Wet cleaning equipment

Abstract

The embodiment of the utility model provides wet cleaning equipment. The wet cleaning equipment comprises a wet cleaning chamber; the rotatable Bernoulli table disc is positioned in the wet cleaning chamber and is used for placing a wafer; the wafer is adsorbed on the Bernoulli table disc, and the front surface of the wafer faces the Bernoulli table disc; the recycling cup assembly is arranged around the Bernoulli table disc so as to collect liquid thrown out when the wafer rotates; wherein the recycling cup assembly comprises a plurality of layers of cup bodies, and the surface, for receiving the liquid, of part of the top or all the top of each layer of cup body is provided with a concave part and / or a convex part. By the adoption of the technical scheme, the problem that chemical liquid splashes to the recycling cup to form reverse splashing can be effectively solved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more particularly to a wet cleaning apparatus. Background Technology

[0002] In the back-side processing of semiconductor manufacturing, a damage layer of a certain thickness is generated after the wafer is thinned on the back side. To remove the damage layer and relieve stress, acid etching cleaning of the wafer's back side is required. Since this is a back-side process, the wafer is cleaned with the back side facing upwards, while the front side, the Bernoulli pallet, does not contact the wafer's front side. During the cleaning process, chemical droplets may splash onto the recovery cup, potentially causing backsplashing and entering the gap between the Bernoulli pallet and the wafer. This contaminates and corrodes the edge of the wafer's front side, affecting wafer quality.

[0003] In this context, how to provide a technical solution to solve the problem of liquid splashing has become an urgent technical issue. Utility Model Content

[0004] In view of this, the present disclosure provides a wet cleaning apparatus that can effectively address the problem of liquid splashing in the wet cleaning process and improve the quality of the front side of the wafer.

[0005] This disclosure provides a wet cleaning apparatus, comprising: a wet cleaning chamber; a rotatable Bernoulli platen located within the wet cleaning chamber for placing a wafer; the wafer being adsorbed onto the Bernoulli platen with its front facing the platen; and a recovery cup assembly disposed around the Bernoulli platen to collect liquid ejected during wafer rotation; wherein the recovery cup assembly comprises multiple cups, each cup having a portion or all of its top surface having a recess and / or a protrusion on the surface receiving the liquid.

[0006] Optionally, each cup body includes: a columnar cylindrical portion surrounding the Bernoulli table; and an annular top connected to the cylindrical portion and extending obliquely upward from the upper end of the cylindrical portion toward the axis of the Bernoulli table.

[0007] Optionally, the recess and / or protrusion are located on the inner and / or outer side of the top of the cup body.

[0008] Optionally, each layer of the cup can rise and fall within its own limited height.

[0009] Optionally, the recessed portion and / or protruding portion satisfies one or more of the following: for each cup layer, when raised to the highest height, the lowest position of its recessed portion is higher than the top surface of the Bernoulli table; for each cup layer, when raised to the highest height, the lowest position of its protruding portion is higher than the top surface of the Bernoulli table; the recessed portion and / or protruding portion are provided in the entire area of ​​the inner and / or outer sides of the top.

[0010] Optionally, the recesses and / or protrusions are arranged in a grid-like and / or groove-like shape.

[0011] Optionally, the ratio of the depth of the recess and / or protrusion to the thickness of the top of the cup body to which it belongs is (0, 2 / 3).

[0012] Optionally, the recesses and / or protrusions are evenly distributed on the surface of the top of the cup body.

[0013] Optionally, the material of the recess and / or protrusion includes PTFE.

[0014] Optionally, the recessed portion and / or protruding portion satisfies one or more of the following: the recessed portion and / or protruding portion is formed by an etching process; the recessed portion and / or protruding portion is made by a molding process.

[0015] Optionally, the recessed portion and / or protruding portion satisfies one or more of the following: the shape of the cross-section of the recessed portion and / or protruding portion is selected from one or more of the following: polygon, circle, ellipse, sector, wherein the plane containing the cross-section is parallel to the bottom surface of the recessed portion and / or protruding portion; the shape of the recessed portion and / or protruding portion is selected from one or more of the following: tetrahedron, cube, cuboid, hemisphere, frustum, truncated pyramid, ring.

[0016] Optionally, it also includes a drive device coupled to the recycling cup assembly for driving the cup layers to rise and fall.

[0017] Optionally, the driving device includes a group of cylinders, each group of cylinders being coupled to the same layer of cup body to drive the layer of cup body to rise and fall independently.

[0018] Compared with the prior art, the technical solution of the present disclosure has the following advantages:

[0019] The wet cleaning apparatus of this disclosure has recesses and / or protrusions on the surface of each cup that receives the liquid, due to the partial or complete top of each cup. When the wafer rotates at high speed and some liquid is thrown onto the sidewall of the recovery cup, the recesses and / or protrusions effectively reduce liquid splashing onto the wafer, especially when the back side of the wafer is facing upwards. This prevents splashed liquid from seeping between the front side of the wafer and the wafer platform, thus effectively addressing the problem of liquid splashing during chemical cleaning in wet cleaning processes. Furthermore, when a Bernoulli platform is used, this solution effectively addresses liquid splashing during cleaning even when there is a certain gap between the Bernoulli platform and the front side of the wafer, thus effectively solving the problem of liquid splashing in wet cleaning processes and improving the quality of the front side of the wafer. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments of this disclosure or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A cross-sectional schematic diagram of a wet cleaning apparatus according to an embodiment of the present disclosure is shown;

[0022] Figure 2 A schematic diagram of the structure of a recycling cup according to an embodiment of this disclosure is shown;

[0023] Figure 3 A schematic diagram of the structure of a recycling cup with the top unfolded is shown in an embodiment of this disclosure;

[0024] Figure 4 This illustration shows a schematic diagram of another structure in which the top of the recycling cup unfolds, according to an embodiment of this disclosure.

[0025] Figure 5 This illustration shows a schematic diagram of another structure in which the top of the recycling cup unfolds, according to an embodiment of this disclosure.

[0026] Figure 6 This invention discloses a schematic diagram showing the structural cross-section of the top of various recycling cups in embodiments of the present invention;

[0027] Figure 7 A structural schematic diagram of the top cross-section of various recycling cups in embodiments of this disclosure is shown. Detailed Implementation

[0028] The technical solutions of this utility model will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of this utility model, used to illustrate the concept of this utility model; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of this utility model. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0029] It should be noted that the accompanying drawings in this embodiment are schematic diagrams, used to illustrate the concept of this utility model and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of this utility model, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0030] As described in the background section, in wet cleaning processes, when chemical droplets splash onto the recovery cups, they may cause backsplashing, entering the gap between the Bernoulli pallet and the wafer. This is because: since this is a back-side process, the wafer is cleaned with the back side facing up, and the front side (the Bernoulli pallet) does not contact the wafer's front side. During the cleaning process, the wafer rotates at high speed, and some liquid is thrown onto the side walls of different recovery cups. When chemical droplets splash onto the recovery cups, they may cause backsplashing, entering the gap between the Bernoulli pallet and the wafer, thus contaminating and corroding the edge of the wafer's front side, affecting wafer quality.

[0031] To address the aforementioned technical problems, this disclosure provides a wet cleaning apparatus, comprising: a wet cleaning chamber; a rotatable Bernoulli platen located within the wet cleaning chamber for placing a wafer; the wafer being adsorbed onto the Bernoulli platen with its front facing the platen; and a recovery cup assembly disposed around the Bernoulli platen to collect liquid ejected during wafer rotation; wherein the recovery cup assembly comprises multiple layers of cups, each layer having a portion or all of its top surface having a recess and / or a protrusion on the surface receiving the liquid.

[0032] The wet cleaning apparatus of this disclosure has recesses and / or protrusions on the surface of each cup that receives the liquid, with part or all of the top surface of each cup. When the wafer rotates at high speed and some liquid is thrown onto the sidewall of the recovery cup, the recesses and / or protrusions effectively reduce the backflow of liquid onto the wafer, especially when the back side of the wafer is facing upwards. This prevents backflowed liquid from seeping between the front side of the wafer and the wafer platform, thus effectively addressing the problem of liquid backflow during chemical cleaning in wet cleaning processes. Furthermore, when a Bernoulli platform is used on the wafer platform, this solution effectively addresses the liquid backflow problem during cleaning, even when there is a certain gap between the Bernoulli platform and the front side of the wafer, thereby improving the quality of the front side of the wafer.

[0033] To make the above-described objects, features and advantages of this disclosure more apparent and understandable, a clear and complete illustrative description of this disclosure is provided below in conjunction with the accompanying drawings.

[0034] See Figure 1 The diagram shown is a cross-sectional view of a wet cleaning device according to an embodiment of this disclosure. Figure 1 As shown, wet cleaning equipment may include:

[0035] Wet cleaning of chamber 11;

[0036] A rotatable Bernoulli tray 2, located within the wet cleaning chamber 11, is used to place the wafer W;

[0037] A recovery cup assembly 1 is set around the Bernoulli table 2 to collect the liquid ejected as the wafer W rotates;

[0038] The recycling cup assembly 1 includes a multi-layered cup body 12;

[0039] The top part or all of the top of each cup body has a recessed portion and / or a raised portion on the surface that receives the liquid, for example... Figure 3 The recessed portion and / or protruding portion 121 is shown in the diagram.

[0040] The Bernoulli chuck is a non-contact chuck that operates based on Bernoulli's principle, a fundamental concept in fluid dynamics. Bernoulli's principle states that in fluid flow, an increase in fluid velocity leads to a decrease in fluid pressure, and vice versa. When the Bernoulli chuck operates, external compressed air flows at high speed through a small gap between the chuck and the surface of the object being transported. Due to the increased air velocity, Bernoulli's principle causes a decrease in air pressure flowing through the gap, creating a low-pressure region between the chuck and the object. However, the surrounding air pressure is relatively high, pushing the wafer towards this low-pressure region. In this way, the wafer can be attracted without direct contact.

[0041] It should be pointed out Figure 1 In this configuration, the front side of the wafer faces the Bernoulli pallet, meaning the side with the etched circuitry faces the Bernoulli pallet. This is because after the wafer is thinned, a damage layer of a certain thickness is generated on the back side of the wafer. In order to remove the damage layer and relieve stress, acid etching cleaning of the back side of the wafer is required.

[0042] Bernoulli trays can hold wafers without direct contact, thus avoiding damage to the front side of the wafer.

[0043] The recycling cup assembly 1 comprises multiple layers of cup bodies 12, with flow channels between adjacent cup bodies, for example... Figure 1 There are flow channels 122 between adjacent cups. It should be noted that this embodiment is intended to illustrate the structure in the figure, and not to limit the specific protective structure. That is, the number of multi-layer cups 12 can be at least 2, or it can be 3, 4 or 5, and the specific number is determined according to the actual process requirements.

[0044] Specifically, during the wafer cleaning process, the Bernoulli platform 2 attracts and rotates the wafer W. The liquid contacts the back surface of the wafer for cleaning and is then ejected. Most of the liquid is recycled through the corresponding guide channel 122. Some of the ejected liquid is blocked by the recesses and / or protrusions on the top or all of the top of each recycling cup, and then flows into the bottom of the cup and is collected by the corresponding recycling cup. This effectively solves the problem of liquid splashing during the chemical liquid cleaning process in the wet cleaning process.

[0045] It should be noted that, Figure 1 The structure and dimensions of the wet cleaning chamber 11, the recovery cup assembly 1, and the Bernoulli tray 2 shown are merely illustrative examples used to illustrate how flexible placement of recesses and / or protrusions in the equipment can reduce liquid splashing, and should not be construed as a limitation of this disclosure.

[0046] In some embodiments of this disclosure, see Figure 1 and Figure 2The recycling cup assembly 1 comprises multiple cup bodies, each cup body including: a cylindrical part surrounding the Bernoulli table 2; an annular top connected to the cylindrical part and extending obliquely upward from the upper end of the cylindrical part toward the axis of the Bernoulli table.

[0047] In some embodiments, the column structure may include at least one of a cylindrical structure, an elliptical column structure, and a square column structure.

[0048] In some embodiments, the ring structure may include at least one of a circular ring structure, an elliptical ring structure, and a square ring structure.

[0049] This embodiment of the invention does not limit the cup structure; those skilled in the art can adjust and set it according to the actual situation.

[0050] In one specific embodiment, the cylindrical section and the annular top structure can effectively accommodate the circular wafer W and the rotatable Bernoulli table 2, occupying less internal space and reducing liquid splashing.

[0051] In some embodiments of this disclosure, see Figure 1 The top part or all of the top of each layer of the cup body of the recycling cup has a recess and / or a protrusion on the surface that receives the liquid, the recess and / or the protrusion being located on the inside and / or outside of the top of the cup body.

[0052] The top of the recycling cup body 12 can be a ring with a certain width, and the top tip of the recycling cup body 12 can be used to represent the top opening of the ring; the entire top of the recycling cup body 12 can be seen in [reference needed]. Figure 2 ,Right now Figure 2 The central truncated cone section.

[0053] In some embodiments, see Figure 1 The surface of each layer of the recovery cup that receives the liquid has a recess and / or a protrusion located on the inside of the top of the cup; the recess and / or the protrusion facing the Bernoulli plate can reduce liquid splashing.

[0054] In some embodiments, see Figure 1 The surface of each layer of the recovery cup that receives the liquid has recesses and / or protrusions, with the recesses and / or protrusions of the outermost layer located inside the partial or complete top; the recesses and / or protrusions of the middle layers are located inside and / or outside the partial or complete top, for example: see Figure 7The recessed and / or raised portions of the cup body are located on the inner and outer sides of part or all of the top; the recessed and / or raised portions of the innermost cup body are located on the outer side of part or all of the top (i.e., the side away from the Bernoulli table). This structure can also effectively reduce liquid splashing.

[0055] This embodiment of the invention does not limit the specific position of the recessed portion and / or protruding portion on the surface of each layer of the recovery cup that receives the liquid. As long as the purpose of reducing liquid splashing is achieved, those skilled in the art can adjust the setting according to the actual situation. In one specific embodiment, the recessed portion and / or protruding portion receives the inner surface of the liquid on the entire top of each layer of the recovery cup. This structure can reduce liquid splashing.

[0056] In some embodiments of this disclosure, a recovery cup assembly 1 is arranged around the Bernoulli tray 2 to collect liquid ejected during wafer rotation; the recovery cup assembly 1 includes multiple cups, each cup having a portion or all of its top surface with recesses and / or protrusions on the surface receiving the liquid; wherein each cup rises and falls within its respective defined height.

[0057] Specifically, see Figure 1 When the outermost cup and the middle cup of the recycling cup rise to a predetermined height, and the innermost cup descends to a predetermined height, the Bernoulli plate 2 adsorbs and drives the wafer W to rotate. The liquid contacts the back surface of the wafer W for cleaning. The liquid enters the guide channel 122 between the middle cup and the innermost cup. The recessed and / or raised parts of the surface of the cup that receives the liquid reduce liquid splashing and prevent the liquid from corroding the front side of the wafer W.

[0058] In some embodiments of this disclosure, a recovery cup assembly 1 is disposed around the Bernoulli table 2 to collect liquid ejected during the rotation of the wafer W; the recovery cup assembly 1 includes multiple cups, each cup having a portion or all of its top surface with recesses and / or protrusions on the surface receiving the liquid; wherein each cup rises and falls within its respective defined height, and for each cup, when it rises to its highest height, the lowest position of its recesses and / or protrusions is higher than the top surface of the Bernoulli table;

[0059] It should be noted that the lowest position is not a limitation on the lowest position that the recess and / or protrusion can be set on the top of the cup, but rather a limitation on one of the boundaries of the smallest range that the recess and / or protrusion can be distributed on the top of the cup.

[0060] Therefore, the recesses and / or protrusions on the surface of each cup layer that receives the liquid can effectively reduce chemical splashing and prevent the liquid from corroding the front side of the wafer.

[0061] In some embodiments of this disclosure, a recovery cup assembly 1 is disposed around the Bernoulli tray 2 to collect liquid ejected during the rotation of the wafer W; the recovery cup assembly 1 includes multiple cup bodies, each cup body having a portion or all of its top surface having a recess and / or a protrusion on the surface receiving the liquid; wherein the recess and / or the protrusion are disposed in the entire area of ​​the inner and / or outer sides of the top.

[0062] Specifically, for example: see Figure 2 A schematic diagram of a recycling cup shows that the recessed portions and / or protrusions can be disposed in the entire area of ​​the inner and / or outer side of the top frustum of the recycling cup. Distributing the entire area with recessed portions and / or protrusions ensures that the recessed portions and / or protrusions effectively reduce chemical splashing and prevent liquid corrosion of the wafer's front side.

[0063] In some embodiments, the recess and / or protrusion may not only be provided at the top, for example... Figure 2 Part and / or all of the central frustum, extending further downwards into the cylindrical portion, for example... Figure 2 Part and / or all of the area of ​​the central cylinder.

[0064] In some embodiments of this disclosure, a recovery cup assembly 1 is disposed around the Bernoulli tray 2 to collect liquid ejected during the rotation of the wafer W; the recovery cup assembly 1 includes multiple cup bodies, each cup body having a portion or all of its top surface receiving the liquid having recesses and / or protrusions; wherein the recesses and / or protrusions are arranged in a grid and / or groove shape.

[0065] Specifically, see Figure 3 A schematic diagram of a recovery cup with its top unfolded is shown. The surface of each layer of the recovery cup that receives the liquid has recesses and / or protrusions forming concentric annular grooves. A Bernoulli plate adsorbs and drives the wafer W to rotate. The liquid contacts and cleans the back surface of the wafer, then is splashed out, with some entering the annular grooves at the top of the cup and then flowing into the recovery cup along the side wall of the cup. Therefore, the annular grooves can reduce chemical liquid splashing and prevent liquid from corroding the front side of the wafer.

[0066] It should be noted that, see Figure 4A schematic diagram of a structure where the top of a recycling cup unfolds. The surface of each layer of the recycling cup that receives the liquid has recesses and / or protrusions, which do not necessarily have to be concentric annular grooves; they can also be grooves extending downwards from the top of the cup as shown in the figure. These grooves can also reduce chemical liquid splashing and prevent liquid from corroding the front side of the wafer.

[0067] In addition, see Figure 5 A schematic diagram of the structure of a recycling cup with the top unfolded, wherein the surface of each layer of the recycling cup that receives the liquid has recesses and / or protrusions that form a grid; when the liquid is splashed onto the grid, the grid can also reduce chemical liquid splashing and prevent liquid from corroding the front side of the wafer.

[0068] In some embodiments of this disclosure, a recovery cup assembly 1 is disposed around the Bernoulli platform 2 to collect liquid splashed out during the rotation of the wafer W; the recovery cup assembly 1 includes multiple cup bodies, and the surface of each cup body that receives the liquid has a recess and / or a protrusion; wherein the ratio of the depth of the recess and / or protrusion to the thickness of the top of the cup body to which it belongs is (0, 2 / 3]. This structure can ensure that the cup body of the recovery cup has good strength, while also ensuring that the recess and / or protrusion can reduce chemical liquid splashing and prevent liquid from corroding the front side of the wafer.

[0069] In some embodiments, the ratio of the depth of the recess and / or protrusion to the thickness of the top of the cup body to which it belongs is greater than 2 / 3.

[0070] It should be noted that the ratio of the depth of the recess and / or protrusion to the thickness of the top of the cup body to which it belongs can be adjusted according to specific process conditions or material strength to improve the feasibility of the equipment.

[0071] In some embodiments of this disclosure, a recovery cup assembly 1 is arranged around the Bernoulli tray 2 to collect liquid splashed out during the rotation of the wafer W. The recovery cup assembly 1 includes multiple cup bodies, and the top part or all of the top of each cup body has a recessed portion and / or a raised portion on the surface that receives the liquid. The recessed portion and / or the raised portion are evenly distributed on the top surface of the respective cup body. This evenly distributed structure can effectively reduce the difficulty of equipment processing, increase feasibility, and also ensure the performance stability of the recessed portion and / or the raised portion, thereby reducing chemical liquid splashing and preventing liquid corrosion of the wafer front side.

[0072] In some embodiments, the recesses and / or protrusions on the top surface of each layer of the recycling cup, which receive the liquid, may be unevenly distributed, partially uniformly distributed, or partially unevenly distributed on the top surface of the respective cup body. This can reduce chemical liquid splashing and prevent liquid from corroding the front side of the wafer.

[0073] In some embodiments of this disclosure, the recesses and / or protrusions on the surface of each layer of the recycling cup that receives the liquid are made of PTFE. This material is inexpensive and is not easily corroded by the liquid used in the etching process. It can reduce chemical liquid splashing and prevent liquid from corroding the front side of the wafer, while taking into account the equipment manufacturing cost.

[0074] In some embodiments, the material of the recessed portion and / or the protruding portion is the same as the material of the cup body, and they are integrally formed, which can reduce the difficulty of equipment manufacturing.

[0075] It should be noted that the liquid used to clean the back of the wafer is corrosive, such as a mixture based on one or more of nitric acid, sulfuric acid and hydrofluoric acid, or a mixture based on sulfuric acid and / or hydrofluoric acid. The selected material must be corrosion-resistant.

[0076] In some embodiments of this disclosure, the recesses and / or protrusions on the surface of each layer of the recycling cup that receives the liquid are formed by an etching process. This process makes the device more precise, and the recesses and / or protrusions are smoother. Their surfaces are less likely to absorb liquid, which can reduce chemical liquid splashing, prevent liquid from corroding the front side of the wafer, and allow the liquid to flow into the recycling cup better.

[0077] In some embodiments, the recesses and / or protrusions are made by compression molding, a process that is highly efficient, has relatively low mold costs, is simple to process, and has good process stability.

[0078] In some embodiments, the recesses and / or protrusions utilize both molding and etching processes, which combines the advantages of both methods and increases the feasibility of the equipment.

[0079] In addition, there are other manufacturing methods for the recessed and / or raised portions, such as: pushing, pressing, bonding, welding, etc. Those skilled in the art can explore and choose on their own, as long as the processed recessed and / or raised portions can reduce chemical liquid splashing and prevent liquid corrosion of the wafer front side.

[0080] In some embodiments of this disclosure, the top part or all of the top of each layer of the recycling cup has a recess and / or a protrusion on the surface that receives the liquid; the shape of the cross-section of the recess and / or the protrusion is selected from one or more of the following: polygonal, circular, elliptical, fan-shaped, wherein the plane of the cross-section is parallel to the bottom surface of the recess and / or the protrusion.

[0081] In some embodiments of this disclosure, the top part or all of the top of each layer of the recycling cup has a recessed portion and / or a raised portion on the surface that receives the liquid; the shape of the recessed portion and / or the raised portion is selected from one or more of the following: tetrahedron, cube, cuboid, hemisphere, frustum, prism, prismatic, annular.

[0082] In some embodiments, the cross-sectional shape of the recess and / or protrusion can be any one or more shapes such as triangle, rectangle, or arc. This disclosure does not impose any limitations on the cross-sectional shape or shape of the recess and / or protrusion, as long as it reduces chemical liquid splashing.

[0083] In some embodiments of this disclosure, there is also a driving device (not shown in the figure) coupled to the recycling cup assembly 1 for driving each layer of cup 12 to rise and fall.

[0084] In some embodiments of this disclosure, the driving device includes a cylinder that can be coupled to the same layer of cup 12 to drive the layer of cup 12 to rise and fall independently.

[0085] The cylinders can be in groups, with two cylinders in each group coupled to the same layer of cup 12 to drive the layer of cup 12 to rise and fall independently, thereby further improving stability during the independent rising and falling process.

[0086] For example Figure 1 The recycling cup assembly 1 has a total of six cylinders coupled to their respective cup bodies 12.

[0087] It should be noted that in some embodiments, the driving device may include an air pump; the air pump may be coupled to the same layer of cup 12 to drive the layer of cup 12 to rise and fall independently.

[0088] The air pumps can be in groups, with each group consisting of two cylinders coupled to the same layer of the cup 12 to drive the cup 12 to rise and fall independently. This further improves stability during the independent rising and falling process.

[0089] It should be noted that in some embodiments, each layer of cylinder can be a single cylinder, and each cylinder is coupled to the same layer of cup 12 to drive the layer of cup 12 to rise and fall independently.

[0090] Each layer of cylinders can have multiple cylinders, which are evenly distributed around the Bernoulli plate and coupled to the same layer of cup.

[0091] Specifically, see Figure 1 The cylinder drives the outermost and middle cups 12 to rise, and drives the innermost cup to fall. The Bernoulli platform 2 drives the wafer W to rotate rapidly. The liquid falls on the wafer W and is then thrown out. Most of the liquid falls into the guide channel between the middle cup and the innermost cup. Some of the liquid is blocked by the middle cup, which can reduce the splashing of chemical liquid. The liquid is collected after flowing into the guide channel 122 and finally discharged through the guide pipe. The guide pipe is connected to a two-way valve, which controls whether the collected liquid is recycled.

[0092] It should be noted that the wet cleaning equipment provided in this disclosure may also include other components, such as a liquid supply system. To facilitate the description of the technical solution and highlight the innovative aspects of this specification, components of the Bernoulli tray and recovery cup assembly that can be implemented using existing technology have been omitted in this disclosure.

[0093] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0094] In the embodiments of this application, "multiple" refers to two or more.

[0095] The descriptions of "first," "second," etc., appearing in the embodiments of this application are for illustrative purposes and to distinguish the objects being described. They have no order and do not indicate any special limitation on the number of devices in the embodiments of this application, nor do they constitute any limitation on the embodiments of this application.

[0096] It should be noted that the sequence number of each step in this embodiment does not represent a limitation on the execution order of each step.

[0097] While the embodiments disclosed herein are as described above, this utility model is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of this utility model; therefore, the scope of protection of this utility model should be determined by the scope defined in the claims.

Claims

1. A wet cleaning device, characterized in that, include: Wet cleaning of the chamber; A rotatable Bernoulli tray, located within the wet cleaning chamber, is used to place the wafer; The wafer is attached to the Bernoulli table and its front side faces the Bernoulli table. A recovery cup assembly, arranged around the Bernoulli table, is used to collect liquid ejected during wafer rotation; The recycling cup assembly comprises multiple cup bodies, and the surface of each cup body that receives the liquid has a recess and / or a protrusion.

2. The wet cleaning equipment according to claim 1, characterized in that, Each cup layer includes: A cylindrical section surrounds the Bernoulli table; The annular top is connected to the cylindrical portion and extends obliquely upward from the upper end of the cylindrical portion toward the axis of the Bernoulli table.

3. The wet cleaning equipment according to claim 1, characterized in that, The recessed portion and / or protruding portion are located on the inner and / or outer side of the top of the cup body.

4. The wet cleaning equipment according to claim 1, characterized in that, Each layer of the cup rises and falls within its own limited height.

5. The wet cleaning equipment according to claim 4, characterized in that, The recessed portion and / or protruding portion satisfy one or more of the following: For each cup layer, when it rises to its highest height, the lowest point of its recess is higher than the top surface of the Bernoulli plate; For each cup layer, when it rises to its highest height, the lowest point of its protrusion is higher than the top surface of the Bernoulli plate; The recessed portion and / or protruding portion are provided in the entire area of ​​the inner and / or outer side of the top.

6. The wet cleaning equipment according to claim 1, characterized in that, The recesses and / or protrusions are arranged in a grid-like and / or groove-like shape.

7. The wet cleaning equipment according to claim 1, characterized in that, The ratio of the depth of the recess and / or protrusion to the thickness of the top of the cup body to which it belongs is (0, 2 / 3).

8. The wet cleaning equipment according to claim 1, characterized in that, The recesses and / or protrusions are evenly distributed on the top surface of the cup body.

9. The wet cleaning equipment according to claim 1, characterized in that, The material of the recesses and / or protrusions includes PTFE.

10. The wet cleaning equipment according to claim 1, characterized in that, The recessed portion and / or protruding portion satisfy one or more of the following: The recessed portion and / or protruding portion are formed by an etching process; The recessed portion and / or protruding portion are made by compression molding.

11. The wet cleaning equipment according to claim 1, characterized in that, The recessed portion and / or protruding portion satisfy one or more of the following: The shape of the cross-section of the recess and / or protrusion is selected from one or more of the following: polygonal, circular, elliptical, sector-shaped, wherein the plane containing the cross-section is parallel to the bottom surface of the recess and / or protrusion; The shape of the recess and / or protrusion is selected from one or more of the following: tetrahedron, cube, cuboid, hemisphere, frustum, prism, ring.

12. The wet cleaning equipment according to claim 1, characterized in that, Also includes: A drive unit, coupled to the recycling cup assembly, is used to drive each layer of cups to rise and fall.

13. The wet cleaning equipment according to claim 12, characterized in that, The driving device includes a group of cylinders, each group of cylinders being coupled to the same layer of cup body to drive the layer of cup body to rise and fall independently.

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