Film pressing head
By introducing a pressure guide in the pressure head, the problem of uneven solder distribution was solved, and uniform solder distribution in the welding area was achieved, thereby improving welding quality and product reliability.
Patent Information
- Application Number
- CN202422902872.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-11-26
AI Technical Summary
In existing technologies, the solder distribution is uneven during the soldering process of semiconductor products, especially at the corners of the soldering area where solder is often lacking, resulting in gaps after chip placement, which affects the soldering quality and product reliability.
Design a molding head with molding space and receiving space, and set molding guide in receiving space. The guide guide guides the solder during molding to ensure uniform solder distribution, especially at the corners of the welding area.
The design of the guide component improves the uniformity of solder placement, ensuring that the solder fully covers the welding area, thereby enhancing welding quality and product reliability.
Smart Images
Figure CN223798694U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and in particular to a pressing head. Background Technology
[0002] Some semiconductor products use leadframes as the carrier for chip placement. Before packaging, a soldering material (such as solder paste) is applied to the soldering areas of the leadframe using a laminating head. The chip is then placed onto the soldering material in the soldering areas (such as the base island area) of the leadframe, and soldered to the soldering area using the soldering material. The application of the soldering material directly affects the soldering quality and product reliability. Summary of the Invention
[0003] This application provides a pressure head, which includes:
[0004] A film pressing head body has a film pressing space with an opening facing one side, and an accommodating space communicating with the film pressing space is provided inside the film pressing space; wherein, the film pressing head body has a film pressing side wall and a film pressing bottom wall forming the film pressing space, and the film pressing bottom wall is arranged around the accommodating space;
[0005] A pressure-forming guide is disposed in the receiving space and extends into the pressure-forming space to guide the solder in the pressure-forming space when the pressure-forming head performs pressure-forming on the solder; wherein the extension length of the pressure-forming guide in the depth direction of the pressure-forming space is less than the depth of the pressure-forming space.
[0006] In some embodiments, the pressure head body includes a sidewall surrounding the receiving space and the pressure space, the bottom wall surface of the pressure head being a stepped surface on the sidewall facing the opening; the pressure guide is mounted on the sidewall.
[0007] In some embodiments, the pressure head body includes four sidewalls connected in sequence, the four sidewalls being arranged opposite each other in pairs, and the connection between two adjacent sidewalls forming a connection corner;
[0008] At least one sidewall is provided with a pressure-film guide, the inner wall of each sidewall is a flat wall surface, and the pressure-film guide has a guide surface at an angle of 30°-50° to the inner wall of the sidewall on which it is provided, so as to guide part of the solder to the corner where the sidewall on which the pressure-film guide is provided connects with the adjacent sidewall.
[0009] In some embodiments, the included angle is 40°.
[0010] In some embodiments, the pressing head has four pressing guides, each of which is correspondingly disposed on a side wall; wherein each pressing guide has two opposing guide surfaces, and a first connecting side and a second connecting side connecting the two guide surfaces, the width of the first connecting side being greater than the width of the second connecting side, the first connecting side facing the side wall on which it is disposed, and the second connecting side facing away from the side wall on which it is disposed; there is an included angle of 30°-50° between each of the two guide surfaces and the first connecting side.
[0011] In this configuration, each guide surface forms a flow channel with the guide surface that is closer to the other of the two guide surfaces of the adjacent pressure film guide to guide the solder to the corresponding connection corner.
[0012] In some embodiments, the sidewall is provided with at least a first mounting portion, and the pressure film guide is provided with a second mounting portion. The first mounting portion and the second mounting portion cooperate with each other to install and fix the pressure film guide.
[0013] In some embodiments, the first mounting portion and the second mounting portion are both mounting holes, and the pressure head further includes a fixing member for being disposed in the first mounting portion and the second mounting portion;
[0014] The fastener is the set-top screw.
[0015] In some embodiments, the extension length of the pressure film guide in the depth direction of the pressure film space is adjustable;
[0016] For the pressing head including four pressing guides, the extension length of at least one of the four pressing guides in the depth direction of the pressing space is adjustable.
[0017] In some embodiments, the area of the cross section of the pressure-film guide extending into the pressure-film space in the direction perpendicular to the depth of the pressure-film space is a first area, and the area of the cross section of the pressure-film space in the direction perpendicular to the depth of the pressure-film space is a second area, and the ratio between the first area and the second area is 0.3-0.5.
[0018] In some embodiments, the surface of the pressure-film guide facing the opening has a consistent extension length in the depth direction of the pressure-film space.
[0019] The main technical effects achieved by the embodiments of this application are:
[0020] The pressing head provided in this application embodiment is configured to have a pressing space and a receiving space, and a pressing guide that can extend into the pressing space is provided in the receiving space to guide the solder in the pressing space when the pressing head presses and forms the solder, so as to facilitate the formation of a solder layer in areas where solder is easily lacking and improve the uniformity of solder placement. Attached Figure Description
[0021] Figure 1 This is a side view of a film pressing head provided in an exemplary embodiment of this application;
[0022] Figure 2 This is a bottom view of a pressure head provided in an exemplary embodiment of this application;
[0023] Figure 3 This is a side view of a pressure head without a pressure guide provided in an exemplary embodiment of this application;
[0024] Figure 4 yes Figure 3 A bottom view of the structure shown;
[0025] Figure 5 This is a perspective view of a pressure-film guide provided in an exemplary embodiment of this application;
[0026] Figure 6 This is a bottom view of a pressure-film guide provided in an exemplary embodiment of this application;
[0027] Figure 7 This is a schematic diagram of a chip structure after a molding head is used to mold solder on a solder placement area using an exemplary embodiment of this application. Detailed Implementation
[0028] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0029] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0030] The following is in conjunction with the appendix Figures 1 to 7 This application provides a detailed description of some embodiments of the pressure head. Unless otherwise specified, features in the following embodiments can be combined with each other.
[0031] Please refer to Figure 1 and combine when necessary Figures 2 to 7 As shown, this application provides a pressure head 100, which includes a pressure head body 10 and a pressure guide 20.
[0032] The pressing head body 10 has a pressing space 102 with an opening 1020 facing one side, and an accommodating space 101 communicating with the pressing space 102 is provided inside the pressing space 102; wherein, the pressing head body 10 has a pressing side wall 1021 and a pressing bottom wall 1022 forming the pressing space 102, and the pressing bottom wall 1022 is arranged around the accommodating space 101.
[0033] The pressure-forming guide 20 is disposed in the receiving space 101 and extends into the pressure-forming space 102 to guide the solder in the pressure-forming space 102 when the pressure-forming head 100 performs pressure-forming on the solder; wherein, the extension length H2 of the pressure-forming guide 20 in the depth direction of the pressure-forming space 102 is less than the depth H1 of the pressure-forming space 102, so that the pressure-forming guide 20 does not affect the thickness of the solder in its area during the process of guiding the solder.
[0034] The aforementioned pressing head 100 is configured to have a pressing space 102 and a receiving space 101, and a pressing guide 20 that can extend into the pressing space 102 is provided in the receiving space 101 to guide the solder in the pressing space 102 when the pressing head 100 presses and forms the solder, so as to facilitate the formation of a solder layer in areas where solder is easily lacking and improve the uniformity of solder placement.
[0035] The extension length H2 of the pressure guide 20 in the depth direction of the pressure space 102 can be set according to the thickness required by the specific solder and the solder flow requirements.
[0036] The solder mentioned in this application can be tin-lead solder, lead-free solder, or other solders used to solder chips onto solder areas. For example, it can be used to solder chips onto solder areas on leadframe substrates or other carriers. This solder can be used to fix the chip in place. In some products, the solder can also simultaneously achieve electrical connection between the chip and the soldering area structure.
[0037] In some embodiments, the pressure head body 10 includes a sidewall 111 surrounding the receiving space 101 and the pressure space 102. The pressure bottom wall surface 1022 is a stepped surface on the sidewall 111 facing the opening 1020. The pressure bottom wall surface 1022 is disposed around the junction of the receiving space 101 and the pressure space 102. The pressure guide 20 is mounted on the sidewall 111.
[0038] In some embodiments, the bottom wall surface 1022 of the molding die may be a flat wall surface. In other embodiments, the bottom wall surface of the molding die may also be configured to include a main body wall surface located in the inner circle and an excess solder holding groove located in the outer circle of the main body wall surface and recessed therein, so as to accommodate excess solder during the molding die forming of solder, which is beneficial to further improve the molding die forming effect of solder.
[0039] Combination Figure 3 As shown, the sidewall 111 includes a receiving space sidewall 1111 forming a receiving space 101 and a pressing sidewall 1112 forming a pressing space 102. The pressing bottom wall surface 1022 is the wall surface of the receiving space sidewall 1111 facing the opening 1020. The pressing sidewall surface 1021 is the inner wall surface of the pressing sidewall 1112.
[0040] In some embodiments, the pressure head body 10 includes four sidewalls 111 connected in sequence, the four sidewalls 111 being arranged opposite each other in pairs, and the connection between two adjacent sidewalls 111 forming a connection corner 1001. The connection corner 1001 includes the corner at the connection between adjacent receiving space sidewalls 1111 and the corner at the connection between adjacent pressure sidewalls 1112.
[0041] The four sidewalls 111 are connected in sequence and arranged opposite each other in pairs. The resulting accommodating space 101 and the pressing space 102 can be roughly rectangular in cross section perpendicular to the depth direction Z.
[0042] The inventors discovered through research that in some semiconductor structures, the corners of the solder placement area are prone to solder deficiency, resulting in blank areas with no solder after chip mounting. Based on this, the pressure film guide 20 can be configured as a guide structure capable of directing solder to the required corners.
[0043] In some embodiments, at least one sidewall 111 is provided with a pressure-forming guide 20. The inner wall of each sidewall 111 (i.e., the inner wall of the accommodating space sidewall 1111) is a flat wall surface. The pressure-forming guide 20 has a guide surface 23 that forms an angle α of 30°-50° (including the endpoint angle) with the inner wall of the sidewall 111 to guide a portion of the solder to the corner 1001 where the sidewall 111 with the pressure-forming guide 20 connects to the adjacent sidewall 111. The guide surface 23 is a flat wall surface.
[0044] Understandably, the pressure film guide 20 is mainly used to guide some of the solder toward the corner direction of the connection between adjacent pressure film sidewalls 1112.
[0045] In some embodiments, the included angle α is 40°, and the guiding surface 23 has a better guiding effect.
[0046] It should be noted that the inner wall of the sidewall does not necessarily have to be a straight surface. In some other embodiments, the guide surface can also be set to other shapes, such as a curved surface with a certain curvature. The guide surface as a whole only needs to be able to guide the solder towards the corresponding corner. The included angle α can also be other angles other than 30°-50°, set according to specific needs.
[0047] In some embodiments, the pressing head 100 has four pressing guides 20, each pressing guide 20 being correspondingly disposed on a sidewall 111; wherein each pressing guide 20 has two opposing guide surfaces 23, and a first connecting side surface 24 and a second connecting side surface 22 connecting the two guide surfaces 23, the width of the first connecting side surface 24 being greater than the width of the second connecting side surface 22, the first connecting side surface 24 facing the disposed sidewall 111, and the second connecting side surface 22 facing away from the disposed sidewall 111. Each of the two guide surfaces 23 has an included angle of 30°-50° with the first connecting side surface 24.
[0048] In this configuration, a flow channel 1002 is formed between each guide surface 23 and the guide surface 23 closer to the other of the two guide surfaces 23 of the adjacent pressure-film guide 20, to guide the solder to a corresponding connection corner 1001. Figure 2 As shown, the four pressure-film guides 20 can form four guide channels 1002 corresponding to the four corners 1001 respectively.
[0049] The pressure-forming guide 20 may also include a top surface 21 and a bottom surface facing away from the top surface 21. When the pressure-forming guide 20 is disposed in the receiving space 101, its top surface 21 may face the side where the opening 1020 of the guide space 102 is located.
[0050] Of course, the angle between the two guide surfaces 23 and the first connecting side surface 24 can be the same or different.
[0051] It should be noted that in some other embodiments, the cross-sectional shape of the accommodating space and the pressing space can also be other shapes. The pressing head body may also include multiple other sidewalls, which can be configured according to specific needs. The pressing guide 20 may also be multiple other types.
[0052] It should also be noted that in some other embodiments, the pressure film guide can also be configured to guide the solder to other areas that need it (such as areas that are prone to solder shortage or insufficient solder thickness), such as other edge areas of the solder area, or areas with less solder, etc. Accordingly, the pressure film guide can be configured according to specific needs.
[0053] Combination Figures 2 to 4 As shown, in some embodiments, the sidewall 111 is provided with at least a first mounting portion 103, and the pressure film guide 20 is provided with a second mounting portion 201. The first mounting portion 103 and the second mounting portion 201 cooperate with each other to install and fix the pressure film guide 20.
[0054] In some embodiments, the first mounting portion 103 and the second mounting portion 201 are both mounting holes, and the pressing head 100 further includes a fixing member 40 for being disposed in the first mounting portion 103 and the second mounting portion 201. This arrangement facilitates the installation and fixing between the pressing guide 20 and the pressing head body 10.
[0055] In some embodiments, the fastener 40 is a stop screw.
[0056] It should be noted that in some other embodiments, the first mounting part and the second mounting part can also be other mounting structures, such as one being a mounting groove and the other being a mounting protrusion.
[0057] It should also be noted that, in some other embodiments, the pressure membrane guide can also be disposed on the bottom wall of the receiving space on the side opposite to the pressure membrane space.
[0058] In some embodiments, the extension length H2 of the pressure guide 20 in the depth direction Z of the pressure space 102 is adjustable, so that the pressure head 100 can be used for solder guiding for a variety of different needs, and has greater applicability.
[0059] Accordingly, in some embodiments, the length of the pressure-membrane guide 20 in the depth direction of the accommodating space 101 (which is in the same direction as the depth direction Z of the pressure-membrane space 102) is less than or equal to the depth of the accommodating space 101.
[0060] When the pressure head includes multiple pressure guides, the extension length H2 of at least one pressure guide in the depth direction Z of the pressure space 102 is adjustable.
[0061] Combination Figure 2 As shown, the pressing head 100 includes four pressing guides 20, and the extension length H2 of at least one of the four pressing guides 20 in the depth direction Z of the pressing space 102 is adjustable.
[0062] The pressure membrane guide 20 can be raised or lowered as needed.
[0063] For the pressure-forming guide 20 whose extension length H2 in the depth direction Z of the pressure-forming space 102 is adjustable, the first mounting part 103 and the second mounting part 201 need to be adjusted accordingly to fix the pressure-forming guide 20 when the extension length H2 in the depth direction Z of the pressure-forming space 102 reaches the required length. Taking the two mounting parts as mounting holes as an example, the mounting holes can be elongated mounting holes extending in the depth direction Z of the pressure-forming space 102, or multiple mounting holes arranged in the depth direction Z of the pressure-forming space 102.
[0064] In some embodiments, the length of the pressure-film guide 20 in the depth direction of the receiving space 101 (which is in the same direction as the depth direction Z of the pressure-film space 102) is less than or equal to the depth of the receiving space 101, so that the pressure-film guide 20 can be retracted into the receiving space 101 when not needed.
[0065] In some embodiments, the pressure guide 20 extending into the pressure space 102 has a first area S1 on the surface of its side facing the opening 1020 in the Z-direction perpendicular to the depth of the pressure space 102, and a second area S2 on the cross-section of the pressure space 102 in the Z-direction perpendicular to the depth of the pressure space 102. The ratio between the first area S1 and the second area S2 is 0.3-0.5 (including the endpoint value). This allows for solder flow guidance without affecting the overall pressure molding of the solder.
[0066] Combination Figure 2 As shown, for a device including multiple pressure-film guides 20, the first area S1 is the sum of the areas of the cross sections of the multiple pressure-film guides 20 in the direction Z perpendicular to the depth of the pressure-film space 102.
[0067] In some embodiments, the second area S2 is the area of the opening 1020 of the pressure film space 102.
[0068] In some embodiments, the surface of the pressure film guide 20 facing the opening 1020 has the same extension length H2 in the depth direction Z of the pressure film space 102, and the top surface 21 of the pressure film guide 20 is a plane with the same extension length H2 in each region.
[0069] Accordingly, the first area S1 can be the sum of the top surfaces 21 of each pressure-film guide 20 extending into the pressure-film space 102.
[0070] In other embodiments, the specific surface shape of the top surface 21 can also be set as needed.
[0071] Please refer to Figure 1As shown, in some embodiments, the film pressing head 100 may further include a mounting structure 13 and a connecting structure 12. The connecting structure 12 is located between the mounting structure 13 and the film pressing head body 10, and is used to connect the mounting structure and the film pressing head body 10. The mounting structure 13 is used to mount the film pressing head 100 onto the film pressing equipment. The mounting structure has a mounting groove with an opening 1020 facing away from the opening 1020 of the film pressing head body 10, for docking and fixing with a suitable mounting structure.
[0072] In some embodiments, both the mounting structure 13 and the connecting structure 12 are located on the side opposite to the opening 1020.
[0073] Based on the above description, and in combination Figure 7 Taking the placement of solder 300 on the base island 200 of the lead frame and the soldering of chip 400 onto the base island 200 as an example, the raw material of solder 300 (such as solder wire) can first be placed on a preset soldering area on the base island 200, and the solder 300 can be heated and melted. Then, the pressing head 100 provided in this application is used to press and shape the solder 300 in the lead frame solder area (i.e., base island 200). Subsequently, the chip 400 is placed on the solder 300 and cooled and solidified to form a shape as shown in the image. Figure 7 The results are shown. Figure 7 As shown, the solder 300 formed by the laminating head 100 provided in this application can fill the area of the chip 400, especially the corners of the chip 400, after the chip 400 is set and the solder 300 is cured.
[0074] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.
[0075] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
Claims
1. A pressure-pressing head, characterized in that, include: A film pressing head body has a film pressing space with an opening facing one side, and an accommodating space communicating with the film pressing space is provided inside the film pressing space; wherein, the film pressing head body has a film pressing side wall and a film pressing bottom wall forming the film pressing space, and the film pressing bottom wall is arranged around the accommodating space; A pressure-forming guide is disposed in the receiving space and extends into the pressure-forming space to guide the solder in the pressure-forming space when the pressure-forming head performs pressure-forming on the solder; wherein the extension length of the pressure-forming guide in the depth direction of the pressure-forming space is less than the depth of the pressure-forming space.
2. The pressure head as described in claim 1, characterized in that, The pressure head body includes a side wall surrounding the receiving space and the pressure space, and the bottom wall surface of the pressure head is a stepped surface on the side wall facing the opening; the pressure guide is installed on the side wall.
3. The pressure head as described in claim 2, characterized in that, The pressure head body includes four sidewalls connected in sequence, with the four sidewalls arranged opposite to each other in pairs, and the connection between two adjacent sidewalls forming a connection corner. At least one sidewall is provided with a pressure-film guide, the inner wall of each sidewall is a flat wall surface, and the pressure-film guide has a guide surface at an angle of 30°-50° to the inner wall of the sidewall on which it is provided, so as to guide part of the solder to the corner where the sidewall on which the pressure-film guide is provided connects with the adjacent sidewall.
4. The pressure head as described in claim 3, characterized in that, The included angle is 40°.
5. The pressure head as described in claim 3, characterized in that, The pressing head has four pressing guides, each corresponding to a side wall. Each pressing guide has two opposing guide surfaces, and a first connecting side and a second connecting side connecting the two guide surfaces. The width of the first connecting side is greater than the width of the second connecting side. The first connecting side faces the side wall on which it is set, while the second connecting side faces away from the side wall on which it is set. There is an angle of 30°-50° between each of the two guide surfaces and the first connecting side. In this configuration, each guide surface forms a flow channel with the guide surface that is closer to the other of the two guide surfaces of the adjacent pressure film guide to guide the solder to the corresponding connection corner.
6. The pressure head as described in claim 2, characterized in that, The side wall is provided with at least a first mounting portion, and the pressure film guide is provided with a second mounting portion. The first mounting portion and the second mounting portion cooperate with each other to install and fix the pressure film guide.
7. The pressure head as described in claim 6, characterized in that, Both the first mounting portion and the second mounting portion are mounting holes, and the pressing head further includes a fixing member for being disposed in the first mounting portion and the second mounting portion; The fastener is the set-top screw.
8. The pressure head as described in any one of claims 1 to 7, characterized in that, The extension length of the pressure-pressing guide in the depth direction of the pressure-pressing space is adjustable; For the pressing head including four pressing guides, the extension length of at least one of the four pressing guides in the depth direction of the pressing space is adjustable.
9. The pressure head as described in claim 1, characterized in that, The area of the cross section of the pressure-film guide extending into the pressure-film space in the direction perpendicular to the depth of the pressure-film space is the first area, and the area of the cross section of the pressure-film space in the direction perpendicular to the depth of the pressure-film space is the second area. The ratio between the first area and the second area is 0.3-0.
5.
10. The pressure head as described in claim 1, characterized in that, The surface of the pressure-film guide facing the opening has the same extension length in the depth direction of the pressure-film space.