PCB fine blanking device and die

Abstract

The utility model discloses a PCB fine blanking device which comprises a fine blanking module, the fine blanking module is provided with an upper die and a lower die, the upper die is connected with the lower die, the upper die is provided with a plurality of first positioning supporting columns, the lower die is provided with first positioning grooves matched with the first positioning supporting columns in number, the first positioning supporting columns are embedded into the first positioning grooves, and the first positioning supporting columns are connected with the lower die. The upper die is provided with a convex-surface shearing opening, the lower die is provided with a concave-surface shearing opening, and the fine blanking module is used for impacting and shaping the PCB; the auxiliary positioning module is provided with a first auxiliary positioning unit, a second auxiliary positioning unit and a connecting unit, the first auxiliary positioning unit is arranged on the side, away from the lower mold, of the upper mold, and the second auxiliary positioning unit is arranged on the side, away from the upper mold, of the lower mold; the first auxiliary positioning unit and the second auxiliary positioning unit are connected through the connecting unit, and the auxiliary positioning module is used for accurately positioning the PCB. According to the technical scheme of the embodiment, the precision of the PCB fine blanking device can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a fine blanking die technical field especially is concerned with a kind of PCB fine blanking device and mould. BACKGROUND

[0002] At present, small size single PCB is mostly processed by milling edge process, and the appearance of finished product is completed by laser plate marking. However, the efficiency of laser plate marking is low and the cost is high, which leads to low production efficiency of PCB and cannot meet the forming requirements of ±0.01mm high-precision tolerance. SUMMARY

[0003] The utility model aims at at least one of the technical problems existing in prior art. To this end, the utility model provides a kind of PCB fine blanking device and mould, which can realize the efficient production of PCB with high precision.

[0004] On the one hand, according to the PCB fine blanking device of the utility model embodiment, it comprises:

[0005] The fine blanking module is provided with an upper die and a lower die, the upper die is connected with the lower die, the upper die is provided with a plurality of first positioning pillars, the lower die is provided with a first positioning groove matched with the number of the first positioning pillars, the first positioning pillar is embedded into the first positioning groove, the side of the upper die and the lower die is provided with a convex shear opening, the side of the lower die and the upper die is provided with a concave shear opening, and the fine blanking module is used for impacting and shaping the PCB.

[0006] The auxiliary positioning module is provided with a first auxiliary positioning unit, a second auxiliary positioning unit and a connecting unit, the first auxiliary positioning unit is arranged on the side of the upper die away from the lower die, the second auxiliary positioning unit is arranged on the side of the lower die away from the upper die, the first auxiliary positioning unit and the second auxiliary positioning unit are connected through the connecting unit, and the auxiliary positioning module is used for accurately positioning the PCB.

[0007] According to some embodiments of the utility model, the connecting unit is provided with a first connecting sleeve shaft and a second connecting sleeve shaft, the first auxiliary positioning unit is provided with a first fixed plate, the first fixed plate is connected with the upper die, the first fixed plate is provided with a second positioning groove and a third positioning groove, the second auxiliary positioning unit is provided with a second fixed plate, the second fixed plate is connected with the lower die, the second fixed plate is provided with a second positioning support and a third positioning support, the second positioning support and the second positioning groove are connected through the first connecting sleeve shaft, and the third positioning support and the third positioning groove are connected through the second connecting sleeve shaft.

[0008] According to some embodiments of the utility model, the first connecting sleeve shaft is sleeved on the outer surface of the second positioning support, the second connecting sleeve shaft is sleeved on the outer surface of the third positioning support, the outer surface of the first connecting sleeve shaft is provided with a plurality of first through holes and a plurality of bearing beads, the bearing beads are embedded in the first through holes, and the outer surfaces of the plurality of bearing beads are matched with the inner surfaces of the second positioning groove and the third positioning groove.

[0009] According to some embodiments of the utility model, the first connecting sleeve shaft is provided with a first elastic connecting piece, the second connecting sleeve shaft is provided with a second elastic connecting piece, one end of the first elastic connecting piece is connected with the first connecting sleeve shaft, the other end of the first elastic connecting piece is connected with the first fixed plate, one end of the second elastic connecting piece is connected with the second connecting sleeve shaft, and the other end of the second elastic connecting piece is connected with the second fixed plate.

[0010] According to some embodiments of the utility model, the diameter of the second positioning support, the first connecting sleeve shaft and the second positioning groove increases in sequence, and the diameter of the third positioning support, the second connecting sleeve shaft and the third positioning groove increases in sequence.

[0011] According to some embodiments of the utility model, the first elastic connecting piece and the second elastic connecting piece are both springs.

[0012] According to some embodiments of the utility model, the upper die and the lower die are further provided with a plurality of positioning holes, and the positioning holes are used for assisting in positioning the PCB.

[0013] The PCB fine blanking device provided by the utility model has at least the following beneficial effects:

[0014] The fine blanking module is provided with an upper die and a lower die, the upper die is connected with the lower die, the upper die is provided with a plurality of first positioning supports, the lower die is provided with a first positioning groove matched in number with the first positioning supports, the first positioning supports are embedded into the first positioning grooves, one side of the upper die and the lower die in abutment is provided with a convex shear opening, one side of the lower die and the upper die in abutment is provided with a concave shear opening, and the fine blanking module is used for impacting and shaping the PCB board; the auxiliary positioning module is provided with a first auxiliary positioning unit, a second auxiliary positioning unit and a connecting unit, the first auxiliary positioning unit is arranged on one side of the upper die away from the lower die, the second auxiliary positioning unit is arranged on one side of the lower die away from the upper die, and the first auxiliary positioning unit and the second auxiliary positioning unit are connected through the connecting unit, and the auxiliary positioning module is used for accurately positioning the PCB board, according to the technical scheme of the embodiment, the positioning supports and the positioning grooves arranged on the upper die and the lower die are matched with each other, and the PCB half-fine blanking device is further accurately positioned under the action of the auxiliary positioning module, so that the precision of the PCB fine blanking device is improved, and the fine blanking efficiency of the PCB board is improved.

[0015] Additional aspects and advantages of the present application will be described in the following description, some of which will become apparent from the description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description that follows, including the appended drawings, in which:

[0017] Fig. 1 It is a schematic diagram of the overall structure of the PCB fine blanking device of the embodiment of the present application;

[0018] Fig. 2 It is a schematic diagram of the structure of the upper die and the first auxiliary positioning unit of the embodiment of the present application;

[0019] Fig. 3 It is a schematic diagram of the structure of the lower die and the second auxiliary positioning unit of the embodiment of the present application. DETAILED DESCRIPTION

[0020] This part will describe the specific embodiments of the present application in detail, the preferred embodiments of the present application are shown in the drawings, the drawings are used to supplement the description of the text part in the description, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the present application, but it cannot be understood as the limitation of the protection scope of the present application.

[0021] In the description of the utility model, if several meanings are one or more, the meaning of multiple is two or more, greater than, less than, exceed and the like are understood as not including the number, above, below, within and the like are understood as including the number. If it is described to the first, the second is only used for distinguishing the purpose of technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0022] In the description of the utility model, unless otherwise explicitly limited, the words such as setting, installation, connection should be understood in a broad sense, and the person skilled in the art can reasonably determine the specific meaning of the above words in the utility model according to the specific content of the technical scheme.

[0023] Refer to Figs. 1 to 3 The utility model discloses a small size PCB fine punching device, including fine punching module 100, fine punching module 100 is provided with upper die 110 and lower die 120, upper die 110 is connected with lower die 120, upper die 110 is provided with a plurality of first positioning pillar 111, lower die 120 is provided with the first positioning groove 121 matched with the number of first positioning pillar 111, first positioning pillar 111 is embedded into first positioning groove 121, the side of upper die 110 and lower die 120 is attached is provided with convex face shear mouth 112, the side of lower die 120 and upper die 110 is attached is provided with concave face shear mouth 122, fine punching module 100 is used for impacting and shaping to PCB, auxiliary positioning module 200, auxiliary positioning module 200 is provided with first auxiliary positioning unit 210, second auxiliary positioning unit 220 and connecting unit 230, first auxiliary positioning unit 210 is set up in the side of upper die 110 away from lower die 120, second auxiliary positioning unit 220 is set up in the side of lower die 120 away from upper die 110, first auxiliary positioning unit 210 and second auxiliary positioning unit 220 are connected through connecting unit 230, auxiliary positioning module 200 is used for accurately positioning to PCB. According to the technical scheme of the embodiment, the positioning pillar and positioning groove set up through upper die 110 and lower die 120 cooperate with each other, and further accurate alignment is carried out to PCB half fine punching device under the action of auxiliary positioning module 200, then the precision of PCB fine punching device is improved, and the fine punching efficiency of PCB is improved.

[0024] It should be noted that a plurality of first positioning pillars 111 are arranged on the upper die 110, and the lower die 120 is provided with a plurality of first positioning grooves 121 matched with the number of the first positioning pillars 111, so that the first positioning pillars 111 and the first positioning grooves 121 are used in cooperation to ensure accurate positioning of the upper die 110 and the lower die 120 during the PCB punching process. Further, when the upper die 110 is attached to the lower die 120, the convex shear opening 112 is opposite to the concave shear opening 122, and they jointly impact and shape the PCB, thereby ensuring the accuracy of the PCB punching and effectively improving the efficiency of the PCB punching.

[0025] It should be noted that the auxiliary positioning module 200 is used to pre-position the upper die 110 and the lower die 120 before the PCB is punched, and the auxiliary positioning module 200 is used to reduce the tolerance accuracy during the tens of thousands of times of repeated fine punching process of the PCB fine punching device, thereby improving the fine punching accuracy.

[0026] The connecting unit 230 is provided with a first connecting sleeve shaft 231 and a second connecting sleeve shaft 232, the first auxiliary positioning unit 210 is provided with a first fixed plate 211 connected with the upper die 110, the first fixed plate 211 is provided with a second positioning groove 2111 and a third positioning groove 2112, the second auxiliary positioning unit 220 is provided with a second fixed plate 221 connected with the lower die 120, the second fixed plate 221 is provided with a second positioning pillar 2211 and a third positioning pillar 2212, the second positioning pillar 2211 and the second positioning groove 2111 are connected through the first connecting sleeve shaft 231, and the third positioning pillar 2212 and the third positioning groove 2112 are connected through the second connecting sleeve shaft 232.

[0027] It should be noted that when the upper die 110 and the lower die 120 are connected through the connecting unit 230, the second positioning groove 2111 of the fixed plate is connected with the second positioning pillar 2211 through the first connecting sleeve shaft 231, and the third positioning groove 2112 is connected with the third positioning pillar 2212 through the second connecting sleeve shaft 232, thereby realizing accurate connection between the upper die 110 and the lower die 120, and further improving the accuracy of the PCB fine punching. In addition, by arranging the connecting unit 230 on the auxiliary positioning module 200, the stability of the fine punching device during the PCB fine punching process is further enhanced, and the accuracy deviation during the repeated fine punching process is avoided.

[0028] The first connecting sleeve shaft 231 is sleeved on the outer surface of the second positioning support 2211, the second connecting sleeve shaft 232 is sleeved on the outer surface of the third positioning support 2212, the outer surface of the first connecting sleeve shaft 231 is provided with a plurality of first through holes 2311 and a plurality of bearing beads 2312, the bearing beads 2312 are embedded in the first through holes 2311, and the outer surfaces of the plurality of bearing beads 2312 are in close contact with the inner surfaces of the second positioning groove 2111 and the third positioning groove 2112.

[0029] It should be noted that when the fine punching device fine punches the PCB, the first connecting sleeve shaft 231 is sleeved on the outer surface of the second positioning support 2211, and the second connecting sleeve shaft 232 is sleeved on the outer surface of the third positioning support 2212, so that the upper die 110 and the lower die 120 can be accurately positioned in the axial and radial directions through the first connecting sleeve and the second connecting sleeve shaft. Further, the outer surfaces of the first connecting sleeve shaft 231 and the second connecting sleeve shaft 232 are provided with a plurality of first through holes 2311, and the bearing beads 2312 are embedded in the first through holes 2311. When the upper die 110 and the lower die 120 are in close contact, the outer surfaces of the bearing beads 2312 are in close contact with the inner surfaces of the second positioning groove 2111 and the third positioning groove 2112, thereby realizing the close connection and positioning between the upper die 110 and the lower die 120. During the fine punching process, with the closing of the upper die 110 and the lower die 120, the first connecting sleeve shaft 231 and the second connecting sleeve shaft 232 slide along the second positioning support 2211 and the third positioning support 2212 respectively until the bearing beads 2312 are in close contact with the inner surfaces of the second positioning groove 2111 and the third positioning groove 2112, thereby ensuring the accurate alignment and stable connection between the upper die 110 and the lower die 120.

[0030] The first connecting sleeve shaft 231 is provided with a first elastic connecting piece 2313, the second connecting sleeve shaft 232 is provided with a second elastic connecting piece 2321, one end of the first elastic connecting piece 2313 is connected with the first connecting sleeve shaft 231, the other end of the first elastic connecting piece 2313 is connected with the first fixed plate 211, one end of the second elastic connecting piece 2321 is connected with the second connecting sleeve shaft 232, and the other end of the second elastic connecting piece 2321 is connected with the second fixed plate 221.

[0031] It should be noted that when the PCB fine punching device is working, vibration and impact force will be generated. If the vibration and impact force directly act between the connecting sleeve shaft and the fixed plate, it will cause the PCB fine punching device to appear loose connection, wear and even damage. By setting the first elastic connecting piece 2313 and the second elastic connecting piece 2321, the vibration and impact force generated during the working process of the fine punching device can be effectively absorbed and alleviated. When the fine punching device punches the PCB, a downward impact force will be generated. This impact force first acts on the second connecting sleeve shaft 232, and then is transmitted to the second fixed plate 221 through the second elastic connecting piece 2321. Because the elastic connecting piece has a certain elasticity and deformation ability, it can absorb part of the impact force and convert it into elastic potential energy and store it. When the impact force disappears, the elastic connecting piece will restore to its original state and release the stored elastic potential energy, thereby maintaining the stability and precision of the system. Similarly, when the fine punching device is returning or performing other actions, corresponding vibration and impact forces will also be generated. These forces will also be transmitted and absorbed by the elastic connecting piece, thereby protecting the various components of the fine punching device from damage. In addition, because the first elastic connecting piece 2313 and the second elastic connecting piece 2321 have a certain adaptability, the failure rate caused by loose connection or wear can be reduced to a certain extent, thereby reducing maintenance costs and improving the reliability of the PCB fine punching device.

[0032] The diameters of the second positioning pillar 2211, the first connecting sleeve shaft 231 and the second positioning groove 2111 increase in turn, and the diameters of the third positioning pillar 2212, the second connecting sleeve shaft 232 and the third positioning groove 2112 increase in turn. It should be noted that the design of increasing diameters makes each component in the PCB fine punching device support step by step, ensuring that each component can stably bear the pressure and load from above or the side. The increasing diameters also mean an increase in contact area, thereby improving the connection strength and stability between components. By dispersing stress and improving the connection strength between components, downtime and maintenance costs caused by component damage or failure are reduced. And the failure rate caused by loose or wear is reduced. Because the stability and precision of the PCB fine punching device are improved, the fine punching quality of the PCB can be ensured.

[0033] The first elastic connecting piece 2313 and the second elastic connecting piece 2321 are both springs. It should be noted that the spring has excellent elastic recovery, which can quickly recover to the original shape and size after being subjected to external force. It can absorb and release impact force during the PCB fine punching process, protecting the connecting parts from damage. During the design and manufacturing process, the spring can adjust its elastic coefficient and carrying capacity according to the needs. By selecting the appropriate spring type and parameters, the first elastic connecting piece 2313 and the second elastic connecting piece 2321 have good carrying capacity and stability in the PCB fine punching device, and can withstand forces and loads from all directions. The spring can maintain its elastic recovery and carrying capacity when repeatedly subjected to external forces, and is not prone to fatigue failure.

[0034] The upper die 110 and the lower die 120 are also provided with a plurality of positioning holes 130 for assisting in positioning the PCB. It should be noted that the positioning hole 130 serves as a physical positioning reference for the PCB between the upper die 110 and the lower die 120, ensuring the accurate position of the PCB during processing. These holes are usually located at the edges or specific positions of the PCB and are used in conjunction with corresponding pins or clamps on the die to achieve precise alignment. By providing multiple positioning holes 130, multi-point positioning can be formed, further improving the stability and accuracy of the PCB during processing. This helps to reduce processing errors and improve product quality.

[0035] In a second aspect, the utility model embodiment further provides a PCB fine punching die, comprising the PCB fine punching device as described in the first aspect.

[0036] In the description of the present specification, the description of the terms "one embodiment", "further embodiment", "some specific embodiments" or "some examples" and the like means that the specific features, structures or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] Although the embodiments of the utility model have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A PCB fine blanking device, characterized by, The PCB fine blanking device comprises a fine blanking module, an auxiliary positioning module and a positioning module. The fine blanking module is provided with an upper die and a lower die, the upper die is connected with the lower die, the upper die is provided with a plurality of first positioning pillars, the lower die is provided with a plurality of first positioning grooves matched with the number of the first positioning pillars, the first positioning pillars are embedded into the first positioning grooves, and the side of the upper die and the lower die in close contact is provided with a convex shear opening, and the side of the lower die and the upper die in close contact is provided with a concave shear opening. The auxiliary positioning module is provided with a first auxiliary positioning unit, a second auxiliary positioning unit and a connecting unit, the first auxiliary positioning unit is arranged on the side of the upper die away from the lower die, the second auxiliary positioning unit is arranged on the side of the lower die away from the upper die, and the first auxiliary positioning unit and the second auxiliary positioning unit are connected through the connecting unit.

2. The fine blanking device of the PCB plate according to claim 1, characterized in that, The connecting unit is provided with a first connecting sleeve shaft and a second connecting sleeve shaft, the first auxiliary positioning unit is provided with a first fixed plate connected with the upper die, the first fixed plate is provided with a second positioning groove and a third positioning groove, the second auxiliary positioning unit is provided with a second fixed plate connected with the lower die, the second fixed plate is provided with a second positioning pillar and a third positioning pillar, the second positioning pillar and the second positioning groove are connected through the first connecting sleeve shaft, and the third positioning pillar and the third positioning groove are connected through the second connecting sleeve shaft.

3. The fine blanking device of claim 2, wherein, The first connecting sleeve shaft is sleeved on the outer surface of the second positioning pillar, the second connecting sleeve shaft is sleeved on the outer surface of the third positioning pillar, the outer surface of the first connecting sleeve shaft is provided with a plurality of first through holes and a plurality of bearing beads, the bearing beads are embedded into the first through holes, and the outer surfaces of the plurality of bearing beads are in close contact with the inner surfaces of the second positioning groove and the third positioning groove.

4. The fine blanking device of claim 2, wherein, The first connecting sleeve shaft is provided with a first elastic connecting piece, the second connecting sleeve shaft is provided with a second elastic connecting piece, one end of the first elastic connecting piece is connected with the first connecting sleeve shaft, the other end of the first elastic connecting piece is connected with the first fixed plate, one end of the second elastic connecting piece is connected with the second connecting sleeve shaft, and the other end of the second elastic connecting piece is connected with the second fixed plate.

5. The fine blanking device of the PCB plate according to claim 2, characterized in that, The diameters of the second positioning pillar, the first connecting sleeve shaft and the second positioning groove increase in sequence, and the diameters of the third positioning pillar, the second connecting sleeve shaft and the third positioning groove increase in sequence.

6. The fine blanking device of claim 4, wherein, The first elastic connecting piece and the second elastic connecting piece are both springs.

7. The fine blanking device of the PCB plate according to claim 1, characterized in that, The upper die and the lower die are further provided with a plurality of positioning holes for auxiliary positioning of the PCB.

8. A fine blanking die for a PCB board, characterized by, The PCB fine blanking device comprises a fine blanking module, an auxiliary positioning module and a positioning module. The PCB fine blanking device comprises a fine blanking module, an auxiliary positioning module and a positioning module.

Images