Anti-oxidation circuit board

Abstract

The utility model provides an anti-oxidation circuit board, which relates to the technical field of circuit boards, and comprises a main circuit substrate, a middle placing plate frame and an outer connecting frame, the main circuit substrate is placed on the top of the middle placing plate frame, the middle placing plate frame horizontally slides on the inner side of the outer connecting frame through the matching of a sliding rail, and the upper surface and the lower surface of the main circuit substrate are respectively covered with a copper foil circuit layer. The copper foil circuit layer is covered with an insulating layer, and a resistance heating layer is attached to the outer side of the insulating layer. The resistance heating layer is heated to heat and dry the main circuit substrate, the copper foil circuit layer and the insulating layer, so that water vapor at the welding position of the insulating layer and the electronic component can be effectively removed, accelerated oxidation and short-circuit faults caused by electrification due to excessive water vapor are avoided, and the problem that a large amount of water vapor is attached to the outside of the circuit board is solved. And oxidation is accelerated and a short-circuit fault is caused when the circuit board is electrified.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to an antioxidant circuit board. Background Technology

[0002] Circuit boards are the support for electronic components and the carrier for electrical connections. They are an important part of electronic equipment. The copper foil on the outside of the circuit board substrate material serves as a conductive line, and the copper foil on the circuit board enables the electrical connection of different components.

[0003] When circuit boards are oxidized by oxygen, an oxide layer forms on the surface of the copper foil or at the solder joints, leading to a series of adverse effects. While circuit boards generate heat during prolonged operation, which helps reduce external moisture, excessive moisture adheres to the exterior of the circuit boards during long-term shutdowns or in high-humidity seasons. This accelerates oxidation and causes short-circuit faults when the circuit boards are powered on. Furthermore, the use of anti-static bags for packaging circuit boards during bulk transportation to the factory for assembly makes disassembly more difficult, and the large amount of waste from these bags increases the cleaning burden on personnel. Summary of the Invention

[0004] This disclosure relates to an anti-oxidation circuit board. During long-term shutdowns or in high-humidity seasons, the resistance heating layer heats up to dry the main circuit board, copper foil circuit layer, and insulation layer. This process effectively removes moisture from the insulation layer and the soldering positions of electronic components, preventing accelerated oxidation and short-circuit faults caused by excessive moisture when energized. This significantly improves the anti-oxidation performance of the circuit board. Compared with traditional anti-static bags, the second movable cover, the upper sealing cover, and the middle board rack can be reused, avoiding frequent disassembly of the anti-static bag and reducing the burden of personnel handling anti-static bag waste.

[0005] In a first aspect, this disclosure provides an anti-oxidation circuit board, specifically comprising: a main circuit board, a central placement board frame, and an external connection frame. The main circuit board is placed on top of the central placement board frame, which slides horizontally inside the external connection frame via a slide rail. Both the upper and lower surfaces of the main circuit board are covered with copper foil circuit layers, which are covered with an insulating layer. The component connection positions of the copper foil circuit layers are not covered by the insulating layer. A resistance heating layer is attached to the outside of the insulating layer. The electronic components of the main circuit board are located on the top front side.

[0006] In at least some embodiments, the resistive heating layer covers the outer side of the insulating layer on the back side of the main circuit board with fewer electronic components, and the heating layer heats and dries the main circuit board, copper foil circuit layer, and insulating layer.

[0007] In at least some embodiments, side push plates are fixedly provided on both sides of the top of the middle placement plate frame, upper through holes are provided in an array at intervals on the top of the middle placement plate frame, a middle desiccant partition is provided in the middle of the middle placement plate frame, and a first movable cover plate is rotatably provided at the opening position in front of the middle desiccant partition on the middle placement plate frame.

[0008] In at least some embodiments, the upper through hole is located between two side push plates, and the lower end of the upper through hole is connected to the middle desiccant partition, where the desiccant material inside the middle desiccant partition performs dehumidification.

[0009] In at least some embodiments, the main circuit board is placed on top of the upper through hole, and the main circuit board is located between two side push plates.

[0010] In at least some embodiments, the upper part of the outer connecting frame is recessed and has an upper slot, the lower part of the outer connecting frame is protruding and has a lower insert block, the outer connecting frame is fixedly mounted on both sides of the upper sealing cover, the lower outer side of the upper sealing cover is fitted with an outer sealing strip, a support spring is provided between the outer sealing strip and the upper sealing cover, the front rotating shaft of the upper sealing cover is fitted with a second movable cover plate, the rotating shaft of the second movable cover plate is also provided with a spiral spring to ensure that it is reset to a vertical state so as to close the upper sealing cover.

[0011] In at least some embodiments, the support spring supports the bottom of the outer sealing strip and the top surface of the middle placement plate frame to keep them in contact. The outer sealing strip seals the gap between the middle placement plate frame and the upper sealing cover. At the same time, the support spring supports the outer sealing strip to increase the sliding resistance of the middle placement plate frame and prevent the middle placement plate frame from sliding out during transportation. The support of the support spring ensures that the outer sealing strip maintains a close and sealing effect with the middle placement plate frame even after wear. When the middle placement plate frame is below the upper sealing cover, the second movable cover plate and the upper sealing cover surround and cover the outside of the side push plate.

[0012] In at least some embodiments, the bottom insert block of the external connector and the top slot of another external connector are slidably connected and threaded holes are provided so that they can be reinforced and fixed with screws, and multiple external connectors and circuit boards are stacked vertically.

[0013] This utility model provides an antioxidant circuit board, which has the following beneficial effects:

[0014] During long-term shutdowns or in seasons with high humidity, the resistance heating layer heats up to dry the main circuit board, copper foil circuit layer, and insulation layer. This process effectively removes moisture from the insulation layer and the soldering positions of electronic components, preventing excessive moisture from accelerating oxidation and causing short circuits when powered on, thereby significantly improving the oxidation resistance of the circuit board.

[0015] During circuit board transportation, the second movable cover, the upper sealing cover, and the middle board rack work together to surround and seal the main circuit board and other components in the middle. At the same time, the dehumidifying material inside the middle dehumidifier layer plays a dehumidifying role, reducing the internal air humidity and minimizing the impact of external air humidity on the circuit board. Compared with traditional anti-static bags, the second movable cover, the upper sealing cover, and the middle board rack can be reused, avoiding the trouble of frequently disassembling the anti-static bag and reducing the burden of anti-static bag waste disposal.

[0016] The rigid second movable cover and the upper sealing cover provide good impact protection for the circuit board, effectively reducing damage during transportation. The external connecting frame can be stacked vertically through the sliding cooperation of the upper slot and the lower insert, thereby significantly improving space utilization. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings of the embodiments will be briefly described below.

[0018] The accompanying drawings described below are only related to some embodiments of the present invention and are not intended to limit the scope of the present invention.

[0019] In the attached diagram:

[0020] Figure 1 A schematic diagram of the main circuit board structure of this application is shown;

[0021] Figure 2 This invention illustrates a structural diagram of the external connecting frame in a vertically stacked arrangement.

[0022] Figure 3 This invention shows a schematic diagram of the structure of the middle placement plate frame in the state outside the upper sealing cover;

[0023] Figure 4 This invention shows a schematic diagram of the structure of the middle placement plate frame in the state of being inside the upper sealing cover;

[0024] Figure 5 A schematic diagram of the structure of the outer sealing strip of this application is shown;

[0025] Figure 6 A schematic diagram of the structure of the placement rack in this application is shown;

[0026] List of reference numerals

[0027] 1. Main circuit board; 101. Copper foil circuit layer; 102. Insulating layer; 103. Resistance heating layer;

[0028] 2. Middle placement rack; 201. Side push plate; 202. Top through hole; 203. First movable cover plate; 204. Middle desiccant compartment;

[0029] 3. External connecting frame; 301. Upper slot; 302. Lower insert block; 303. Upper sealing cover; 304. External sealing strip; 305. Support spring; 306. Second movable cover plate. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0031] Example 1: Please refer to Figures 1 to 6 :

[0032] This utility model proposes an anti-oxidation circuit board, comprising: a main circuit board 1, a middle placement board frame 2, and an external connection frame 3. The upper and lower surfaces of the main circuit board 1 are covered with copper foil circuit layers 101, and the copper foil circuit layers 101 are covered with insulating layers 102. The component connection positions of the copper foil circuit layers 101 are not covered by the insulating layers 102. A resistance heating layer 103 is attached to the outside of the insulating layers 102. The electronic components of the main circuit board 1 are located on the top front. The main circuit board 1 is placed on top of the middle placement board frame 2. Side push plates 201 are fixedly installed on both sides of the top of the plate rack 2. Upper through holes 202 are arranged in an array at intervals on the top of the middle plate rack 2. A middle desiccant compartment 204 is provided in the middle of the middle plate rack 2. A first movable cover plate 203 is rotatably mounted on the middle plate rack 2 at the opening position in front of the middle desiccant compartment 204. Opening the first movable cover plate 203 allows for the replacement of the desiccant inside the middle desiccant compartment 204. The main circuit board 1 is placed on top of the upper through holes 202, and the main circuit board 1 is positioned on both side push plates. Between boards 201, the dehumidifying material inside the desiccant separator 204 dehumidifies the air around the circuit board through the upper through-hole 202. The middle board placement rack 2 slides horizontally inside the outer connecting frame 3 via a slide rail. The upper part of the outer connecting frame 3 has an upper slot 301 recessed, and the lower part of the outer connecting frame 3 has a lower insert block 302 protruding. The outer connecting frame 3 is fixedly mounted on both sides of the upper sealing cover 303. The lower outer side of the upper sealing cover 303 has a U-shaped outer sealing strip 304 that slides and fits against it. A support spring 305 is provided between the upper sealing cover 303 and the upper sealing cover 303. The front rotating shaft of the upper sealing cover 303 is equipped with a second movable cover plate 306. The rotating shaft of the second movable cover plate 306 is also equipped with a hairspring to ensure that it returns to the vertical state and closes the upper sealing cover 303. The lower insert block 302 at the bottom of the outer connecting frame 3 and the upper slot 301 at the top of another outer connecting frame 3 are slidably connected and are provided with threaded holes so that they can be reinforced with screws. Multiple outer connecting frames 3 and circuit boards are stacked vertically to improve space utilization.

[0033] In this embodiment, the resistance heating layer 103 covers the outer side of the insulating layer 102 on the back side of the main circuit board 1 with fewer electronic components. The resistance heating layer 103 heats up to dry the main circuit board 1, the copper foil circuit layer 101, and the insulating layer 102, reducing moisture in the insulating layer 102 and the soldering positions of the electronic components, and avoiding accelerated oxidation when energized due to excessive moisture.

[0034] In this embodiment, the upper through hole 202 is located between the two side push plates 201. The lower end of the upper through hole 202 is connected to the middle desiccant partition 204. The desiccant partition 204 contains dehumidifying material to reduce the air humidity at the top of the middle board rack 2 and around the circuit board, thereby reducing the impact of external air humidity on the circuit board.

[0035] In this embodiment, the support spring 305 supports the bottom of the outer sealing strip 304 and the top surface of the middle placement plate 2 to keep them in contact. The outer sealing strip 304 seals the gap between the middle placement plate 2 and the upper sealing cover 303. At the same time, the support spring 305 supports the outer sealing strip 304 to increase the sliding resistance of the middle placement plate 2, preventing the middle placement plate 2 from sliding out during transportation. The support of the support spring 305 ensures that the outer sealing strip 304 maintains a close and sealing effect with the middle placement plate 2 even after wear. When the middle placement plate 2 is below the upper sealing cover 303, the second movable cover plate 306 and the upper sealing cover 303 surround and cover the outside of the side push plate 201. The second movable cover plate 306 and the upper sealing cover 303 can provide good collision protection for the circuit board and avoid collision damage to the circuit board during transportation.

[0036] In Embodiment 2, based on Embodiment 1, the resistance heating layer 103 can be a separate resistance film heater. The resistance heating layer 103 is attached to the bottom of the circuit board. The resistance heating layer 103 is connected to the copper foil circuit layer 101 through circuits to realize the linkage control between the electronic components of the copper foil circuit layer 101 and the resistance heating layer 103. Alternatively, the resistance heating layer 103 can also be controlled by a separate circuit and not linked to the circuit board.

[0037] The working principle of this embodiment: The main circuit board 1 is made of a combination of glass fiber and resin. The copper foil circuit layer 101 is the copper connection circuit layer for the components. The insulating layer 102 is the external insulating and sealing layer. The components of the main circuit board 1 are connected to the copper connection lines of the copper foil circuit layer 101 by soldering. The copper connection lines of the copper foil circuit layer 101 are sealed by the insulating layer 102 to achieve insulation from the external air. The metal parts of the components and the soldered parts of the copper foil circuit layer 101 are directly exposed to the air and are prone to oxidation. During the use of the circuit board, during long-term shutdown or in high humidity conditions... During seasonal periods, a layer of moisture may adhere to the outside of the circuit board. Before turning on the circuit board or when the device is powered on but not yet started, the resistance heating layer 103 first heats up the temperature. The heating layer 103 heats and dries the main circuit board 1, the copper foil circuit layer 101, and the insulating layer 102, reducing the moisture in the insulating layer 102 and the soldering positions of electronic components. This process can effectively remove the moisture from the insulating layer 102 and the soldering positions of electronic components, thereby preventing excessive moisture from accelerating the oxidation of the insulating layer 102 and the soldering positions of electronic components and causing short circuit faults when the circuit is powered on, thus significantly improving the oxidation resistance of the circuit board.

[0038] After the circuit board components are soldered, during transportation to the factory before assembly, the middle placement rack 2 and the circuit board are both located below the upper sealing cover 303. The second movable cover 306, the upper sealing cover 303, and the middle placement rack 2 work together to surround and seal the main circuit board 1 and other components in the middle. At the same time, the dehumidifying material inside the middle dehumidifier layer 204 plays a dehumidifying role, reducing the air humidity inside the upper sealing cover 303 and around the circuit board, reducing the impact of external air humidity on the circuit board. The support spring 305 supports the outer sealing strip 304 and the middle placement rack 2 to fit and seal, reducing the flow of internal and external air and reducing oxidation during transportation. When the circuit board needs to be removed, the middle placement rack 2 is pulled outward. The middle placement rack 2, the side push plate 201, and the circuit board move synchronously. The side push plate 201 pushes the second movable cover 306 to rotate upward and open, preventing the second movable cover from being removed. In the event of a collision between board 306 and the circuit board, the middle board holder 2 and the circuit board are moved to the outside of the upper sealing cover 303 for removal. Compared with traditional anti-static bags, the second movable cover 306, the upper sealing cover 303, and the middle board holder 2 can be reused, avoiding the hassle of frequently disassembling the anti-static bag and reducing the burden of disposing of the anti-static bag as waste, thus reducing the burden of cleaning up the waste from the anti-static bag. The hard plastic second movable cover 306 and the upper sealing cover 303 can provide good collision protection for the circuit board, avoiding collision damage to the circuit board during transportation, effectively reducing damage during transportation and lowering the probability of damage. The external connecting frame 3, through the sliding cooperation of the upper slot 301 and the lower insert block 302, enables multiple external connecting frames 3 and circuit boards to be stacked vertically, thereby significantly improving space utilization and avoiding damage to the circuit boards when stacked vertically.

[0039] The following points should be noted in this article:

[0040] 1. The accompanying drawings of the embodiments disclosed herein only involve structures relevant to the embodiments disclosed herein; other structures may refer to general designs.

[0041] 2. Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0042] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An oxidation-resistant circuit board comprising: Main circuit substrate (1), middle placement frame (2) and outer connection frame (3); characterized in that, the main circuit substrate (1) is placed on the top of the middle placement frame (2), the middle placement frame (2) is matched with horizontal sliding inside the outer connection frame (3) through the slide rail, the upper and lower surfaces of the main circuit substrate (1) are covered with copper foil circuit layer (101), the copper foil circuit layer (101) is covered with insulating layer (102), and the outer side of the insulating layer (102) is attached with resistance heating layer (103).

2. The oxidation-resistant circuit board according to claim 1, wherein The resistance heating layer (103) is covered on the outer side of the insulating layer (102) on the back of the side of the main circuit substrate (1) with less electronic components.

3. The oxidation-resistant circuit board according to claim 2, wherein The top of the middle placement frame (2) is fixedly provided with side push plates (201) on both sides, the top of the middle placement frame (2) is provided with upper through holes (202) at intervals, the middle of the middle placement frame (2) is provided with a middle desiccant separation layer (204), and the first movable cover plate (203) is rotationally connected to the front opening position of the middle desiccant separation layer (204).

4. The oxidation-resistant circuit board according to claim 3, wherein The upper through holes (202) are between the two side push plates (201), and the lower ends of the upper through holes (202) are communicated with the middle desiccant separation layer (204).

5. The oxidation-resistant circuit board according to claim 4, wherein The main circuit substrate (1) is placed on the top of the upper through holes (202), and the main circuit substrate (1) is between the two side push plates (201).

6. The oxidation-resistant circuit board according to claim 1, wherein The upper part of the outer connection frame (3) is concave and provided with an upper insertion slot (301), the lower part of the outer connection frame (3) is convex and provided with a lower insertion block (302), the outer connection frame (3) is fixedly arranged on both sides of the upper sealing cover (303), the outer side of the lower part of the upper sealing cover (303) is slidably attached with an outer sealing strip (304), the support spring (305) is arranged between the outer sealing strip (304) and the upper sealing cover (303), and the front part of the upper sealing cover (303) is rotationally arranged with the second movable cover plate (306).

7. The oxidation-resistant circuit board according to claim 6, wherein The support spring (305) supports the bottom of the outer sealing strip (304) and the top surface of the middle placement frame (2) to keep attachment, and when the middle placement frame (2) is below the upper sealing cover (303), the second movable cover plate (306) and the upper sealing cover (303) are arranged on the outer side of the side push plate (201) in a cage manner.

8. The oxidation-resistant circuit board according to claim 7, wherein The lower insertion block (302) at the bottom of the outer connection frame (3) is slidably connected with the upper insertion slot (301) at the top of another outer connection frame (3).

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