Wafer vacuum clamping and rotating device

Abstract

The utility model discloses a wafer vacuum clamping and rotating device which comprises a rotating suction cup, a cross-shaped rotating table, a rotating main shaft, a lifting circular truncated cone, a wafer support claw, a lifting circular truncated cone supporting column, a telescopic electric air cylinder, an upper mounting plate, a lower mounting plate, a side plate, a motor and a ventilation device. And the cross turntable is fixedly connected with the rotating main shaft through a screw. The wafer support claw is fixedly connected with the lifting circular truncated cone through a screw, the lifting circular truncated cone is fixedly connected with the lifting circular truncated cone supporting column through a screw, the lifting circular truncated cone supporting column is in threaded connection with the telescopic electric air cylinder, and the telescopic electric air cylinder is fixedly connected with the lower mounting plate through a screw. The ventilation device is fixedly connected with the lower mounting plate through screws, the upper mounting plate, the lower mounting plate and the side plate are fixedly connected through screws, the motor is fixedly connected with the lower mounting plate through screws, and the motor is connected with the rotating main shaft through the transmission device and drives the rotating suction cup to rotate through the rotating main shaft.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor wafer cleaning and drying technology, specifically relating to a wafer vacuum clamping and rotating device. Background Technology

[0002] With the continuous advancement of semiconductor technology, chip integration is increasing, linewidth is shrinking, and the quality requirements for wafers are becoming increasingly stringent. For advanced semiconductor processes, such as nanoscale processes, the cleanliness requirements for the wafer surface are extremely high. Contaminants on the wafer surface can severely impact the electrical performance of semiconductor devices. For example, metallic impurities can form unnecessary conductive channels in the wafer, increasing the risk of leakage and reducing the device's insulation performance; organic contaminants may cause changes in the device's threshold voltage, affecting its switching characteristics. Only through thorough cleaning processes can the interference of these impurities on device performance be minimized, allowing the chip to operate normally according to design requirements and ensuring its high-speed, low-power performance indicators are achieved. In the numerous processes of wafer manufacturing, such as oxidation, diffusion, photolithography, etching, and ion implantation, each step may introduce new impurities or contaminants. These must be removed promptly through cleaning processes to ensure chip quality and performance, thereby improving overall product yield. Improper cleaning can lead to residual contaminants, surface damage, or changes in surface properties, potentially affecting processes such as photoresist coating and thin film deposition, thus impacting the overall chip manufacturing quality.

[0003] There are two main types of wafer cleaning methods: dry cleaning and wet cleaning. Mechonic spraying is a highly efficient wet cleaning method that combines mechonic wave energy with spray cleaning. Through a specially designed nozzle, high-frequency sound waves (typically in the megahertz range) generated by a mechonic transducer are transmitted into the sprayed water stream. When the water stream carrying mechonic energy impacts the wafer surface, the high-speed flow of the water and the high-frequency vibration of the mechonic waves work together to generate a powerful mechanical impact force and a microscopic agitation effect. This action effectively removes various contaminants from the wafer surface, such as microparticles, organic matter, and metallic impurities.

[0004] During wafer cleaning, the wafer needs to be fixed in place. To improve cleaning effectiveness, the fixed wafer needs to be rotated for multi-angle cleaning. Existing wafer fixing devices use a clamping method, which results in incomplete wafer cleaning. For example, application number CN202310432516.2, applicant: Suzhou Zhicheng Semiconductor Technology Co., Ltd., provides a wafer cleaning machine, including: a stage, a cavity mechanism disposed on the stage and having an opening, a cleaning unit assembled on the stage and formed on the circumferential outer side of the cavity mechanism, and a wafer rotation mechanism penetrating the stage and extending axially into the cavity mechanism; the cleaning unit includes: several swing arms with nozzles, a brushing device with cleaning brush heads, and several air inlet pipes formed circumferentially on the outer side of the wafer rotation mechanism and extending longitudinally into the cavity mechanism; the cavity mechanism includes: a cavity bottom unit, and an upper guide shroud and a lower guide shroud radially inwardly covering the cavity bottom unit; the wafer cleaning machine further includes: a lifting mechanism for driving the upper and lower guide shrouds to move vertically in the longitudinal direction. This application achieves integrated processing of multiple steps, including wafer cleaning, brushing, nitrogen drying, and separation and recovery of cleaning fluid, thereby improving processing efficiency. The technical drawback of this solution is that the wafer rotation structure uses grippers to fix the wafer, which can lead to incomplete cleaning of contaminants on the wafer surface edges. Furthermore, existing equipment using grippers to fix the wafer during the wafer fabrication process is prone to damaging the wafer surface, ultimately affecting the quality of the finished product. Utility Model Content

[0005] The purpose of this invention is to solve the above-mentioned problems and provide a wafer vacuum clamping and rotating device that can clean the entire surface of a wafer (including the wafer edge), remove contaminants more thoroughly, and make loading and unloading more convenient.

[0006] To solve the above-mentioned technical problems, the technical solution of this utility model is: a wafer vacuum clamping and rotating device, including a rotating chuck, a cross turntable, a rotating spindle, a lifting turntable, wafer support claws, a lifting turntable support column, a telescopic electric cylinder, an upper mounting plate, a lower mounting plate, a side plate, a motor, and a ventilation device. The rotating chuck and the cross turntable are connected and fixed by screws, and the cross turntable and the rotating spindle are connected and fixed by screws. The wafer support claws and the lifting turntable are connected and fixed by screws, the lifting turntable and the lifting turntable support column are connected and fixed by screws, the lifting turntable support column and the telescopic electric cylinder are connected by threads, and the telescopic electric cylinder and the lower mounting plate are connected and fixed by screws. The ventilation device and the lower mounting plate are connected and fixed by screws, the upper mounting plate, the lower mounting plate and the side plate are connected and fixed by screws, the motor and the lower mounting plate are connected and fixed by screws, and the motor is connected to the rotating spindle through a transmission device, and drives the rotating chuck to rotate through the rotating spindle.

[0007] Preferably, the rotating spindle is fitted with a bearing, and the rotating spindle and the bearing are connected through a shaft hole. There are two bearings, which are respectively connected to the upper mounting plate and the lower mounting plate through shaft holes.

[0008] Preferably, a linear bearing is fitted on the lifting platform support column, the lifting platform support column and the linear bearing are engaged through a shaft hole, and the linear bearing is connected and fixed to the upper mounting plate by screws.

[0009] Preferably, a sealing ring is also fitted on the rotating spindle, and the sealing ring is located inside the upper mounting plate.

[0010] Preferably, the transmission device includes a synchronous pulley module and a synchronous belt. The synchronous pulley module includes a motor synchronous pulley and a rotating spindle synchronous pulley. The rotating spindle and the rotating spindle synchronous pulley are connected by a key and have an interference fit. The rotating spindle synchronous pulley and the motor synchronous pulley are connected by a synchronous belt. The motor synchronous pulley and the motor are connected by a key and have an interference fit.

[0011] Preferably, a ventilation device is installed at the bottom of the lower mounting plate. The ventilation device is connected to the rotating suction cup via a rotating spindle. The ventilation device has a cylindrical structure and a ventilation hole in the middle. The rotating spindle has a central through hole in the middle. The rotating suction cup has a rotating suction cup hole. The ventilation hole of the ventilation device is connected to the end of the central through hole of the rotating spindle, and the other end of the central through hole of the rotating spindle is connected to the rotating suction cup hole.

[0012] Preferably, silicon carbide is provided between the ventilation device and the rotating spindle, and the silicon carbide and the rotating spindle are connected through a shaft hole. A silicon carbide sealing ring is fitted on the silicon carbide, and the ventilation device and the silicon carbide are sealed together by the silicon carbide sealing ring.

[0013] Preferably, the ventilation device is equipped with a quick-connect fitting, and the ventilation device and the quick-connect fitting are connected by threads.

[0014] The beneficial effects of this utility model are:

[0015] 1. The wafer vacuum clamping and rotating device provided by this utility model has a simple structure and is easy to use. By using a rotating suction cup to adsorb the wafer, the wafer can be fixed more stably without damaging the wafer.

[0016] 2. This utility model uses a motor to control the rotation of the rotating suction cup, thereby making the wafer more thoroughly cleaned. At the same time, the rotating suction cup is used to adsorb and stop the adsorption of the wafer, which facilitates the loading and unloading of the wafer.

[0017] 3. This utility model uses the wafer support claw and the lifting platform support column to cooperate, thereby making the installation and replacement of wafers more stable and preventing shaking that could affect the quality of the wafer itself.

[0018] 4. This utility model avoids the problem of incomplete cleaning of contaminants on the wafer surface caused by grippers holding the wafer edge.

[0019] The ventilation device adopted by these five utility models not only achieves high-speed rotation of the rotating shaft, but also meets the requirements of vacuum tightness, avoiding the problem of the air tube following the rotation of the rotating shaft. Furthermore, the use of wear-resistant silicon carbide material makes the ventilation device have a longer service life. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a wafer vacuum clamping and rotating device according to the present invention;

[0021] Figure 2 (a)- Figure 2 (b) is a comparative schematic diagram of the side structure of this utility model and the corresponding half section;

[0022] Figure 3 This is a schematic diagram showing the connection between the ventilation device and the rotating spindle of this utility model;

[0023] Figure 4 This is a schematic diagram of the silicon carbide installation principle of this utility model;

[0024] Figure 5 This is a schematic diagram of the connection structure between the rotating spindle and the vacuum suction cup of this utility model.

[0025] Explanation of reference numerals in the attached drawings: 201, Rotary suction cup; 202, Cross turntable; 203, Rotary spindle; 204, Lifting platform; 205, Wafer holder claw; 206, Lifting platform support column; 207, Linear bearing; 208, Telescopic electric cylinder; 209, Upper mounting plate; 210, Lower mounting plate; 211, Side plate; 212, Bearing; 213, Sealing ring; 214, Synchronous pulley module; 215, Synchronous belt; 216, Motor; 217, Ventilation device; 218, Silicon carbide; 219, Quick-connect connector; 221, Silicon carbide sealing ring; 222, Suction cup sealing ring; 223, Rotary spindle sealing ring; 2141, Motor synchronous pulley; 2142, Rotary spindle synchronous pulley. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0027] like Figures 1 to 5As shown, this utility model provides a wafer vacuum clamping and rotating device, including a rotating suction cup 201, a cross turntable 202, a rotating spindle 203, a lifting platform 204, a wafer support claw 205, a lifting platform support column 206, a telescopic electric cylinder 208, an upper mounting plate 209, a lower mounting plate 210, a side plate 211, a motor 216, and a ventilation device 217. The rotating suction cup 201 is fixed to the cross turntable 202 by screws, and the cross turntable 202 is fixed to the rotating spindle 203 by screws. The wafer support claw 205 is fixed to the lifting platform 204 by screws, the lifting platform 204 is fixed to the lifting platform support column 206 by screws, the lifting platform support column 206 is threaded to the telescopic electric cylinder 208, and the telescopic electric cylinder 208 is fixed to the lower mounting plate 210 by screws. The ventilation device 217 is fixed to the lower mounting plate 210 by screws. The upper mounting plate 209, the lower mounting plate 210 and the side plate 211 are fixed to each other by screws. The motor 216 is fixed to the lower mounting plate 210 by screws. The motor 216 is connected to the rotating spindle 203 through a transmission device and drives the rotating suction cup 201 to rotate through the rotating spindle 203.

[0028] A bearing 212 is fitted on the rotating spindle 203. The rotating spindle 203 and the bearing 212 are connected through shaft holes. There are two bearings 212, which are respectively connected to the upper mounting plate 209 and the lower mounting plate 210 through shaft holes.

[0029] In this embodiment, two bearings 212 are respectively embedded in the center of the upper mounting plate 209 and the lower mounting plate 210 to facilitate the rotation of the main shaft 203.

[0030] A linear bearing 207 is fitted on the lifting platform support column 206. The lifting platform support column 206 and the linear bearing 207 are engaged through a shaft hole. The linear bearing 207 is connected and fixed to the upper mounting plate 209 by screws.

[0031] The lifting platform support column 206 passes through the mounting plate 209 and is connected to the telescopic electric cylinder 208. When the telescopic electric cylinder 208 is working, it drives the lifting platform support column 206 to move up and down, thereby causing the lifting platform 204 to move up and down synchronously. In this embodiment, the telescopic electric cylinder 208 is a mature existing technology product.

[0032] like Figure 2 (a)- Figure 2 As shown in (b), a sealing ring 213 is also fitted on the rotating spindle 203, and the sealing ring 213 is located inside the upper mounting plate 209. The sealing ring 213 and the bearing 212 are arranged coaxially. Figure 2 (a) shows a side half-sectional view of the present invention. Figure 2 (b) shows a schematic diagram of the side structure of this utility model.

[0033] The transmission device includes a synchronous pulley module 214 and a synchronous belt 215. The synchronous pulley module 214 includes a motor synchronous pulley 2141 and a rotating spindle synchronous pulley 2142. The rotating spindle 203 and the rotating spindle synchronous pulley 2142 are connected by a key and have an interference fit. The rotating spindle synchronous pulley 2142 and the motor synchronous pulley 2141 are connected by the synchronous belt 215. The motor synchronous pulley 2141 and the motor 216 are connected by a key and have an interference fit.

[0034] When the motor 216 is working, it drives the motor synchronous pulley 2141 to rotate, which in turn drives the rotating spindle synchronous pulley 2142 to rotate via the synchronous belt 215, thereby causing the rotating spindle 203 to rotate, and finally causing the rotating suction cup 201 to rotate.

[0035] A ventilation device 217 is installed at the bottom of the lower mounting plate 210. The ventilation device 217 is connected to the rotating suction cup 201 through the rotating spindle 203. The ventilation device 217 is a cylindrical ventilation connecting block with a ventilation hole in the middle. The rotating spindle 203 has a rotating spindle central through hole in the middle. The rotating suction cup 201 has a rotating suction cup hole. The ventilation hole of the ventilation device is connected to the end of the rotating spindle central through hole, and the other end of the rotating spindle central through hole is connected to the rotating suction cup hole.

[0036] The rotary table 202 has a central through hole in the middle, and the rotary suction cup 201 has a central hole. The rotary suction cup hole and the central hole are connected, and the central hole is located in the middle of the rotary suction cup 201, with the rotating suction cup surrounding the central hole. The other end of the rotary spindle 203 is connected to the rotary table 202 by screws, and the other end of the central through hole of the rotary spindle is connected to the central through hole of the rotary table 202. A rotary spindle sealing ring 223 is provided between the two components for sealing. At the same time, the rotary table 202 and the rotary suction cup 201 are connected and fixed by screws, and the central through hole is connected to the rotary suction cup hole of the rotary suction cup 201. A suction cup sealing ring 222 is provided between the two components for sealing.

[0037] A silicon carbide 218 is provided between the ventilation device 217 and the rotating spindle 203. The silicon carbide 218 and the rotating spindle 203 are connected through a shaft hole. A silicon carbide sealing ring 221 is fitted on the silicon carbide 218, and the ventilation device 217 and the silicon carbide 218 are sealed together by the silicon carbide sealing ring 221. In this embodiment, the silicon carbide 218 has a ring-shaped structure.

[0038] The ventilation device 217 is equipped with a quick-connect connector 219, and the ventilation device 217 and the quick-connect connector 219 are connected by threads. During use, the quick-connect connector 219 is connected to an existing air pump. The vacuum suction force generated by the existing air pump causes the rotating suction cup 201 to generate suction force, thereby fixing the wafer.

[0039] In this embodiment, the quick-connect connector 219 is an existing product, a standard part, model PC8-G02 (with an outer diameter of 8mm and a thread diameter of G1 / 4 external thread).

[0040] In use, the wafer is placed onto the wafer holder claw 205 by a person or an existing robotic arm. At this time, the lifting platform 204 is at its highest position. The telescopic electric cylinder 208 is activated, and the wafer follows the lifting platform 204 down, finally being placed on the rotating suction cup 201. The lifting platform 204 continues to descend to its lowest point, and the air pump is activated, tightly adsorbing the wafer. While waiting for the wafer to pass through the existing cleaning equipment, after cleaning is completed, the air pump stops, the wafer is released, the telescopic electric cylinder 208 is activated, the lifting platform 204 rises, and the wafer is lifted onto the wafer holder claw 205. When the lifting platform 204 reaches its highest position, the telescopic electric cylinder 208 stops, and the wafer is removed by a person or a robotic arm, completing the entire process.

[0041] During the vacuum clamping and rotation of the wafer, after the wafer is placed on the rotating chuck 201, the air pump is started, the wafer is adsorbed, and the rotating chuck 201 begins to rotate. During the wafer cleaning process, to ensure the high-speed rotation of the rotating spindle 203 without the ventilation device 217 and air pipes rotating with it, wear-resistant silicon carbide 218 is specially selected. The outer ring of the silicon carbide 218 is tightly connected to the inner wall of the ventilation device 217 through a silicon carbide sealing ring 221. The inner ring of the silicon carbide 218 forms a clearance fit with the rotating spindle 203. When the rotating spindle 203 rotates, it creates clearance friction with the inner hole of the silicon carbide 218. Furthermore, the rotating spindle 203 is a hollow shaft; when the air pump is running, this structure generates a pressure difference to create a seal that adsorbs the wafer, preventing the ventilation device 217 and air pipes from rotating with it.

[0042] Those skilled in the art will recognize that the embodiments described herein are intended to help the reader understand the principles of this invention, and should be understood that the scope of protection of this invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific modifications and combinations based on these technical teachings disclosed in this invention without departing from the essence of this invention, and these modifications and combinations are still within the scope of protection of this invention.

Claims

1. A wafer vacuum chucking and rotating device, characterized by: The utility model provides a kind of wafer rotating device, including rotary chuck (201), cross turntable (202), rotary main shaft (203), lifting round table (204), wafer support claw (205), lifting round table support column (206), telescopic electric cylinder (208), upper mounting plate (209), lower mounting plate (210), side plate (211), motor (216) and ventilation device (217), the rotary chuck (201) is fixed by screw connection with cross turntable (202), cross turntable (202) is fixed by screw connection with rotary main shaft (203);The wafer support claw (205) is fixed by screw connection with lifting round table (204), lifting round table (204) is fixed by screw connection with lifting round table support column (206), lifting round table support column (206) is connected by screw thread with telescopic electric cylinder (208), telescopic electric cylinder (208) is fixed by screw connection with lower mounting plate (210);The ventilation device (217) is fixed by screw connection with lower mounting plate (210), upper mounting plate (209), lower mounting plate (210) are fixed by screw connection with side plate (211), motor (216) is fixed by screw connection with lower mounting plate (210), motor (216) is connected with rotary main shaft (203) by transmission device, and rotary chuck (201) is driven to rotate by rotary main shaft (203).

2. The wafer vacuum chucking and rotating device according to claim 1, wherein: The rotary main shaft (203) is sleeved with bearing (212), and the rotary main shaft (203) is connected with the bearing (212) through the shaft hole cooperation, and the number of the bearing (212) is two and is connected with the upper mounting plate (209) and the lower mounting plate (210) through the shaft hole cooperation.

3. The wafer vacuum chucking and rotating device according to claim 1, wherein: The lifting round table support column (206) is sleeved with linear bearing (207), and the lifting round table support column (206) is connected with the linear bearing (207) through the shaft hole, and the linear bearing (207) is fixed with the upper mounting plate (209) by screw connection.

4. The wafer vacuum chucking and rotating device according to claim 1, wherein: The rotary main shaft (203) is also sleeved with sealing ring (213), and the sealing ring (213) is located in the upper mounting plate (209).

5. The wafer vacuum chucking and rotating device according to claim 1, wherein: The transmission device includes synchronous pulley module (214) and synchronous belt (215), and the synchronous pulley module (214) includes motor synchronous pulley (2141) and rotary main shaft synchronous pulley (2142), the rotary main shaft (203) is connected with the rotary main shaft synchronous pulley (2142) through the key and interference fit, the rotary main shaft synchronous pulley (2142) is connected with the motor synchronous pulley (2141) through the synchronous belt (215), and the motor synchronous pulley (2141) is connected with the motor (216) through the key and interference fit.

6. The wafer vacuum chucking and rotating device according to claim 1, wherein: The bottom of the lower mounting plate (210) is provided with a ventilation device (217) connected with the rotary chuck (201) through a rotating shaft (203), the ventilation device (217) is a cylindrical structure, a ventilation hole is arranged in the middle of the ventilation device (217), a central through hole is arranged in the middle of the rotating shaft (203), a rotary chuck hole is arranged on the rotary chuck (201), the ventilation hole is communicated with the end of the central through hole, and the other end of the central through hole is communicated with the rotary chuck hole.

7. The wafer vacuum chucking and rotating device according to claim 1, wherein: Silicon carbide (218) is arranged between the ventilation device (217) and the rotating shaft (203), the silicon carbide (218) is connected with the rotating shaft (203) through a shaft hole, a silicon carbide sealing ring (221) is sleeved on the silicon carbide (218), and the ventilation device (217) and the silicon carbide (218) are sealingly connected through the silicon carbide sealing ring (221).

8. The wafer vacuum chucking and rotating device according to claim 1, wherein: The ventilation device (217) is provided with a quick plug connector (219), and the ventilation device (217) and the quick plug connector (219) are connected through threads.

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