Heat dissipation structure for multi-hotspot heat dissipation of high-density electronic device and electronic optical equipment

Abstract

The utility model belongs to the technical field of heat dissipation of electronic optical equipment, and discloses a heat dissipation structure for multi-hotspot heat dissipation of a high-density electronic device and the electronic optical equipment. The heat dissipation structure comprises a shell and a fluid dredging piece, the shell is provided with a cavity used for containing the fluid dredging piece and a plurality of heating components, the surface of the shell is provided with a fluid inlet and a fluid outlet, the inner wall face of the cavity is provided with a plurality of heat dissipation through grooves, and the heat dissipation through grooves are connected to the corresponding heating components in a heat transfer mode. The two ends of each heat dissipation through groove communicate with the fluid inlet and the fluid outlet correspondingly, and the fluid dredging pieces are arranged on heat dissipation paths of the heat dissipation through grooves. Under the driving of the fluid dredging piece and the guiding of the heat dissipation through groove, the heat conduction fluid can efficiently flow in the heat dissipation through groove, and heat is discharged from the fluid outlet, so that heat dissipation and rapid cooling of multiple hot spots can be accurately, rapidly and effectively realized, the use performance, the safety and the stability of a high-density electronic device are improved, and the service life of the electronic device is prolonged. And meanwhile, the production cost and the manufacturing difficulty can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic optical equipment, and in particular to a heat dissipation structure and electronic optical equipment for heat dissipation of multiple hot spots in high-density electronic devices. Background Technology

[0002] Nowadays, with the rapid development of electronic optical technology products such as projectors, scanners, and cameras, the size of electronic devices is constantly shrinking and the integration is constantly increasing. This leads to a sharp increase in the heat flux density of electronic components. Excessively high operating temperatures will directly reduce the reliability and lifespan of electronic components. Therefore, it is particularly important to reduce the operating temperature of electronic components.

[0003] Taking projectors as an example, most projectors on the market currently use cooling fans for heat dissipation. The cooling fan, optical engine projection module, and electronic control board are integrated into the same housing. The housing has vents that connect to the gaps between the cooling fan, the optical engine projection module, and the various components on the electronic control board, allowing the cooling fan to dissipate heat from inside the housing through these heat dissipation paths. However, this heat dissipation method is ineffective; the narrow heat dissipation paths mean that when a large amount of heat is generated inside the housing, it is difficult to quickly and effectively dissipate most of the heat, thus affecting the projector's performance.

[0004] Therefore, it is necessary to design a heat dissipation structure and electro-optical device for high-density electronic devices with multiple hot spots to solve the problems existing in the prior art. Utility Model Content

[0005] One objective of this invention is to provide a heat dissipation structure for high-density electronic devices with multiple hot spots. Without increasing the weight and volume of the high-density electronic devices or changing the original layout of internal components, it can accurately and quickly dissipate heat, achieve rapid cooling of multiple hot spots, improve the performance and safety stability of high-density electronic devices, and reduce costs and manufacturing difficulties.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A heat dissipation structure for high-density electronic devices with multiple hot spots includes a housing and a fluid guiding component. The housing has a cavity for accommodating the fluid guiding component and multiple heat-generating components. The surface of the housing is provided with a fluid inlet and a fluid outlet. The inner wall of the cavity is provided with multiple heat dissipation channels. The heat dissipation channels are heat-transferringly connected to the corresponding heat-generating components, and the two ends of each heat dissipation channel are respectively connected to the fluid inlet and the fluid outlet. The fluid guiding component is disposed on the heat dissipation path of the heat dissipation channel.

[0008] Preferably, a flow collection groove is provided on the inner wall of the cavity, the flow collection groove is connected to the fluid outlet and multiple heat dissipation channels, and the fluid guiding component is provided in the flow collection groove.

[0009] Preferably, the fluid guiding component is a cooling fan; and / or, the cross-section of the collecting groove is circular.

[0010] Preferably, the fluid guiding component is a cooling fan, the housing is square, the fluid inlet and the fluid outlet are disposed opposite to each other on both sides of the housing, the collecting groove is located at one corner of the housing, and multiple heat dissipation channels are distributed in a star shape in the cavity. Furthermore, there is a flow guiding gap between the side of the housing without the fluid inlet and the heat-generating component, and the flow guiding gap connects the fluid inlet and part of the heat dissipation channels.

[0011] Preferably, at least one of the heat dissipation channels includes at least two branch channels.

[0012] Preferably, the width of the branch channels is the same.

[0013] Preferably, the bottom of the heat dissipation channel is inclined at an angle to the bottom surface of the housing.

[0014] Preferably, the thickness of the inner wall of the cavity is set to H, and the depth of the end of the heat dissipation channel facing the fluid inlet is set to h1, A = h1 / H, and A satisfies: 0.3 ≤ A < 0.5;

[0015] Let the depth of the end of the heat dissipation channel facing the collection channel be h2, B = h2 / H, and B satisfy: 0.5 < B ≤ 0.7.

[0016] Preferably, the inner wall of the cavity is provided with a plurality of connecting posts protruding from it, and the heating component is threadedly connected to the connecting posts via a threaded connector.

[0017] Another objective of this invention is to provide an electronic optical device that, by setting up the aforementioned heat dissipation structure for high-density electronic components with multiple hot spots, helps the overall device maintain stable performance during long-term operation, extends its service life, and improves the user experience.

[0018] To achieve this objective, the present invention adopts the following technical solution:

[0019] An electro-optical device, including an auxiliary structure and the aforementioned heat dissipation structure for high-density electronic devices with multiple hot spots, wherein the auxiliary structure is connected to the heat dissipation structure for high-density electronic devices with multiple hot spots.

[0020] The beneficial effects of this utility model are:

[0021] This embodiment provides a heat dissipation structure for multiple hot spots in high-density electronic devices. When multiple heat-generating components inside the housing operate simultaneously and generate a large amount of heat, a heat-conducting fluid can enter the heat dissipation channel from the fluid inlet under the action of the fluid guide. This absorbs the heat generated by the multiple heat-generating components. Driven by the fluid guide and guided by the heat dissipation channel, the heat-conducting fluid can flow efficiently, dissipating the heat from the fluid outlet. Furthermore, by creating slots inside the housing to dissipate heat outward, heat dissipation and rapid cooling of multiple hot spots can be achieved precisely, quickly, and effectively without adding additional heat dissipation structures, increasing the weight and volume of the high-density electronic device, or changing the original layout of the multiple internal heat-generating components. This improves the performance and safety stability of high-density electronic devices while also reducing production costs and manufacturing difficulty.

[0022] This embodiment also provides an electro-optical device. Because the electro-optical device is provided with the above-mentioned heat dissipation structure for high-density electronic devices with multiple hot spots, the heat dissipation channels provided in the heat dissipation structure enable the electro-optical device to not only not increase the weight and volume of the overall device, but also to achieve precise and efficient heat dissipation of high-density electronic devices. This helps the overall device maintain stable performance during long-term operation, extends its service life, and improves the user experience. Attached Figure Description

[0023] Figure 1 This is an internal structural diagram of the heat dissipation structure for high-density electronic devices with multiple hot spots provided in this embodiment of the utility model;

[0024] Figure 2 This is an exploded view of the heat dissipation structure for high-density electronic devices with multiple hot spots provided in this embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of the internal structure of the shell provided in an embodiment of the present utility model;

[0026] Figure 4 This is a cross-sectional view of the housing provided in an embodiment of the present utility model;

[0027] Figure 5 yes Figure 4 A magnified view of a section at point A in the middle;

[0028] Figure 6 yes Figure 4 A magnified view of a section at point B.

[0029] In the picture:

[0030] 100. Projection component; 200. Main control component;

[0031] 1. Shell; 101. Flow guide gap; 11. Fluid inlet; 12. Fluid outlet; 13. Heat dissipation channel; 131. Branch flow channel; 14. Collection channel;

[0032] 2. Fluid guiding components;

[0033] 3. Connecting column. Detailed Implementation

[0034] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0035] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] In the description of this embodiment, the terms "upper," "lower," "right," and "left," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0038] Combination Figures 1 to 6As shown, this embodiment provides a heat dissipation structure for high-density electronic devices with multiple hot spots, used to achieve rapid heat dissipation of multiple hot spots inside electronic devices with high integration density. It can be understood that "multiple hot spots" in this article refers to multiple heat-generating components installed inside the electronic device. The structure includes a housing 1 and a fluid guiding component 2. The housing 1 has a cavity for accommodating the fluid guiding component 2 and multiple heat-generating components. The surface of the housing 1 is provided with a fluid inlet 11 and a fluid outlet 12. Multiple heat dissipation grooves 13 are formed on the inner wall of the cavity. The heat dissipation grooves 13 are connected to the heat-generating components one by one, and the two ends of each heat dissipation groove 13 are respectively connected to the fluid inlet 11 and the fluid outlet 12. The fluid guiding component 2 is disposed on the heat dissipation path of the heat dissipation groove 13.

[0039] With the above configuration, when multiple heat-generating components operate simultaneously and generate a large amount of heat, the heat-conducting fluid can enter the heat dissipation channel 13 from the fluid inlet 11 under the action of the fluid guide 2. This absorbs the heat generated by the multiple heat-generating components, and through the drive of the fluid guide 2 and the guidance of the heat dissipation channel 13, the heat-conducting fluid can flow efficiently, dissipating the heat from the fluid outlet 12. Furthermore, by creating slots inside the housing 1 to dissipate heat outwards, heat dissipation and rapid cooling of multiple hot spots can be achieved precisely, quickly, and effectively without adding additional heat dissipation structures, increasing the weight and volume of high-density electronic devices, or changing the original layout of multiple internal heat-generating components. This improves the performance and safety stability of high-density electronic devices while also reducing production costs and manufacturing difficulty.

[0040] In this embodiment, a projector will be used as an example to describe in detail the heat dissipation structure for high-density electronic devices with multiple hot spots.

[0041] It should be noted in advance that the projector in this embodiment includes an optical engine module, which mainly consists of three parts: a projection component 100, a main control component 200, and a heat sink. The projection component 100, main control component 200, and heat sink are all integrated and installed within the housing 1 of the optical engine module. The projection component 100 includes components such as a light source, an optical lens, and a light engine. The main control component 200 includes components responsible for signal processing and control, such as a main control circuit board and an FPC. Therefore, the optical engine module mainly contains two heat-generating components: the projection component 100 and the main control component 200. The heat sink effectively dissipates heat from the projection component 100 and the main control component 200, ensuring the normal operating temperature of the optical engine module. Its function is the same as that of the fluid guiding component 2. Thus, the optical engine module of this projector can be used as an example of a high-density electronic device to illustrate the heat dissipation structure provided in this embodiment.

[0042] Preferably, the fluid guiding component 2 is a cooling fan, and the corresponding heat-conducting fluid is air. The cooling fan generates airflow through high-speed rotation, which can effectively accelerate the flow of the heat-conducting fluid within the heat dissipation channel 13, thereby helping to further improve heat dissipation efficiency. At the same time, the cooling fan is compact in size and reliable in operation, achieving excellent heat dissipation effect without occupying too much internal space and weight.

[0043] In this embodiment, heat dissipation channels 13 are formed at the bottom of the housing 1, and a flow collecting channel 14 is also formed at the bottom of the housing 1. The flow collecting channel 14 connects the heat dissipation channels 13 and the fluid outlet 12, and the aforementioned fluid guiding component 2 is provided in the flow collecting channel 14, thereby realizing unified control of multiple heat dissipation channels 13 by the fluid guiding component 2. When the fluid guiding component 2 is activated, the heat-conducting fluid can be collected in the flow collecting channel 14 through multiple heat dissipation channels 13, so that the fluid guiding component 2 can quickly and effectively conduct the heat in multiple heat dissipation channels 13 from the fluid outlet 12, ensuring efficient heat dissipation. In addition, the design of the flow collecting channel 14 avoids heat backflow, further improving the stability and reliability of the heat dissipation effect.

[0044] Preferably, refer to Figure 3 As shown, the cross-section of the heat collection channel 14 is circular. The circular design helps to reduce the flow resistance of the heat-conducting fluid and increase the flow rate, thereby preventing heat from accumulating in the heat collection channel 14 and ensuring efficient heat dissipation.

[0045] Specifically, in this embodiment, combined with Figure 2 , Figure 3 As shown, the housing 1 has a square structure. The fluid inlet 11 and the fluid outlet 12 are disposed opposite each other on the two side surfaces of the housing 1. The projection component 100, the main control component 200, and the fluid guiding component 2 are disposed close to each other inside the housing 1, with the main control component 200 disposed near the fluid inlet 11 and the projection component 100 and the fluid guiding component 2 disposed near the fluid outlet 12, and the two are arranged side by side, so that the collection groove 14 is located at one corner of the housing 1. In addition, multiple heat dissipation grooves 13 are distributed in a star shape in the cavity, so that some heat dissipation grooves 13 are used for precise docking with the main control component 200, and the remaining heat dissipation grooves 13 are used for precise docking with the projection component 100, so as to achieve the purpose of precise heat conduction for the main control component 200 and the projection component 100. There is a flow guiding gap 101 between the side of the housing 1 without the fluid inlet 11 and the projection component 100, and the flow guiding gap 101 is used to connect the fluid inlet 11 and the remaining heat dissipation grooves 13.

[0046] With the above configuration, the heat-conducting fluid can be split after entering the cavity. A portion of the heat-conducting fluid can directly enter part of the heat dissipation channel to absorb the heat dissipated by the main control component 200, while another portion can enter the remaining heat dissipation channel 13 through the flow guide gap 101 to absorb the heat dissipated by the projection component 100. This achieves efficient heat dissipation for multiple heat-generating components and meets the heat dissipation requirements of other high-density electronic devices with internal component arrangements similar to this optomechanical module.

[0047] Of course, it is understood that in other embodiments, the layout of the current collection groove 14 and the heat dissipation groove 13 can be adjusted according to the distribution of the internal components of the housing 1 to adapt to the heat dissipation requirements of different types of high-density electronic devices. As long as each heat-generating component can be effectively cooled, it is within the protection scope of this utility model.

[0048] It should be noted that, in order to further improve heat dissipation efficiency, in other parallel embodiments, the bottom of the heat dissipation channel 13 is provided with an inclined angle between it and the bottom surface of the housing 1, so that the bottom of the heat dissipation channel 13 forms an inclined surface. By forming the bottom of the heat dissipation channel 13 into an inclined surface, the heat-conducting fluid can be guided to flow more smoothly to the collection channel 14, reducing flow dead angles and further improving heat dissipation efficiency.

[0049] For example, refer to Figure 5 and Figure 6 As shown, taking one of the heat dissipation channels 13 as an example, the thickness of the inner wall of the cavity is set to H, the depth of the end of the heat dissipation channel 13 facing the fluid inlet 11 is set to h1, A = h1 / H, and A satisfies: 0.3 ≤ A < 0.5; the depth of the end of the heat dissipation channel 13 facing the collection channel 14 is set to h2, B = h2 / H, and B satisfies: 0.5 < B ≤ 0.7.

[0050] For example, A can be 0.3, 0.35, 0.4, or 0.45, and B can be 0.6, 0.65, 0.7, or 0.75; this invention is not limited in this respect. If A is less than 0.3, the depth of the heat dissipation groove 13 will be insufficient, affecting the flow efficiency of the heat-conducting fluid; if B is greater than 0.7, the heat dissipation groove 13 may be excessively deep, increasing flow resistance, reducing heat dissipation effect, and also affecting the structural strength of the housing 1. Preferably, A is 0.3 and B is 0.7. This ratio design achieves the optimal heat dissipation effect while avoiding the phenomenon of the housing 1 being weak at the heat dissipation groove 13, ensuring the stability of the housing 1 in use.

[0051] It should be noted that, in this embodiment, since the main control component 200 occupies a larger space in the housing 1 and has more heat-generating components than the projection component 100, the number of heat dissipation channels 13 for the main control component 200 will also be increased accordingly, and the flow guiding cross-sectional area of ​​the heat dissipation channels 13 will also be increased accordingly.

[0052] For example, in this embodiment, reference is made to Figure 3 As shown, there are three heat dissipation channels 13 for cooling the main control component 200, and one heat dissipation channel 13 for cooling the projection component 100. Among the three heat dissipation channels 13 for the main control component 200, preferably two heat dissipation channels 13 have a larger flow guiding cross-sectional area and the other has a smaller one. In order to avoid reducing the structural strength of the bottom of the housing 1, one embodiment is to branch the two heat dissipation channels 13 with larger flow guiding cross-sectional areas, so that each heat dissipation channel 13 includes at least two branch flow channels 131. The design of the branch flow channels 131 ensures that the heat dissipation channel 13 does not reduce the heat dissipation performance of the main control component 200, and can also form a protrusion between the branch flow channels 131 to ensure that the bottom of the housing 1 has sufficient structural strength, thereby maintaining the stability and durability of the overall structure of the housing 1.

[0053] In this embodiment, the heat dissipation channel 13 used for heat dissipation of the projection component 100 is also branched to ensure the structural strength of the housing 1 located at the position of the projection component 100.

[0054] More preferably, the width of the branch channels 131 is the same to ensure that the flow rate of the heat-conducting fluid in each branch channel 131 is uniform and to avoid local overheating.

[0055] Optionally, in this embodiment, a plurality of connecting posts 3 are also provided on the bottom of the cavity. The connecting posts 3 have threaded holes inside. The heating component is connected to the connecting posts 3 by a threaded connector. This threaded connection method not only ensures that the heating component is installed firmly, but also does not hinder the flow of heat-conducting fluid in the heat dissipation channel 13, thereby further improving the heat dissipation efficiency.

[0056] This embodiment also provides an electro-optical device. Taking the aforementioned projector as an example, the projector includes not only an optical engine module but also an auxiliary structure connected to the optical engine module. This auxiliary structure may include a support frame for fixing the optical engine module and a speaker module for transmitting sound outwards, providing the optical engine module with stable placement and a good sound output environment. Because this electro-optical device incorporates the aforementioned heat dissipation structure for high-density electronic components with multiple hotspots, and through the heat dissipation channels 13 within the heat dissipation structure, the electro-optical device not only does not increase the overall weight and volume of the device but also achieves precise and efficient heat dissipation for the high-density electronic components. This helps the overall device maintain stable performance during long-term operation, extends its service life, and improves the user experience.

[0057] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0058] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A heat dissipating structure for dissipating heat from multiple heat sources in a high-density electronic device, characterized by comprising: The application relates to a heat dissipation structure for high-density electronic devices with multiple heat points, which comprises a shell (1) and a fluid guide (2), wherein the shell (1) has a cavity for accommodating the fluid guide (2) and multiple heat generating components, the surface of the shell (1) is provided with a fluid inlet (11) and a fluid outlet (12), the inner wall surface of the cavity is provided with multiple heat dissipation channels (13), the heat dissipation channels (13) are in heat transfer connection with the corresponding heat generating components, and the two ends of each heat dissipation channel (13) are respectively connected with the fluid inlet (11) and the fluid outlet (12); the fluid guide (2) is arranged on the heat dissipation path of the heat dissipation channel (13).

2. The high-density electronic device multi-hot-spot heat dissipating heat sink structure according to claim 1, characterized by, The inner wall surface of the cavity is also provided with a flow collecting groove (14), the flow collecting groove (14) is connected with the fluid outlet (12) and the multiple heat dissipation channels (13), and the fluid guide (2) is arranged in the flow collecting groove (14).

3. The high-density electronic device multi-hot-spot heat dissipating heat sink structure according to claim 2, characterized by, The fluid guide (2) is a heat dissipation fan; and / or the cross section of the flow collecting groove (14) is circular.

4. The high-density electronic device multi-hot-spot heat dissipating heat sink structure according to claim 3, characterized by The fluid guide (2) is a heat dissipation fan, the shell (1) is square, the fluid inlet (11) and the fluid outlet (12) are oppositely arranged on the two sides of the shell (1), the flow collecting groove (14) is located at a corner of the shell (1), the multiple heat dissipation channels (13) are arranged in a star shape in the cavity, and a flow guiding gap (101) is arranged between the side of the shell (1) without the fluid inlet (11) and the heat generating components, the flow guiding gap (101) is connected with the fluid inlet (11) and part of the heat dissipation channels (13).

5. The high-density electronic device multi-hot-spot heat dissipating heat sink structure according to claim 3, characterized by At least one of the heat dissipation channels (13) comprises at least two branch flow channels (131).

6. The high-density electronic device multi-hot-spot heat dissipating heat sink structure according to claim 5, wherein The width dimensions of the branch flow channels (131) are the same.

7. The high-density electronic device multi-hot-spot heat dissipating heat sink structure according to claim 2, characterized by An inclined angle is arranged between the bottom of the heat dissipation channel (13) and the bottom surface of the shell (1).

8. The high-density electronic device multi-hot-spot heat dissipating heat sink structure according to claim 7, characterized by The thickness of the inner wall surface of the cavity is set as H, the depth of one end of the heat dissipation channel (13) towards the fluid inlet (11) is set as h1, A=h1 / H, and A satisfies 0.3<=A<0.5; The depth of the other end of the heat dissipation channel (13) towards the flow collecting groove (14) is set as h2, B=h2 / H, and B satisfies 0.5 9. The high-density electronic device multi-hot-spot heat dissipating heat sink structure according to any one of claims 1 to 8, characterized by, The inner wall surface of the cavity is provided with multiple connecting columns (3), and the heat generating components are threadedly connected with the connecting columns (3) through thread connecting members.

10. An electro-optical device, characterized by The application further relates to an auxiliary structure connected with the heat dissipation structure for high-density electronic devices with multiple heat points.

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