SMT (surface mount technology) device for manufacturing PCBA (printed circuit board assembly)

Abstract

The utility model discloses an SMT paster device for PCBA board manufacturing, comprising a processing table top and clamping transportation mechanisms, the left and right sides of the rear end of the top of the processing table top are symmetrically and fixedly connected with second support columns, and the top ends of the first support column and the second support columns are both provided with the clamping transportation mechanisms. A first supporting frame is fixedly connected to the middle of the top of the machining table top, an electric lifting rod is arranged at the right end of the first supporting frame, a fixing rod is fixedly connected to the top end of the electric lifting rod, and a second supporting frame is rotationally connected to the left end of the fixing rod. By arranging the spray head, the upper clamping plate, the lower clamping plate and the second supporting frame, before soldering paste is printed on a soldering block, the soldering block is clamped by the upper clamping plate and the lower clamping plate, the second supporting frame capable of being turned over is used for turning over the soldering block, cleaning liquid sprayed out of the spray head is used for cleaning the two faces of the soldering block, residues on the soldering block are effectively removed, pollution of a circuit board is reduced, and the soldering quality is improved.

Description

Technical Field

[0001] This utility model relates to the field of SMT (Surface Mount Technology) technology, and in particular to an SMT assembly device for PCBA (Printed Circuit Board Assembly) fabrication. Background Technology

[0002] Surface mount technology, also known as surface mount assembly or surface mounting technology, is a circuit assembly technology that mounts leadless or short-lead surface mount components onto the surface of a printed circuit board or other substrate, and then assembles them by methods such as reflow soldering or dip soldering.

[0003] Before surface mount technology (SMT) assembly on a PCBA board, ensuring the cleanliness of the board is crucial, as it directly affects the soldering quality. Therefore, those skilled in the art have provided an SMT assembly apparatus for PCBA board fabrication to address the problems mentioned in the background section. Utility Model Content

[0004] The purpose of this invention is to provide an SMT placement device for PCBA board manufacturing, which can effectively remove residues on the soldering board, reduce circuit board contamination, and improve soldering quality; it also wipes away the cleaning liquid, saving drying time and facilitating subsequent solder paste printing, thus ensuring soldering quality and improving work efficiency.

[0005] To achieve the above objectives, an SMT placement device for PCBA board manufacturing is provided, comprising: a processing table and a clamping and transporting mechanism. First support columns are symmetrically fixedly connected to the left and right sides of the top front end of the processing table, and second support columns are symmetrically fixedly connected to the left and right sides of the top rear end of the processing table. A clamping and transporting mechanism is provided at the top of both the first and second support columns. A first support frame is fixedly connected to the middle of the top of the processing table. A through hole is provided on the right side wall of the first support frame. An electric lifting rod is provided at the right end of the first support frame. A fixing rod is fixedly connected to the top of the electric lifting rod. A second support frame is rotatably connected to the left end of the fixing rod. A lower clamping plate is fixedly connected to the bottom of the inner wall of the second support frame. A threaded rod is rotatably connected between the upper and lower inner walls of the second support frame. An upper clamping plate is threaded onto the circumference of the threaded rod. A nozzle is provided on the top inner wall of the first support frame. A top plate is fixedly connected to the middle of the top of the clamping and transporting mechanism at the rear end. A third support frame is provided in the middle between the two second support columns. A cleaning cloth is provided on the top outer wall of the third support frame and the bottom inner wall of the top plate.

[0006] According to the SMT placement device for PCBA board manufacturing, a groove is provided at the top left end of the fixing rod, and a first motor is fixedly connected inside the groove. The drive end of the first motor is fixedly connected to the middle of the right side wall of the second support frame, and the first motor controls the rotation of the second support frame.

[0007] According to the SMT placement device for PCBA board manufacturing, a second motor is fixedly connected to the rear end of the top outer wall of the second support frame, and the drive end of the second motor is fixedly connected to the threaded rod to control the clamping operation of the upper and lower clamping plates.

[0008] According to the SMT placement device for PCBA board manufacturing, the front end of the threaded rod is provided with a sliding rod, and the top and bottom ends of the sliding rod are respectively fixedly connected to the upper and lower inner walls of the second support frame.

[0009] According to the SMT placement device for PCBA board manufacturing, the top front ends of the lower clamping plate and the upper clamping plate are both inserted into the slide rod, and the middle part of the fixing rod is inserted into the through hole.

[0010] According to the SMT placement device for PCBA board manufacturing, an electric push rod is fixedly connected to the top of the rear end of the first support column, and both the first support frame and the third support frame are U-shaped.

[0011] According to the aforementioned SMT assembly device for PCBA board manufacturing, the number of nozzles is multiple, and the second support frame has a U-shaped cross-section.

[0012] Beneficial effects:

[0013] 1. This utility model is equipped with a nozzle, an upper clamping plate, a lower clamping plate, and a second support frame. Before the solder paste is printed on the soldering plate, the upper and lower clamping plates are used to clamp the soldering plate, and the second support frame can be flipped to turn the soldering plate over. The cleaning liquid sprayed from the nozzle is used to clean both sides of the soldering plate, effectively removing residues on the soldering plate, reducing circuit board contamination, and improving soldering quality.

[0014] 2. This utility model, by setting up a cleaning cloth, a third support frame and a top plate, allows the cleaning liquid to be wiped off between the third support frame and the top plate after the welding plate has been cleaned with cleaning liquid and is being transported backward by the clamping and conveying mechanism. This saves drying time, facilitates the subsequent printing of solder paste, ensures welding quality and improves work efficiency.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is a three-dimensional front view of an SMT placement device for PCBA board fabrication according to the present invention.

[0018] Figure 2 for Figure 1 Enlarged view of point A in the image;

[0019] Figure 3 This is a top view of the three-dimensional structure of an SMT placement device for PCBA board manufacturing according to this utility model;

[0020] Figure 4 for Figure 3 Enlarged view of point B in the image.

[0021] Legend:

[0022] 1. Processing table; 2. First support column; 3. Second support column; 4. Clamping and transporting mechanism; 5. First support frame; 6. Nozzle; 7. Through hole; 8. Electric lifting rod; 9. First motor; 10. Second support frame; 11. Lower clamping plate; 12. Upper clamping plate; 13. Threaded rod; 14. Second motor; 15. Slide rod; 16. Third support frame; 17. Top plate; 18. Cleaning cloth; 19. Electric push rod; 20. Fixing rod. Detailed Implementation

[0023] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0024] Reference Figures 1-4This utility model discloses an SMT placement device for PCBA board fabrication, comprising a processing table 1 and a clamping and transporting mechanism 4. The clamping and transporting mechanism 4 is existing technology. First support columns 2 are symmetrically fixedly connected to the left and right sides of the top front end of the processing table 1, and second support columns 3 are symmetrically fixedly connected to the left and right sides of the top rear end of the processing table 1. The height of the second support columns 3 is higher than that of the first support columns 2, so an electric push rod 19 can push the soldering plate onto the clamping and transporting mechanism 4 at the rear end. The top ends of both the first support columns 2 and the second support columns 3 are equipped with the clamping and transporting mechanism 4. A first support frame 5 is fixedly connected to the middle of the top of the processing table 1. A through hole 7 is opened on the right side wall of the first support frame 5, and an electric lifting rod 8 is provided at the right end of the first support frame 5. The top of the electric lifting rod 8 is fixedly connected to a fixed rod 20. The left end of the fixed rod 20 is rotatably connected to a second support frame 10. The bottom of the inner wall of the second support frame 10 is fixedly connected to a lower clamping plate 11. The rear end of the upper and lower inner walls of the second support frame 10 is rotatably connected to a threaded rod 13. The circumference of the threaded rod 13 is threadedly connected to an upper clamping plate 12. The top inner wall of the first support frame 5 is provided with a nozzle 6. The top middle of the rear end clamping and transporting mechanism 4 is fixedly connected to a top plate 17. The middle between the two second support columns 3 is provided with a third support frame 16. The top outer wall of the third support frame 16 and the bottom inner wall of the top plate 17 are both provided with cleaning cloths 18. The cleaning cloths 18 are used to wipe the solder plate that has just been sprayed with cleaning liquid clean in order to prepare for the subsequent solder paste printing work.

[0025] A groove is provided at the top left end of the fixed rod 20, and a first motor 9 is fixedly connected inside the groove. The drive end of the first motor 9 is fixedly connected to the middle of the right side wall of the second support frame 10. A second motor 14 is fixedly connected to the rear end of the top outer wall of the second support frame 10, and the drive end of the second motor 14 is fixedly connected to the threaded rod 13. A sliding rod 15 is provided at the front end of the threaded rod 13, and the top and bottom ends of the sliding rod 15 are fixedly connected to the upper and lower inner walls of the second support frame 10, respectively. The top front ends of the lower clamping plate 11 and the upper clamping plate 12 are both inserted into the sliding rod 15, and the middle part of the fixed rod 20 is inserted into the through hole 7, which plays a certain limiting role. An electric push rod 19 is fixedly connected to the top of the rear end of the first support column 2. The first support frame 5 and the third support frame 16 are both U-shaped. There are multiple nozzles 6, and the cross section of the second support frame 10 is U-shaped.

[0026] Working principle: The solder plate is placed on the front clamping and transporting mechanism 4 and transported backward. The second support frame 10 is raised and lowered by the electric lifting rod 8 to the horizontal position of the front clamping and transporting mechanism 4. The threaded rod 13 rotates to control the upper clamping plate 12 to move downward, clamping the transmitted solder plate. The electric lifting rod 8 raises the solder plate. At this time, the nozzle 6 sprays out cleaning fluid. The first motor 9 rotates the second support frame 10, flipping the solder plate on both sides so that both sides of the solder plate are cleaned. After cleaning, it is rotated back to its original position. The electric lifting rod 8 lowers the solder plate to the level position of the clamping and transporting mechanism 4 on the second support column 3. The electric push rod 19 pushes the solder plate into the rear clamping and transporting mechanism 4 and then moves it backward. It passes through the cleaning cloths 18 on the upper and lower sides to wipe the cleaning fluid off the solder plate for subsequent operations such as solder paste printing and surface mount.

[0027] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An SMT placement apparatus for PCBA board fabrication, comprising: A processing table (1) and a clamping and transporting mechanism (4) are characterized in that: first support columns (2) are symmetrically fixedly connected to the left and right sides of the top front end of the processing table (1); second support columns (3) are symmetrically fixedly connected to the left and right sides of the top rear end of the processing table (1); clamping and transporting mechanisms (4) are provided at the top ends of the first support columns (2) and the second support columns (3); a first support frame (5) is fixedly connected to the middle of the top of the processing table (1); a through hole (7) is opened on the right side wall of the first support frame (5); an electric lifting rod (8) is provided at the right end of the first support frame (5); a fixed rod (20) is fixedly connected to the top end of the electric lifting rod (8); and the fixed rod (20) is fixedly connected to the top end of the electric lifting rod (8). The left end of the fixed rod (20) is rotatably connected to the second support frame (10). The bottom of the inner wall of the second support frame (10) is fixedly connected to the lower clamping plate (11). The rear end of the upper and lower inner walls of the second support frame (10) is rotatably connected to the threaded rod (13). The circumference of the threaded rod (13) is threadedly connected to the upper clamping plate (12). The top inner wall of the first support frame (5) is provided with a nozzle (6). The top middle of the rear clamping and transporting mechanism (4) is fixedly connected to the top plate (17). The middle between the two second support columns (3) is provided with a third support frame (16). The top outer wall of the third support frame (16) and the bottom inner wall of the top plate (17) are both provided with cleaning cloths (18).

2. The SMT placement device for PCBA board fabrication according to claim 1, characterized in that, The top left end of the fixed rod (20) has a groove, and a first motor (9) is fixedly connected inside the groove. The drive end of the first motor (9) is fixedly connected to the middle of the right side wall of the second support frame (10).

3. The SMT placement device for PCBA board fabrication according to claim 1, characterized in that, The second motor (14) is fixedly connected to the rear end of the top outer wall of the second support frame (10), and the drive end of the second motor (14) is fixedly connected to the threaded rod (13).

4. The SMT placement apparatus for PCBA board fabrication according to claim 1, characterized in that, The threaded rod (13) is provided with a slide rod (15) at its front end. The top and bottom ends of the slide rod (15) are respectively fixedly connected to the upper and lower inner walls of the second support frame (10).

5. The SMT placement apparatus for PCBA board fabrication according to claim 1, characterized in that, The top front ends of the lower clamping plate (11) and the upper clamping plate (12) are both inserted into the sliding rod (15), and the middle part of the fixing rod (20) is inserted into the through hole (7).

6. The SMT placement apparatus for PCBA board fabrication according to claim 1, characterized in that, An electric push rod (19) is fixedly connected to the top of the rear end of the first support column (2), and both the first support frame (5) and the third support frame (16) are U-shaped.

7. The SMT placement apparatus for PCBA board fabrication according to claim 1, characterized in that, The number of nozzles (6) is multiple, and the second support frame (10) has a U-shaped cross-section.

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