Polymer microneedle patch stamping die

Abstract

The utility model discloses a polymer microneedle patch stamping die, which belongs to the technical field of stamping dies, and comprises a die holder and a forming seat arranged on the surface of the die holder, the surface of the die holder is provided with a heat dissipation groove, and a heat dissipation assembly is arranged in the heat dissipation groove. The forming seat is used for stamping processing treatment of the polymer microneedle patch; a heat dissipation fan of the heat dissipation assembly is located in a heat dissipation groove of the die holder, in the continuous stamping operation process, the heat dissipation fan is started through external control equipment, air circulation in the heat dissipation groove of the die holder is accelerated, and therefore heat accumulation is reduced, and the die has the good auxiliary heat dissipation performance and the good use effect. The bottom of the carrier plate of the cooling fan is fixedly connected with the guide frame, the damping plate of the guide frame is slidably inserted into the guide hole of the supporting plate, when the cooling fan needs to be overhauled and maintained, the carrier plate and the cooling fan can be horizontally pulled relative to the supporting plate to move to the outer side of the die holder, and the overhauling space is enlarged.

Description

TECHNICAL FIELD

[0001] The utility model relates to punch press die technical field more specifically, relate to a kind of high polymer microneedle patch punch press die. BACKGROUND

[0002] High polymer microneedle patch punch press die as punch press die, can be handled to high polymer microneedle patch.

[0003] After searching, the high polymer microneedle patch punch press die of existing announcement No. The metal blade is embedded into the interference fit hole, the firmness between the metal blade and the base plate can be improved, and a plurality of clamping grooves are provided in the vertical direction of the embedded piece, and the clamping blocks are provided on the base plate and clamped with the clamping grooves, so that the metal blade is prevented from being separated from the hole due to strong force, the firmness of the connection between the metal blade and the base plate is improved, and the service life of the microneedle patch punch press die can be effectively improved.

[0004] For common high polymer microneedle patch punch press die, since the die holder is of integral structure, heat accumulation in the die holder is prone to occur during continuous operation, and the heat dissipation performance is poor, thereby affecting the processing quality of the product. Utility model content

[0005] 1. Technical problem to be solved

[0006] In view of the problems in the prior art, the utility model aims to provide a high polymer microneedle patch punch press die, the surface of the die holder is provided with a forming seat, and the forming seat is used for punch press processing of the high polymer microneedle patch. The surface of the die holder is provided with a heat dissipation groove, and a heat dissipation assembly is installed in the heat dissipation groove. During continuous punch press operation, the heat dissipation fan is started by an external control device to accelerate air circulation in the heat dissipation groove of the die holder, thereby reducing heat accumulation, having good auxiliary heat dissipation performance, and having good use effect. The bottom of the carrier plate of the heat dissipation fan is fixedly connected with a guide frame, and the damping plate of the guide frame is slidingly inserted into the guide hole of the supporting plate. When the heat dissipation fan needs to be overhauled and maintained, the carrier plate can be horizontally pulled relative to the supporting plate to move the heat dissipation fan to the outside of the die holder, thereby increasing the maintenance space.

[0007] 2. Technical scheme

[0008] To solve the above problems, the utility model adopts the following technical scheme.

[0009] A polymer microneedle patch stamping die, including die holder, and the forming seat installed on the surface of the die holder, the surface of the die holder is provided with a heat dissipation groove, the heat dissipation groove is internally provided with a heat dissipation assembly;

[0010] The heat dissipation assembly includes a bottom support fixedly connected to the bottom end of the heat dissipation groove of the die holder, rubber seats symmetrically bonded to the surface of the bottom support, a support plate fixedly connected to the surface of the rubber seat, a carrier plate installed above the support plate, a heat dissipation fan fixedly connected to the surface of the carrier plate, and a guide frame fixedly connected to the bottom of the carrier plate.

[0011] Preferably, the heat dissipation fan is located inside the heat dissipation groove of the die holder, and a heat dissipation gap is provided between the heat dissipation fan and the heat dissipation groove.

[0012] Preferably, the surface of the support plate is provided with a guide hole, and the support plate is arranged in parallel above the bottom support.

[0013] Preferably, the surface of the guide frame is fixedly connected with a damping plate, and the damping plate is inserted into the guide hole and arranged in sliding mode.

[0014] Preferably, the die holder is provided with a stepped groove at both ends, and the stepped groove of the die holder is provided with a mounting hole.

[0015] Preferably, the heat dissipation groove extends to the back surface of the die holder, and the surface of the die holder is arranged in an open mode.

[0016] Preferably, a dustproof mesh plate is bonded to the surface of the die holder, and the dustproof mesh plate is located at the outer side of the heat dissipation fan.

[0017] 3. Beneficial effects

[0018] Compared with the prior art, the utility model has the advantages that:

[0019] (1) The die holder is provided with a forming seat on the surface, which is used for stamping processing of the polymer microneedle patch. The surface of the die holder is provided with a heat dissipation groove, and the heat dissipation groove is internally provided with a heat dissipation assembly. The heat dissipation fan of the heat dissipation assembly is located inside the heat dissipation groove of the die holder. During continuous stamping operation, the heat dissipation fan is started by an external control device to accelerate air circulation inside the heat dissipation groove of the die holder, thereby reducing heat accumulation and having good auxiliary heat dissipation performance and good use effect. The carrier plate of the heat dissipation fan is fixedly connected with a guide frame, and the damping plate of the guide frame is slidably inserted into the guide hole of the support plate. When the heat dissipation fan needs to be overhauled and maintained, the carrier plate can be horizontally pulled relative to the support plate, and the heat dissipation fan is moved to the outer side of the die holder to increase the maintenance space.

[0020] (2) The surface of the mold base of the scheme is bonded with a dustproof screen plate, the dustproof screen plate is located at the outer side position of the heat dissipation fan, and the dustproof screen plate has good dustproof protection effect. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0022] Figure 2 It is a mold base and dustproof screen plate structure schematic view of the utility model;

[0023] Figure 3 It is a bottom support and carrier plate position structure schematic view of the utility model;

[0024] Figure 4 It is a bottom support and carrier plate connection structure schematic view of the utility model.

[0025] Explanation of reference numerals in the drawing:

[0026] 1, mold base; 2, forming seat; 3, heat dissipation groove; 4, bottom support; 5, carrier plate; 6, mounting hole; 7, dustproof screen plate; 8, rubber seat; 9, support plate; 10, guide frame; 11, heat dissipation fan; 12, damping plate; 13, guide hole. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model; obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments, and all other embodiments obtained by those skilled in the art without creative labor based on the embodiments in the utility model belong to the protection scope of the utility model.

[0028] Embodiment 1:

[0029] Please refer to Figures 1-4 A high polymer microneedle patch stamping die, comprising a mold base 1 and a forming seat 2 installed on the surface of the mold base 1, the surface of the mold base 1 is provided with a heat dissipation groove 3, and a heat dissipation assembly is installed in the heat dissipation groove 3.

[0030] The heat dissipation assembly comprises a bottom support 4 fixedly connected to the bottom end of the heat dissipation groove 3 of the mold base 1, rubber seats 8 symmetrically bonded to the surface of the bottom support 4, a support plate 9 fixedly connected to the surface of the rubber seat 8, a carrier plate 5 installed above the support plate 9, a heat dissipation fan 11 fixedly connected to the surface of the carrier plate 5, and a guide frame 10 fixedly connected to the bottom of the carrier plate 5.

[0031] The heat dissipation fan 11 is located inside the heat dissipation groove 3 of the mold base 1, and a heat dissipation gap is arranged between the heat dissipation fan 11 and the heat dissipation groove 3.

[0032] It should be noted that the surface of the mold base 1 is provided with a forming seat 2, and the forming seat 2 is used for stamping processing of the high-molecular micro-needle patch; the surface of the mold base 1 is provided with a heat dissipation groove 3, and the heat dissipation groove 3 is internally provided with a heat dissipation assembly, and the heat dissipation fan 11 of the heat dissipation assembly is located inside the heat dissipation groove 3 of the mold base 1. During continuous stamping operation, the heat dissipation fan 11 is started by an external control device to accelerate air circulation inside the heat dissipation groove 3 of the mold base 1, thereby reducing heat accumulation, having good auxiliary heat dissipation performance, and having good use effect; the bottom of the carrier plate 5 of the heat dissipation fan 11 is fixedly connected with the guide frame 10, and the damping plate 12 of the guide frame 10 is slidingly inserted into the guide hole 13 of the support plate 9. When the heat dissipation fan 11 needs to be overhauled and maintained, the carrier plate 5 can be horizontally pulled relative to the support plate 9, and the heat dissipation fan 11 is moved to the outside of the mold base 1 to increase the maintenance space.

[0033] Referring to Figures 1-4 , both ends of the mold base 1 are provided with stepped grooves, the stepped grooves of the mold base 1 are provided with mounting holes 6, the heat dissipation groove 3 extends to the back position of the mold base 1, the surface of the mold base 1 is provided in an open type, the surface of the mold base 1 is bonded with a dust screen plate 7, and the dust screen plate 7 is located at the outside of the heat dissipation fan 11.

[0034] It should be noted that the surface of the mold base 1 is bonded with a dust screen plate 7, and the dust screen plate 7 is located at the outside of the heat dissipation fan 11. The dust screen plate 7 has good dust protection effect.

[0035] In use: the surface of the mold base 1 is provided with a forming seat 2, and the forming seat 2 is used for stamping processing of the high-molecular micro-needle patch; the surface of the mold base 1 is provided with a heat dissipation groove 3, and the heat dissipation groove 3 is internally provided with a heat dissipation assembly, and the heat dissipation fan 11 of the heat dissipation assembly is located inside the heat dissipation groove 3 of the mold base 1. During continuous stamping operation, the heat dissipation fan 11 is started by an external control device to accelerate air circulation inside the heat dissipation groove 3 of the mold base 1, thereby reducing heat accumulation, having good auxiliary heat dissipation performance, and having good use effect; the bottom of the carrier plate 5 of the heat dissipation fan 11 is fixedly connected with the guide frame 10, and the damping plate 12 of the guide frame 10 is slidingly inserted into the guide hole 13 of the support plate 9. When the heat dissipation fan 11 needs to be overhauled and maintained, the carrier plate 5 can be horizontally pulled relative to the support plate 9, and the heat dissipation fan 11 is moved to the outside of the mold base 1 to increase the maintenance space; the surface of the mold base 1 is bonded with a dust screen plate 7, and the dust screen plate 7 is located at the outside of the heat dissipation fan 11. The dust screen plate 7 has good dust protection effect.

[0036] The above merely describes a preferred embodiment of the present application; the scope of protection of the present application is not limited thereto. Any skilled person in the art, according to the technical scheme and improvement concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, which should be covered in the scope of protection of the present application.

Claims

1. A polymer microneedle patch stamping die, comprising a die base (1), and a forming seat (2) installed on the surface of the die base (1), characterized in that: The surface of the mold base (1) is provided with a heat dissipation groove (3), and the heat dissipation groove (3) is internally provided with a heat dissipation assembly; The heat dissipation assembly comprises a bottom support (4) fixedly connected to the bottom end of the heat dissipation groove (3) of the mold base (1), rubber seats (8) symmetrically bonded to the surface of the bottom support (4), a support plate (9) fixedly connected to the surface of the rubber seat (8), a carrier plate (5) installed above the support plate (9), a heat dissipation fan (11) fixedly connected to the surface of the carrier plate (5), and a guide frame (10) fixedly connected to the bottom of the carrier plate (5).

2. The polymer microneedle patch stamping die of claim 1, wherein: The heat dissipation fan (11) is located inside the heat dissipation groove (3) of the mold base (1), and a heat dissipation gap is provided between the heat dissipation fan (11) and the heat dissipation groove (3).

3. The polymer microneedle patch stamping die of claim 1, wherein: The surface of the support plate (9) is provided with a guide hole (13), and the support plate (9) is arranged in parallel above the bottom support (4).

4. The polymer microneedle patch stamping die of claim 1, wherein: The surface of the guide frame (10) is fixedly connected with a damping plate (12), the damping plate (12) is inserted into the guide hole (13) and is arranged in sliding mode.

5. The polymer microneedle patch stamping die of claim 1, wherein: Both ends of the mold base (1) are provided with step grooves, and the step grooves of the mold base (1) are provided with mounting holes (6).

6. The polymer microneedle patch stamping die of claim 1, wherein: The heat dissipation groove (3) extends to the back position of the mold base (1), and the surface of the mold base (1) is provided in an open type.

7. The polymer microneedle patch stamping die of claim 1, wherein: The surface of the mold base (1) is bonded with a dust screen plate (7), and the dust screen plate (7) is located outside the heat dissipation fan (11).

Images