Cleaning equipment for chip wafer processing

Abstract

The utility model relates to the technical field of wafer processing, and discloses cleaning equipment for chip wafer processing, which comprises a cleaning tank, one side of the cleaning tank is provided with a control terminal, one side of the cleaning tank is fixedly connected with a driving motor, and the output end of the driving motor is rotatably connected with a rotating shaft through a gear. According to the cleaning equipment for chip wafer processing, the driving motor operates to drive the rotating shaft to drive the cross plate to rotate, so that the four soaking baskets are soaked or lifted out of the cleaning tank, wafers contained in the soaking baskets are automatically soaked, lifted out and drained off, then the soaking baskets are moved to the position of the shell, the turbine fan is driven to operate through the driving device, and the wafer is cleaned. High-strength wind power is generated to blow and wash the wafer contained in the soaking basket, water stains attached to the surface of the wafer are blown away, dirt and impurities attached to the surface of the wafer are blown away at the same time, the situation that the subsequent machining effect of the wafer is affected by water marks generated after the water stains are dry is prevented, and the cleanliness of the cleaned wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a cleaning device for chip wafer processing. Background Technology

[0002] In the semiconductor manufacturing process, wafer cleaning is a crucial step. During manufacturing, wafers come into contact with various chemicals and impurities. If these substances are not removed, they may cause circuit defects, affecting the performance and reliability of the chip. Cleaning can remove particles from the wafer surface. These particles may cause pattern defects in the subsequent photolithography process, thus affecting the precision of the chip. Wafer cleaning is an important step in ensuring the performance and yield of semiconductor products and is an indispensable step for the entire chip manufacturing industry.

[0003] Traditional chip wafer cleaning processes often involve immersing or rinsing the wafer with deionized water. After such cleaning steps, some impurities and water stains that were not completely removed during the rinsing process often remain on the wafer surface. These water stains form watermarks after drying on the wafer surface, which negatively affects the cleaning effect of the wafer. The presence of watermarks not only affects the surface quality of the wafer, but also reduces the accuracy of the wafer in subsequent photolithography processes, thereby affecting the performance and reliability of the entire chip. Utility Model Content

[0004] The technical problem to be solved by this utility model is that the existing technology has the disadvantage that water stains remain after wafer cleaning, which affects the wafer cleaning effect. To this end, we propose a cleaning equipment for chip wafer processing.

[0005] To achieve the above objectives, this application adopts the following technical solution: a cleaning device for chip wafer processing, comprising a cleaning tank, a control terminal installed on one side of the cleaning tank, a drive motor fixedly connected to one side of the cleaning tank, a rotating shaft rotatably connected to the output end of the drive motor via gears, a cross plate fixedly connected to one side of the rotating shaft, soaking baskets rotatably connected to all four sides of the cross plate via rotating shafts, a housing fixedly connected to one end of the top of the cleaning tank, a drive device fixedly connected to one side of the housing, and a turbine fan installed at the output end of the drive device.

[0006] Preferably, a heating device is fixedly connected to the top of the outer shell, and a heat-conducting pipe is installed at the bottom of the heating device, with the heat-conducting pipe fixedly connected to the inner wall of the outer shell.

[0007] Preferably, each soaking basket has a counterweight fixedly connected to its bottom, and the counterweight is parallel to the deionization level of the soaking basket.

[0008] Preferably, an observation window is fixedly connected to one side of the cleaning tank, and the observation window is made of tempered glass.

[0009] Preferably, two rubber pads are fixedly connected to the bottom of the cleaning tank, and two rollers are fixedly connected to the other end of the bottom of the cleaning tank.

[0010] Preferably, ultrasonic cleaning devices are installed on both sides of the cleaning tank, with one end of the ultrasonic cleaning device placed at the bottom of the inner wall of the cleaning tank.

[0011] The technical effects and advantages of this utility model are as follows:

[0012] In this invention, a drive motor drives a rotating shaft to rotate a cross plate, causing four soaking baskets to soak or be lifted out of the cleaning tank. This achieves automatic soaking, lifting, and draining of the wafers in the soaking baskets. The soaking baskets are then moved to the outer casing, where a drive device drives a turbine fan to generate high-intensity airflow to blow clean the wafers in the soaking baskets. This removes water stains and dirt adhering to the wafer surface, preventing watermarks from forming after the water stains dry and affecting subsequent wafer processing, thus improving the cleanliness of the wafers after cleaning. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0014] Figure 2 This is a bottom view of the bottom structure of this utility model;

[0015] Figure 3 This is a cross-sectional view of the internal structure of the outer shell of this utility model;

[0016] Figure 4 This is a sectional view of the vertical cross-section of the outer shell of this utility model;

[0017] Figure 5 This is a sectional view of the vertical cross-section of this utility model.

[0018] Legend: 1. Cleaning tank; 2. Control terminal; 3. Drive motor; 4. Rotating shaft; 5. Cross plate; 6. Soaking basket; 7. Outer shell; 8. Drive device; 9. Turbine fan; 10. Heating device; 11. Heat pipe; 12. Counterweight; 13. Observation window; 14. Rubber pad; 15. Roller; 16. Ultrasonic cleaning device. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0020] Reference Figure 1 - Figure 5 As shown, this utility model provides a technical solution: a cleaning device for chip wafer processing, including a cleaning tank 1, a control terminal 2 installed on one side of the cleaning tank 1, a drive motor 3 fixedly connected to one side of the cleaning tank 1, a rotating shaft 4 rotatably connected to the output end of the drive motor 3 via gears, a cross plate 5 fixedly connected to one side of the rotating shaft 4, and soaking baskets 6 rotatably connected to all four sides of the cross plate 5 via rotating shafts, a housing 7 fixedly connected to one end of the top of the cleaning tank 1, a drive device 8 fixedly connected to one side of the housing 7, and a turbine fan 9 installed at the output end of the drive device 8. The operator controls the drive motor 3 to start via the control terminal 2, causing the drive motor 3 to drive the rotating shaft 4 to move the cross plate 5 inside the cleaning tank 1, and then through a set soaking... The basket 6 can hold chip wafers, allowing the soaking basket 6 to be immersed in the cleaning tank 1 for cleaning. Then, the cross plate 5 rotates clockwise so that only the bottom soaking basket 6 is immersed in the cleaning tank 1. When the bottom soaking basket 6 is rotated to one side of the outer shell 7 by the cross plate 5, the drive device 8 drives the turbine fan 9 to generate high-intensity airflow to blow and wash the chip wafers inside the soaking basket 6, thereby blowing off the deionized water stains and particulate dirt attached to the surface of the chip wafers and quickly drying the chip wafers. This device can automatically retrieve the chip wafers after soaking and cleaning, and then use airflow to keep the chip wafers dry while blowing away impurities on their surface, achieving a highly efficient cleaning effect for the chip wafers.

[0021] Reference Figure 3 As shown in this embodiment: a heating device 10 is fixedly connected to the top of the outer casing 7, and a heat conduction pipe 11 is installed at the bottom of the heating device 10. The heat conduction pipe 11 is fixedly connected to the inner wall of the outer casing 7. The high temperature heat generated by the operation of the heating device 10 is conducted to the heat conduction pipe 11. The wind generated by the turbine fan 9 passes over the surface of the heat conduction pipe 11, thereby driving the heat on the surface of the heat conduction pipe 11, so that the turbine fan 9 can blow hot air towards the soaking basket 6, thereby accelerating the drying speed of the cleaned chip wafer in the soaking basket 6 and reducing water marks caused by natural drying of water stains.

[0022] Reference Figure 2 As shown in this implementation scheme: a counterweight 12 is fixedly connected to the bottom of each soaking basket 6. The counterweight 12 is parallel to the deionization level of the soaking basket 6. By setting the counterweight 12, the bottom of the soaking basket 6 is weighted, so that the center of gravity is concentrated at the bottom of the soaking basket 6. This ensures that the soaking basket 6 is always in a horizontal state while rotating with the cross plate 5, thereby preventing the soaking basket 6 from tilting and spilling when the cross plate 5 rotates.

[0023] Reference Figure 1 , Figure 2 and Figure 5 As shown in this embodiment: an observation window 13 is fixedly connected to one side of the cleaning tank 1. The observation window 13 is made of tempered glass. By installing the observation window 13 made of tempered glass on one side of the cleaning tank 1, the staff can directly observe the inside of the cleaning tank 1 through the observation window 13 and more intuitively observe the cleaning effect of the soaking basket 6 on the chip wafer. At the same time, if the chip wafer being cleaned inside the cleaning tank 1 falls or other situations occur, it can be directly observed and dealt with in a timely manner.

[0024] Reference Figure 2 As shown in this embodiment: two rubber pads 14 are fixedly connected to the bottom of the cleaning tank 1, and two rollers 15 are fixedly connected to the other end of the bottom of the cleaning tank 1. When the worker lifts one end of the cleaning tank 1 upward, the rubber pads 14 are moved away from the ground while the rollers 15 are in contact with the ground. At this time, the rollers 15 rotate, allowing the worker to push the cleaning tank 1 so that the rollers 15 contact the ground and rotate, thereby moving the cleaning tank 1. When the cleaning tank 1 is placed on the ground, the rubber pads 14 contact the ground, increasing the friction between the cleaning tank 1 and the ground, so that the rollers 15 can no longer rotate, thus facilitating the worker to move and transport the cleaning tank 1.

[0025] Reference Figure 1 and Figure 2 As shown in this embodiment: ultrasonic cleaning devices 16 are installed on both sides of the cleaning tank 1. One end of the ultrasonic cleaning device 16 is placed at the bottom of the inner wall of the cleaning tank 1. Through the roller 15, the operator can operate the control terminal 2 to drive the roller 15, so that the roller 15 generates ultrasonic vibration inside the cleaning tank 1, thereby performing high-frequency vibration cleaning on the chip wafers placed in the soaking basket 6, thereby improving the cleaning effect of the device on the chip wafers.

[0026] Working principle: The operator controls the drive motor 3 via the control terminal 2, which drives the rotating shaft 4 to move the cross plate 5 inside the cleaning tank 1. Chip wafers are placed inside the immersion basket 6, which is then immersed in the cleaning tank 1 for cleaning. The cross plate 5 rotates clockwise, ensuring only the bottom immersion basket 6 is immersed. When the bottom immersion basket 6 is rotated to one side of the outer casing 7, the drive device 8 drives the turbine fan 9 to generate high-intensity airflow, blowing away deionized water stains and particulate contaminants adhering to the surface of the chip wafers. This device rapidly dries chip wafers by immersing them in water and then automatically removing them. It uses airflow to keep the wafers dry while simultaneously removing surface impurities, achieving highly efficient cleaning. A heating device 10 generates high-temperature heat, which is conducted to the heat pipe 11. The airflow from the turbine fan 9 passes over the surface of the heat pipe 11, carrying away the heat and directing it towards the immersion basket 6. This accelerates the drying process of the cleaned chip wafers in the basket 6, reducing watermarks caused by natural drying. A counterweight 12 stabilizes the bottom of the immersion basket 6. Weight is added to concentrate the center of gravity at the bottom of the soaking basket 6, ensuring that the soaking basket 6 remains horizontally level while rotating with the cross plate 5. This prevents the soaking basket 6 from tilting and spilling when the cross plate 5 rotates. A tempered glass observation window 13 is installed on one side of the cleaning tank 1, allowing staff to directly observe the interior of the cleaning tank 1 and more intuitively assess the cleaning effect of the soaking basket 6 on the chip wafers. Furthermore, any chip wafers falling or other issues occurring inside the cleaning tank 1 can be directly observed and addressed promptly. By lifting one end of the cleaning tank 1, the rubber pad 14 is moved away from the ground. When the roller 15 is placed on the ground, its rotation allows the operator to push the cleaning tank 1, causing the roller 15 to rotate and move. When the cleaning tank 1 is placed on the ground, the rubber pad 14 increases the friction between the cleaning tank 1 and the ground, preventing the roller 15 from rotating. This makes it easier for the operator to move and transport the cleaning tank 1. The roller 15 allows the operator to operate the control terminal 2 to drive the roller 15, causing it to generate ultrasonic vibrations inside the cleaning tank 1. This high-frequency vibration cleaning of the chip wafers in the soaking basket 6 improves the cleaning effect of the device on the chip wafers.

[0027] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cleaning apparatus for chip wafer processing, comprising a cleaning tank (1), characterized in that: The control terminal (2) is installed on one side of the cleaning tank (1), the driving motor (3) is fixedly connected on one side of the cleaning tank (1), the output end of the driving motor (3) is rotatably connected with the rotating shaft (4) through a gear, the cross plate (5) is fixedly connected on one side of the rotating shaft (4), the soaking baskets (6) are rotatably connected around the cross plate (5) through rotating shafts, the shell (7) is fixedly connected on one end of the top of the cleaning tank (1), the driving device (8) is fixedly connected on one side of the shell (7), and the turbine fan (9) is installed on the output end of the driving device (8).

2. The cleaning apparatus for processing a chip wafer according to claim 1, wherein: The heating device (10) is fixedly connected on the top of the shell (7), the heat conducting pipe (11) is installed on the bottom of the heating device (10), and the heat conducting pipe (11) is fixedly connected to the inner wall of the shell (7).

3. The cleaning apparatus for chip wafer processing according to claim 1, characterized by: The counterweight blocks (12) are fixedly connected to the bottoms of the soaking baskets (6), and the counterweight blocks (12) are parallel to the deionization of the soaking baskets (6).

4. The cleaning apparatus for processing a chip wafer according to claim 1, wherein: The observation window (13) is fixedly connected on one side of the cleaning tank (1), and the observation window (13) is made of toughened glass.

5. The cleaning apparatus for chip wafer processing according to claim 1, characterized by: The two rubber pads (14) are fixedly connected to the bottom of the cleaning tank (1), and the two rollers (15) are fixedly connected to the other end of the bottom of the cleaning tank (1).

6. The cleaning apparatus for chip wafer processing according to claim 1, wherein: The ultrasonic cleaning devices (16) are installed on the two sides of the cleaning tank (1), and one end of the ultrasonic cleaning device (16) is arranged on the bottom of the inner wall of the cleaning tank (1).

Images