Temperature adjusting device for semiconductor equipment

Abstract

The utility model relates to a temperature adjusting device for semiconductor equipment, relates to the field of temperature adjustment of semiconductor equipment, and aims to solve the problems of overhigh equipment operation energy consumption and high-temperature aging of equipment cables caused by overhigh equipment energy consumption during operation of some processes in a semiconductor factory. An opening and closing valve is arranged between the injection pipe and the discharge pipe; and a medium flows in through the injection pipe, enters equipment through the opening and closing valve, passes through the equipment and is finally discharged through the discharge pipe. The semiconductor device has the effect of realizing temperature regulation of the semiconductor device.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor equipment temperature regulation, in particular to a temperature regulating device for semiconductor equipment. BACKGROUND

[0002] Semiconductor equipment plays a vital role in modern industrial production, especially in the process of integrated circuit manufacturing. With the continuous development of semiconductor technology, the performance requirements of the equipment are also increasing.

[0003] In some high-energy consumption process, the energy consumption of the equipment is high, which leads to high temperature aging of the cable, seriously affecting the service life and safety of the equipment. CONTENT OF THE INVENTION

[0004] In order to realize the temperature regulation of semiconductor equipment, the present application provides a temperature regulating device for semiconductor equipment.

[0005] The temperature regulating device for semiconductor equipment provided by the present application adopts the following technical scheme:

[0006] A temperature regulating device for semiconductor equipment, comprising an injection pipe and an exhaust pipe, and a start-stop valve is arranged between the injection pipe and the exhaust pipe; the medium flows into the equipment through the start-stop valve after flowing into the injection pipe, and finally flows out of the exhaust pipe after flowing through the equipment.

[0007] By adopting the above technical scheme, the temperature regulation of semiconductor equipment is realized. Specifically, the flow of the medium is controlled by the start-stop valve between the injection pipe and the exhaust pipe, ensuring that the medium can effectively flow into the equipment for temperature regulation and smoothly flow out after completing the regulation. This scheme effectively solves the temperature management problem of semiconductor equipment under high energy consumption operation, reduces the risk of cable aging due to high temperature, and improves the reliability and service life of the equipment.

[0008] Preferably, an adjusting assembly is arranged between the injection pipe and the exhaust pipe, and the adjusting assembly comprises a shunt pipe, one end of the shunt pipe being connected with the start-stop valve, and the other end being connected with the exhaust pipe.

[0009] By adopting the above technical scheme, when the required medium flow of the equipment needs to be reduced or cut off during the main loop circulation process, the flow direction of the medium can be flexibly adjusted through the start-stop valve and the shunt pipe in the adjusting assembly, effectively avoiding the problems of high energy consumption and cable high temperature aging caused by excessive main loop flow, and improving the operation efficiency and safety of the equipment.

[0010] Preferably, the end of the discharge pipe connected with the shunt pipe is provided with a shut-off valve, one end of the shut-off valve is connected with the discharge pipe, the other end of the shut-off valve is used for discharging medium, the side wall of the shut-off valve is communicated with the shunt pipe, and the shut-off valve is synchronous with the on-off valve to open and close the shunt pipe.

[0011] By adopting the above technical scheme, accurate temperature regulation of the semiconductor equipment is realized. Specifically, by arranging the shut-off valve at the end of the discharge pipe connected with the shunt pipe, one end of the shut-off valve is connected with the discharge pipe, the other end is used for discharging medium, and the side wall of the shut-off valve is communicated with the shunt pipe, so that the shut-off valve is synchronous with the on-off valve to open and close the shunt pipe. This design not only effectively controls the flow path of the medium, but also ensures flexible switching between the main road and the branch road, thereby better meeting the temperature requirements under different process conditions, reducing the energy consumption of the equipment, and prolonging the service life of the equipment.

[0012] Preferably, the communication part of the on-off valve and the shut-off valve is provided with a mounting piece, the on-off valve is communicated with the injection pipe, the shunt pipe and the discharge pipe through the mounting piece, and the shut-off valve is communicated with the shunt pipe and the discharge pipe through the mounting piece.

[0013] By adopting the above technical scheme, the on-off valve and the shut-off valve are effectively connected with each pipe, and smooth flow of the medium between each pipe is ensured. The design of the mounting piece not only improves the flexibility and maintainability of the device, but also ensures the sealing and stability between the valve and the pipe, thereby effectively reducing the risk of medium leakage and improving the overall reliability and safety of the temperature regulating device.

[0014] Preferably, the mounting piece includes a mounting pipe and a mounting connector, one end of the mounting pipe is detachably connected with the on-off valve or the shut-off valve, the other end of the mounting pipe is detachably connected with the mounting connector, and one end of the mounting connector away from the mounting pipe is detachably connected with one of the injection pipe, the discharge pipe and the shunt pipe.

[0015] By adopting the above technical scheme, the structure design of the mounting piece makes the connection between the on-off valve and the shut-off valve and the injection pipe, the discharge pipe and the shunt pipe more flexible and convenient, improves the assembly efficiency and maintenance convenience of the device. At the same time, the detachable connection design facilitates quick replacement and maintenance of parts, reducing maintenance cost.

[0016] Preferably, the mounting piece further includes a bending connector and a bending extension pipe, the bending connector is arranged between the mounting pipe and the mounting connector, one end of the bending connector is detachably connected with the mounting pipe, the other end of the bending connector is detachably connected with the bending extension pipe, and one end of the bending extension pipe away from the bending connector is detachably connected with the mounting connector.

[0017] By adopting the technical scheme, flexible layout of the mounting piece is realized, so that the temperature adjusting device can adapt to different installation requirements in limited space. The design of the bending joint and the bending continuation pipe increases the flexibility of the pipeline connection, facilitates the adjustment of the angle and the length, and thus improves the installation convenience and the maintenance convenience of the whole system.

[0018] Preferably, the mounting piece further comprises a receiving pipe, two ends of the receiving pipe being detachably connected with the on-off valve and the intercepting valve respectively.

[0019] Preferably, the on-off valve and the intercepting valve are combined valves of on-off valves and regulating valves; the on-off valve and the intercepting valve are manual valves or pneumatic valves.

[0020] By adopting the technical scheme, the on-off valve and the intercepting valve are combined valves of on-off valves and regulating valves, so that the flow and the flow direction of the medium can be accurately controlled in the main loop and the branch loop, and the accuracy and the stability of the temperature adjustment of the equipment are ensured. Meanwhile, the on-off valve and the intercepting valve can be operated in a manual or pneumatic mode, the operation flexibility and the automation degree of the device are improved, and the complexity and the failure rate of manual operation are reduced.

[0021] In summary, the present application has at least one of the following beneficial technical effects:

[0022] 1. The flow of the medium is controlled by the on-off valve between the injection pipe and the discharge pipe, so that the medium can flow into the equipment for temperature adjustment effectively and be discharged smoothly after the adjustment. This scheme effectively solves the temperature management problem of the semiconductor equipment under high energy consumption, reduces the risk of aging of the equipment cable due to high temperature, and improves the reliability and the service life of the equipment;

[0023] 2. In the main loop, when the required medium flow of the equipment needs to be reduced or cut off, the flow direction of the medium can be flexibly adjusted by the on-off valve and the shunt pipe in the regulating assembly, so that the problems of high energy consumption and high temperature aging of the cable caused by excessive flow in the main loop are effectively avoided, and the operation efficiency and the safety of the equipment are improved;

[0024] 3. The on-off valve and the intercepting valve are effectively connected with the pipes, so that the smooth flow of the medium between the pipes is ensured. The design of the mounting piece not only improves the flexibility and the maintainability of the device, but also ensures the sealing and the stability between the valve and the pipe, so that the risk of medium leakage is effectively reduced, and the overall reliability and the safety of the temperature adjusting device are improved. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a structural schematic view of a temperature adjusting device for a semiconductor equipment in an embodiment of the present application.

[0026] Figure 2Fig. 1 is a structural diagram of the open-close valve and the intercept valve in the embodiment of the present application.

[0027] Reference signs: 1, injection pipe; 2, discharge pipe; 3, open-close valve; 4, adjusting assembly; 41, shunt pipe; 42, intercept valve; 5, mounting piece; 51, mounting pipe; 52, mounting joint; 53, elbow joint; 54, elbow extension pipe; 55, storage pipe. DETAILED DESCRIPTION

[0028] The following will be described in detail with reference to the accompanying drawings. Figures 1-2 The present application will be further described in detail.

[0029] The embodiment of the present application discloses a temperature regulating device for semiconductor equipment. Referring to Figure 1 The temperature regulating device for semiconductor equipment comprises an injection pipe 1 and a discharge pipe 2, and an open-close valve 3 is arranged between the injection pipe 1 and the discharge pipe 2; a mounting piece 5 is arranged on the open-close valve 3, the open-close valve 3 is connected with the injection pipe 1 through the mounting piece 5, and the open-close valve 3 is also connected with the equipment through the mounting piece 5. An intercept valve 42 is arranged between the equipment and the discharge pipe 2, and the intercept valve 42 is connected with the equipment through the mounting piece 5.

[0030] The medium flows into the equipment through the injection pipe 1 and the open-close valve 3, adjusts the temperature of the equipment when passing through the inside of the equipment, and is finally discharged by the discharge pipe 2 through the intercept valve 42. The flow of the medium is controlled through the open-close valve 3 between the injection pipe 1 and the discharge pipe 2, so that the medium can effectively flow into the equipment for temperature adjustment and be smoothly discharged after the adjustment is completed. The scheme effectively solves the temperature management problem of the semiconductor equipment under high energy consumption operation, reduces the risk of aging of the equipment cable due to high temperature, and improves the reliability and service life of the equipment.

[0031] Referring to Figure 1 An adjusting assembly 4 is arranged between the injection pipe 1 and the discharge pipe 2, the adjusting assembly 4 comprises a shunt pipe 41, the open-close valve 3 is connected with one end of the shunt pipe 41 through the mounting piece 5, and the intercept valve 42 is also connected with the other end of the shunt pipe 41 through the mounting piece 5. The material of the shunt pipe 41 is also a stainless steel material which is resistant to high temperature and corrosion, so that leakage or corrosion phenomenon will not occur during long-term use. The length of the shunt pipe 41 is designed according to actual requirements, and is generally not more than 1 meter, so as to reduce the pipeline resistance and improve the medium flow efficiency. In actual application, a flowmeter can also be additionally arranged on the shunt pipe 41, so as to monitor the flow of the medium in real time and ensure the stable operation of the system.

[0032] In the main loop cycle process, when the required medium flow of the equipment needs to be reduced or cut off, the branch loop can be opened by opening and closing valve 3 and shunt pipe 41 to flexibly adjust the medium flow direction, effectively avoid the problem of high energy consumption and cable high temperature aging caused by excessive main loop flow, improve the operation efficiency and safety of the equipment. The medium is introduced to realize the cooling or heating or ion implantation of the equipment.

[0033] Referring to Figure 1 In order to facilitate the disassembly and installation of opening and closing valve 3 and shutoff valve 42, the connection between opening and closing valve 3 and shutoff valve 42 is provided with mounting piece 5. Opening and closing valve 3 is connected with injection pipe 1, shunt pipe 41 and discharge pipe 2 through mounting piece 5. Shutoff valve 42 is connected with shunt pipe 41 and discharge pipe 2 through mounting piece 5. This design further simplifies the assembly and maintenance of the system, improves the reliability and durability of the system.

[0034] Mounting piece 5 includes mounting pipe 51 and mounting connector 52. One end of mounting pipe 51 is detachably connected with opening and closing valve 3 or shutoff valve 42 through threads, and the other end is detachably connected with mounting connector 52 through threads. The end of mounting connector 52 away from mounting pipe 51 is detachably connected with one of injection pipe 1, discharge pipe 2 and shunt pipe 41 through threads. The materials of mounting pipe 51 and mounting connector 52 are stainless steel materials with high temperature resistance and corrosion resistance, which can ensure that there is no leakage or corrosion phenomenon during long-term use. The diameter of mounting pipe 51 is selected according to the actual flow demand, which is generally in the range of DN25 to DN50mm, to ensure smooth flow of the medium.

[0035] The connection between mounting pipe 51 and mounting connector 52 can also use quick connector in other embodiments, which is convenient for quick installation and disassembly. The material of quick connector can be brass or stainless steel, which has good corrosion resistance and sealing performance. O-ring is used for sealing at the connection position to prevent medium leakage. The material of O-ring is selected according to the characteristics of the medium, such as fluororubber and silicone rubber, to adapt to different working environments.

[0036] Mounting piece 5 also includes bending connector 53 and bending extension pipe 54. Bending connector 53 and bending extension pipe 54 are added at the part where the pipeline needs to be bent. One end of bending connector 53 is detachably connected with mounting pipe 51 through threads, and the other end is detachably connected with bending extension pipe 54 through threads. The end of bending extension pipe 54 away from bending connector 53 is detachably connected with mounting connector 52 through threads. The materials of bending connector 53 and bending extension pipe 54 are stainless steel materials with high temperature resistance and corrosion resistance, which can ensure that there is no leakage or corrosion phenomenon during long-term use. The design of bending connector 53 and bending extension pipe 54 allows the pipeline to bend within a certain range, reduces the difficulty of pipeline layout, and improves the flexibility of the system.

[0037] Referring to Figure 2The mounting member 5 further comprises a receiving tube 55, which is detachably connected to the on-off valve 3 and the shut-off valve 42 through screw threads at both ends during package transportation. The receiving tube 55 serves to centrally manage the control signal lines of the on-off valve 3 and the shut-off valve 42, preventing the signal lines from being entangled and damaged. The material of the receiving tube 55 can be PVC or metal hose, which has good flexibility and anti-interference capability. The diameter of the receiving tube 55 is selected according to the number and thickness of the signal lines, and is generally in the range of φ10 to φ25 mm, so as to ensure smooth transmission of the signal lines.

[0038] Through the design of the mounting member 5, the modular assembly and maintenance of the temperature control device of the semiconductor equipment are realized. The flexible design of the mounting member 5 not only simplifies the assembly process of the system, but also improves the reliability and durability of the system. The design of the bent joint 53 and the bent extension tube 54 allows the pipeline to bend within a certain range, reducing the difficulty of pipeline arrangement and improving the flexibility of the system. The use of the receiving tube 55 effectively manages the control signal lines during transportation, preventing the signal lines from being entangled and damaged, and further improving the stability of the system. The overall design is simple and compact, easy to install and maintain, greatly reducing the operating cost of the equipment and prolonging the service life of the equipment.

[0039] Specifically, the on-off valve 3 and the shut-off valve 42 include manual valves and pneumatic valves, the manual valves are suitable for simple operation scenes, have low cost and are easy to maintain. The pneumatic valves have the characteristics of fast response speed and high precision, and are suitable for complex process environments. The injection pipe 1 and the discharge pipe 2 are made of stainless steel material which is resistant to high temperature and corrosion, ensuring that there is no leakage or corrosion phenomenon during long-term use. The diameter of the injection pipe 1 and the discharge pipe 2 is selected according to the actual flow demand, generally in the range of DN25 to DN50 mm, to ensure smooth flow of the medium. Through the design of the combination valve of the on-off valve and the regulating valve, more accurate flow control of the temperature control device of the semiconductor equipment is realized.

[0040] The on-off valve 3 and the shut-off valve 42 are combination valves of on-off valves and regulating valves. The use of combination valves not only improves the flexibility of the system, but also realizes accurate adjustment of the flow under different process conditions, further improving the stability and reliability of the system. The combination use of manual valves and pneumatic valves not only ensures the basic operation simplicity, but also meets the high precision demand under complex process environment. The overall design is simple and compact, easy to install and maintain, greatly reducing the operating cost of the equipment and prolonging the service life of the equipment.

[0041] The implementation principle of the temperature adjusting device for the semiconductor equipment is that the medium flows into the equipment through the injection pipe 1, enters the equipment through the on-off valve 3, adjusts the temperature of the equipment when passing through the inside of the equipment, and is finally discharged by the discharge pipe 2 through the intercepting valve 42. The flow of the medium is controlled through the on-off valve 3 between the injection pipe 1 and the discharge pipe 2, so that the medium can effectively flow into the equipment for temperature adjustment and be smoothly discharged after the adjustment is completed. In the main loop circulation process, when the required medium flow of the equipment needs to be reduced or cut off, the branch loop can be opened through the on-off valve 3 and the shunt pipe 41 to flexibly adjust the medium flow direction, effectively avoid the problems of high energy consumption of the equipment and high temperature aging of the cable caused by too large main loop flow, and improve the operation efficiency and safety of the equipment. The temperature adjustment of the semiconductor equipment is realized.

[0042] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, so: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A temperature regulating device for a semiconductor device, characterized by: The utility model provides an injection pipe (1) and discharge pipe (2) are provided with opening and closing valve (3) between injection pipe (1) and discharge pipe (2), medium flows into after opening and closing valve (3) into equipment and finally by discharge pipe (2) after equipment and is discharged from discharge pipe (2); Adjusting assembly (4) is arranged between injection pipe (1) and discharge pipe (2), and adjusting assembly (4) includes shunt pipe (41), one end of shunt pipe (41) is connected with opening and closing valve (3), and the other end is connected with discharge pipe (2); The end of discharge pipe (2) connected with shunt pipe (41) is provided with a stop valve (42), one end of stop valve (42) is connected with discharge pipe (2), the other end opposite to discharge pipe (2) of stop valve (42) is used for discharging medium, the side wall of stop valve (42) is communicated with shunt pipe (41), and opening and closing valve (3) is synchronous to shunt pipe (41) and realizes opening and closing.

2. The temperature regulating device for a semiconductor device according to claim 1, wherein: The communication place of opening and closing valve (3) and stop valve (42) is provided with mounting piece (5), opening and closing valve (3) is communicated with injection pipe (1), shunt pipe (41) and discharge pipe (2) through mounting piece (5), and stop valve (42) is communicated with shunt pipe (41) and discharge pipe (2) through mounting piece (5).

3. A temperature regulating device for a semiconductor device according to claim 2, wherein: The mounting piece (5) includes mounting pipe (51) and mounting connector (52), one end of mounting pipe (51) is detachably connected with opening and closing valve (3) or stop valve (42), the other end of mounting pipe (51) is detachably connected with mounting connector (52), and one end, away from mounting pipe (51) of mounting connector (52) is detachably connected with injection pipe (1), discharge pipe (2) and shunt pipe (41).

4. A temperature regulating device for a semiconductor device according to claim 3, wherein: The mounting piece (5) further includes bending connector (53) and bending continuation pipe (54), bending connector (53) is arranged between mounting pipe (51) and mounting connector (52), one end of bending connector (53) is detachably connected with mounting pipe (51), the other end is detachably connected with bending continuation pipe (54), and one end, away from bending connector (53) of bending continuation pipe (54) is detachably connected with mounting connector (52).

5. The temperature regulating device for a semiconductor device according to claim 3, wherein: The mounting piece (5) further includes receiving pipe (55), both ends of receiving pipe (55) can be detachably connected with opening and closing valve (3) and stop valve (42) respectively.

6. The temperature regulating device for a semiconductor device according to claim 1, wherein: Opening and closing valve (3) and stop valve (42) are combined valves of switch valve and regulating valve, and opening and closing valve (3) and stop valve (42) are manual valve or pneumatic valve.

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