Electronic equipment

Abstract

The utility model relates to the technical field of terminals, and discloses electronic equipment. In the electronic equipment, the connector between the mainboard and the battery flexible circuit board is connected with the vapor chamber on the screen through the heat-conducting glue, so that the vapor chamber can tightly press the connector. Therefore, a pressing support does not need to be additionally arranged in the electronic equipment to press the connector, and the weight of the electronic equipment is reduced. Moreover, the connector can directly transfer the heat to the vapor chamber, so that the heat transfer path is reduced, and the heat dissipation effect of the electronic equipment can be improved.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to an electronic device. Background Technology

[0002] In some electronic devices, circuit boards are typically connected to each other using connectors. To ensure the stability of the electrical connection between the two circuit boards, screws and brackets are usually used to tighten the connectors. However, screws and brackets increase the weight of the electronic device, which is detrimental to its lightweight design. Utility Model Content

[0003] An embodiment of this application provides an electronic device.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, this application discloses an electronic device, including a housing that encloses a receiving cavity. The receiving cavity contains a first circuit board, a second circuit board, and a connector. The first and second circuit boards are disposed opposite each other along a first direction, and the connector is disposed between the first and second circuit boards for electrical connection. Furthermore, the insertion direction of the male and female contacts of the connector is the first direction. The electronic device also includes a heat spreader. On the heat spreader housing, the heat spreader and the first circuit board are disposed opposite each other along the first direction and spaced apart to form a first gap. The electronic device also includes thermally conductive adhesive, which fills the first gap. The orthographic projection of the thermally conductive adhesive onto a first plane at least partially overlaps with the orthographic projection of the connector onto a first plane, and the first plane is perpendicular to the first direction. The heat spreader can transmit pressure along the first direction to the connector through the thermally conductive adhesive and the first circuit board to press the connector firmly.

[0006] According to an embodiment of this application, a first circuit board and a second circuit board of an electronic device are disposed opposite to each other along a first direction and electrically connected by a connector, wherein the male and female contacts of the connector are inserted along the first direction. When the heat spreader is fixedly connected to the first circuit board by thermally conductive adhesive and presses the first circuit board, the first circuit board can provide a clamping force to the connector. That is, the thermally conductive adhesive can transfer the clamping force to the connector, ensuring the stability of the connector connection. At the same time, the thermally conductive adhesive can also conduct heat from the connector to the heat spreader, thereby shortening the heat transfer path and improving the heat dissipation performance of the electronic device.

[0007] Secondly, this application discloses an electronic device, including a housing that encloses a receiving cavity. A first circuit board, a second circuit board, and a connector are disposed within the receiving cavity. The connector electrically connects the first and second circuit boards, and the insertion direction of the male and female contacts of the connector is a first direction. The electronic device also includes a heat spreader disposed on the housing. The heat spreader and the connector are positioned opposite each other and spaced apart along the first direction to form a second gap. The electronic device also includes thermally conductive adhesive that fills the second gap. The heat spreader can transmit pressure along the first direction to the connector through the thermally conductive adhesive to press the connector firmly.

[0008] According to an embodiment of this application, the connector and the heat spreader of the electronic device are arranged at a distance from each other along a first direction, such that the heat spreader is directly fixedly connected to the connector by thermally conductive adhesive. That is, the heat spreader, thermally conductive adhesive, and connector are stacked along the first direction. In this state, the thermally conductive adhesive can both transfer clamping force to the connector to ensure the stability of the connector connection and transfer heat from the connector to the heat spreader to improve the heat dissipation performance of the electronic device.

[0009] In one possible implementation of the first or second aspect described above, the housing includes a screen, a middle frame, and a rear cover. Along the first direction, the screen and the rear cover are respectively disposed on opposite sides of the middle frame to jointly enclose a receiving cavity. The heat dissipation plate is disposed on the screen and is located on the side of the screen facing the receiving cavity.

[0010] According to the embodiments of this application, the first direction can be the thickness direction of the electronic device. After the thermally conductive adhesive is cured, the heat spreader on the screen along the first direction can directly or indirectly provide pressure to the connector through the thermally conductive adhesive, thereby pressing the connector onto the circuit board assembly to improve the stability of the connector connecting the first circuit board and the second circuit board.

[0011] In one possible implementation of the first or second aspect described above, the mid-frame and the rear cover are integrally connected.

[0012] In some embodiments of this application, the mid-frame and rear cover of the housing are integrally connected, thereby ensuring the housing's sealing and aesthetics. Furthermore, since the mid-frame and rear cover are integrally connected, when assembling electronic devices, it is necessary to first assemble the motherboard and battery into the housing, and then cover the screen with the mid-frame. Before covering the screen with the mid-frame, thermally conductive adhesive can be applied to the connector. After the screen is covered with the mid-frame and the thermally conductive adhesive has cured, the heat spreader on the screen can provide direct or indirect clamping force to the connector through the thermally conductive adhesive.

[0013] In one possible implementation of the first or second aspect described above, the second circuit board is disposed on the rear cover.

[0014] In some embodiments of this application, the second circuit board may be disposed on the rear cover and fixedly connected to the rear cover so that the second circuit board can support the connector, so that the heat spreader can directly or indirectly provide clamping force to the connector and ensure the stability of the connector connection.

[0015] In one possible implementation of the first or second aspect described above, the electronic device further includes a first device electrically connected to the first circuit board, and the second circuit board is the motherboard of the electronic device.

[0016] In some embodiments of this application, the first circuit board may also be connected to a first device in an electronic device, and the second circuit board is the motherboard of the electronic device, which can control the first device through the first circuit board.

[0017] In one possible implementation of the first or second aspect described above, the first device is a battery, and the first circuit board is a flexible circuit board.

[0018] In one possible implementation of the first or second aspect described above, the first device and the second circuit board are arranged sequentially along a second direction, which is perpendicular to the first direction.

[0019] In some embodiments of this application, the second direction may be the length direction of the electronic device. The first device and the circuit board are arranged sequentially along the length direction of the electronic device.

[0020] In one possible implementation of the first or second aspect described above, the matrix of the thermally conductive adhesive comprises an acrylic adhesive.

[0021] In some embodiments of this application, acrylate adhesives have the advantages of room temperature curing, fast curing speed, and high adhesive layer strength. Therefore, before installing the screen, thermally conductive adhesive can be applied to the connector, and then the screen can be installed. The heat spreader on the screen presses the thermally conductive adhesive onto the heat spreader. Because the acrylate adhesive is fluid before curing, the thermally conductive adhesive can better adhere to the heat spreader during the pressing process, thereby improving the thermal conductivity. Since acrylate adhesives are room temperature curable and have a fast curing speed, the thermally conductive adhesive can cure quickly. After curing, the heat spreader on the screen can apply pressure to the connector through the thermally conductive adhesive.

[0022] In one possible implementation of the first or second aspect described above, the doping in the thermally conductive adhesive includes thermally conductive metals or graphene.

[0023] In some embodiments of this application, doping the thermally conductive adhesive with thermally conductive metals or graphene can improve its thermal conductivity and strength, enabling it to transfer the pressure applied by the heat spreader to the connector. In some embodiments, the thermally conductive metal may be aluminum powder, etc.

[0024] In one possible implementation of the first or second aspect above, the mass percentage of the above-mentioned doping in the thermally conductive adhesive is greater than or equal to 20%.

[0025] In one possible implementation of the first or second aspect described above, the acrylate adhesive has a Shore A hardness greater than or equal to 50 degrees, and a tensile strength greater than or equal to 14 MPa. Attached Figure Description

[0026] FIG. 1A A perspective view of an electronic device is shown;

[0027] FIG. 1B An exploded view of an electronic device is shown;

[0028] FIG. 1C A schematic diagram of a structure for removing the screen from an electronic device is shown;

[0029] FIG. 1D A cross-sectional view of an electronic device is shown. FIG. 1A (A-section diagram);

[0030] FIG. 2A An exploded view of an electronic device is shown according to some embodiments of this application;

[0031] FIG. 2B According to some embodiments of this application, a schematic diagram of a structure for removing the screen from an electronic device is shown;

[0032] FIG. 2C According to some embodiments of this application, a cross-sectional view of an electronic device is shown. FIG. 2A (Cross-section diagram of BB);

[0033] FIG. 2D According to some embodiments of this application, a partial structural schematic diagram of another electronic device is shown;

[0034] FIG. 3A According to some embodiments of this application, a schematic diagram is shown showing that the dopants of the thermally conductive adhesive include graphene;

[0035] FIG. 3B According to some embodiments of this application, a schematic diagram is shown showing that the doping of the thermally conductive adhesive includes metallic materials. Detailed Implementation

[0036] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0037] This application provides an electronic device for reducing the weight of the electronic device and improving the heat dissipation efficiency of the electronic device.

[0038] The electronic devices in this application embodiment can be mobile phones, wearable devices, tablets, virtual reality (VR) devices, augmented reality (AR) devices, devices in industrial control, devices in smart cities, smart homes, and other electronic devices. For example, the following uses a mobile phone as an example to describe some exemplary scenarios in this application embodiment.

[0039] In the illustrations in this article, the X direction can be the width direction of the electronic device, the Y direction can be the length direction of the electronic device, and the Z direction can be the thickness direction of the electronic device. The X, Y, and Z directions can be perpendicular to each other.

[0040] For example, FIGS. 1A-1D A schematic diagram of an electronic device 100 is shown, wherein, FIG. 1A This is a three-dimensional view of electronic device 100. FIG. 1B This is an exploded view of electronic device 100. FIG. 1C A schematic diagram of the structure of electronic device 100 without the screen. FIG. 1D Cross-sectional view of electronic device 100 ( FIG. 1A (Cross-section diagram of AA).

[0041] like FIGS. 1A-1D As shown, the housing of the electronic device 100 includes a screen 10, a mid-frame 21, and a back cover 22. Along the Z-direction, the screen 10 and the back cover 22 are respectively disposed on opposite sides of the mid-frame 21, thus, the screen 10, mid-frame 21, and back cover 22 together form a receiving cavity 30. In some embodiments of this application, the mid-frame 21 and the back cover 22 can be integrally formed, thereby improving the sealing between the mid-frame 21 and the back cover 22, simplifying the housing manufacturing process, and maintaining the aesthetic appearance of the mid-frame 21 and the back cover 22.

[0042] In some embodiments of this application, the housing of the electronic device 100 may also be composed of other structures, for example, the screen 10 may be replaced by a panel that does not have a display function, etc. The embodiments of this application do not limit the specific form of the housing.

[0043] In some embodiments of this application, the electronic device 100 further includes a heat spreader 11. The heat spreader 11 is disposed on the housing. Exemplarily, the heat spreader 11 is disposed on (e.g., stacked on) the screen 10 and is located on the side of the screen 10 facing the receiving cavity 30. The heat spreader 11 and the screen 10 can be fixedly connected by an adhesive or the like.

[0044] It is understood that the heat spreader 11 has high thermal conductivity, which can quickly disperse the heat generated by the heat source (such as the screen 10 or the electronic device in the cavity 30) to the entire surface of the heat spreader 11, and transfer the heat to the outside of the electronic device 100 through thermal radiation and convection, thereby reducing the internal temperature of the electronic device 100 and helping to maintain the stability and smoothness of the electronic device 100 under high load operation.

[0045] The receiving cavity 30 is used to house some components of the electronic device 100, such as the battery 40, flexible circuit board 60, motherboard 50, and control devices of the screen 10.

[0046] In some embodiments of this application, the battery 40 and the motherboard 50 are sequentially arranged in the receiving cavity 30 along the Y direction. For example, the battery 40 can be fixed to the back cover 22 by adhesive, and the motherboard 50 can be fixed to the middle frame 21 or the back cover 22 by clips or screws, thereby ensuring the stability of the motherboard 50.

[0047] Battery 40 is electrically connected to flexible circuit board 60. Flexible circuit board 60 and main board 50 can be electrically connected via board-to-board (BTB) connector 70, thereby allowing main board 50 to control the operating state of battery 40. For example, main board 50 can manage the power supply to battery 40 and monitor its status.

[0048] refer to FIG. 1D In some embodiments of this application, the BTB connector 70 includes a male connector 71 (or "female contact") and a female connector 72 (or "female contact"). The male connector 71 is electrically connected to the flexible circuit board 60, and the female connector 72 can be fixed to the side of the main board 50 opposite to the screen 10 along the Z direction and is electrically connected to the main board 50. The male connector 71 and the female connector 72 can, for example, be inserted along the Z direction to achieve an electrical connection between the flexible circuit board 60 and the main board 50.

[0049] To ensure the stability of the connection between the male connector 71 and the female connector 72 of the BTB connector 70, in some embodiments, the BTB connector 70 can be fixed to the motherboard 50 by means of a bracket and screws or other structures.

[0050] For example, refer to FIG. 1DAlong the Z-direction, a clamping bracket 80 is provided on the side of the motherboard 50 opposite to the screen 10. The clamping bracket 80 covers the BTB connector 70 along the Z-direction and abuts against the side of the BTB connector 70 opposite to the screen 10 along the Z-direction. A cushioning foam may be attached to the side of the clamping bracket 80 facing the BTB connector 70. The clamping bracket 80 can be fixed to the motherboard 50 by screws 81, thereby providing a clamping force F1 along the Z-direction to the BTB connector 70, preventing the male connector 71 of the BTB connector 70 from disengaging from the female connector 72, and maintaining the stability of the BTB connector 70. In some embodiments, a foam pad may be filled between the clamping bracket 80 and the BTB connector 70 along the Z-direction to ensure that the clamping bracket 80 can provide a clamping force to the BTB connector 70 along the Z-direction.

[0051] It is understandable that although the stability of the BTB connector 70 can be ensured by clamping the bracket 80, the electronic device 100 will have an additional weight of clamping bracket 80 and screw 81 used for clamping bracket 80, which will make the overall weight of electronic device 100 higher and will not be conducive to the lightweighting of electronic device 100.

[0052] It is understandable that during the power supply process of battery 40, battery 40 will generate heat, resulting in a higher internal temperature of electronic device 100, which in turn affects the performance of electronic device 100. In addition, during data transmission, the male socket 71 and female socket 72 of BTB connector 70 will also generate heat, thereby affecting the data transmission efficiency of BTB connector 70.

[0053] Therefore, in some embodiments, thermally conductive adhesive 90 can be filled between the clamping bracket 80 and the heat spreader 11 along the Z direction, so that the heat generated by the battery 40 can be transferred from the flexible circuit board 60 to the BTB connector 70, then from the BTB connector 70 to the clamping bracket 80, then from the clamping bracket 80 to the heat spreader 11 through the thermally conductive adhesive 90, and finally from the heat spreader 11 to the screen 10, so as to release the heat generated by the battery 40 to the outside of the electronic device 100, thereby reducing the internal temperature of the electronic device 100.

[0054] It is understandable that during the heat transfer process described above, the heat needs to be transferred from the BTB connector 70 to the clamping bracket 80, and then from the clamping bracket 80 to the heat spreader 11 via the thermally conductive adhesive 90. Therefore, the heat transfer path is relatively long, which reduces the heat dissipation effect of the electronic device 100.

[0055] In summary, in the aforementioned electronic device 100, maintaining the stability of the BTB connector 70 connection through the clamping bracket 80 and screw 81 increases the overall weight of the electronic device 100, which is detrimental to its lightweight design. Furthermore, the longer heat transfer path during the heat dissipation process of the battery 40 reduces its heat dissipation efficiency, thereby diminishing the overall heat dissipation effect of the electronic device 100.

[0056] To this end, this application provides an electronic device in which the BTB connector 70 is fixedly connected to the heat spreader 11 of the screen 10 by thermally conductive adhesive. The heat spreader 11 can transmit the clamping force to the BTB connector 70 through the thermally conductive adhesive, thereby eliminating the need for the clamping bracket 80, reducing the weight and thickness of the electronic device 100.

[0057] In addition, the heat from the BTB connector 70 can be directly transferred to the heat spreader 11 through the thermally conductive adhesive, without having to be transferred to the clamping bracket 80 first and then to the thermally conductive adhesive, thereby shortening the heat transfer path and improving the heat dissipation efficiency of the electronic device 100.

[0058] The following describes an electronic device according to an embodiment of this application.

[0059] For example FIGS. 2A-2C According to some embodiments of this application, a schematic diagram of an electronic device 100 is shown, wherein, FIG. 2A An exploded view of an electronic device 100 is shown according to some embodiments of this application. FIG. 2B According to some embodiments of this application, a schematic diagram of an electronic device 100 without a screen is shown. FIG. 2C According to some embodiments of this application, a cross-sectional view of an electronic device 100 is shown. FIG. 2A (Cross-section view of BB).

[0060] refer to FIGS. 2A-2C The housing of the electronic device 100 includes a screen 10, a middle frame 21 and a back cover 22. Along the Z direction, the screen 10 and the back cover 22 are respectively located on opposite sides of the middle frame 21, thereby jointly forming a receiving cavity 30.

[0061] The electronic device 100 also includes a heat spreader 11 (e.g., a VC heat spreader). Exemplarily, the heat spreader 11 is disposed on (e.g., stacked on) the screen 10 and is located on the side of the screen 10 facing the receiving cavity 30.

[0062] The receiving cavity 30 is used to house some components of the electronic device 100, such as the battery 40 (as an example of a first component), the flexible circuit board 60 (as an example of a first circuit board), the motherboard 50 (as an example of a second circuit board), and the controller of the screen 10, etc.

[0063] In some embodiments, the battery 40 and the motherboard 50 are sequentially disposed in the receiving cavity 30 along the Y direction (as an example of the second direction), and the battery 40 is electrically connected to the flexible circuit board 60 (as an example of the first circuit board), and the flexible circuit board 60 and the motherboard 50 are electrically connected through a BTB connector 70.

[0064] The electronic device 100 in the embodiments of this application is the same as described above. FIGS. 1A-1C Unlike the illustrated electronic device 100, the electronic device 100 in this embodiment does not include the clamping bracket 80 and the screw 81.

[0065] In some embodiments of this application, along the Z-direction (as an example of a first direction), the heat spreader 11 on the screen 10 is spaced apart from the BTB connector 70 (as an example of a connector), that is, along the Z-direction, a gap is formed between the heat spreader 11 and the BTB connector 70 (as an example of a second gap). This gap is filled with thermally conductive adhesive H (or "thermal conductive gel"). In this way, the heat spreader 11 can be fixedly connected to the BTB connector 70 by the thermally conductive adhesive H. Furthermore, along the Z-direction, the heat spreader 11 can transmit pressure F2 to the BTB connector 70 through the thermally conductive adhesive H, thereby pressing the BTB connector 70.

[0066] It is understood that the heat spreader 11 on the screen 10 is fixedly connected to the BTB connector 70 via thermally conductive adhesive H, thereby providing pressure F2 along the Z direction to the BTB connector 70, preventing the male connector 71 and female connector 72 of the BTB connector 70 from separating, thus ensuring the stability of the electrical connection of the BTB connector 70. Therefore, no additional fixing structure is needed in the electronic device 100 to fix the BTB connector 70, thereby reducing the weight of the electronic device 100 and contributing to its lightweight design.

[0067] In other embodiments, the male connector 71 may be fixed to the motherboard 50, and the female connector 72 may be electrically connected to the battery 40 via a flexible circuit board 60 or other circuit boards. The embodiments of this application do not limit the specific positions of the male connector 71 and the female connector 72. The direction in which the male connector 71 and the female connector 72 are inserted into each other may be parallel to the Z-direction, or may have a small angle with the Z-direction (e.g., an angle within 10°). That is, along the Z-direction, the connector can at least be subjected to the pressure provided by the heat spreader 11.

[0068] It is understood that in some embodiments of this application, the middle frame 21 and the back cover 22 of the electronic device 100 are an integral structure, which can improve the sealing and aesthetics of the electronic device 100.

[0069] During the assembly of the electronic device 100, the electronic components within the receiving cavity 30 of the electronic device 100 can be installed first, and then the screen 10 can be fitted onto the middle frame 21 of the electronic device 100. For example, the heat spreader 11 can be pre-attached to the back of the screen 10 to form a screen assembly. After the components within the receiving cavity 30 of the electronic device 100 are installed (e.g., after the male and female connectors 71 and 72 of the BTB connector 70 are inserted along the Z direction), thermally conductive adhesive H can be added to the side of the male connector 71 of the BTB connector 70 opposite to the heat spreader 11 along the Z direction, and then the screen assembly can be fitted onto the middle frame 21 along the Z direction, thereby completing the assembly of the electronic device 100. After the electronic device 100 is assembled, the screen 10 can press the heat spreader 11, thereby applying a clamping force F2 to the BTB connector 70 through the heat spreader 11.

[0070] In addition to applying adhesive to the surface of the BTB connector 70 to form the thermally conductive adhesive H during the dispensing process, adhesive can also be applied around the BTB connector 70 to form the protective adhesive H0. That is, in this embodiment, the dispensing of both the thermally conductive adhesive H and the protective adhesive H0 can be completed in a single dispensing process. This avoids the need for two dispensing processes, saving on process costs.

[0071] In some embodiments of this application, the thermally conductive adhesive H may have high tensile strength and hardness so that it can transmit the clamping force F2 applied by the heat spreader 11 to the BTB connector 70. Therefore, after the screen 10 is placed on the middle frame 21, the heat spreader 11 is fixedly connected to the BTB connector 70 through the thermally conductive adhesive H, and the heat spreader 11 can provide pressure to the BTB connector 70 through the thermally conductive adhesive H to ensure the stability of the connector 70 connection.

[0072] It is understandable that when the thermally conductive adhesive H is not cured, it is in a liquid state. When the heat spreader 11 on the screen 10 is attached to the thermally conductive adhesive H, the fluidity of the thermally conductive adhesive H can maintain a better adhesion with the heat spreader 11. The thermally conductive adhesive H has high hardness and thermal conductivity after curing, thus ensuring that the heat spreader 11 provides a clamping force F2 to the BTB connector 70 through the thermally conductive adhesive H, and that the BTB connector 70 effectively transfers heat to the heat spreader 11.

[0073] It is understood that in some embodiments of this application, the electronic device 100 applies pressure to the BTB connector 70 through the heat spreader 11 to ensure the stability of the BTB connector 70 connection. Furthermore, since the BTB connector 70 is connected to the heat spreader 11 on the screen 10 via thermally conductive adhesive H, the heat transferred from the battery 40 to the BTB connector 70 through the flexible circuit board 60, as well as the heat generated by the BTB connector 70 itself, can be directly transferred to the heat spreader 11 through the thermally conductive adhesive H, thereby improving the thermal conductivity of the BTB connector 70.

[0074] like FIG. 2C As shown by the dashed line in the image, FIG. 2C The dashed lines in the diagram represent the heat transfer process. The heat generated by the battery 40 can be transferred to the BTB connector 70 through the flexible circuit board 60. The BTB connector 70 can then transfer the heat to the heat spreader 11 through the thermally conductive adhesive H. The heat spreader 11 evenly transfers the heat to the screen 10, and then the heat is transferred to the outside of the electronic device 100 through the screen 10. In other words, relative to... FIG. 1D The proposed solution can shorten the heat transfer path, thereby improving the heat dissipation of the electronic device 100.

[0075] In other words, the thermally conductive adhesive H in this embodiment can both transfer the pressure applied to the BTB connector 70 by the heat exchange plate 11 to ensure the stability of the BTB connector 70 and improve the heat dissipation effect of the BTB connector 70, thus avoiding high internal temperature of the electronic device 100.

[0076] Other details of the electronic device 100, such as the housing, receiving cavity 30, heat spreader 11, battery 40, circuit board 60, motherboard 50, and BTB connector 70, and their other configuration details and variations, can be found in the above section regarding... FIGS. 1A-1D The description is omitted.

[0077] FIG. 2D According to some other embodiments of this application, a partial structural schematic diagram of an electronic device is shown.

[0078] This embodiment and FIG. 2C The illustrated embodiment differs in that the flexible circuit board 60 and the main board 50 are arranged opposite each other along the Z-direction, and the BTB connector 70 is disposed between the flexible circuit board 60 and the main board 50. Furthermore, thermally conductive adhesive H is filled between the flexible circuit board 60 and the heat spreader 11. In some embodiments of this application, a first gap is formed between the heat spreader 11 and the flexible circuit board 60 along the Z-direction, the thermally conductive adhesive H is filled in the first gap, and the orthographic projection of the thermally conductive adhesive H along the XY plane (as an example of the first plane) at least partially overlaps with the orthographic projection of the BTB connector 70 along the XY plane, so that the heat spreader 11 provides a clamping force F2 to the BTB connector 70 along the Z-direction through the thermally conductive adhesive H and the flexible circuit board 60, thereby clamping the BTB connector 70 and preventing the male connector 71 and female connector 72 of the BTB connector 70 from separating. Exemplarily, a reinforcing steel sheet may be provided in the area of ​​the flexible circuit board 60 surface in contact with the thermally conductive adhesive H.

[0079] In addition, in this embodiment, the thermally conductive adhesive H and the protective adhesive H0 can be dispensed in one dispensing process, avoiding two dispensing processes and saving process costs.

[0080] Furthermore, in the embodiments of this application, the heat generated by the battery 40 can be transferred to the heat dissipation plate 11 through the flexible circuit board 60 and the thermally conductive adhesive H, thereby further reducing the heat dissipation path of the battery 40 and improving the heat dissipation effect of the battery 40.

[0081] In some embodiments of this application, the electronic device 100 may also contain other electronic components electrically connected to the second circuit board via the first circuit board and a connector. For example, the first component may be an external interface or an electronic component such as a camera module. The embodiments of this application do not limit the specific structure of the first component.

[0082] In some embodiments of this application, the first circuit board and the second circuit board in the electronic device 100 may also partially overlap along the Z direction, as long as the connector can be fixed to the heat spreader 11 along the Z direction by the thermally conductive adhesive H. The embodiments of this application do not limit the position of the first device and the second circuit board.

[0083] It is understood that in some embodiments of this application, taking battery 40 and motherboard 50 as examples, the method of connecting battery 40 to motherboard 50 through flexible circuit board 60 and BTB connector 70 is described. In other embodiments, electronic device 100 may also include other electronic devices electrically connected through circuit board assembly and connector. Furthermore, the connector is inserted at least in a direction that intersects or is parallel to the thickness direction (e.g., Z direction) of electronic device 100 so that heat dissipation plate 11 and thermally conductive adhesive H on screen 10 fix the connector, thereby achieving the effects of heat dissipation, connector fixation and weight reduction of electronic device 100.

[0084] The thermally conductive adhesive H in the embodiments of this application is described below.

[0085] Exemplary examples, in some embodiments of this application, the thermally conductive adhesive H is a composite material. The base of the thermally conductive adhesive H may include an acrylic adhesive H1, which may be a UV-curable adhesive. The acrylic adhesive may have a Shore A hardness greater than or equal to 50 degrees and a tensile strength greater than or equal to 14 MPa to ensure the hardness of the thermally conductive adhesive H. Doping may be added to the thermally conductive adhesive H, and the dopant may include a highly thermally conductive metallic material H2 (e.g., FIG. 3A ) or graphene material H3 (e.g. FIG. 3BTo improve the thermal conductivity of the thermally conductive adhesive H, in some embodiments of this application, the mass percentage of doping is greater than or equal to 20%. The metal material can be, for example, aluminum powder. Adding a highly thermally conductive metal material H2 or graphene material H3 to the thermally conductive adhesive can further improve its strength and thermal conductivity. This allows the thermally conductive adhesive H to transfer heat from the BTB connector 70 and the clamping force F2 applied to the BTB connector 70 by the heat spreader 11 along the Z direction, which is beneficial for the fastening and preventing loosening of the BTB connector 70.

[0086] In the above description of this embodiment, unless otherwise stated, " / " means "or," for example, A / B can identify A or B; the "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, B existing alone, and A and B existing simultaneously. Furthermore, in this embodiment, the values ​​of each data range include endpoints. For example, A = 10~50 means that A can be 10 or 50.

Claims

1. An electronic device, characterized in that, include: The housing, which encloses a receiving cavity; A first circuit board, a second circuit board, and a connector are disposed in the receiving cavity. The first circuit board and the second circuit board are arranged opposite to each other along a first direction. The connector is disposed between the first circuit board and the second circuit board for electrically connecting the first circuit board and the second circuit board. Furthermore, the insertion direction of the male and female contacts of the connector is the first direction. A heat spreader is disposed on the housing, and the heat spreader and the first circuit board are disposed opposite to each other along a first direction and spaced apart to form a first gap; Thermally conductive adhesive is filled in the first gap, and the orthographic projection of the thermally conductive adhesive on the first plane at least partially overlaps with the orthographic projection of the connector on the first plane, wherein the first plane is perpendicular to the first direction; The heat spreader can transmit pressure along the first direction to the connector through the thermally conductive adhesive and the first circuit board to press the connector tightly.

2. An electronic device, characterized in that, include: The housing, which encloses a receiving cavity; A first circuit board, a second circuit board, and a connector are disposed in the receiving cavity. The connector is electrically connected to the first circuit board and the second circuit board, and the insertion direction of the male and female contacts of the connector is a first direction. A heat spreader is disposed on the housing, and the heat spreader and the connector are arranged opposite to each other and spaced apart along a first direction to form a second gap; Thermally conductive adhesive is filled in the second gap, and the heat spreader can transmit pressure along the first direction to the connector through the thermally conductive adhesive to press the connector.

3. The electronic device according to claim 1 or 2, characterized in that, The housing includes a screen, a middle frame, and a back cover. Along the first direction, the screen and the back cover are respectively disposed on opposite sides of the middle frame to jointly form the receiving cavity. The heat spreader is disposed on the screen and located on the side of the screen facing the receiving cavity.

4. The electronic device according to claim 3, characterized in that, The middle frame and the back cover are connected as a single unit.

5. The electronic device according to claim 3, characterized in that, The second circuit board is located on the rear cover.

6. The electronic device as claimed in claim 1 or 2, characterized in that, The electronic device further includes a first device, which is electrically connected to the first circuit board, and the second circuit board is the motherboard of the electronic device.

7. The electronic device according to claim 6, characterized in that, The first device is a battery, and the first circuit board is a flexible circuit board.

8. The electronic device as claimed in claim 6, characterized in that, The first device and the second circuit board are arranged sequentially along a second direction, which is perpendicular to the first direction.

9. The electronic device as claimed in claim 1 or 2, characterized in that, The matrix of the thermally conductive adhesive includes an acrylic adhesive.

10. The electronic device as claimed in claim 9, characterized in that, The thermally conductive adhesive may be doped with thermally conductive metals or graphene.

11. The electronic device as claimed in claim 10, characterized in that, The mass percentage of the dopant in the thermally conductive adhesive is greater than or equal to 20%.

12. The electronic device as claimed in claim 9, characterized in that, The acrylate adhesive has a Shore A hardness greater than or equal to 50 degrees and a tensile strength greater than or equal to 14 MPa.

Images