Bearing device of circuit board solder mask

Abstract

The utility model relates to the technical field of circuit board production, and discloses a circuit board solder mask bearing device which comprises an installation frame, two installation openings are formed in the surface of the installation frame, one side of the inner wall of each installation opening is rotationally connected with an equal-distance adjusting rod, one end of each equal-distance adjusting rod is provided with a connecting assembly, and the other end of each equal-distance adjusting rod is provided with a connecting rod. A plurality of pitch changing grooves are formed in the outer portion of the equal-distance adjusting rod, and a plurality of movable frames are movably connected to the outer portion of the equal-distance adjusting rod. According to the utility model, through cooperative use of the mounting port, the equidistant adjusting rod, the connecting assembly, the variable-pitch groove, the moving frame, the limiting column, the moving column, the driving assembly and other structures, equidistant variable-pitch adjustment can be carried out on the plurality of separation pads, so that the distance between the plurality of separation pads can be adaptively adjusted according to the size of a circuit board; therefore, the circuit board bearing device can be suitable for bearing work of circuit boards of different sizes, the applicability of the circuit board bearing device is enhanced, and the application range of the circuit board bearing device is widened.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a carrier device for solder mask screen printing on circuit boards. Background Technology

[0002] Circuit boards, also known as PCBs, include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCBs, aluminum substrate boards, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, and printed circuit boards. Circuit boards make circuits miniaturized and more intuitive, playing an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. After solder mask printing, circuit boards need to be left to stand.

[0003] Existing circuit board support devices use spacers to separate circuit boards during storage to prevent them from colliding. However, most existing circuit board support devices cannot adjust the distance between the spacers according to the size of the circuit boards, making them unsuitable for supporting circuit boards of different sizes. This results in poor applicability of the circuit board support devices and reduces their application range. Utility Model Content

[0004] The purpose of this utility model is to address the shortcomings of existing technologies by proposing a carrier device for solder mask printing on circuit boards.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a bearing device for solder mask screen printing on circuit boards, comprising a mounting frame, two mounting openings on the surface of the mounting frame, an equidistant adjusting rod rotatably connected to one side of the inner wall of the mounting opening, a connecting component at one end of the equidistant adjusting rod, several variable pitch grooves on the outside of the equidistant adjusting rod, several movable frames movably connected to the outside of the equidistant adjusting rod, and a spacer pad fixedly connected between the two sides of the inner wall of each of the movable frames, two limiting posts fixedly connected inside the mounting opening and on both sides of the equidistant adjusting rod, movable columns fixedly connected inside the movable frames, and the movable columns slidably connected inside the several variable pitch grooves, two driving components on one side of the mounting frame, snap-fit ​​components on both sides of the mounting frame, and a spacer component between the two sides of the inner wall of the mounting frame.

[0006] By setting a drive component, the connecting component can be rotated, which in turn drives the equidistant adjustment rod to rotate. At this time, several movable columns that are slidably connected inside several variable pitch slots will move with the rotation of the equidistant adjustment rod, thereby causing the movable columns to drive the movable frame to make linear motion, thus adjusting the equidistant pitch of several spacer pads.

[0007] As a further description of the above technical solution:

[0008] The connecting assembly includes a connecting shaft fixedly connected to one end of the equidistant adjusting rod, and a worm gear is sleeved on the outside of the connecting shaft.

[0009] As a further description of the above technical solution:

[0010] The drive assembly includes a hollow block fixedly connected to one side of the mounting frame, a worm gear rotatably connected to one side of the inner wall of the hollow block, and a drive rod fixedly connected to one end of the worm gear.

[0011] By setting a drive rod, the worm can drive the worm wheel to rotate, which in turn drives the connecting shaft and the equidistant adjusting rod to rotate synchronously.

[0012] As a further description of the above technical solution:

[0013] The worm gear meshes with the worm wheel.

[0014] As a further description of the above technical solution:

[0015] The snap-fit ​​assembly includes a hollow column fixedly connected to one side of the mounting frame, and a spring is fixedly connected to one side of the inner wall of the hollow column.

[0016] As a further description of the above technical solution:

[0017] A protrusion is fixedly connected to one end of the spring, and a pull rod is fixedly connected to the side of the protrusion near the spring.

[0018] By setting a pull rod, the protrusion can be moved, thereby releasing the fixation of the partition plate and making it easy to remove the partition plate.

[0019] As a further description of the above technical solution:

[0020] The separation component includes two sets of placement strips fixedly connected to both sides of the inner wall of the mounting frame. A separation plate is provided between each set of placement strips, and a snap-fit ​​groove is provided on both sides of the separation plate.

[0021] By setting a partition, the mounting frame can be divided into upper and lower areas, allowing the mounting frame to hold two sets of circuit boards of different sizes.

[0022] As a further description of the above technical solution:

[0023] One end of the protrusion is adapted to the snap-fit ​​groove.

[0024] This utility model has the following beneficial effects:

[0025] 1. Compared with existing technologies, this circuit board solder mask screen printing support device, through the coordinated use of structures such as mounting port, equidistant adjustment rod, connecting component, variable pitch groove, moving frame, limiting post, moving post and drive component, can perform equidistant variable pitch adjustment on several spacer pads. This allows the distance between several spacer pads to be adjusted to match the size of the circuit board, thus making it suitable for supporting circuit boards of different sizes, enhancing the applicability of the circuit board support device and expanding its application range.

[0026] 2. Compared with the existing technology, the support device for solder mask printing on the circuit board can divide the mounting frame into upper and lower areas through the combined use of snap-fit ​​components and separation components, so that the mounting frame can be used to support two different sizes of circuit boards, thus improving the practicality of the circuit board support device. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a carrier device for solder mask printing on a circuit board, as proposed in this utility model.

[0028] Figure 2 This is a schematic diagram of the mounting frame structure of a bearing device for solder mask screen printing on a circuit board, as proposed in this utility model.

[0029] Figure 3 This is a schematic diagram of the movable frame structure of a support device for solder mask screen printing on a circuit board, as proposed in this utility model.

[0030] Figure 4 This is a schematic diagram of the partition plate structure of the bearing device for solder resist screen printing on a circuit board proposed in this utility model.

[0031] Legend:

[0032] 1. Mounting frame; 2. Mounting port; 3. Equidistant adjustment rod; 4. Variable pitch groove; 5. Moving frame; 6. Spacer pad; 7. Limiting post; 8. Moving post; 9. Connecting shaft; 10. Worm gear; 11. Hollow block; 12. Worm; 13. Drive rod; 14. Hollow column; 15. Spring; 16. Protrusion; 17. Pulling rod; 18. Placement strip; 19. Spacer plate; 20. Snap-fit ​​groove. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Reference Figure 1-4 This utility model provides a support device for solder mask screen printing on circuit boards: It includes a mounting frame 1, with two mounting openings 2 on the surface of the mounting frame 1. An equidistant adjusting rod 3 is rotatably connected to one side of the inner wall of each mounting opening 2. One end of the equidistant adjusting rod 3 is provided with a connecting component. Several variable pitch grooves 4 are formed on the outside of the equidistant adjusting rod 3. Several movable frames 5 are movably connected to the outside of the equidistant adjusting rod 3. Spacing pads 6 are fixedly connected between the two sides of the inner walls of each movable frame 5. Two limiting posts 7 are fixedly connected inside the mounting openings 2 and located on both sides of the equidistant adjusting rod 3. Movable posts 8 are fixedly connected inside each of the movable frames 5. The movable posts 8 are slidably connected inside the variable pitch grooves 4. The mounting frame 1... Two drive components are provided on one side, and snap-fit ​​components are provided on both sides of the mounting frame 1. A separation component is provided between the two sides of the inner wall of the mounting frame 1. The two mounting ports 2 are symmetrical about the center of the mounting frame 1. The two sides of the limiting frame pass through the mounting ports 2 and the top is located above the inner wall of the mounting frame 1. The movable frame 5 is slidably connected between the outer surfaces of the two limiting posts 7. By setting the drive components, the connecting components can be driven to rotate, so that the connecting components drive the equidistant adjustment rod 3 to rotate. At this time, the several movable posts 8 slidably connected in several variable pitch grooves 4 will move with the rotation of the equidistant adjustment rod 3, so that the movable posts 8 drive the movable frame 5 to make linear motion, thereby adjusting the several separation pads 6 by equidistant variable pitch.

[0035] The connecting assembly includes a connecting shaft 9 fixedly connected to one end of the equidistant adjusting rod 3, and a worm gear 10 is sleeved on the outside of the connecting shaft 9.

[0036] The drive assembly includes a hollow block 11 fixedly connected to one side of the mounting frame 1. A worm gear 12 is rotatably connected to one side of the inner wall of the hollow block 11. A drive rod 13 is fixedly connected to one end of the worm gear 12. The worm gear 12 meshes with a worm wheel 10. One end of the connecting shaft 9 extends into the interior of the hollow block 11, and the worm wheel 10 is located inside the hollow block 11. The drive rod 13 is T-shaped and one end extends into the exterior of the hollow block 11. By setting the drive rod 13, the worm gear 12 can drive the worm wheel 10 to rotate, thereby driving the connecting shaft 9 and the equidistant adjusting rod 3 to rotate synchronously.

[0037] The snap-fit ​​assembly includes a hollow column 14 fixedly connected to one side of the mounting frame 1. A spring 15 is fixedly connected to one side of the inner wall of the hollow column 14. A protrusion 16 is fixedly connected to one end of the spring 15. A pull rod 17 is fixedly connected to the side of the protrusion 16 near the spring 15. The pull rod 17 is T-shaped and one end extends through to the outside of the hollow column 14. One end of the protrusion 16 extends through the hollow block 11 and the inside of the mounting frame 1 and is located inside the snap-fit ​​groove 20. By setting the pull rod 17, the protrusion 16 can be moved, thereby releasing the fixation of the partition plate 19 and making it easy to remove the partition plate 19.

[0038] The partition assembly includes two sets of placement strips 18 fixedly connected to both sides of the inner wall of the mounting frame 1. A partition plate 19 is provided between each set of placement strips 18. Both sides of the partition plate 19 are provided with snap-fit ​​grooves 20. One end of the protrusion 16 is adapted to the snap-fit ​​groove 20. Each set of placement strips 18 consists of two placement strips 18 and the partition plate 19 is placed between the opposite sides of the two placement strips 18. By setting the partition plate 19, the mounting frame 1 can be divided into upper and lower areas, so that the mounting frame 1 can hold two sets of circuit boards of different sizes.

[0039] Working principle: When it is necessary to adjust the distance between several spacer pads 6, the drive rod 13 is rotated, which drives the worm gear 12 to rotate. At this time, the worm gear 12 drives the meshing worm wheel 10 to rotate, which in turn drives the connecting shaft 9 to rotate. The connecting shaft 9 drives the equidistant adjustment rod 3 to rotate. At this time, due to the rotation of the equidistant adjustment rod 3, several moving columns 8 located on several variable pitch grooves 4 will drive the moving frame 5 to move. Under the action of the limiting column 7, several moving frames 5 will make linear motion until the distance between several spacer pads 6 is adjusted to a suitable spacing. At this time, the drive rod 13 is stopped, and under the self-locking action of the worm wheel 10 and the worm gear 12, the position of several spacer pads 6 is fixed, so that the distance between several spacer pads 6 can be adjusted equidistantly, thereby adapting to different sizes of load-bearing work.

[0040] When it is necessary to divide the mounting frame 1 into upper and lower areas, by moving the two pull rods 17 outward, the two pull rods 17 respectively drive the protrusions 16 to move and compress the two springs 15, causing the protrusions 16 to retract into the hollow block 11 until the pull rods 17 can no longer be moved. At this time, one side of the protrusion 16 is no longer located between a set of placement strips 18. Then, the partition plate 19 is placed between the two sets of placement strips 18 and the two sides of the partition plate 19 are aligned with the front and back of the mounting frame 1. At this time, the two springs 15 are released. A pull rod 17 causes two protrusions 16 to move toward the two locking slots 20 under the action of two springs 15, until one side of the protrusion 16 is locked inside the locking slot 20, thus installing the partition plate 19 inside the mounting frame 1, thereby dividing the mounting frame 1 into upper and lower areas. Then, when it is necessary to remove the partition plate 19, the protrusions 16 can be disengaged from the locking slots 20 by pushing the two pull rods 17 outward, thereby releasing the fixation of the partition plate 19 and making it easy to remove the partition plate 19.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A carrier device for solder mask printing on circuit boards, comprising a mounting frame (1), characterized in that: The surface of the mounting frame (1) has two mounting openings (2). An equidistant adjustment rod (3) is rotatably connected to one side of the inner wall of the mounting opening (2). A connecting component is provided at one end of the equidistant adjustment rod (3). Several variable pitch grooves (4) are provided on the outside of the equidistant adjustment rod (3). Several movable frames (5) are movably connected to the outside of the equidistant adjustment rod (3). A spacer pad (6) is fixedly connected between the two sides of the inner wall of the several movable frames (5). Two limiting posts (7) are fixedly connected inside the mounting opening (2) and on both sides of the equidistant adjustment rod (3). Movable posts (8) are fixedly connected inside the several movable frames (5). The several movable posts (8) are slidably connected inside the several variable pitch grooves (4). Two driving components are provided on one side of the mounting frame (1). Snap-fit ​​components are provided on both sides of the mounting frame (1). A spacer component is provided between the two sides of the inner wall of the mounting frame (1).

2. The carrier device for solder mask printing on a circuit board according to claim 1, characterized in that: The connecting assembly includes a connecting shaft (9) fixedly connected to one end of the equidistant adjusting rod (3), and a worm gear (10) is sleeved on the outside of the connecting shaft (9).

3. The carrier device for solder mask printing on a circuit board according to claim 2, characterized in that: The drive assembly includes a hollow block (11) fixedly connected to one side of the mounting frame (1), a worm gear (12) rotatably connected to one side of the inner wall of the hollow block (11), and a drive rod (13) fixedly connected to one end of the worm gear (12).

4. The bearing device for solder mask printing on a circuit board according to claim 3, characterized in that: The worm (12) meshes with the worm wheel (10).

5. The bearing device for solder mask printing on a circuit board according to claim 1, characterized in that: The snap-fit ​​assembly includes a hollow column (14) fixedly connected to one side of the mounting frame (1), and a spring (15) is fixedly connected to one side of the inner wall of the hollow column (14).

6. The carrier device for solder mask printing on a circuit board according to claim 5, characterized in that: One end of the spring (15) is fixedly connected to a protrusion (16), and a pull rod (17) is fixedly connected to the side of the protrusion (16) near the spring (15).

7. The carrier device for solder mask printing on a circuit board according to claim 6, characterized in that: The separation component includes two sets of placement strips (18) fixedly connected to both sides of the inner wall of the mounting frame (1). A separation plate (19) is provided between each set of placement strips (18), and a snap-fit ​​groove (20) is provided on both sides of the separation plate (19).

8. The carrier device for solder mask printing on a circuit board according to claim 7, characterized in that: One end of the protrusion (16) is adapted to the snap-fit ​​groove (20).

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