Substrate cutting device

Abstract

The utility model relates to a substrate cutting device, which comprises a first chuck part for conveying a first substrate; a first bridge part providing a channel for conveying the first substrate; a first cutting part which is supported by the first bridge part and cuts the first substrate; a second chuck unit that conveys a second substrate; a second bridge part providing a channel for conveying the second substrate; a second cutting part which is supported by the second bridge part and cuts the second substrate; and a platform part which supports the first bridge part and the second bridge part.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of substrate cutting device. BACKGROUND

[0002] The substrate for semiconductor process is separated by chip unit by substrate cutting device.

[0003] The kind of this substrate has wafer, sapphire, glass etc.

[0004] The substrate cutting device of the past can only cut single substrate once, to improve productivity, multiple substrate cutting devices are used to cut multiple substrates.

[0005] However, multiple substrate cutting devices have the problem of larger space occupation due to the number of devices. SUMMARY

[0006] The utility model aims at providing a kind of substrate cutting device for cutting multiple substrates.

[0007] The substrate cutting device according to the embodiment of the utility model includes: first chuck part, conveying first substrate;First bridge part, provides the passage of conveying first substrate;First cutting part, is supported in first bridge part and cuts first substrate;Second chuck part, conveying second substrate;Second bridge part, provides the passage of conveying second substrate;Second cutting part, is supported in second bridge part and cuts second substrate;And platform part, supports first bridge part and second bridge part.

[0008] According to the embodiment, the first cutting part includes: first a blade, rotates on the side of first substrate to cut first substrate;First a moving part, is supported in first bridge part and moves first a blade up and down and left and right;First b blade, rotates on the other side of first substrate to cut first substrate;And first b moving part, is supported in first bridge part and moves first b blade up and down and left and right.

[0009] According to the embodiment, the second cutting part includes: second a blade, rotates on the side of second substrate to cut second substrate;Second a moving part, is supported in second bridge part and moves second a blade up and down and left and right;Second b blade, rotates on the other side of second substrate to cut second substrate;Second b moving part, is supported in second bridge part and moves second b blade up and down and left and right.

[0010] According to the embodiment, the first bridge part and the second bridge part are separated in the front-back direction.

[0011] According to the embodiment, one end of the first bridge part and one end of the second bridge part are separated in the left-right direction.

[0012] According to the embodiment, the first bridge part and the second bridge part are partially overlapped in the left-right direction.

[0013] According to the embodiment, the first bridge portion includes a pair of first pillar portions supported to the platform portion apart in the left-right direction, and a first upper frame supported to the pair of first pillar portions.

[0014] According to the embodiment, the second bridge portion includes a pair of second pillar portions supported to the platform portion apart in the left-right direction, and a second upper frame supported to the pair of second pillar portions.

[0015] According to the embodiment, one of the pair of first pillar portions and one of the pair of second pillar portions overlap in the left-right direction.

[0016] According to the embodiment, the first and second cutting portions that cut the first and second substrates, respectively, are independent members that process the first and second substrates, and the common member includes an in-out portion that carries in and out the first and second substrates, a cleaning portion that cleans the first and second substrates, and a conveying portion that conveys the first and second substrates.

[0017] The substrate cutting process according to the embodiment of the present application includes, in the substrate cutting device that cuts the first and second substrates: a first cutting and conveying step of conveying the first substrate from the carrying-in position to the first cutting position; a first cutting step of cutting the first substrate; a second cutting and conveying step of conveying the second substrate from the carrying-in position to the second cutting position; a second cutting step of cutting the second substrate; a first cleaning and conveying step of conveying the cut first substrate from the first cutting position to the cleaning position; a first cleaning step of cleaning the first substrate; a first carrying-out and conveying step of conveying the cleaned first substrate from the cleaning position to the carrying-out position; a second cleaning and conveying step of conveying the cut second substrate from the second cutting position to the cleaning position; a second cleaning step of cleaning the second substrate; and a second carrying-out and conveying step of conveying the cleaned second substrate from the cleaning position to the carrying-out position.

[0018] According to the embodiment, before the second substrate is conveyed from the second cutting position to the cleaning position, it is confirmed whether the first substrate is cleaned at the cleaning position, and if the first substrate is cleaned, the second substrate is conveyed from the second cutting position to the cleaning position.

[0019] The substrate cutting device according to the present application can cut a plurality of substrates, and thus can improve the space utilization.

[0020] In addition, the substrate cutting device according to the present application can prevent interference between the substrates when cutting the plurality of substrates.

[0021] In addition, the substrate cutting device according to the present application can reduce the cost of the substrate cutting device by using the common member. BRIEF DESCRIPTION OF DRAWINGS

[0022] Hereinafter, preferred embodiments of the present application will be described in detail with reference to the accompanying drawings. Like reference numerals refer to like elements throughout the drawings, but the present application is not limited thereto.

[0023] Figure 1 is a front perspective view of a substrate cutting apparatus according to an embodiment of the present application.

[0024] Figure 2 is a rear perspective view of a substrate cutting apparatus according to an embodiment of the present application.

[0025] Figure 3 is a front view of a substrate cutting apparatus according to an embodiment of the present application.

[0026] Figure 4 is a rear view of a substrate cutting apparatus according to an embodiment of the present application.

[0027] Figure 5 is a left view of a substrate cutting apparatus according to an embodiment of the present application.

[0028] Figure 6 is a right view of a substrate cutting apparatus according to an embodiment of the present application.

[0029] Figure 7 is a top view of a substrate cutting apparatus according to an embodiment of the present application (Note that the diagonal portion indicates the position of the lower pillar portion of the upper shelf).

[0030] Figure 8 is a top view of a substrate cutting apparatus according to another embodiment of the present application (Note that the diagonal portion indicates the position of the lower pillar portion of the upper shelf).

[0031] Figure 9 is a process diagram of a process using a substrate cutting apparatus according to an embodiment of the present application.

[0032] (Explanation of Reference Numerals)

[0033] S1: first substrate S2: second substrate

[0034] 110: first chuck portion 120: second chuck portion

[0035] 210: first bridge portion 220: second bridge portion

[0036] 310: first cutting portion 320: second cutting portion

[0037] B1a: first a blade B1b: first b blade

[0038] B2a: Second blade a; B2b: Second blade b

[0039] M1a: First a moving part; M1b: First b moving part

[0040] M2a: Second a moving part M2b: Second b moving part

[0041] 211: First Pillar Department 212: First Shelf Launch

[0042] 221: Second Pillar Section 222: Second Shelf Launch

[0043] 10: Platform Department; 20: Reception Department

[0044] 30: Conveying section; 40: Cleaning section

[0045] X1-X2: Left-right direction; Y1-Y2: Front-back direction

[0046] Z1-Z2: Up and down directions Detailed Implementation

[0047] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this invention pertains can easily implement it.

[0048] This invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0049] like Figures 1 to 6 As shown, the substrate cutting apparatus according to an embodiment of the present invention may include a first chuck portion 110, a first bridge portion 210, a first cutting portion 310, a second chuck portion 120, a second bridge portion 220, a second cutting portion 320, and a platform portion 10.

[0050] The first chuck section 110 can transport the first substrate S1. For example, the first chuck section 110 can be moved back and forth by an actuator (e.g., a ball screw motor), and the first substrate S1 can be placed on the first chuck section 110 and transported in the back-and-forth direction.

[0051] The first bridge section 210 can provide a channel P1 for transporting the first substrate S1.

[0052] The first cutting portion 310 can be supported on the bridge portion 210 to cut the first substrate S1.

[0053] The second chuck section 120 can transport the second substrate S2. For example, the second chuck section 120 can be moved back and forth by an actuator (e.g., a ball screw motor), and the second substrate S2 can be placed in the second chuck section 120 and transported in the back-and-forth direction.

[0054] The second bridge portion 220 can provide a passage P2 to transport the second substrate S2.

[0055] The second cutting portion 320 can be supported by the second bridge portion 220 to cut the second substrate S2.

[0056] The platform portion 10 can support the first bridge portion 210 and the second bridge portion 220.

[0057] Specifically, the first cutting portion 310 can include a first a blade B1a, a first a moving portion M1a, a first b blade B1b, and a first b moving portion M1b.

[0058] The first a blade B1a can rotate at one side of the first substrate S1 to cut the first substrate S1. For example, the first a blade B1a can be a circular blade and rotate by an actuator.

[0059] The first a moving portion M1a can support the first a blade B1a to move up, down, left, and right. For example, the first a moving portion M1a moves in the left-right direction X1-X2 with the first bridge portion 210 as a reference by the first bridge portion 210 and an actuator (e.g., a ball screw motor), and the first a blade B1a moves in the up-down direction Z1-Z2 with the first bridge portion 210 as a reference by the first a moving portion M1a and an actuator (e.g., a ball screw motor).

[0060] The first b blade B1b can rotate at the other side of the first substrate S1 to cut the first substrate S1. For example, the first b blade B1b can be a circular blade and rotate by an actuator.

[0061] The first b moving portion M1b can support the first b blade B1b to move up, down, left, and right. For example, the first b moving portion M1b moves in the left-right direction X1-X2 with the first bridge portion 210 as a reference by the first bridge portion 210 and an actuator (e.g., a ball screw motor), and the first b blade B1b moves in the up-down direction Z1-Z2 with the first bridge portion 210 as a reference by the first b moving portion M1b and an actuator (e.g., a ball screw motor).

[0062] In addition, the second cutting portion 320 can include a second a blade B2a, a second a moving portion M2a, a second b blade B2b, and a second b moving portion M2b.

[0063] The second a blade B2a can rotate at one side of the second substrate S2 to cut the second substrate S2. For example, the second a blade B2a can be a circular blade and rotate by an actuator.

[0064] The second a moving section M2a can support the second a blade B2a to move up and down and left and right with respect to the second bridge section 220. For example, the second a moving section M2a moves in the left and right direction X1-X2 with respect to the second bridge section 220 by the second bridge section 220 and an actuator (e.g., a ball screw motor), and the second a blade B2a moves in the up and down direction Z1-Z2 with respect to the second bridge section 220 by the second a moving section M2a and an actuator (e.g., a ball screw motor).

[0065] The second b blade B2b can rotate on the other side of the second substrate S2 to cut the second substrate S2. For example, the second b blade B2b can be a circular blade and rotate by an actuator.

[0066] The second b moving section M2b can support the second b blade B2b to move up and down and left and right with respect to the second bridge section 220. For example, the second b moving section M2b moves in the left and right direction X1-X2 with respect to the second bridge section 220 by the second bridge section 220 and an actuator (e.g., a ball screw motor), and the second b blade B2b moves in the up and down direction Z1-Z2 with respect to the second bridge section 220 by the second b moving section M2b and an actuator (e.g., a ball screw motor).

[0067] It can occur that the scattering of by-products generated by cutting the first substrate S1 and the second substrate S2, vibration generated by cutting, etc. interfere with each other.

[0068] As shown in FIG. 1, the substrate cutting apparatus according to an embodiment of the present application can include a first bridge section 210, a second bridge section 220, a first a moving section M1a, a second a moving section M2a, a first b moving section M1b, a second b moving section M2b, a first a blade B1a, a second a blade B2a, a first b blade B1b, and a second b blade B2b. Figure 7 As shown in FIG. 1, the substrate cutting apparatus according to an embodiment of the present application can include a first bridge section 210, a second bridge section 220, a first a moving section M1a, a second a moving section M2a, a first b moving section M1b, a second b moving section M2b, a first a blade B1a, a second a blade B2a, a first b blade B1b, and a second b blade B2b.

[0069] Specifically, the first bridge section 210 and the second bridge section 220 can be spaced apart in the front and back direction Y1-Y2 by a front and back interval Ygab.

[0070] In addition, one end of the first bridge section 210 and one end of the second bridge section 220 can be spaced apart in the left and right direction X1-X2 by a left and right interval Xgab1.

[0071] In addition, the first bridge section 210 and the second bridge section 220 can partially overlap in the left and right direction X1-X2 by a left and right interval Xgab2.

[0072] In this way, by being disposed spaced apart from each other by the first bridge section 210 and the second bridge section 220, it is possible to prevent mutual interference generated by cutting the first substrate S1 and the second substrate S2.

[0073] As shown in FIG. 1, the substrate cutting apparatus according to an embodiment of the present application can include a first bridge section 210, a second bridge section 220, a first a moving section M1a, a second a moving section M2a, a first b moving section M1b, a second b moving section M2b, a first a blade B1a, a second a blade B2a, a first b blade B1b, and a second b blade B2b. Figures 5 to 7As shown, according to the embodiment of the substrate cutting device of the present application, the first pillar portion 211 and the second pillar portion 221 which overlap each other in the left-right direction X1-X2 can be arranged between the first substrate S1 and the second substrate S2.

[0074] Specifically, the first bridge portion 210 can include the first pillar portion and the first upper shelf 212.

[0075] The pair of first pillar portions 211 are supported to the platform portion 10 in the left-right direction X1-X2 with a space therebetween. The first upper shelf 212 is supported to the pair of first pillar portions 211. The first substrate S1 is transported through a passage formed by the first upper shelf 212 and the pair of first pillar portions 211 which support the first upper shelf 212.

[0076] In addition, the second bridge portion 220 can include the second pillar portion 221 and the second upper shelf 222.

[0077] The pair of second pillar portions 221 are supported to the platform portion 10 in the left-right direction X1-X2 with a space therebetween. The second upper shelf 222 is supported to the pair of second pillar portions 221. The second substrate S2 is transported through a passage formed by the second upper shelf 222 and the pair of second pillar portions 221 which support the second upper shelf 222.

[0078] In addition, one of the pair of first pillar portions 211 and one of the pair of second pillar portions 221 overlap each other in the left-right direction X1-X2. The first pillar portion 211 and the second pillar portion 221 which overlap each other in the left-right direction X1-X2 can be located between the first substrate S1 and the second substrate S2. For example, as shown in FIG. 1, the first pillar portion 211 and the second pillar portion 221 which overlap each other in the left-right direction X1-X2 are spaced apart in the front-rear direction Y1-Y2. Figure 7 In addition, one of the pair of first pillar portions 211 and one of the pair of second pillar portions 221 overlap each other in the left-right direction X1-X2. The first pillar portion 211 and the second pillar portion 221 which overlap each other in the left-right direction X1-X2 can be located between the first substrate S1 and the second substrate S2. For example, as shown in FIG. 1, the first pillar portion 211 and the second pillar portion 221 which overlap each other in the left-right direction X1-X2 are spaced apart in the front-rear direction Y1-Y2. Figure 8 In addition, one of the pair of first pillar portions 211 and one of the pair of second pillar portions 221 overlap each other in the left-right direction X1-X2. The first pillar portion 211 and the second pillar portion 221 which overlap each other in the left-right direction X1-X2 can be located between the first substrate S1 and the second substrate S2. For example, as shown in FIG. 1, the first pillar portion 211 and the second pillar portion 221 which overlap each other in the left-right direction X1-X2 are spaced apart in the front-rear direction Y1-Y2.

[0079] Thus, by arranging the first pillar portion 211 and the second pillar portion 221 which overlap each other in the left-right direction X1-X2 between the first substrate S1 and the second substrate S2, it is possible to prevent the mutual interference which occurs when cutting the first substrate S1 and the second substrate S2.

[0080] The conventional substrate cutting device can cut only a single substrate at a time, and therefore the components such as modules, parts, and the like of each device are separately constituted.

[0081] If these components are shared, it is possible to reduce the cost of the substrate cutting device.

[0082] As an embodiment of a common component, the first cutting portion 310 and the second cutting portion 320, which respectively cut the first substrate S1 and the second substrate S2, can be used as independent components for processing the first substrate S1 and the second substrate S2. As a common component for processing the first substrate S1 and the second substrate S2, it includes an inlet / outlet portion 20, a cleaning portion 40, and a conveying portion 30.

[0083] The inlet / outlet 20 can carry in and out the first substrate S1 and the second substrate S2. For example, the inlet / outlet 20 can be a loading port for placing a housing containing the substrate.

[0084] The cleaning unit 40 can clean the first substrate S1 and the second substrate S2. For example, the cleaning unit 40 can be a module that supplies cleaning fluid to the substrate and cleans the byproducts of the substrate by rotating it.

[0085] The transport unit 30 can transport the first substrate S1 and the second substrate S2. The transport unit 30 can transport the first substrate S1 from the inlet / outlet unit 20 to the first chuck unit 110, from the first chuck unit 110 to the cleaning unit 40, and from the cleaning unit 40 back to the inlet / outlet unit 20. Similarly, the transport unit 30 can transport the second substrate S2 from the inlet / outlet unit 20 to the second chuck unit 120, from the second chuck unit 120 to the cleaning unit 40, and from the cleaning unit 40 back to the inlet / outlet unit 20. For example, the transport unit 30 can be a robot that transports substrates.

[0086] The substrate cutting process using a substrate cutting apparatus for cutting the first substrate S1 and the second substrate S2 will be described next.

[0087] like Figure 9 As shown, the substrate cutting process includes the following steps: a first cutting conveying step T1, in which the first substrate S1 is conveyed from the loading position to the first cutting position; a first cutting step T2, in which the first substrate S1 is cut; a second cutting conveying step T3, in which the second substrate S2 is conveyed from the loading position to the second cutting position; a second cutting step T4, in which the second substrate S2 is cut; a first cleaning conveying step T5, in which the cut first substrate S1 is conveyed from the first cutting position to the cleaning position; a first cleaning step T6, in which the first substrate S1 is cleaned; a first removal conveying step T7, in which the cleaned first substrate S1 is conveyed from the cleaning position to the removal position; a second cleaning conveying step T8, in which the cut second substrate S2 is conveyed from the second cutting position to the cleaning position; a second cleaning step T9, in which the second substrate S2 is cleaned; and a second removal conveying step T10, in which the cleaned second substrate S2 is conveyed from the cleaning position to the removal position.

[0088] The in-out position and the out-in position correspond to the position of the in-out portion 20, the first cutting position corresponds to the position of the first chuck portion 110, the second cutting position corresponds to the position of the second chuck portion 120, and the cleaning position corresponds to the position of the cleaning portion 40. The transport between the positions is transported by the transport portion 30.

[0089] As an embodiment of the steps performed as the substrate cutting process, before performing the second cleaning transport step T8 of transporting the second substrate S2 from the second cutting position to the cleaning position, it is confirmed whether the cleaning of the first substrate S1 has been completed at the cleaning position, and if the cleaning of the first substrate S1 has been completed, the second cleaning transport step T8 of transporting the second substrate S2 from the second cutting position to the cleaning position can be performed.

[0090] The above, through the preferred embodiments of the present application is explained in detail, but the present application is not limited thereto, can be implemented in various forms within the scope of right.

Claims

1. A substrate cutting apparatus characterized by comprising: Comprising: a first chuck section that transports a first substrate; a first bridge section that provides a passage for transporting the first substrate; a first cutting section that is supported by the first bridge section and cuts the first substrate; a second chuck section that transports a second substrate; a second bridge section that provides a passage for transporting the second substrate; a second cutting section that is supported by the second bridge section and cuts the second substrate; and a stage section that supports the first bridge section and the second bridge section.

2. The substrate cutting apparatus according to claim 1, wherein the first cutting section includes: a first a blade that rotates on one side of the first substrate to cut the first substrate; a first a moving section that moves the first a blade up, down, left, and right while being supported by the first bridge section; a first b blade that rotates on the other side of the first substrate to cut the first substrate; and a first b moving section that moves the first b blade up, down, left, and right while being supported by the first bridge section, the second cutting section includes: a second a blade that rotates on one side of the second substrate to cut the second substrate; a second a moving section that moves the second a blade up, down, left, and right while being supported by the second bridge section; a second b blade that rotates on the other side of the second substrate to cut the second substrate; and a second b moving section that moves the second b blade up, down, left, and right while being supported by the second bridge section.

3. The substrate cutting apparatus according to claim 1, wherein the first bridge section and the second bridge section are separated in a front-rear direction.

4. The substrate cutting apparatus according to claim 3, wherein one end of the first bridge section and one end of the second bridge section are separated in a left-right direction.

5. The substrate cutting apparatus according to claim 4, wherein the first bridge section and the second bridge section partially overlap in the left-right direction.

6. The substrate cutting apparatus according to claim 5, wherein the first bridge section includes: a pair of first support column sections that are separated in the left-right direction and are supported by the stage section; and a first upper frame that is supported by the pair of first support column sections, the second bridge section includes: a pair of second support column sections that are separated in the left-right direction and are supported by the stage section; and a second upper frame that is supported by the pair of second support column sections, one of the pair of first support column sections and one of the pair of second support column sections overlap in the left-right direction.

7. The substrate cutting apparatus according to claim 1, wherein the first cutting section and the second cutting section that cut the first substrate and the second substrate, respectively, are independent members that handle the first substrate and the second substrate, a common member that handles the first substrate and the second substrate includes: an in-out section that carries in and carries out the first substrate and the second substrate; a cleaning section that cleans the first substrate and the second substrate; and a transport section that transports the first substrate and the second substrate.

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