Wafer cleaning device of edge grinding machine

Abstract

The utility model discloses a wafer cleaning device of an edge grinding machine, which comprises a rack, a first push rod and a second push rod are symmetrically arranged on the rack in the vertical direction, the first push rod is rotatably arranged on the rack and is driven by a first motor to rotate, and the second push rod is positioned at the lower part and is driven by a first cylinder to vertically move on the rack. Two horizontal cleaning rollers are arranged on one side of the first ejector rod and one side of the second ejector rod, the two cleaning rollers are arranged up and down, the cleaning rollers are rotationally installed on installation plates and driven by a second motor to rotate, and the two installation plates are installed on the support through a synchronous driving mechanism to synchronously move in the same direction or opposite directions. The support is installed on the rack through the horizontal moving mechanism and moves in the direction of the first ejector rod and the second ejector rod, the rack is further provided with a spraying pipe, the cleaning roller rotates to preliminarily clean the rotating wafer, particulate matter on the surface of the wafer is removed, and therefore the burden of follow-up cleaning can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cleaning technical field, specifically to a kind of wafer cleaning device of edge grinder. BACKGROUND

[0002] The edge of wafer needs to be ground to lose sharpness in the processing procedure of wafer. The wafer is clamped by clamping mechanism and rotated during grinding, and then the grinding head is close to the edge of wafer to grind. Cooling water is needed to cool during the grinding process. However, the particles generated during grinding cannot be completely washed away by cooling water, and a large number of particles will adhere to the wafer, and the lower surface of the wafer cannot be washed by the cooling water, thereby increasing the burden of subsequent wafer cleaning. SUMMARY

[0003] In order to solve the above problems in the prior art, the utility model provides a wafer cleaning device of edge grinder.

[0004] In order to achieve the above technical effects, the utility model adopts the following scheme:

[0005] A wafer cleaning device of edge grinder, comprising a rack, a first top rod and a second top rod are symmetrically arranged on the rack in the vertical direction, the first top rod is rotatably installed on the rack and driven to rotate by a first motor, the second top rod is located below, and the lower end of the second top rod is connected with a rotating transmission rod, the transmission rod is driven to move vertically on the rack by a first cylinder, two horizontal cleaning rollers are arranged on one side of the first top rod and the second top rod, and the two cleaning rollers are arranged one above the other, the cleaning rollers are rotatably installed on mounting plates and driven to rotate by a second motor, two mounting plates are installed on a support by a synchronous driving mechanism to move synchronously towards or away from each other, the support is installed on the rack by a horizontal moving mechanism and moves towards the direction of the first top rod and the second top rod, and a spray pipe is further arranged on the rack.

[0006] In the preferred technical solution, the synchronous driving mechanism comprises a vertical slide rail vertically arranged on the support, two mounting plates are slidably installed on the vertical slide rail, and a double-threaded screw rod is arranged through the two mounting plates, the double-threaded screw rod is arranged in parallel with the vertical slide rail, and one end of the double-threaded screw rod is connected with a third motor.

[0007] In the preferred technical solution, the horizontal moving mechanism comprises a horizontal guide rail horizontally installed on the rack, a moving seat is slidably installed on the horizontal guide rail, the moving seat is driven to move by a second cylinder, and the support is fixedly arranged on the moving seat.

[0008] In the preferred technical solution, the lower end of the first top rod and the upper end of the second top rod are both fixedly provided with rubber clamping heads.

[0009] Preferably, a first synchronous wheel is fixed on the first top rod, an output end of the first motor is provided with a second synchronous wheel, and the first synchronous wheel and the second synchronous wheel are connected through a synchronous belt transmission.

[0010] Compared with the prior art, the beneficial effects are:

[0011] The wafer is grinded, the two cleaning rollers are driven by the horizontal moving mechanism to move above and below the wafer, and the two cleaning rollers are clamped to the wafer under the driving of the synchronous driving mechanism, the water sprayed by the spray pipe is on the surface of the wafer, the cleaning roller rotates to preliminarily clean the wafer in rotation, and the particles on the surface of the wafer are removed, so that the burden of subsequent cleaning can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a structural schematic view of the utility model.

[0013] Figure 2 is a top view schematic view of the synchronous driving mechanism in the utility model.

[0014] The drawings are as follows: 1, rack; 2, first top rod; 3, second top rod; 4, first motor; 5, first air cylinder; 6, cleaning roller; 7, mounting plate; 8, second motor; 9, support; 10, spray pipe; 11, vertical slide rail; 12, double-threaded screw rod; 13, third motor; 14, horizontal guide rail; 15, moving seat; 16, second air cylinder; 17, rubber clamping head; 18, first synchronous wheel; 19, second synchronous wheel; 20, synchronous belt. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.

[0016] The wafer cleaning device of the edge grinder comprises a frame 1, a first top rod 2 and a second top rod 3 are symmetrically arranged on the frame 1 in the vertical direction, the first top rod 2 is rotatably installed on the frame 1 and is driven to rotate by a first motor 4, the second top rod 3 is located below, the lower end of the second top rod 3 is connected with a rotating transmission rod, the transmission rod is driven to vertically move on the frame 1 by a first air cylinder 5, one side of the first top rod 2 and the second top rod 3 is provided with two horizontal cleaning rollers 6, the two cleaning rollers 6 are arranged one above the other, the cleaning roller 6 is rotatably installed on a mounting plate 7 and is driven to rotate by a second motor 8, the two mounting plates 7 are installed on a support 9 to synchronously move towards or away from each other by a synchronous driving mechanism, the support 9 is installed on the frame 1 to move towards the first top rod 2 and the second top rod 3 by a horizontal moving mechanism, and the frame 1 is further provided with a spray pipe 10, the spray pipe 10 is provided with at least two, which are located above and below the wafer, respectively, and water is sprayed from above and below the wafer towards the wafer.

[0017] The first top rod 2 and the second top rod 3 are vertically arranged and coaxially arranged, the wafer is placed between the first top rod 2 and the second top rod 3, the second top rod 3 is lifted under the drive of the first air cylinder 5 and the transmission rod, and the second top rod 3 and the transmission rod are rotatably connected through a bearing, so as to clamp the wafer, and the first top rod 2 is driven to rotate under the drive of the first motor 4, so as to drive the wafer to rotate, which is convenient for polishing the edge of the wafer, and the polishing head is provided with one side. After the wafer is polished, the two cleaning rollers 6 are moved to above and below the wafer under the drive of the horizontal moving mechanism, and the two cleaning rollers 6 clamp the wafer under the drive of the synchronous driving mechanism, the spray pipe 10 sprays water on the surface of the wafer, and the cleaning roller 6 rotates to preliminarily clean the wafer in rotation, so as to remove the particles on the surface of the wafer, thereby reducing the burden of subsequent cleaning.

[0018] Preferably, the synchronous driving mechanism comprises a vertical slide rail 11 vertically arranged on the support, the two mounting plates 7 are slidably arranged on the vertical slide rail 11, and a double-threaded screw rod 12 is arranged on the two mounting plates 7, the double-threaded screw rod 12 is arranged in parallel with the vertical slide rail 11, and one end of the double-threaded screw rod 12 is connected with a third motor 13. The third motor 13 drives the double-threaded screw rod 12 to rotate, thereby driving the two mounting plates 7 to synchronously move towards or away from each other.

[0019] Preferably, the horizontal moving mechanism comprises a horizontal guide rail 14 horizontally installed on the frame 1, a moving seat 15 is slidably arranged on the horizontal guide rail 14, the moving seat 15 is driven to move by a second air cylinder 16, and the support 9 is fixedly arranged on the moving seat 15.

[0020] Preferably, the lower end of the first ejector rod 2 and the upper end of the second ejector rod 3 are fixedly provided with rubber clamping heads 17.

[0021] Preferably, the first ejector rod 2 is fixedly provided with a first synchronous wheel 18, the output end of the first motor 4 is provided with a second synchronous wheel 19, and the first synchronous wheel 18 and the second synchronous wheel 19 are drivingly connected through a synchronous belt 20.

[0022] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0023] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0024] Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

Claims

1. A wafer cleaning device of an edge grinder, characterized by, The utility model provides a kind of cleaning device, including rack (1), the first top rod (2) and second top rod (3) are symmetrically provided on the rack (1) in vertical direction, the first top rod (2) is rotatably installed on rack (1) and is driven to rotate by first motor (4), the second top rod (3) is below, the lower end of second top rod (3) is connected with rotating transmission rod, the transmission rod is driven to move vertically on rack (1) by first cylinder (5), one side of the first top rod (2) and second top rod (3) is equipped with two horizontal cleaning rollers (6), two cleaning rollers (6) are arranged one above the other, the cleaning roller (6) is rotatably installed on mounting plate (7) and is driven to rotate by second motor (8), two mounting plates (7) are installed on support (9) by synchronous drive mechanism and move synchronously towards or opposite, the support (9) is installed on rack (1) by horizontal moving mechanism and moves towards the direction of first top rod (2) and second top rod (3), the rack (1) is also equipped with spray pipe (10).

2. The wafer cleaning apparatus of the edge polisher according to claim 1, wherein The synchronous drive mechanism includes vertical slide rail (11) vertically arranged on support, two mounting plates (7) are slidably mounted on vertical slide rail (11), and two mounting plates (7) are provided with double-threaded screw rod (12) passing through, the double-threaded screw rod (12) is arranged in parallel with vertical slide rail (11), one end of the double-threaded screw rod (12) is connected with third motor (13).

3. The wafer cleaning apparatus of the edge polisher according to claim 1, wherein The horizontal moving mechanism includes horizontal guide rail (14) horizontally mounted on rack (1), moving seat (15) is slidably installed on horizontal guide rail (14), the moving seat (15) is driven to move by second cylinder (16), and the support (9) is fixedly arranged on the moving seat (15).

4. The wafer cleaning apparatus of the edge polisher according to claim 1, wherein The lower end of the first top rod (2) and the upper end of the second top rod (3) are both fixedly provided with rubber clamping head (17).

5. The wafer cleaning apparatus of the edge polisher according to claim 1, wherein The first top rod (2) is fixedly provided with first synchronous wheel (18), the output end of the first motor (4) is provided with second synchronous wheel (19), and the first synchronous wheel (18) and the second synchronous wheel (19) are drivingly connected by synchronous belt (20).

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