Die bonding equipment capable of switching multiple feeding modes

Abstract

The utility model discloses a die bonding device capable of switching multiple feeding modes. The die bonding device is provided with a die bonding device body placed at a working position. Comprising a vibration disc which is connected to the upper surface of the die bonding equipment body, a lower-layer movement group is slidably arranged on the upper surface of the die bonding equipment body, an upper-layer movement group is slidably connected to the upper surface of the lower-layer movement group, and meanwhile, a wafer disc is connected to the upper surface of the upper-layer movement group; and the visual frame is mounted at the rear end of the upper surface of the die bonding equipment body. Various feeding methods are integrated on one machine type, and through rapid switching of all functional modules, the requirements for producing different products are met, space is saved for a user, cost is reduced, one machine has multiple purposes, economic benefits are increased, and competitiveness is improved for enterprises; and a feeder upper resistor, a vibration disc upper resistor and a blue film upper chip function module are added, so that the equipment function can be quickly switched.

Description

Technical Field

[0001] This utility model relates to the technical field of die bonding equipment with multiple feeding methods, specifically a die bonding equipment with switchable multiple feeding methods. Background Technology

[0002] Die bonding equipment is an important machine in semiconductor packaging. It picks up chips and places them on lead frames for soldering in designated areas. It also works with a feeding device to control the assembly of chips or other components. However, during use, it is inconvenient to limit the feeding of chips, which can easily cause the feeding position to deviate, and the feeding method is relatively simple.

[0003] To overcome the aforementioned shortcomings, existing technology (Chinese patent application CN202111038605.6, filed on September 6, 2021) provides a dual-mode automatic feeding mechanism for a die bonder. By integrating the stacking stage and feeding track into the pusher box mechanism, the feeding mode can be automatically switched without disassembling the mechanism. When substrate stacking is selected, the feeding track is pulled out from under the pusher box mechanism, the substrate is stacked on the stacking stage, and the suction mechanism transports the substrate to the feeding track for feeding. The other mechanisms enter a waiting mode. When the material box feeding is selected... The feeding track is retracted under the pusher box mechanism, the material box is placed on the stacking table, the pusher box mechanism pushes the material box onto the lifting mechanism, the pusher box mechanism loads the material, and when unloading the material box, the lifting mechanism lowers the material box to the horizontal position of the receiving box mechanism, the receiving box mechanism retracts the material box; there is also prior art (Chinese patent application No. CN202210416341.1, application date 2022.04.20) an automatic feeding mechanism for a die bonder, which uses a gripper to grip the substrate and place it on the feeding section, and the conveyor belt transports the substrate to the die bonder. The worm gear drives the gear to rotate, which in turn rotates the directional lever to change the angle, thus changing the conveyor belt's direction. This is suitable for die bonders with different feeding angles and heights, making it more flexible and convenient for production. This also relates to existing technology (Chinese patent application CN202323068092.0, filed on November 14, 2023), which describes an automatic feeding mechanism for a die bonder. This mechanism has elastic casters at the bottom to provide shock absorption and prevent loosening of components during movement. The suction cup... A receiving tray is installed at the bottom. When the die bonding material adsorbed by the suction cup falls, the receiving tray can catch the falling die bonding material to prevent it from being damaged. The sensor can detect the falling die bonding material, and the suction cup can re-adsorb it. Although the existing technology can complete the feeding, during the operation, the existing die bonding machine feeding structure only has one of the following: feeder to resistor, vibratory plate to resistor, or blue film to chip. The function is limited, and there are many types of products. Multiple models must be purchased to meet production needs. In addition, multiple machines occupy more space and have higher costs.

[0004] To address the aforementioned issues, there is an urgent need for innovative designs based on existing die bonding equipment. Utility Model Content

[0005] The purpose of this utility model is to provide a die bonding device with multiple switching feeding methods, in order to solve the problems mentioned in the background art, that the existing die bonding machine feeding structure only has one of the following during operation: feeding resistors on feeders, feeding resistors on vibratory feeders, or feeding chips on blue films. The function is limited, and there are many types of products, so multiple models must be purchased to meet production needs. In addition, multiple machines occupy more space and have higher costs.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a die bonding device with multiple switching feeding methods, comprising a die bonding device body placed in the working position; including: a vibratory plate connected to the upper surface of the die bonding device body, wherein a lower motion group slides on the upper surface of the die bonding device body, and an upper motion group is slidably connected to the upper surface of the lower motion group, while a wafer disk is connected to the upper surface of the upper motion group; a vision frame installed at the rear end of the upper surface of the die bonding device body, wherein a vision lens camera one is nested and connected to the front side of the outer surface of the vision frame, and a vision lens camera two is provided on the right side of the outer surface of the vision lens camera one, and the vision lens camera two is positioned on the right side of the outer surface of the vision frame.

[0007] Preferably, the vibratory feeder and the die bonding equipment body form a positioning structure, and the die bonding equipment body forms a multi-axis sliding structure with the wafer disk through the lower motion group and the upper motion group.

[0008] With the above structure, the vibratory feeder can be effectively assembled during use to control the delivery of resistive materials. It can be used in conjunction with the lower and upper motion groups, and with the chip fixed by the blue film on the wafer disk, it can be used with the swing arm to form a gripping and conveying mechanism.

[0009] Preferably, a lower moving platform is slidably connected to the left side of the upper surface of the die bonding equipment body, and an upper moving platform is slidably connected to the upper surface of the lower moving platform. A feeder is installed on the upper surface of the upper moving platform. Meanwhile, a ejector pin holder is installed in the middle section of the upper surface of the die bonding equipment body, and an ejector pin body is telescopically connected to the upper surface of the ejector pin holder.

[0010] With the above structure, the feeder can be effectively connected during use to deliver resistive materials in different ways, and the ejector pin body on the ejector pin holder can be raised to a suitable height to pierce the blue film, so that the nozzle on the swing arm can pick up the chip.

[0011] Preferably, the die bonding equipment body forms a multi-axis sliding structure with the feeder through the lower moving platform and the upper moving platform, and the feeder is installed at equal distances from the upper surface of the upper moving platform, and the die bonding equipment body forms a telescopic structure with the ejector pin frame and the ejector pin body.

[0012] The above structure effectively improves the stability of conveying and material handling during use.

[0013] Preferably, the vision frame and the die bonding device body form an integrated structure, and the vision frame, vision lens camera one, and vision lens camera two form an integrated structure.

[0014] The above structure allows for the stable assembly of visual lens camera one and visual lens camera two during use, improving the stability of position monitoring and preventing misalignment.

[0015] Preferably, the upper and lower motors are mounted on the rear side of the upper surface of the vision frame, and the outer surfaces of the upper and lower motors are rotatably connected to the off-axis wheel via an off-axis. The outer surface of the off-axis wheel is axially connected to the connecting rod, and the lower surface of the connecting rod is rotatably connected to the moving block. The outer surface of the moving block is rotatably connected to the sliding component, which limits the sliding component to slide on the outer surface of the vision frame. A connector is mounted on the outer surface of the moving block, and a swing arm is mounted on the lower surface of the connector. A rotary motor is rotatably connected to the upper surface of the connector, and the rotary motor is positioned and assembled on the upper surface of the vision frame. An output component is assembled on the upper surface of the die bonding equipment body.

[0016] The above structure can be used to assemble and control the position of the moving block, increase the height of the swing arm connected to the moving block, thereby controlling the angle of the swing arm and picking up the chip.

[0017] Preferably, the vision frame forms an off-axis rotation structure through upper and lower motors and an off-axis wheel, and the off-axis wheel forms a deflection rotation structure through a connecting rod and a moving block. The moving block forms an upper and lower sliding structure with the vision frame through a sliding component. At the same time, the moving block and the connecting member form an integrated structure, and the connecting member is embedded in the inner surface of the swing arm. The connecting member and the rotary motor form a rotation structure.

[0018] The above structure effectively improves the stability of the moving block's up-and-down movement during use, prevents deviation, and controls the angle of the swing arm of the connector assembly, enabling the swing arm to pick up the chip.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] 1. By integrating multiple feeding methods into one model and enabling rapid switching between functional modules, this machine can meet the production needs of different products, saving space and reducing costs for users. Its multi-functionality increases economic benefits and enhances the competitiveness of enterprises. Improvements are made by adding functional modules, such as resistor loading on the feeder, resistor loading on the vibratory feeder, and chip loading on the blue film, improving the equipment's functionality and allowing for rapid switching. Furthermore, when using any function, other unrelated components need to be moved aside or removed. Each component is secured using a quick-release and quick-installation method, and each component has pre-drilled mounting holes for assembly.

[0021] 2. Equipped with an easy-to-assemble vibratory feeder, the installation position can be interchanged with the wafer disks set in the lower and upper motion groups. Different conveying devices can be assembled according to the different materials being conveyed, and in conjunction with the lower and upper motion groups, multi-position adjustment can be formed to control the stability of the conveying operation. In conjunction with the lower and upper moving platforms, the position of the feeder can be adjusted to convey different product parts.

[0022] 3. Equipped with a ejector pin holder, the ejector pins are controlled to rise to a suitable height to pierce the blue film, facilitating the suction nozzle on the swing arm to pick up the chip. Numerous chips are fixed to the blue film assembled with the wafer disk. On this platform, each chip needs to be moved one by one to a suitable fixed position for the swing arm to pick up, cooperating with the swing arm to improve gripping stability. Furthermore, the stability of vision lens camera one and vision lens camera two facilitates the detection of the product's position, thereby controlling the movement of the wafer disk and feeder. This allows adjustment of the swing arm's angle and height for gripping and transporting the product to the packaging position. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the die bonding device body of this utility model;

[0024] Figure 2 This is a three-dimensional structural diagram of the lower motion assembly of this utility model;

[0025] Figure 3 This is a three-dimensional structural diagram of the ejector pin holder of this utility model;

[0026] Figure 4 This is a schematic diagram of the three-dimensional structure of the visual frame of this utility model;

[0027] Figure 5 This is a three-dimensional structural diagram of the connector of this utility model.

[0028] In the diagram: 1. Die bonding equipment body; 2. Vibratory feeder; 3. Lower motion group; 4. Upper motion group; 5. Die wafer disk; 6. Lower moving platform; 7. Upper moving platform; 8. Feeder; 9. Ejector pin holder; 10. Ejector pin body; 11. Vision frame; 12. Vision lens camera one; 13. Vision lens camera two; 14. Upper and lower motors; 15. Offset wheel; 16. Connecting rod; 17. Moving block; 18. Sliding assembly; 19. Connector; 20. Swing arm; 21. Rotary motor; 22. Output component. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figures 1-5 The present invention provides the following technical solution: a die bonding device with multiple feeding methods that can be switched, wherein a die bonding device body 1 is provided and placed in the working position.

[0031] Example 1: As Figures 1-3 The technical solution shown in this utility model provides the following technical solution: a die bonding device with multiple switching feeding methods, comprising: a vibratory feeder 2 connected to the upper surface of the die bonding device body 1, wherein a lower motion group 3 slides on the upper surface of the die bonding device body 1, and an upper motion group 4 is slidably connected to the upper surface of the lower motion group 3, while a wafer disk 5 is connected to the upper surface of the upper motion group 4; the vibratory feeder 2 and the die bonding device body 1 form a positioning structure, and the die bonding device body 1 forms a multi-axis sliding structure with the wafer disk 5 through the lower motion group 3 and the upper motion group 4; the die bonding device body 1... The lower moving platform 6 is slidably connected to the left side of the upper surface, and the upper surface of the lower moving platform 6 is slidably connected to the upper moving platform 7. The feeder 8 is installed on the upper surface of the upper moving platform 7. Meanwhile, the ejector pin holder 9 is installed in the middle section of the upper surface of the die bonding equipment body 1, and the ejector pin body 10 is telescopically connected to the upper surface of the ejector pin holder 9. The die bonding equipment body 1 forms a multi-axis sliding structure with the feeder 8 through the lower moving platform 6 and the upper moving platform 7. The feeder 8 is installed at equal distances from the upper surface of the upper moving platform 7, and the die bonding equipment body 1 forms a telescopic structure with the ejector pin holder 9 and the ejector pin body 10.

[0032] In use, the vibratory plate 2 is assembled by the die bonding equipment body 1, and the resistor is fed by the vibratory plate 2. The upper motion group 4 assembled by the lower motion group 3 and the connected wafer disk 5 can be replaced at the assembly position. When it is necessary to control the chip feeding, the position of the wafer disk 5 is controlled by the multi-axis linkage between the lower motion group 3 and the upper motion group 4. With the use of vision lens camera 12 and vision lens camera 23, the position of the chip can be identified, and the position of the feeder 8 assembled by the lower moving platform 6 and the upper moving platform 7 can be identified to identify the resistor feeding position for later gripping. When the chip is carried by the blue film assembled on the wafer disk 5, the ejector body 10 assembled on the ejector pin frame 9 is controlled to rise and fall to puncture the blue film, so that the swing arm 20 can adsorb the chip later.

[0033] Example 2: Figure 1 , Figure 2 and Figure 4 The technical solution shown, based on Embodiment 1, further discloses the use of the vision lens camera 12, the specific content of which is as follows: a vision frame 11 is installed on the rear end of the upper surface of the die bonding equipment body 1, and the vision lens camera 12 is nested and connected to the front side of the outer surface of the vision frame 11. A vision lens camera 2 13 is provided on the right side of the outer surface of the vision lens camera 12, and the vision lens camera 2 13 is positioned on the right side of the outer surface of the vision frame 11. The vision frame 11 and the die bonding equipment body 1 form an integrated structure, and the vision frame 11, the vision lens camera 12, and the vision lens camera 2 13 form an integrated structure.

[0034] In use, the vision lens camera 12 and vision lens camera 23 assembled by the vision frame 11 respectively identify the position of the resistor on the feeder 8 and the chip on the wafer disk 5, which are used to control the position of the swing arm 20 and adjust the position of the wafer disk 5 so that the swing arm 20 can pick up and use the chip.

[0035] Example 3: Figure 1 , Figure 2 , Figure 4 and Figure 5The technical solution shown, based on Embodiment 2, further discloses the position control of the swing arm 20, the specific details of which are as follows: A vertical motor 14 is mounted on the rear side of the upper surface of the vision frame 11, and an off-axis wheel 15 is rotatably connected to the outer surface of the vertical motor 14 via an off-axis. A connecting rod 16 is axially connected to the outer surface of the off-axis wheel 15, and a moving block 17 is rotatably connected to the lower surface of the connecting rod 16. A sliding assembly 18 is rotatably connected to the outer surface of the moving block 17, limiting the sliding assembly 18 to slide on the outer surface of the vision frame 11. A connecting member 19 is mounted on the outer surface of the moving block 17, and a swing arm 20 is mounted on the lower surface of the connecting member 19. A rotary motor 21 is rotatably connected to the upper surface of the connector 19, and the rotary motor 21 is positioned and assembled on the upper surface of the vision frame 11. An output component 22 is assembled on the upper surface of the die bonding equipment body 1. The vision frame 11 forms an off-axis rotation structure with the upper and lower motors 14 and the off-axis wheel 15. The off-axis wheel 15 forms a deflection rotation structure with the moving block 17 through the connecting rod 16. The moving block 17 forms an up-and-down sliding structure with the vision frame 11 through the sliding component 18. At the same time, the moving block 17 and the connector 19 form an integrated structure. The connector 19 is embedded in the inner surface of the swing arm 20 and forms a rotation structure with the rotary motor 21.

[0036] In use, visual recognition between vision lens camera 12 and vision lens camera 13 controls the rotation of the off-axis wheel 15 via the up and down motor 14 of the vision frame 11. The off-axis wheel 15 rotates off-axis, and the connecting rod 16, which controls the rotation of the central axis of the off-axis wheel 15, drives the moving block 17 to move up and down. The sliding component 18 assembled with the moving block 17 forms a limit sliding with the vision frame 11, thereby controlling the stability of the moving block 17's up and down sliding and preventing tilting. This controls the moving block 17 to drive the connecting piece 19 to move up and down, and simultaneously adjusts the rotation of the rotary motor 21 to control the rotation of the swing arm 20. During rotation, the connection between the swing arm 20 and the connecting piece 19 is adjusted to adjust the swing arm 20 to rise during rotation and control the swing arm 20 to grasp the chip, improving the stability of the swing arm 20 and the chip grasping stability. The chip is then transported to the output piece 22 for subsequent die bonding.

[0037] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A die bonding device with multiple feeding methods switchable, comprising a die bonding device body (1) placed in the working position; Its features are, include: Vibratory plate (2) is connected to the upper surface of the die bonding equipment body (1), and a lower motion group (3) slides on the upper surface of the die bonding equipment body (1), and an upper motion group (4) slides on the upper surface of the lower motion group (3), while a wafer disk (5) is connected to the upper surface of the upper motion group (4). A vision frame (11) is installed on the rear end of the upper surface of the die bonding device body (1), and a vision lens camera (12) is nested and connected to the front side of the outer surface of the vision frame (11). A vision lens camera (13) is provided on the right side of the outer surface of the vision lens camera (12), and the vision lens camera (13) is positioned on the right side of the outer surface of the vision frame (11).

2. The die bonding equipment with switchable multiple feeding methods according to claim 1, characterized in that: The vibratory plate (2) and the die bonding equipment body (1) form a positioning structure, and the die bonding equipment body (1) and the wafer disk (5) form a multi-axis sliding structure through the lower motion group (3) and the upper motion group (4).

3. The die bonding equipment with switchable multiple feeding methods according to claim 1, characterized in that: The upper surface of the die bonding equipment body (1) is slidably connected to the lower moving platform (6), and the upper surface of the lower moving platform (6) is slidably connected to the upper moving platform (7). The upper surface of the upper moving platform (7) is equipped with a feeder (8). Meanwhile, the middle section of the upper surface of the die bonding equipment body (1) is equipped with a ejector pin frame (9), and the upper surface of the ejector pin frame (9) is telescopically connected to the ejector pin body (10).

4. The die bonding equipment with switchable multiple feeding methods according to claim 1, characterized in that: The die bonding equipment body (1) forms a multi-axis sliding structure with the feeder (8) through the lower moving platform (6) and the upper moving platform (7), and the feeder (8) is installed at equal distances from the upper surface of the upper moving platform (7), and the die bonding equipment body (1) forms a telescopic structure with the ejector pin frame (9) and the ejector pin body (10).

5. A die bonding device with switchable multiple feeding methods according to claim 1, characterized in that: The vision frame (11) and the die bonding device body (1) form an integrated structure, and the vision frame (11) and vision lens camera one (12) and vision lens camera two (13) form an integrated structure.

6. A die bonding device with switchable multiple feeding methods according to claim 1, characterized in that: The upper surface of the vision frame (11) is equipped with an upper and lower motor (14), and the outer surface of the upper and lower motor (14) is rotatably connected to an off-axis wheel (15) via an off-axis. The outer surface of the off-axis wheel (15) is axially connected to a connecting rod (16), and the lower surface of the connecting rod (16) is rotatably connected to a moving block (17). The outer surface of the moving block (17) is rotatably connected to a sliding component (18), which limits the sliding component (18) to slide on the outer surface of the vision frame (11). The outer surface of the moving block (17) is equipped with a connector (19), and the lower surface of the connector (19) is equipped with a swing arm (20). The upper surface of the connector (19) is rotatably connected to a rotary motor (21), which positions and assembles the rotary motor (21) on the upper surface of the vision frame (11). The upper surface of the die bonding device body (1) is equipped with an output component (22).

7. A die bonding device with switchable multiple feeding methods according to claim 1, characterized in that: The vision frame (11) forms an off-axis rotation structure through the upper and lower motors (14) and the off-axis wheel (15), and the off-axis wheel (15) forms a deflection rotation structure through the connecting rod (16) and the moving block (17), and the moving block (17) forms an upper and lower sliding structure with the vision frame (11) through the sliding component (18). At the same time, the moving block (17) and the connecting piece (19) form an integrated structure, and the connecting piece (19) is embedded in the inner surface of the swing arm (20), and the connecting piece (19) and the rotary motor (21) form a rotation structure.

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