Radiator, power supply control module and energy storage system

Abstract

The embodiment of the utility model relates to the technical field of heat dissipation, and discloses a radiator, a power supply control module and an energy storage system.The radiator comprises a heat dissipation main body and a box body, the box body is provided with a containing groove and a positioning groove, the positioning groove communicates with the containing groove, and the box body is installed on the heat dissipation main body; at least part of the heat dissipation body is exposed to the end, away from the containing groove, of the positioning groove, the containing groove is used for containing a circuit board provided with a power assembly, the positioning groove is used for containing a heat-conducting fin, and the surface, away from the heat dissipation body, of the heat-conducting fin abuts against the power assembly. By means of the mode, the risk that the heat-conducting fin displaces relative to the radiator in the process of assembling the radiator, the heat-conducting fin and the circuit board can be reduced.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat sink, a power control module, and an energy storage system. Background Technology

[0002] Power transistors are commonly used devices in energy storage systems. Their pins are soldered onto the circuit board to make electrical connections with the board. During operation, power transistors need to carry high voltage and high current, which results in a large amount of heat generation, so heat dissipation is required for power transistors.

[0003] In related technologies, heat sinks are typically used to dissipate heat from power transistors. Since power transistors require insulation, a heat-conducting fin is placed between the power transistor and the surface of the heat sink. The heat-conducting fin is made of insulating material, and the heat in the power transistor can be conducted to the heat sink through the heat-conducting fin, and then dissipated through the heat sink.

[0004] When assembling a heat sink, heat-conducting fins, and circuit board, the heat-conducting fins are usually placed in the designated position on the heat sink first, and then the circuit board is installed and fixed to the heat sink. At this time, the power transistors on the circuit board come into contact with the heat-conducting fins, thus completing the assembly of the heat sink, heat-conducting fins, and circuit board.

[0005] During the implementation of the embodiments of this application, the inventors discovered that during the assembly of the heat sink, heat-conducting plate, and circuit board, the heat-conducting plate is prone to displacement relative to the heat sink, resulting in poor contact between the heat-conducting plate and the power transistor on the circuit board, which affects the heat dissipation of the power transistor. Utility Model Content

[0006] The main technical problem solved by the embodiments of this application is to provide a heat sink, a power control module and an energy storage system that can reduce the risk of displacement of the heat conductor relative to the heat sink during the assembly of the heat sink, the heat conductor and the circuit board.

[0007] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is: to provide a heat sink, including a heat sink body and a housing, the housing being provided with a receiving groove and a positioning groove, the positioning groove communicating with the receiving groove, the housing being installed on the heat sink body, and at least a portion of the heat sink body being exposed at the end of the positioning groove away from the receiving groove, the receiving groove being used to accommodate a circuit board, the circuit board being provided with a power component, the positioning groove being used to accommodate a heat-conducting sheet, and the surface of the heat-conducting sheet away from the heat sink body being used to abut against the power component.

[0008] In some embodiments, the housing is provided with a plurality of positioning slots, which are spaced apart and one end of each positioning slot is connected to a receiving slot. The heat dissipation body is at least partially exposed at the end of each positioning slot away from the receiving slot, and each positioning slot is used to accommodate a heat-conducting plate.

[0009] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is: to provide a power control module, including a circuit board, a heat-conducting sheet and the above-mentioned heat sink, the circuit board being housed in a receiving groove, the circuit board including a board body and a power component, the power component being disposed on the board body, at least a portion of the heat-conducting sheet being housed in a positioning groove, the heat-conducting sheet abutting against the portion of the heat sink body exposed in the positioning groove, and the surface of the heat-conducting sheet away from the heat sink body abutting against the power component.

[0010] In some embodiments, the housing is provided with a protrusion, one end of which is disposed on the bottom wall of the receiving groove, and the other end of which extends in a direction away from the heat dissipation body. The plate abuts against the end of the protrusion away from the bottom wall of the receiving groove, and the plate is spaced apart from the bottom wall of the receiving groove.

[0011] In some embodiments, the power control module includes a screw connector, and a screw groove is provided at one end of the protrusion away from the bottom wall of the receiving groove. The screw connector passes through the plate and is screwed into the screw groove.

[0012] In some embodiments, there are multiple protrusions and screws, with the protrusions spaced apart from each other. One end of each protrusion is disposed on the bottom wall of the receiving groove, and the end of each protrusion facing away from the bottom wall of the receiving groove is provided with a screw groove. The plate abuts against each protrusion, and a screw is inserted through the plate and screwed into a screw groove.

[0013] In some embodiments, the power assembly includes a power transistor and a pressure block. The pressure block is disposed on the surface of the plate facing the bottom wall of the receiving slot. The power transistor includes a body and a pin. One end of the pin is connected to the body, and the other end of the pin is fixed to the plate. The body is located on the side of the pressure block away from the plate and abuts against the heat-conducting sheet.

[0014] In some embodiments, a first thermally conductive adhesive is disposed between the thermally conductive sheet and the power component.

[0015] In some embodiments, a second thermally conductive adhesive is provided between the thermally conductive sheet and the heat dissipation body.

[0016] To solve the above-mentioned technical problems, another technical solution adopted in this application embodiment is: to provide an energy storage system, including a battery and the above-mentioned power control module, wherein the battery is electrically connected to the power control module, and the power control module is used to control the input and output current of the battery.

[0017] The beneficial effects of this application embodiment are as follows: Unlike the prior art, in this application embodiment, by setting a positioning groove on the housing and placing the heat-conducting plate in the positioning groove, the risk of displacement of the heat-conducting plate relative to the heat dissipation body during the assembly of the heat sink, heat-conducting plate and circuit board can be reduced. This reduces the risk of misalignment between the power component and the heat-conducting plate after the circuit board is installed on the heat sink, which is conducive to improving the stability of the contact between the power component and the heat-conducting plate, ensuring that the contact area between the power component and the heat-conducting plate is maximized, thereby improving the heat dissipation efficiency of the heat sink for the power component. In addition, during the manufacturing process of the housing, since the housing itself needs to be slotted, setting the positioning groove on the housing can be processed together with other grooves in the housing, which helps to simplify the processing steps and improve production efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0019] Figure 1 This is a schematic diagram of the structure of the heat sink provided in the embodiments of this application;

[0020] Figure 2 This is a schematic diagram of the power control module provided in the embodiments of this application;

[0021] Figure 3 This is an exploded view of the power control module provided in the embodiments of this application;

[0022] Figure 4 yes Figure 3 An enlarged view of the area shown in section A;

[0023] Figure 5 This is a schematic cross-sectional view of the power control module provided in the embodiments of this application;

[0024] Figure 6 yes Figure 5 An enlarged view of the area shown in section B;

[0025] Figure 7 This is a schematic diagram of the connection structure of the energy storage system provided in the embodiments of this application. Detailed Implementation

[0026] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0028] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0029] In related technologies, when assembling a heat sink, heat-conducting fins, and a circuit board, the heat-conducting fins are typically placed in a designated position on the heat sink first, and then the circuit board is installed and fixed to the heat sink. At this point, the power transistors on the circuit board come into contact with the heat-conducting fins, thus completing the assembly of the heat sink, heat-conducting fins, and circuit board. However, existing heat sinks are difficult to position the heat-conducting fins precisely. During the assembly of the heat sink, heat-conducting fins, and circuit board, the heat-conducting fins are prone to displacement relative to the heat sink, resulting in poor contact between the heat-conducting fins and the power transistors on the circuit board, thus affecting the heat dissipation effect on the power transistors.

[0030] To solve or partially solve the above problems, this application provides a heat sink, a power control module, and an energy storage system. By setting a positioning groove to position the heat-conducting plate, the risk of displacement of the heat-conducting plate relative to the heat sink can be reduced during the assembly of the heat sink, heat-conducting plate, and circuit board. This improves the stability of the contact between the heat-conducting plate and the power component, thereby improving the heat dissipation efficiency of the power component.

[0031] The specific structure and function of this application are described in detail below.

[0032] Please see Figure 1 , Figure 2 and Figure 3 The heat sink 1 includes a heat sink body 11 and a housing 12. The housing 12 is provided with a receiving groove 121 and a positioning groove 122. The positioning groove 122 is disposed on the bottom wall 1211 of the receiving groove 121, and one end of the positioning groove 122 communicates with the receiving groove 121. The receiving groove 121 is used to receive a circuit board 2 on which a power component 22 is disposed. The housing 12 is fixed to the heat sink body 11. At least a portion of the heat sink body 11 is exposed in the positioning groove 122. The positioning groove 122 is used to receive a heat-conducting plate 3. When the heat-conducting plate 3 is placed in the positioning groove 122, the heat-conducting plate 3 abuts against the portion of the heat sink body 11 exposed in the positioning groove 122. The positioning groove 122 can restrict the movement of the heat-conducting plate 3 relative to the heat sink body 11. During the assembly of the heat sink 1, the heat-conducting plate 3 and the circuit board 2, the heat-conducting plate 3 is first placed in the positioning groove 122, and then the circuit board 2 is fixed to the heat sink 1, so that the power component 22 on the circuit board 2 abuts against the surface of the heat-conducting plate 3 away from the heat dissipation body 11, so that the heat in the power component 22 can be transferred to the heat dissipation body 11 through the heat-conducting plate 3, thereby dissipating heat from the power component 22. In this embodiment, by setting a positioning groove 122 on the housing 12 and placing the heat-conducting plate 3 in the positioning groove 122, the risk of displacement of the heat-conducting plate 3 relative to the heat dissipation body 11 during the assembly of the heat sink 1, the heat-conducting plate 3 and the circuit board 2 can be reduced. This reduces the risk of misalignment between the power component 22 and the heat-conducting plate 3 after the circuit board 2 is installed on the heat sink 1, which helps to improve the stability of the contact between the power component 22 and the heat-conducting plate 3 and ensures that the contact area between the power component 22 and the heat-conducting plate 3 is maximized, thereby improving the heat dissipation efficiency of the heat sink 1 for the power component 22. In addition, during the manufacturing process of the housing 12, since the housing 12 itself needs to be slotted, setting the positioning groove 122 on the housing 12 can be processed together with other grooves in the housing 12, which helps to simplify the processing steps and improve production efficiency.

[0033] In some embodiments, the housing 12 is provided with a plurality of positioning slots 122, which are spaced apart on the bottom wall 1211 of the receiving slot 121. One end of each positioning slot 122 is connected to the receiving slot 121. The heat dissipation body 11 is at least partially exposed at the end of each positioning slot 122 away from the receiving slot 121. Each positioning slot 122 is used to accommodate the heat-conducting plate 3. Correspondingly, the circuit board 2 is provided with a plurality of power components 22, each power component 22 corresponding to at least one heat-conducting plate 3. When the circuit board 2 is mounted and fixed to the heat sink 1, each heat-conducting plate 3 abuts against the corresponding power component 22, thereby conducting at least a portion of the heat from the power component 22 to the heat dissipation body 11.

[0034] In some embodiments, the heat dissipation body 11 is made of a metal material, such as aluminum alloy or copper alloy. Metal materials have good thermal conductivity, which is beneficial to improving the heat dissipation efficiency of the heat sink 1.

[0035] It is worth noting that the heat dissipation body 11 is not limited to metal materials, and it can also be made of other materials. That is, the material used in the heat dissipation body 11 is sufficient to meet the heat dissipation requirements of the circuit board 2. This application does not limit this.

[0036] This application also provides an embodiment of a power control module 100; please refer to [link / reference]. Figure 2 and Figure 3 The power control module 100 includes a circuit board 2, a heat-conducting plate 3, and the aforementioned heat sink 1. The circuit board 2 is housed in a receiving slot 121 so that the enclosure 12 can protect the circuit board 2 and reduce the risk of damage to the circuit board 2. The circuit board 2 includes a board body 21 and the aforementioned power component 22. The board body 21 is fixed to the enclosure 12, and the power component 22 is disposed on the board body 21, with the power component 22 located on the surface of the board body 21 facing the heat sink 11. Please refer to... Figure 6 In the arrangement direction of the heat dissipation body 11 and the housing 12, a portion of the heat-conducting plate 3 is housed in the positioning groove 122, and another portion of the heat-conducting plate 3 protrudes from the positioning groove 122, so that when the circuit board 2 is installed on the heat sink 1, the power component 22 can easily abut against the portion of the heat-conducting plate 3 protruding from the positioning groove 122, thereby enabling the power component 22 to transfer heat to the heat dissipation body 11 through the heat-conducting plate 3, thereby accelerating the heat dissipation efficiency of the power component 22.

[0037] When the circuit board 2 includes multiple power components 22, all power components 22 are disposed on the surface of the board body 21 facing the heat dissipation body 11. In this case, there are multiple heat-conducting plates 3, and the housing 12 is provided with multiple positioning grooves 122. In the arrangement direction of the heat dissipation body 11 and the housing 12, a portion of a heat-conducting plate 3 is received in a positioning groove 122, and another portion of each heat-conducting plate 3 protrudes from the corresponding positioning groove 122. Each power component 22 corresponds to at least one heat-conducting plate 3. When the circuit board 2 is mounted on the heat sink 1, the surface of each heat-conducting plate 3 facing away from the heat dissipation body 11 abuts against the power component 22 corresponding to that heat-conducting plate 3. Each heat-conducting plate 3 plays a role in heat conduction and insulation. When the power component 22 generates heat, each heat-conducting plate 3 conducts the heat of the power component 22 to the heat sink 1, and the heat sink 1 dissipates heat from each power component 22.

[0038] In some embodiments, the heat-conducting sheet 3 is made of ceramic material.

[0039] In some embodiments, the housing 12 is provided with a protrusion 123, one end of which is disposed on the bottom wall 1211 of the receiving groove 121, and the other end of which extends away from the heat dissipation body 11. The plate 21 abuts against the end of the protrusion 123 away from the bottom wall 1211 of the receiving groove 121, so that the plate 21 and the bottom wall 1211 of the receiving groove 121 are spaced apart from each other. The plate 21 is fixed to the protrusion 123, thereby realizing the fixation between the circuit board 2 and the housing 12. In this embodiment, by providing a protrusion 123, the plate 21 is positioned at one end of the protrusion 123 away from the bottom wall 1211 of the receiving groove 121, thereby making the plate 21 and the bottom wall 1211 of the receiving groove 121 spaced apart from each other. This reduces the risk of interference between the electronic components on the plate 21 and the bottom wall 1211 of the receiving groove 121, facilitates the installation of the circuit board 2 onto the heat sink 1, and also reduces the risk of the heat sink 1 short-circuiting the electronic components on the plate 21.

[0040] In some embodiments, please refer to Figure 3 and Figure 4 The power control module 100 includes a screw connector 4. A screw groove 1231 is provided at one end of the protrusion 123 facing away from the bottom wall 1211 of the receiving groove 121. The screw connector 4 passes through the plate 21 and is screwed into the screw groove 1231, thereby fixing the plate 21 to the protrusion 123. Fixing the plate 21 to the protrusion 123 via the screw connector 4 ensures a stable connection and simple operation.

[0041] In some embodiments, there are multiple protrusions 123 and screw connectors 4, with the protrusions 123 spaced apart from each other. One end of each protrusion 123 is disposed on the bottom wall 1211 of the receiving groove 121, and the end of each protrusion 123 facing away from the bottom wall 1211 of the receiving groove 121 is provided with a screw groove 1231. The plate 21 abuts against the end of each protrusion 123 facing away from the bottom wall 1211 of the receiving groove 121, so that the multiple protrusions 123 can jointly support the plate 21. A screw connector 4 passes through the plate 21 and is screwed into a screw groove 1231, thereby fixing the plate 21 inside the housing 12. In this embodiment, by providing multiple screw connectors 4 and multiple protrusions 123, the stability of the fixation between the plate 21 and the housing 12 can be improved.

[0042] In some embodiments, the aforementioned protrusions 123 are formed by press-fitting. Specifically, after the main body of the housing 12 (i.e., the portion of the housing 12 excluding the protrusions 123) is manufactured, the press-fitting screw post is press-fitted and fixed to the bottom wall 1211 of the receiving groove 121, thereby forming the aforementioned protrusions 123. The processing technology is simple. In addition, the press-fitting screw post is a national standard part, which is highly versatile and inexpensive for mass production. Furthermore, it does not require separate machining of screw grooves 1231 for each protrusion 123, thereby simplifying the production process and improving production efficiency.

[0043] In some embodiments, please refer to Figure 3 and Figure 6 The power assembly 22 includes a power transistor 221 and a pressure block 222. The power transistor 221 includes a body 2211 and pins 2212. One end of the pins 2212 is connected to the body 2211, and the other end of the pins 2212 is fixed to the plate 21. The body 2211 and the plate 21 are electrically connected through the pins 2212. The pressure block 222 is fixed to the surface of the plate 21 facing the bottom wall 1211 of the receiving groove 121. The body 2211 is located on the side of the pressure block 222 away from the plate 21, so that the pressure block 222 can isolate the body 2211 from the plate 21, reducing the risk of short-circuiting the power transistor 221 by the circuits or other electronic devices on the plate 21. The surface of the body 2211 away from the plate 21 abuts against the heat-conducting plate 3, so that the heat-conducting plate 3 can transfer the heat of the body 2211 to the heat dissipation body 11.

[0044] In some embodiments, the power component 22 includes a plurality of power tubes 221, which are spaced apart. The body 2211 of each power tube 221 is isolated from the plate 21 by a pressure block 222. The body 2211 of one power tube 221 corresponds to a heat-conducting plate 3, that is, the body 2211 of one power tube 221 abuts against a heat-conducting plate 3, so that the heat of the body 2211 of each power plate can be transferred to the heat sink 1 through the corresponding heat-conducting plate 3, so as to achieve heat dissipation of the power component 22.

[0045] In some embodiments, a first thermally conductive adhesive (not shown) is provided between the heat-conducting sheet 3 and the body 2211 of the power tube 221. The first thermally conductive adhesive can improve the heat transfer efficiency between the heat-conducting sheet 3 and the power tube 221, thereby improving the heat dissipation efficiency of the heat sink 1 for the power tube 221. In addition, the first thermally conductive adhesive can fill the tiny gap between the heat-conducting sheet 3 and the body 2211 of the power tube 221, thereby increasing the heat-conducting contact area and further improving the heat dissipation efficiency of the power tube 221.

[0046] In some embodiments, a second thermally conductive adhesive (not shown) is disposed between the heat-conducting sheet 3 and the heat dissipation body 11. The second thermally conductive adhesive can improve the heat transfer efficiency between the heat-conducting sheet 3 and the heat dissipation body 11, thereby improving the heat dissipation efficiency of the heat dissipation body 11 for the power transistor 221. Similarly, the second thermally conductive adhesive can also fill the tiny gaps between the heat-conducting sheet 3 and the heat dissipation body 11, thereby increasing the contact area for heat conduction between the heat dissipation body 11 and the heat-conducting sheet 3, thereby further improving the heat dissipation efficiency of the heat dissipation body 11 for the power transistor 221.

[0047] In this embodiment, by providing a positioning groove 122 on the housing 12 and placing the heat-conducting plate 3 in the positioning groove 122, the risk of displacement of the heat-conducting plate 3 relative to the heat dissipation body 11 during the assembly of the heat sink 1, the heat-conducting plate 3 and the circuit board 2 can be reduced. This reduces the risk of misalignment between the power component 22 and the heat-conducting plate 3 after the circuit board 2 is installed on the heat sink 1, which helps to improve the stability of the contact between the power component 22 and the heat-conducting plate 3 and ensures that the contact area between the power component 22 and the heat-conducting plate 3 is maximized, thereby improving the heat dissipation efficiency of the heat sink 1 for the power component 22. In addition, during the manufacturing process of the housing 12, since the housing 12 itself needs to be slotted, setting the positioning groove 122 on the housing 12 can be processed together with other grooves in the housing 12, which helps to simplify the processing steps and improve production efficiency.

[0048] This application also provides an embodiment of an energy storage system 1000; please refer to [link / reference]. Figure 7 The energy storage system 1000 includes a battery 200 and the aforementioned power control module 100. The battery 200 is electrically connected to the power control module 100, which is used to control the input and output current, voltage, etc. of the battery 200.

[0049] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A heat sink, characterized by, The heat sink comprises: a heat sink body; a box body provided with a receiving groove and a positioning groove in communication with the receiving groove, the box body being mounted on the heat sink body, and at least part of the heat sink body being exposed to the positioning groove away from the receiving groove, the receiving groove being used for receiving a circuit board provided with a power component, and the positioning groove being used for receiving a heat-conducting sheet, a surface of the heat-conducting sheet away from the heat sink body being used for abutting against the power component.

2. The heat sink according to claim 1, wherein the box body is provided with a plurality of positioning grooves, the plurality of positioning grooves being spaced apart, and one end of each of the plurality of positioning grooves being in communication with the receiving groove, and at least part of the heat sink body being exposed to each of the positioning grooves away from the receiving groove, each of the positioning grooves being used for receiving the heat-conducting sheet.

3. A power control module, characterized by The heat sink according to any one of claims 1-2, a circuit board, a heat-conducting sheet and the heat sink, the circuit board being received in the receiving groove, the circuit board comprising a board body and a power component, the power component being arranged on the board body, at least part of the heat-conducting sheet being received in the positioning groove, the heat-conducting sheet abutting against the part of the heat sink exposed to the positioning groove, and a surface of the heat-conducting sheet away from the heat sink abutting against the power component.

4. The power control module according to claim 3, wherein the box body is provided with a protruding part, one end of the protruding part being arranged on a bottom wall of the receiving groove, and the other end of the protruding part extending away from the heat sink body, the board body abutting against one end of the protruding part away from the bottom wall of the receiving groove, and the board body being spaced apart from the bottom wall of the receiving groove.

5. The power control module according to claim 4, wherein the power control module further comprises a screwing part, the protruding part being provided with a screw groove at one end away from the bottom wall of the receiving groove, the screwing part being arranged through the board body, and the screwing part being screwed into the screw groove.

6. The power control module according to claim 5, wherein the number of the protruding parts and the screwing parts is plural, the plurality of protruding parts being spaced apart from each other, and each of the screwing parts being arranged through the board body and screwed into the screw groove of one of the protruding parts.

7. The power control module according to claim 3, wherein the power component comprises a power tube and a pressing block, the pressing block being arranged on a surface of the board body facing the bottom wall of the receiving groove, the power tube comprising a body and a pin, one end of the pin being connected to the body, the other end of the pin being fixed to the board body, the body being located on a side of the pressing block away from the board body, and the body abutting against the heat-conducting sheet.

8. The power control module according to claim 3, wherein a first heat-conducting adhesive is arranged between the heat-conducting sheet and the power component.

9. The power control module according to claim 3, wherein a second heat-conducting adhesive is arranged between the heat-conducting sheet and the heat sink body.

10. An energy storage system characterized by, A battery and a power control module as claimed in any one of claims 3 to 9, the battery being electrically connected to the power control module, the power control module being configured to control input and output current from the battery.

Images