly on the solder joint between the multilayer flexible circuit board and the rigid circuit board. This protects the relatively fragile solder joints and reduces the possibility of breakage at the solder joint between the multilayer flexible circuit board and the rigid circuit board. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is an installation diagram of a multilayer thermally conductive flexible circuit board according to this utility model;

[0020] Figure 2 This is a schematic diagram of the structure of a multilayer thermally conductive flexible circuit board according to this utility model;

[0021] Figure 3 This is an enlarged schematic diagram of a portion of the structure of the support base of a multilayer thermally conductive flexible circuit board according to this utility model.

[0022] Figure 4 This is an exploded view of the vertical block, movable block, and anti-slip film of a multilayer thermally conductive flexible circuit board according to this utility model.

[0023] In the figure: 1. Support base; 2. First screw; 3. Multilayer flexible circuit board; 4. Outer edge film; 5. Anti-slip film; 6. Vertical block; 7. Movable block; 8. Second screw; 9. Pressure plate; 10. Elastic sheet; 11. Guide rod; 12. Connecting piece; 13. Perforation; 14. Heat dissipation groove; 15. Rigid circuit board; 16. External equipment housing. Detailed Implementation

[0024] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0025] Example: Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, this utility model discloses a multilayer thermally conductive flexible circuit board, including a support base 1. Both ends of the support base 1 are provided with multiple first screws 2. The support base 1 is fixedly installed in the outer device housing by the first screws 2. A multilayer flexible circuit board 3 is provided on the upper end of the support base 1. The multilayer flexible circuit board 3 is placed on the support base 1. The end of the multilayer flexible circuit board 3 near the support base 1 is a welding end. The welding end of the multilayer flexible circuit board 3 is welded to an outer rigid circuit board.

[0026] The outer surfaces of both sides of the multilayer flexible circuit board 3 are fixed with an outer edge film part 4. An anti-slip film 5 is fixed on the upper surface of the outer edge film part 4. The upper end of the support base 1 is provided with two sets of symmetrically distributed fixing mechanisms. The fixing mechanisms are used to press the outer edge film part 4 on the same side onto the support base 1.

[0027] The fixing mechanism includes a vertical block 6 fixed on the support base 1. A movable block 7 is provided on one side of the vertical block 6. The movable block 7 and the vertical block 6 are fixed together by a second screw 8. A pressure plate 9 is provided at the lower end of the movable block 7, which presses on the anti-slip film 5. Two symmetrically distributed elastic sheets 10 are fixed between the pressure plate 9 and the movable block 7.

[0028] A schematic diagram of the device's operation can be found here. Figure 1 and Figure 2 As shown, the support base 1 is installed on the external equipment housing 16 by the first screw 2. One end of the multilayer flexible circuit board 3 is soldered to the rigid circuit board 15. The outer edge film portion 4 at both ends of the multilayer flexible circuit board 3 is fixed by the pressure plate 9. Specifically, the movable block 7 is installed on the vertical block 6, and the pressure plate 9 presses on the anti-slip film 5. The elastic sheet 10 is in a compressed state. The pressure plate 9 can apply extrusion force to the anti-slip film 5 and apply downward pressure to the outer edge film portion 4. At the same time, there is a large friction between the anti-slip film 5 and the pressure plate 9. Thus, the pressure plate 9 cooperates with the support base 1 to clamp and fix the outer edge film portion 4. The outer edge film portion 4 is integrated with the multilayer flexible circuit board 3. Therefore, when the multilayer flexible circuit board 3 is subjected to a horizontal pulling force, by fixing the outer edge film portion 4 of the multilayer flexible circuit board 3, the external pulling force acts on the outer edge film portion 4, avoiding the external pulling force from acting directly on the solder joint between the multilayer flexible circuit board 3 and the rigid circuit board 15. It can protect the more fragile weld joints, reducing the likelihood of breakage at the weld joints between multilayer flexible circuit boards and rigid circuit boards.

[0029] In this design, a thermally conductive metal layer is added to the surface of the multilayer flexible circuit board 3. This thermally conductive metal layer is a copper layer, deposited on the surface of the multilayer flexible circuit board 3 via electroplating. The copper layer has high thermal conductivity, effectively transferring heat from the interior of the multilayer flexible circuit board 3 to the exterior, thereby accelerating heat dissipation. Copper layers are widely used in circuit fabrication and offer the advantage of relatively low cost.

[0030] Two spaced-apart guide rods 11 are fixed on the pressure plate 9, with the upper ends of the guide rods 11 passing through the movable block 7. A connecting piece 12 is provided at the upper end of the movable block 7, and the connecting piece 12 is fixedly connected to the two guide rods 11. The guide rods 11 guide the pressure plate 9, allowing it to move only in the vertical direction, while the connecting piece 12 limits the guide rods 11 to prevent them from detaching from the movable block 7.

[0031] The vertical block 6 has multiple equally spaced through holes 13. The second screw 8 passes through the through holes 13 and is threaded onto the movable block 7. The movable block 7 can be installed at different positions on the vertical block 6 to achieve different heights. The distance between the pressure plate 9 and the support base 1 can be adjusted to clamp and fix the outer edge film 4 and anti-slip film 5 of different thicknesses. Since the thickness of the multilayer flexible circuit board 3 is different, the thickness of the outer edge film 4 also changes synchronously. The multilayer flexible circuit board 3 and the outer edge film 4 have similar thicknesses and can maintain a high connection strength. Therefore, by adjusting the distance between the pressure plate 9 and the support base 1, multilayer flexible circuit boards 3 of different thicknesses can be accommodated.

[0032] The top end of the support base 1 is rounded. The rounded corner at the top end of the support base 1 contacts the multilayer flexible circuit board 3 to prevent the top of the support base 1 from scratching the multilayer flexible circuit board 3.

[0033] The top of the support base 1 has several equidistantly distributed heat dissipation grooves 14, all of which penetrate the support base 1. The multilayer flexible circuit board 3 is placed on the support base 1, and the heat dissipation grooves 14 can accelerate the heat dissipation efficiency at the contact surface between the multilayer flexible circuit board 3 and the support base 1.

[0034] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A multilayer thermally conductive flexible circuit board, characterized in that, Includes a support base (1), with multiple first screws (2) at both ends of the support base (1). The support base (1) is fixedly installed in the outer device housing by the first screws (2). A multi-layer flexible circuit board (3) is provided on the upper end of the support base (1). The multi-layer flexible circuit board (3) is placed on the support base (1). The end of the multi-layer flexible circuit board (3) near the support base (1) is a welding end. The welding end of the multi-layer flexible circuit board (3) is welded to an external rigid circuit board. The outer surfaces of both sides of the multilayer flexible circuit board (3) are fixed with an outer edge film part (4), and an anti-slip film (5) is fixed on the upper surface of the outer edge film part (4). The upper end of the support base (1) is provided with two sets of symmetrically distributed fixing mechanisms. The fixing mechanisms are used to press the outer edge film part (4) on the same side onto the support base (1). The fixing mechanism includes a vertical block (6) fixed on a support base (1), a movable block (7) on one side of the vertical block (6), the movable block (7) and the vertical block (6) are fixed together by a second screw (8), the lower end of the movable block (7) is provided with a pressure plate (9) pressing on the anti-slip film (5), and two symmetrically distributed elastic sheets (10) are fixed between the pressure plate (9) and the movable block (7).

2. The multilayer thermally conductive flexible circuit board according to claim 1, characterized in that, A thermally conductive metal layer is added to the surface of the multilayer flexible circuit board (3).

3. The multilayer thermally conductive flexible circuit board according to claim 2, characterized in that, The thermally conductive metal layer on the surface of the multilayer flexible circuit board (3) is a copper layer, which is deposited on the surface of the multilayer flexible circuit board (3) by electroplating.

4. The multilayer thermally conductive flexible circuit board according to claim 1, characterized in that, Two spaced guide rods (11) are fixed on the pressure plate (9), and the upper end of the guide rod (11) passes through the movable block (7).

5. A multilayer thermally conductive flexible circuit board according to claim 4, characterized in that, The upper end of the movable block (7) is provided with a connecting piece (12), which is fixedly connected to two guide rods (11).

6. A multilayer thermally conductive flexible circuit board according to claim 1, characterized in that, The vertical block (6) has multiple through holes (13) that are evenly spaced vertically. The second screw (8) can pass through the through holes (13) and be threaded onto the movable block (7).

7. A multilayer thermally conductive flexible circuit board according to claim 1, characterized in that, The top end of the support base (1) is rounded.

8. A multilayer thermally conductive flexible circuit board according to claim 1, characterized in that, The top of the support base (1) is provided with several equally spaced heat dissipation grooves (14), and the heat dissipation grooves (14) all penetrate the support base (1).

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